Gas-liquid double-cooling three-dimensional heat dissipation device

Abstract

A gas-liquid double-cooling three-dimensional heat dissipation device comprises a vapor chamber module and a water cooling head. The vapor chamber module comprises a vapor chamber, and the vapor chamber comprises a first cover plate, a second cover plate and a side wall surrounding the first cover plate and the second cover plate to form a hollow cavity. The first cover plate is used for making contact with a heat source, and the water cooling head is fixed to the second cover plate of the vapor chamber so as to improve the heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device, in particular to a gas-liquid dual-cooling three-dimensional heat dissipation device. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs and graphics chips becomes more and more important.

[0003] Electronic components such as CPUs and graphics chips generate heat when running and require proper cooling to achieve optimal performance. In order to keep electronic components such as CPUs and graphics chips running at ideal temperatures, the appropriate air-liquid dual-cooling three-dimensional heat dissipation device configuration will determine the performance of the electronic device.

[0004] In addition, as the size of current electronic devices is getting smaller and smaller, and the number of cores of their computing chips is increasing, the heat generated is also increasing.

[0005] Therefore, how to effectively improve the heat dissipation efficiency of the heat dissipation device to reduce the operating temperature of the computing chip will help improve the overall operating efficiency of the electronic device. Utility Model Content

[0006] The utility model summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This utility model summary is not a complete overview of the present disclosure, and its intention is not to point out the important / key elements of the embodiments of the utility model or to define the scope of the utility model.

[0007] An object of the present invention is to provide a gas-liquid dual-cooling three-dimensional heat dissipation device, which can improve the heat dissipation efficiency and thus improve the overall working efficiency of the electronic device.

[0008] To achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a gas-liquid dual-cooling three-dimensional heat dissipation device is provided, which includes a temperature averaging plate module and a water cooling head. The temperature averaging plate module includes a temperature averaging plate, and the temperature averaging plate includes a first cover plate, a second cover plate and a side wall, and the side wall surrounds the first cover plate and the second cover plate to form a hollow chamber. The first cover plate is used to contact a heat source, and the water cooling head is fixed on the second cover plate of the temperature averaging plate.

[0009] In some embodiments, the vapor chamber module further includes a plurality of first heat pipes extending outward from a side wall of the vapor chamber.

[0010] In some embodiments, the temperature vapor chamber module further includes a plurality of second heat pipes connected to the second cover plate of the temperature vapor chamber, and the second heat pipes are in fluid communication with the hollow chamber.

[0011] In some embodiments, each second heat pipe includes a connecting portion and a heat dissipating portion, wherein the connecting portion is connected to the second cover plate of the temperature homogenizing plate, and the heat dissipating portion is connected to the connecting portion, and the heat dissipating portion is parallel to the first heat pipe.

[0012] In some embodiments, the temperature vapor chamber module further includes a heat dissipation fin module, and the first heat pipe and the second heat pipe are disposed in the heat dissipation fin module.

[0013] In some embodiments, the water cooling head further includes a plurality of heat sinks and a cover. The heat sinks are formed on the second cover of the temperature homogenizer, and the heat dissipation liquid of the water cooling head flows through the heat sinks. The cover is disposed on the heat sinks.

[0014] In some embodiments, the water cooling head further includes a fixing portion formed between the second cover plate of the temperature homogenizing plate and the heat sink.

[0015] In some embodiments, the air-liquid dual-cooling three-dimensional heat dissipation device further includes a plurality of first fans installed on the water cooling head and the heat dissipation fin module.

[0016] In some embodiments, the air-liquid dual-cooling three-dimensional heat dissipation device further includes a second fan installed under the heat dissipation fin module.

[0017] In some embodiments, the air-liquid dual-cooling stereoscopic heat dissipation device further includes an upper cover and a back cover. The upper cover includes a plurality of openings, and the vapor chamber module and the water cooling head are installed between the upper cover and the back cover, and the first fan is preferably aligned with the openings respectively.

[0018] In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device further includes a radiator, a hot water pipe and a cold water pipe. The hot water pipe and the cold water pipe are respectively connected between the water cooling head and the radiator.

[0019] In some embodiments, the water cooling head further includes a partition and an impeller. The partition is installed between the heat sink and the cover, and the impeller is installed above the partition.

[0020] In some embodiments, the partition includes two water inlets and a water outlet. The two water inlets are respectively located on both sides of the partition, and the water outlet is located in the middle of the partition and aligned with the impeller.

[0021] In some embodiments, the cover body includes an arc-shaped groove, and two ends of the arc-shaped groove are respectively aligned with the water inlet.

[0022] In some embodiments, the heat sink includes a water collecting groove.

[0023] In some embodiments, the water collecting groove includes a long concave area and a middle circular concave area. The long concave area runs through the heat sink, and the middle circular concave area is formed in the middle of the long concave area and is aligned with the water outlet of the partition.

[0024] In some embodiments, the heat sink further includes two baffles, which are respectively located at the outermost sides of the heat sink to guide the heat dissipation liquid to move toward the two ends of the heat sink.

[0025] Therefore, the gas-liquid dual-cooling stereoscopic heat dissipation device can use the temperature averaging plate to directly contact the heat source, use the water-cooling head to directly reduce the working temperature of the temperature averaging plate, and the heat dissipation liquid of the water-cooling head can also directly contact the surface of the temperature averaging plate, effectively improving the heat dissipation efficiency of the heat dissipation device. In addition, the gas-liquid dual-cooling stereoscopic heat dissipation device disclosed in the utility model also uses a heat pipe connected to the temperature averaging plate by a fluid, effectively improving the heat dissipation efficiency and heat dissipation capacity of the gas-liquid dual-cooling stereoscopic heat dissipation device, reducing the working temperature of the computing chip, and thereby improving the overall working efficiency of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows:

[0027] Figure 1 It is a three-dimensional schematic diagram of a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the utility model.

[0028] Figure 2 It is a schematic diagram of the exploded view of some components of a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention.

[0029] Figure 3 It is a three-dimensional schematic diagram of a temperature homogenizing plate and a heat pipe connected thereto of a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present invention.

[0030] Figure 4 It is an exploded schematic diagram of a water cooling head of a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present utility model.

[0031] Figure 5 yes Figure 4 A schematic diagram of some components of the water cooling head of the gas-liquid dual-cooling three-dimensional heat dissipation device from another angle.

[0032] The reference numerals are described as follows:

[0033] 100: Air-liquid dual cooling three-dimensional heat dissipation device

[0034] 110: Vacuum board module

[0035] 112: Temperature balancing board

[0036] 114: First Heat Pipe

[0037] 116: Second heat pipe

[0038] 118: Heat sink fin module

[0039] 120: Water cooling head

[0040] 121: Fixed part

[0041] 122: Cover

[0042] 123: Heat sink

[0043] 124: Hollow groove

[0044] 125: Recessed cavity

[0045] 126: Hot water outlet

[0046] 127: Arc groove

[0047] 128: Cold water inlet

[0048] 129: Baffle

[0049] 130: Electronic devices

[0050] 132: Circuit Board

[0051] 134: Heat Source

[0052] 140: Back cover

[0053] 150: Upper cover

[0054] 152: Opening

[0055] 160: First Fan

[0056] 170: Second Fan

[0057] 312: Second cover

[0058] 314: Sidewall

[0059] 316: First cover

[0060] 318: Hollow Chamber

[0061] 322: Connection

[0062] 324: Heat dissipation

[0063] 401: Arrow direction

[0064] 402: Arrow direction

[0065] 410: Impeller

[0066] 420: Partition

[0067] 422: Water inlet

[0068] 424: Water outlet

[0069] 501: Arrow direction

[0070] 502: Arrow direction

[0071] 510: Water collection groove

[0072] 512: Long concave area

[0073] 514: Middle circular depression

[0074] 600: Radiator

[0075] 610: Hot water pipe

[0076] 620: Cold water pipe DETAILED DESCRIPTION

[0077] The following examples are listed in conjunction with the drawings in the specification for detailed description, but the examples provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with an equal technical effect produced by the recombined structure of the elements is within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in their original size. For ease of understanding, the same or similar elements in the following description will be indicated by the same symbols.

[0078] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the present disclosure.

[0079] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to a single or multiple number. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0080] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0081] Figure 1 is a three-dimensional schematic diagram showing a gas-liquid dual-cooling three-dimensional heat dissipation device according to an embodiment of the present utility model, and Figure 2 It is an exploded schematic diagram of some of its components. Figure 3 It is a three-dimensional schematic diagram of a temperature averaging plate and a heat pipe connected to the temperature averaging plate by a fluid in a gas-liquid dual-cooling three-dimensional heat dissipation device. In addition, Figure 4 is an exploded schematic diagram of a water cooling head of a gas-liquid dual-cooling stereoscopic heat dissipation device according to an embodiment of the present invention, and Figure 5 Schematic diagram of some components of the water cooling head from another angle.

[0082] See also Figures 2 to 3 As shown in the figure, the air-liquid dual-cooling three-dimensional heat dissipation device 100 includes a temperature vaporizer module 110 and a water cooling head 120. The temperature vaporizer module 110 includes a temperature vaporizer 112, and the temperature vaporizer 112 includes a first cover plate 316, a second cover plate 312 and a side wall 314. The side wall 314 surrounds the first cover plate 316 and the second cover plate 312 to form a hollow chamber 318, and the first cover plate 316 is used to contact a heat source 134. The water cooling head 120 is fixed on the second cover plate 312 of the temperature vaporizer 112.

[0083] In some embodiments, the heat source 134 can be a central processing unit chip, a graphics chip and / or any electronic component, which can be installed on the circuit board 132 to form an electronic device 130, such as a motherboard, a graphics card or other electronic devices, all of which do not depart from the concept and protection scope of the present invention.

[0084] In some embodiments, the side wall 314 is preferably vertically surrounded between the first cover plate 316 and the second cover plate 312 .

[0085] In addition, the first heat pipe 114 is connected to the side wall 314 of the temperature vapor chamber 112 and extends outward, and the first heat pipe 114 is in fluid communication with the hollow chamber 318 .

[0086] In some embodiments, the first heat pipe 114 is connected to the side wall 314 of the temperature vapor chamber 112 and extends horizontally outward.

[0087] In some embodiments, the first cover plate 316 is a heat-absorbing metal plate, such as a copper metal plate, an aluminum metal plate, a stainless steel plate or other metal plates, to directly or indirectly contact a heat source 134. The second cover plate 312 is preferably a heat-dissipating metal plate, such as a copper metal plate, an aluminum metal plate, a stainless steel plate or other metal plates, to cool the heat dissipation fluid in the temperature homogenizing plate 112, but the present invention is not limited thereto.

[0088] In addition, it is worth noting that the heat dissipation fluid in the temperature equalizing plate 112 can also be guided to the outside of the temperature equalizing plate 112 through the first heat pipe 114, from the hollow chamber 318 of the temperature equalizing plate 112, through the first heat pipe 114, so as to effectively improve the cooling efficiency and heat dissipation capacity of the gas-liquid dual-cooling three-dimensional heat dissipation device 100.

[0089] In some embodiments, the air-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a second heat pipe 116 connected to the second cover plate 312 of the temperature homogenizing plate 112 , and the second heat pipe 116 is also in fluid communication with the hollow chamber 318 .

[0090] In some embodiments, the second heat pipe 116 includes a connecting portion 322 and a heat dissipation portion 324. The connecting portion 322 is directly connected to the second cover plate 312 of the temperature vapor chamber 112, and the heat dissipation portion 324 is connected to the connecting portion 322 and extends outward from the temperature vapor chamber 112, for example, horizontally.

[0091] In some embodiments, the heat dissipation portion 324 is preferably parallel to the first heat pipe 114 .

[0092] In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a heat dissipation fin module 118, which is disposed on the outside of the temperature averaging plate 112, and the heat dissipation portion 324 of the second heat pipe 116 and the first heat pipe 114 are disposed in the heat dissipation fin module 118. In other words, the first heat pipe 114 extends outward from the side wall 314 of the temperature averaging plate 112 and is disposed in the heat dissipation fin module 118, and the second heat pipe 116 extends vertically outward from the second cover plate 312 of the temperature averaging plate 112, and then forms a bend angle of about 90 degrees, so that the heat dissipation portion 324 of the second heat pipe 116 is also disposed in the heat dissipation fin module 118, and preferably the heat dissipation portion 324 of the second heat pipe 116 is parallel to the first heat pipe 114, so as to improve the cooling efficiency and heat dissipation capacity of the gas-liquid dual-cooling three-dimensional heat dissipation device 100.

[0093] Therefore, the first heat pipe 114 and the second heat pipe 116 of the gas-liquid dual-cooling three-dimensional heat dissipation device 100 of the present invention are fluidically connected to the temperature homogenizing plate 112 .

[0094] In some embodiments, the water-cooled head 120 further includes a fixing portion 121 and a plurality of heat sinks 123. The fixing portion 121 is formed on or fixed to the second cover plate 312 of the temperature vapor chamber 112, and the heat sink 123 is formed on the fixing portion 121. In some embodiments, the fixing portion 121 includes a recessed cavity 125, and the heat sink 123 is formed in the recessed cavity 125 of the fixing portion 121. It is worth noting that there is a hollow groove 124 below the cover 122 of the water-cooled head 120, and the fluid is connected to the hot water outlet 126 and the cold water inlet 128, so that the heat dissipation liquid can enter the hollow groove 124 below the cover 122 through the cold water inlet 128, and flow through the heat sink 123 to cool the temperature vapor chamber 112, and then the heat dissipation liquid flows out from the hot water outlet 126.

[0095] See also Figure 1In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a radiator 600, which is connected to the hot water outlet 126 of the water cooling head 120 by a hot water pipe 610, and is connected to the cold water inlet 128 of the water cooling head 120 by a cold water pipe 620, so as to further reduce the working temperature of the temperature vapor chamber 112 by using the radiator 600, so that the heat dissipation liquid circulates on the surface of the radiator 600, the water cooling head 120 and the temperature vapor chamber 112 to reduce the working temperature of the heat source 134.

[0096] See also Figure 4 and Figure 5 As shown in the figure, the water cooling head 120 further includes a partition 420 and an impeller 410. The partition 420 is installed between the heat sink 123 and the cover 122, and the impeller 410 is installed on one side of the partition 420, such as the top. When the heat dissipating liquid of the water-cooled head 120 enters the arc-shaped groove 127 from the cold water inlet 128, the heat dissipating liquid flows along the arc-shaped groove 127 to the two ends of the arc-shaped groove 127, and passes through the water inlets 422 on both sides of the partition 420 in the direction of the arrow direction 401, and enters the two sides of the heat sink 123, for example, on both sides of the recessed cavity 125, and then flows from the two ends of the heat sink 123 to the middle of the heat sink 123 in the arrow direction 501 and the arrow direction 502 respectively to take away the heat on the heat sink 123, and then flows upward in the arrow direction 402, passes through the water outlet 424 of the partition 420, is extracted by the impeller 410, and is discharged through the hot water outlet 126 of the water-cooled head 120.

[0097] In some embodiments, the heat sink 123 further includes a water collection groove 510 formed in the middle of the heat sink 123, and the water collection groove 510 includes a long concave area 512, which runs through the middle of the heat sink 123 and extends to both sides, and a middle circular concave area 514 is formed in the middle of the long concave area 512, preferably aligned with the water outlet 424 of the partition 420. The middle circular concave area 514 is used to collect the heat dissipation liquid, so that the heat dissipation liquid is extracted by the impeller 410 through the water outlet 424 of the partition 420, and then discharged through the hot water outlet 126 of the water cooling head 120.

[0098] In some embodiments, the impeller 410 is aligned with the water outlet 424 of the partition 420 and is aligned with the middle circular recessed area 514 .

[0099] In some embodiments, both sides of the heat sink 123 further include baffles 129 located at the outermost side of the heat sink 123 to guide the heat dissipation liquid to move to both ends of the heat sink 123, and then flow to the middle of the heat sink 123 via arrow directions 501 and 502.

[0100] In some embodiments, the long recessed area 512 extends toward both sides of the heat sink 123 to the inner surface of the baffle 129 , but the present invention is not limited thereto.

[0101] In some embodiments, the gas-liquid dual-cooling three-dimensional heat dissipation device 100 can omit the fixing portion 121 and the heat sink 123 is integrally formed on the second cover plate 312 of the temperature homogenizing plate 112 or fixed on the second cover plate 312 of the temperature homogenizing plate 112. In this case, the cover 122 of the water-cooling head 120 is directly connected to the surface of the second cover plate 312, so that the heat dissipation liquid can flow through the surface of the second cover plate 312 of the temperature homogenizing plate 112 in addition to the heat sink 123.

[0102] Therefore, in some embodiments, the heat sink 123 and the baffle 129 can be directly formed on or fixed to the surface of the second cover plate 312 of the temperature equilibrium plate 112, and the cover body 122 of the water cooling head 120 is directly joined to the surface of the second cover plate 312, so that the partition 420 is arranged above the heat sink 123 and in the hollow groove 124 below the cover body 122 of the water cooling head 120.

[0103] However, the present invention is not limited thereto. The fixing portion 121 and the heat sink 123 may also be manufactured separately from the second cover 312 of the temperature homogenizing plate 112 , and then the fixing portion 121 and the heat sink 123 are fixed on the second cover 312 of the temperature homogenizing plate 112 .

[0104] Furthermore, in some embodiments, the water cooling head 120 may also have an independent heat dissipation liquid circulation, and the water cooling head 120 may be fixed on the second cover plate 312 of the temperature vapor chamber 112 , which also does not deviate from the concept and protection scope of the present invention.

[0105] In some embodiments, the heat sink 123 is a skived heat sink formed on the second cover plate 312 of the temperature homogenizing plate 112 .

[0106] In some embodiments, the air-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a plurality of first fans 160 installed on the water cooling head 120 and the heat dissipation fin module 118 to increase the heat dissipation capacity of the air-liquid dual-cooling three-dimensional heat dissipation device 100 .

[0107] In some embodiments, the air-liquid dual-cooling three-dimensional heat dissipation device 100 further includes a second fan 170 installed under the heat dissipation fin module 118 to further increase the heat dissipation capacity of the air-liquid dual-cooling three-dimensional heat dissipation device 100 .

[0108] In some embodiments, the air-liquid dual cooling stereo heat dissipation device 100 further includes an upper cover 150 and a back cover 140. The upper cover 150 includes a plurality of openings 152, and the vapor chamber module 110 and the water cooling head 120 are installed between the upper cover 150 and the back cover 140, and the first fan 160 is preferably aligned with the openings 152 respectively.

[0109] In summary, the gas-liquid dual-cooling stereoscopic heat dissipation device disclosed in the utility model can use the temperature equalizing plate to directly contact the heat source, use the water cooling head to directly reduce the working temperature of the temperature equalizing plate, and the heat dissipation liquid of the water cooling head can also directly contact the surface of the temperature equalizing plate, effectively improving the heat dissipation efficiency of the heat dissipation device. In addition, the gas-liquid dual-cooling stereoscopic heat dissipation device disclosed in the utility model also uses a heat pipe connected to the temperature equalizing plate by a fluid, effectively improving the heat dissipation efficiency and heat dissipation capacity of the gas-liquid dual-cooling stereoscopic heat dissipation device, reducing the working temperature of the computing chip, and thereby improving the overall working efficiency of the electronic device.

[0110] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be based on what is defined in the claims.

Claims

1. A gas-liquid dual-cooling three-dimensional heat dissipation device, characterized in that: Include: A temperature averaging module, comprising a temperature averaging plate, the temperature averaging plate comprising a first cover plate, a second cover plate and a side wall surrounding the first cover plate and the second cover plate to form a hollow chamber, the first cover plate being used to contact a heat source; and A water cooling head is fixed on the second cover plate of the temperature homogenizing plate.

2. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 1, characterized in that: The vapor chamber module also includes: A plurality of first heat pipes extend outward from the side wall of the temperature homogenizing plate.

3. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 2, characterized in that: The vapor chamber module also includes: A plurality of second heat pipes are connected to the second cover plate of the temperature homogenizing plate, and the plurality of second heat pipes are in fluid communication with the hollow chamber.

4. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 3, characterized in that: Each of the plurality of second heat pipes comprises: A connecting portion connected to the second cover plate of the temperature homogenizing plate; and A heat dissipation portion is connected to the connection portion, and the heat dissipation portion is parallel to the plurality of first heat pipes.

5. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 4, characterized in that: The vapor chamber module also includes: A heat dissipation fin module is provided, wherein the plurality of first heat pipes and the plurality of second heat pipes are disposed in the heat dissipation fin module.

6. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 5, characterized in that: The water cooling head also includes: A plurality of heat sinks are formed on the second cover plate of the temperature homogenizing plate, and the heat dissipation liquid of the water cooling head flows through the plurality of heat sinks; and A cover body is arranged on the plurality of heat sinks.

7. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 6, characterized in that: The water cooling head also includes: A fixing portion is formed between the second cover plate of the temperature homogenizing plate and the plurality of heat sinks.

8. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 7, characterized in that: Also includes: A plurality of first fans are installed on the water cooling head and the heat dissipation fin module.

9. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 8, characterized in that: Also includes: A second fan is installed under the heat dissipation fin module.

10. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 9, characterized in that: Also includes: a top cover comprising a plurality of openings; and A back cover, wherein the temperature vapor chamber module and the water cooling head are installed between the upper cover and the back cover, and the plurality of first fans are aligned with the plurality of openings.

11. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 1, characterized in that: Also includes: a radiator; A hot water pipe connected between the water cooling head and the radiator; and A cold water pipe is connected between the water cooling head and the radiator.

12. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 6, characterized in that: The water cooling head also includes: a partition plate installed between the plurality of heat sinks and the cover; and An impeller is installed above the partition.

13. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 12, characterized in that: The separator includes: two water inlets, respectively located on two sides of the partition; and A water outlet is located in the middle of the partition and is aligned with the impeller.

14. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 13, characterized in that: The cover comprises: An arc-shaped groove, and two ends of the arc-shaped groove are respectively aligned with each of the water inlets.

15. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 14, characterized in that: The plurality of heat sinks include a water collecting groove.

16. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 15, characterized in that: The water collection groove includes: A long concave area running through the plurality of heat sinks; and A middle circular recessed area is formed in the middle of the long strip recessed area and is aligned with the water outlet of the partition.

17. The gas-liquid dual-cooling three-dimensional heat dissipation device according to claim 16, characterized in that: The plurality of heat sinks further comprises: The two baffles are respectively located at the outermost sides of the plurality of heat sinks to guide the heat dissipation liquid to move toward the two ends of the plurality of heat sinks.

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