Heat dissipation device
By setting a groove unit on the fin unit of the heat dissipation device to increase the airflow contact area, the problem of poor heat dissipation efficiency in the prior art is solved, and more efficient heat dissipation is achieved.
Patent Information
- Application Number
- CN202421999069.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-08-16
AI Technical Summary
When existing heat dissipation devices face the large amount of heat energy generated by high-power processors, they cannot maintain effective and consistent heat dissipation, resulting in poor overall heat dissipation efficiency.
A heat dissipation device including a fin unit, a heat pipe group, a fan unit and a groove unit is designed. A groove unit is provided on the fin unit to increase the contact area of the airflow generated by the fan unit to contact the fin unit, thereby expanding the cooling area and improving the heat conduction efficiency.
By increasing the contact area of the airflow, reducing the airflow resistance, increasing the airflow flow rate, reducing fan load and airflow turbulence, the overall heat dissipation efficiency will be effectively improved.
Smart Images
Figure CN222896403U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of heat dissipation, and in particular to a heat dissipation device including fins capable of reducing fluid impedance. Background Art
[0002] In accordance with modern needs, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, in the process, the heat dissipation problem brought by high-performance hardware also comes along. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat, such as using thermal paste or heat sinks to attach to the electronic components to be dissipated to absorb and dissipate the heat.
[0003] However, the above heat dissipation methods have limited effects, so the industry has developed heat dissipation components using heat pipes and fins. This type of heat dissipation component mainly achieves the purpose of heat dissipation by increasing the contact area between the fins and heat pipes and the air. However, when faced with a large amount of heat energy generated by a high-power processor (such as a GPU), such a heat dissipation component still cannot maintain effective and consistent heat dissipation, resulting in poor overall heat dissipation efficiency.
[0004] Therefore, how to provide a heat dissipation device that can solve the above problems is one of the issues that the industry needs to overcome urgently. Utility Model Content
[0005] The purpose of the present invention is to provide a heat dissipation device to solve at least one of the above problems.
[0006] The present disclosure provides a heat dissipation device, comprising: a fin unit having a first side and a second side opposite to each other and a recessed area, wherein the recessed area is formed on the second side; a heat pipe group, partly arranged in the recessed area, partly passing through the fin unit, and partly exposed from the fin unit; a fan unit, arranged on the first side, for generating an airflow passing through the fin unit; and a groove unit, formed on the first side and the second side of the fin unit, for reducing the flow resistance of the airflow flowing from the first side to the second side.
[0007] As in the aforementioned heat dissipation device, the groove unit includes a plurality of first grooves, a plurality of second grooves and a plurality of third grooves, the fin unit includes a first fin group and a second fin group, the first grooves are formed at intervals from each other on the first side of the first fin group, the second grooves are formed at intervals from each other on the second side of the first fin group, the third grooves are formed at intervals from each other on the first side of the second fin group, and the recessed area is formed on the second side of the second fin group.
[0008] As in the aforementioned heat dissipation device, the first groove, the second groove and the third groove respectively have a V-shaped cross section.
[0009] As in the aforementioned heat dissipation device, the V-shaped cross section is an isosceles triangle or a right triangle.
[0010] As in the aforementioned heat dissipation device, the heat pipe group includes four first heat pipes, four second heat pipes and three third heat pipes, the first heat pipes respectively have a first penetration portion, a first bending portion and a first flat portion connected in sequence, the second heat pipe has a second penetration portion and a second flat portion connected in sequence, and the third heat pipe has a third penetration portion, a third bending portion and a third flat portion connected in sequence, and the first flat portion, the second flat portion and the third flat portion are accommodated in the recessed area.
[0011] As in the aforementioned heat dissipation device, the cross-sections of the first flat portion, the second flat portion and the third flat portion are square, and the first penetration portion, the second penetration portion and the third penetration portion are in the shape of a circular tube.
[0012] As in the aforementioned heat dissipation device, the first fin group has four first through holes, four second through holes and three third through holes, the first penetration portion is penetrated in the first through hole, the second penetration portion is penetrated through the second through hole, and part of the third penetration portion is penetrated through the third through hole, and the second fin group has three fourth through holes, and part of the third penetration portion is penetrated through the fourth through holes.
[0013] As in the aforementioned heat dissipation device, the first groove is correspondingly aligned with the first through hole, correspondingly aligned with the second through hole, or misaligned with the first through hole / the second through hole, the second groove is misaligned with the second through hole, and correspondingly aligned with the first through hole or misaligned with the first through hole, and the third groove is misaligned with the fourth through hole.
[0014] As in the aforementioned heat dissipation device, the fin arrangement direction of the first fin group and the second fin group is the same as the heat pipe extension direction of the first penetrating portion, the first flat portion, the second penetrating portion, the second flat portion, the third penetrating portion and the third flat portion.
[0015] As in the aforementioned heat dissipation device, a heat transfer unit is also included, and two opposite sides of the heat transfer unit are respectively in contact with the heat pipe group and a heat source.
[0016] As in the aforementioned heat dissipation device, the heat transfer unit is a copper sheet or a temperature equalizing plate.
[0017] As in the aforementioned heat dissipation device, the material of the heat pipe group is copper.
[0018] In summary, the heat dissipation device disclosed in the present invention increases the contact area of the airflow generated by the fan unit contacting the fin unit by setting a groove unit on the fin unit, which means that the cooling area is expanded, the pressure distribution is more balanced, and the heat conduction efficiency can be improved. The airflow encounters less resistance when entering the groove with a V-shaped cross-section, thereby reducing the pressure drop and increasing the flow rate of the airflow. At the same time, it can reduce the load of the fan, reduce the turbulence and backflow of the airflow, and ultimately effectively improve the overall heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is an overall schematic diagram of the heat dissipation device disclosed in the present invention.
[0020] Figure 2 for Figure 1 Schematic diagram of the cross section along the AA section line.
[0021] Figure 3 for Figure 1 Schematic diagram of the cross section along line BB.
[0022] Figure 4 It is a schematic diagram of an exploded view of the heat dissipation device disclosed in the present invention.
[0023] Figure 5 It is a schematic diagram of the fin unit and the heat pipe group in the heat dissipation device disclosed in the present invention.
[0024] Figure 6 for Figure 5 Schematic diagram from another perspective.
[0025] Figure 7 for Figure 5 Schematic diagram of the decomposition.
[0026] Figure 8 for Figure 7 Schematic diagram from another perspective.
[0027] Fig. 9 It is a schematic diagram of a heat pipe group in the heat dissipation device disclosed in the present invention.
[0028] The reference numerals are as follows:
[0029] 100 Heat sink
[0030] 1 Fin unit
[0031] 1a First side
[0032] 1b Second side
[0033] 11. First fin group
[0034] 111 First through hole
[0035] 112 Second through hole
[0036] 113 Third through hole
[0037] 114 Storage Tank
[0038] 12 Second fin group
[0039] 121 Fourth through hole
[0040] 122 Depression area
[0041] 2 Heat pipe group
[0042] 21. First Heat Pipe
[0043] 211 First Installation Department
[0044] 212 First bending part
[0045] 213 First flat part
[0046] 22. Second heat pipe
[0047] 221 Second Installation Department
[0048] 222 Second flat part
[0049] 23 Third heat pipe
[0050] 231 The Third Piercing Department
[0051] 232 Third bending part
[0052] 233 Third flat part
[0053] 3 Fan unit
[0054] 4 groove units
[0055] 41 First groove
[0056] 42 Second groove
[0057] 43 Third groove
[0058] 5 Heat transfer unit DETAILED DESCRIPTION
[0059] The following describes the implementation of the present disclosure by means of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification, and can also implement or apply the present disclosure by means of other different embodiments.
[0060] See also Figure 1 and Figure 4 The heat dissipation device 100 disclosed in the present invention includes a fin unit 1 , a heat pipe group 2 , a fan unit 3 , a groove unit 4 and a heat transfer unit 5 .
[0061] Please read further Figure 5 , Figure 7 and Figure 8 The fin unit 1 has a first side 1 a and a second side 1 b opposite to each other, and includes a first fin group 11 and a second fin group 12 arranged side by side.
[0062] The first fin group 11 is a structure formed by a plurality of fins arranged at intervals, and has four first through holes 111 penetrating the front and rear sides thereof, four second through holes 112 penetrating the front and rear sides thereof, three third through holes 113 adjacent to the second fin group 12, and four receiving grooves 114 adjacent to the second fin group 12. The first through holes 111 are spaced apart from each other and adjacent to the first side 1a, the second through holes 112 are spaced apart from each other and adjacent to the second side 1b, the third through holes 113 are spaced apart from each other and adjacent to the first side 1a, and the first through holes 111, the second through holes 112, and the third through holes 113 are spaced apart from each other and may specifically have a circular cross section. The receiving grooves 114 are spaced apart from each other and adjacent to one side of the first fin group 11, and are respectively connected to the first through holes 111.
[0063] The second fin group 12 is a structure formed by arranging a plurality of fins at intervals, and has three fourth through holes 121 penetrating the front and rear sides thereof, and a recessed area 122 recessed from the second side 1b. The fourth through holes 121 are spaced apart from each other and adjacent to the first side 1a, and may specifically have a circular cross-section. The recessed area 122 may be formed by a plurality of grooves, which are adjacent to each other and in a stepped shape, or spaced apart from each other, and the extending direction of the grooves is the same as the fin arrangement direction of the second fin group 12.
[0064] The heat pipe group 2 is partially disposed in the recessed area 122, partially penetrates the fin unit 1, and partially exposed from the fin unit 1. Fig. 9 The heat pipe group 2 includes four first heat pipes 21 , four second heat pipes 22 and three third heat pipes 23 .
[0065] Each first heat pipe 21 has a first penetration portion 211, a first bending portion 212 and a first flat portion 213 connected in sequence. One end of the first penetration portion 211 is connected to one end of the first flat portion 213 via the first bending portion 212, so that the first penetration portion 211, the first bending portion 212 and the first flat portion 213 are roughly S-shaped as a whole. The extension directions of the first penetration portion 211 and the first flat portion 213 are parallel to each other. The first penetration portion 211 is penetrated in the first through hole 111 and is roughly tubular. The first bending portion 212 is accommodated in the accommodating groove 114. The first flat portion 213 is accommodated in the recessed area 122, and its cross section is square.
[0066] Each second heat pipe 22 has a second penetration portion 221 and a second flat portion 222 connected in sequence. The extension directions of the second penetration portion 221 and the second flat portion 222 are parallel to each other. The second penetration portion 221 penetrates the second through hole 112 and is roughly in the shape of a circular tube. The second flat portion 222 is accommodated in the recessed area 122 and has a square cross section.
[0067] Each third heat pipe 23 has a third penetration portion 231, a third bending portion 232 and a third flat portion 233 connected in sequence. One end of the third penetration portion 231 is connected to one end of the third flat portion 233 via the third bending portion 232, so that the third penetration portion 231, the third bending portion 232 and the third flat portion 233 are roughly U-shaped as a whole. The extension directions of the third penetration portion 231 and the third flat portion 233 are parallel to each other. A portion of the third penetration portion 231 is penetrated through the fourth through hole 121, and another portion is penetrated through the third through hole 113, and is roughly in the shape of a circular tube. The third bending portion 232 is exposed to the second fin group 12. The third flat portion 233 is accommodated in the recessed area 122, and its cross section is square.
[0068] In one embodiment, the first flat portion 213 , the second flat portion 222 , and the third flat portion 233 may be disposed in parallel with each other in the recessed area 122 , or may be disposed in spaced relation with each other in the recessed area 122 , but the present disclosure is not limited thereto.
[0069] In one embodiment, the heat pipe assembly 2 is made of copper.
[0070] In one embodiment, the fin arrangement direction of the first fin group 11 and the second fin group 12 is the same as the heat pipe extension direction of the first penetrating portion 211 , the first flat portion 213 , the second penetrating portion 221 , the second flat portion 222 , the third penetrating portion 231 and the third flat portion 233 .
[0071] The fan unit 3 is disposed on the first side 1 a of the fin unit 1 and has a plurality of fans for generating airflow passing through the fin unit 1 .
[0072] Please also see Figure 2 , Figure 3 , Figure 5 and Figure 6, the groove unit 4 is formed on the first side 1a and the second side 1b of the fin unit 1, so as to reduce the flow resistance of the airflow generated by the fan unit 3 flowing from the first side 1a to the second side 1b. Specifically, the groove unit 4 includes three first grooves 41, three second grooves 42 and three third grooves 43. The first grooves 41 are formed on the first side 1a of the first fin group 11 at intervals from each other, and the extension direction thereof is the same as the fin arrangement direction of the first fin group 11. The second grooves 42 are formed on the second side 1b of the first fin group 11 at intervals from each other, and the extension direction thereof is the same as the fin arrangement direction of the first fin group 11. In the present embodiment, the extension length of the first groove 41 may be greater than the extension length of the second groove 42, but the present disclosure is not limited thereto. The third grooves 43 are formed on the first side 1a of the second fin group 12 at intervals from each other.
[0073] In one embodiment, the first groove 41 , the second groove 42 , and the third groove 43 each have a V-shaped cross section, and the V-shaped cross section may be an isosceles triangle or a right triangle, but the present disclosure is not limited thereto.
[0074] In one embodiment, the first groove 41 may be vertically aligned with the first through hole 111 or offset with the first through hole 111. Furthermore, the first groove 41 may be vertically aligned with the second through hole 112 or offset with the second through hole 112.
[0075] In one embodiment, the second groove 42 and the second through hole 112 are offset from each other, and may be vertically aligned with the first through hole 111 , or offset from the first through hole 111 .
[0076] In one embodiment, the third groove 43 and the fourth through hole 121 are offset from each other.
[0077] The positions and quantities of the first groove 41 , the second groove 42 and the third groove 43 can be designed according to requirements, and the present disclosure is not limited thereto.
[0078] Since the first groove 41 and the third groove 43 are adjacent to the fan unit 3, this means that the airflow generated by the fan unit 3 will first flow into the first groove 41 and the third groove 43. The first groove 41 and the third groove 43 with a V-shaped cross section can effectively increase the contact area of the airflow, reduce the resistance of the airflow, and increase the flow rate of the airflow, so that the airflow flows more smoothly from the first side 1a to the second side 1b. The second groove 42 is adjacent to the second side 1b and is closer to the heat source. The second groove 42 with a V-shaped cross section can effectively increase the contact area of the airflow and increase the heat exchange efficiency.
[0079] One side of the heat transfer unit 5 contacts the first flat portion 213 , the second flat portion 222 and the third flat portion 233 , and the other side contacts a heat source (such as a display chip) to transfer heat energy generated by the heat source to the fin unit 1 and the heat pipe assembly 2 , and to perform heat dissipation via the fan unit 3 .
[0080] In one embodiment, the heat transfer unit 5 may be a copper sheet or a temperature equalizing plate, but the present disclosure is not limited thereto.
[0081] In summary, the heat dissipation device disclosed in the present invention increases the contact area of the airflow generated by the fan unit contacting the fin unit by setting a groove unit on the fin unit, which means that the cooling area is expanded, the pressure distribution is more balanced, and the heat conduction efficiency can be improved. The airflow encounters less resistance when entering the groove with a V-shaped cross-section, thereby reducing the pressure drop and increasing the flow rate of the airflow. At the same time, it can reduce the load of the fan, reduce the turbulence and backflow of the airflow, and ultimately effectively improve the overall heat dissipation efficiency.
[0082] The above embodiments are only used to illustrate the technical principles, features and effects of the present disclosure, and are not intended to limit the scope of implementation of the present disclosure. Those skilled in the art can modify and change the above embodiments without violating the spirit and scope of the present disclosure. However, any equivalent modifications and changes made by using the teachings of the present disclosure should still be covered by the claims. The scope of protection of the present disclosure should be as listed in the claims.
Claims
1. A heat dissipation device, characterized in that: include: The fin unit has a first side and a second side opposite to each other and a recessed area, wherein the recessed area is formed on the second side; A heat pipe group, partly disposed in the recessed area, partly passing through the fin unit, and partly exposed from the fin unit; a fan unit, disposed on the first side, for generating an airflow passing through the fin unit; and The groove unit is formed on the first side and the second side of the fin unit to reduce the flow resistance of the airflow flowing from the first side to the second side.
2. The heat dissipation device according to claim 1, characterized in that: The groove unit includes a plurality of first grooves, a plurality of second grooves and a plurality of third grooves, and the fin unit includes a first fin group and a second fin group, the first grooves are formed at intervals from each other on the first side of the first fin group, the second grooves are formed at intervals from each other on the second side of the first fin group, the third grooves are formed at intervals from each other on the first side of the second fin group, and the recessed area is formed on the second side of the second fin group.
3. The heat dissipation device according to claim 2, characterized in that: The first groove, the second groove and the third groove each have a V-shaped cross section.
4. The heat dissipation device according to claim 3, characterized in that: The V-shaped cross section is an isosceles triangle or a right triangle.
5. The heat dissipation device according to claim 2, characterized in that: The heat pipe group includes four first heat pipes, four second heat pipes and three third heat pipes, wherein the first heat pipes respectively have a first penetration portion, a first bending portion and a first flat portion connected in sequence, the second heat pipes have a second penetration portion and a second flat portion connected in sequence, and the third heat pipes have a third penetration portion, a third bending portion and a third flat portion connected in sequence, and the first flat portion, the second flat portion and the third flat portion are accommodated in the recessed area.
6. The heat dissipation device according to claim 5, characterized in that: The cross sections of the first flat portion, the second flat portion and the third flat portion are square, and the first penetration portion, the second penetration portion and the third penetration portion are in a circular tube shape.
7. The heat dissipation device according to claim 5, characterized in that: The first fin group has four first through holes, four second through holes and three third through holes, the first penetration portion is penetrated in the first through holes, the second penetration portion is penetrated in the second through holes, and part of the third penetration portion is penetrated in the third through holes, and the second fin group has three fourth through holes, and part of the third penetration portion is penetrated in the fourth through holes.
8. The heat dissipation device according to claim 7, characterized in that: The first groove is correspondingly aligned with the first through hole, correspondingly aligned with the second through hole, or misaligned with the first through hole / the second through hole, the second groove is misaligned with the second through hole, and correspondingly aligned with the first through hole or misaligned with the first through hole, and the third groove is misaligned with the fourth through hole.
9. The heat dissipation device according to claim 5, characterized in that: The fin arrangement directions of the first fin group and the second fin group are the same as the heat pipe extension directions of the first penetration portion, the first flat portion, the second penetration portion, the second flat portion, the third penetration portion and the third flat portion.
10. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a heat transfer unit, and two opposite sides of the heat transfer unit are respectively in contact with the heat pipe group and a heat source.
11. The heat dissipation device according to claim 10, characterized in that: The heat transfer unit is a copper sheet or a temperature equalizing plate.
12. The heat dissipation device according to claim 1, characterized in that: The material of the heat pipe group is copper.