3U disk array case suitable for high-humidity and high-heat environment

Abstract

The utility model belongs to the technical field of a case structure of a disk array, and particularly relates to a 3U disk array case suitable for a highly humid and hot environment. The computer case comprises a closed structure, an air guide structure, a mainboard module, a power module and an electronic disk assembly, the closed structure comprises a module frame assembly, a front panel, a rear panel assembly, a left side plate, a right side plate, an upper cover plate, a wind shield and a maintenance door assembly to form a closed space, and the air guide structure comprises a module frame assembly, a wind shield, a rear panel assembly and an air duct cover plate. The module frame assembly comprises an air guide bottom plate, the air guide bottom plate is hollow, the bottom of the air guide bottom plate is open, the air guide bottom plate and the air duct cover plate form an air passing channel, the wind shield is hollow and comprises two openings, one opening of the wind shield is connected with the rear panel air outlet, the other opening of the wind shield is connected with the air outlet of the air guide bottom plate, and an air passing space is formed in the wind shield. The high-temperature-humidity, high-mould and high-salt-fog environment has good heat dissipation capability and can be applied to the high-humidity, high-mould and high-salt-fog environment.

Description

Technical Field

[0001] The utility model belongs to the technical field of chassis structures of disk arrays, and in particular relates to a 3U disk array chassis suitable for high-humidity and high-heat environments. Background Art

[0002] Existing disk arrays usually adopt a ventilated chassis structure, that is, an air inlet is opened on the front panel, a fan is placed on the rear panel and an air outlet is opened on the rear panel. Boards, hard disks and other devices are all in a ventilated environment, and devices are more susceptible to corrosion in a high humidity and heat environment. Electronic equipment in the marine environment usually has more stringent environmental requirements. For example, electronic equipment on board usually needs to meet the humidity and heat requirements of ten or even fifteen days. Therefore, the existing disk array in the form of a ventilated chassis is difficult to meet the complex environment with high humidity and heat requirements.

[0003] At the same time, the motherboard of the existing disk array usually adopts a large base plate, that is, the motherboard is directly fixed on the wall of the chassis. When the motherboard is directly installed on the wall of the chassis, when maintaining the board, it is necessary to first take the device out of the cabinet, then open the upper cover, and then remove the board for replacement. Modular replacement is impossible, and the maintenance of the board is poor. Utility Model Content

[0004] The purpose of the utility model is to solve the problems of corrosion that is easy to occur in a high-humidity and heat environment, the inability to modularly replace boards, and the poor maintainability of boards. A 3U disk array chassis suitable for a high-humidity and heat environment is proposed, which has good heat dissipation capability, convenient module maintenance, and good storage capacity expansion capability, and can be used in high-humidity and heat, high-mold, and high-salt fog environments.

[0005] In order to achieve the above purpose, the technical solution provided by the utility model is:

[0006] A 3U disk array chassis suitable for high-humidity and heat environment, comprising a chassis assembly, a maintenance door assembly, a mainboard module, a power module and an electronic disk assembly, wherein the chassis assembly comprises a module frame assembly, a front panel, a rear panel assembly, a left side panel, a right side panel, an upper cover, a wind shield and an air duct cover;

[0007] The module frame assembly, the front panel, the rear panel assembly, the left side panel, the right side panel, the upper cover, the wind shield and the maintenance door assembly form a closed space, and the mainboard module, the power module and the electronic disk assembly are installed in the closed space;

[0008] The module frame assembly includes an air guide base plate, which is hollow and has a bottom opening on a side plate surface located outside the enclosed space, the bottom opening of the air guide base plate cooperates with the air duct cover plate to form an air passage, the air guide base plate is provided with an air guide base plate air inlet and an air guide base plate air outlet, the wind shield is hollow and includes two openings, the rear panel assembly includes a rear panel and a first fan, the rear panel is provided with a rear panel air outlet, the first fan is installed in the rear panel air outlet, one opening of the wind shield is connected to the rear panel air outlet, the other opening of the wind shield is connected to the air guide base plate outlet, and a wind passage space is formed in the wind shield.

[0009] Furthermore, the module rack assembly also includes a left side plate of the module rack, a right side plate of the module rack, a cover plate of the module rack, a passive backplane, a left side plate of the mainboard module, a right side plate of the mainboard module, a left side plate of the electronic disk rack, a right side plate of the electronic disk rack, a plurality of middle partitions of the electronic disk rack, a bottom plate of the electronic disk rack, a plurality of guide plates of the power supply modules, a backplane reinforcement plate and a second fan. The left side plate of the module rack and the right side plate of the module rack are respectively fixed on the upper side of the air guide bottom plate, the cover plate of the module rack is fixed on the upper side of the left side plate of the module rack and the right side plate of the module rack, the passive backplane is fixed on the rear side of the left side plate of the module rack, the right side plate of the module rack and the cover plate of the module rack, and the lower side of the left side plate of the mainboard module and the right side plate of the mainboard module are connected to the air guide bottom plate , the upper sides of the left side plate of the mainboard module and the right side plate of the mainboard module are connected to the bottom plate of the electronic disk rack, the lower sides of the left side plate of the electronic disk rack, the right side plate of the electronic disk rack and the middle partition plate of the electronic disk rack are connected to the bottom plate of the electronic disk rack, the upper sides of the left side plate of the electronic disk rack, the right side plate of the electronic disk rack and the middle partition plate of the electronic disk rack are connected to the module rack cover plate, the power module guide plate is fixed on the upper side of the air guide bottom plate, the backplane reinforcement plate is fixed on the rear side of the passive backplane, a plurality of passive backplane air outlets are opened on the passive backplane, a plurality of backplane reinforcement plate air outlets are opened on the backplane reinforcement plate, the backplane reinforcement plate air outlets correspond to the passive backplane air outlets one by one, and the second fan is installed on one of the backplane reinforcement plate air outlets.

[0010] Furthermore, the module frame assembly, front panel, rear panel, left panel, right panel, upper cover, wind shield and maintenance door assembly form an enclosed space, including: the overlapping surface of the front panel and the left panel, the overlapping surface of the front panel and the right panel, the overlapping surface of the front panel and the wind guide bottom plate, the overlapping surface of the front panel and the upper cover, the overlapping surface of the left panel and the wind guide bottom plate, the overlapping surface of the left panel and the upper cover, the overlapping surface of the left panel and the rear panel, the overlapping surface of the right panel and the wind guide bottom plate, the overlapping surface of the right panel and the upper cover, the overlapping surface of the right panel and the rear panel, the overlapping surface of the wind shield and the rear panel, the overlapping surface of the wind shield and the wind guide bottom plate, and the overlapping surface of the rear panel and the upper cover are all installed with sealing strips, and the maintenance door assembly includes a maintenance door and a sealing strip, a sealing groove is opened on the maintenance door, and the front panel has a front panel opening matching the size of the module frame assembly, the size of the sealing groove is larger than the size of the front panel opening, and the sealing strip is installed in the sealing groove.

[0011] Furthermore, a plurality of heat dissipation fins are arranged in the air passage, and the heat dissipation fins are mounted on the air guide bottom plate.

[0012] Furthermore, an air guide baffle is also provided in the air passage, and the air guide baffle extends from the air inlet of the air guide bottom plate to the air outlet of the air guide bottom plate, and the air guide baffle is installed in contact with the air guide bottom plate and the air duct cover plate at the same time.

[0013] Compared with the prior art, the utility model has the following significant advantages: the board is in a closed cavity, which effectively improves the moisture and heat resistance of electronic components. An independent air duct is designed externally, which effectively improves the heat dissipation capacity of the mainboard module and the whole machine. The internal circulation channel and fan designed in the internal module frame assembly improve the heat dissipation capacity of the electronic disk. The whole machine has a heat dissipation capacity of 200W under high temperature conditions of 55°C. The internal module frame assembly is designed, and the mainboard module, power module and electronic disk assembly are all pluggable in the module frame assembly, and the board is easy to maintain. Up to 24 electronic disks can be installed, which can expand the storage capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a disassembled view of a 3U disk array chassis suitable for a high-humidity and high-heat environment according to the utility model;

[0015] Figure 2 This is a component disassembled view of a 3U disk array chassis suitable for a high-humidity and high-heat environment according to the utility model;

[0016] Figure 3 This is a schematic diagram of a module rack assembly of a 3U disk array chassis suitable for a high-humidity and high-heat environment according to the utility model;

[0017] Figure 4 This is a disassembled view of the rear panel components of a 3U disk array chassis suitable for a high-humidity and high-heat environment according to the utility model;

[0018] Figure 5 This is a disassembled view of a maintenance door assembly of a 3U disk array chassis suitable for a high-humidity and high-heat environment according to the utility model;

[0019] Figure 6 This is a schematic diagram of heat dissipation of a mainboard module of a 3U disk array chassis suitable for a high-humidity and high-heat environment according to the utility model;

[0020] Figure 7 The utility model is a schematic diagram of electronic disk heat dissipation of a 3U disk array chassis suitable for a high-humidity and high-heat environment.

[0021] Explanation of the reference numerals: 1. chassis assembly; 2. pluggable motherboard module; 3. pluggable electronic disk assembly; 4. pluggable power module; 5. maintenance door assembly; 6. module rack assembly; 7. left side panel; 8. front panel; 9. air duct cover; 10. right side panel; 11. rear panel assembly; 12. wind shield; 13. upper cover; 14. air guide bottom plate; 15. power module guide plate; 16. left side panel of motherboard module; 17. right side panel of motherboard module; 18. right side panel of module rack; 19. passive backplane; 20. module rack cover; 21. right side panel of electronic disk rack; 22. middle partition of electronic disk rack; 23. first fan; 24. left side panel of electronic disk rack; 25. backplane reinforcement plate; 26. left side panel of module rack; 27. rear panel; 28. maintenance door; 29. ​​conductive rubber strip; 30. second fan; 31. heat dissipation fins; 32. air guide partition. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0023] like Figures 1-2 As shown, the utility model provides a 3U disk array chassis suitable for a high-humidity and hot environment, including a chassis component 1, a maintenance door component 5, a pluggable electronic disk component 3, a pluggable power module 4 and a pluggable motherboard module 2. The chassis component 1 includes a module frame component 6, a front panel 8, a rear panel component 11, a left side panel 7, a right side panel 10, an upper cover 13, a wind shield 12 and an air duct cover 9. The front panel 8 has a front panel opening that matches the size of the module frame component 6. The maintenance door component 5 and the front panel 8 can be connected by hand screws or countersunk screws, such as Figure 3As shown, the module rack assembly 6 includes an air guide bottom plate 14, a module rack left side plate 26, a module rack right side plate 18, a module rack cover plate 20, a passive backplane 19, a mainboard module left side plate 16, a mainboard module right side plate 17, an electronic disk rack left side plate 24, an electronic disk rack right side plate 21, two electronic disk rack middle partitions 22, an electronic disk rack bottom plate, two power module guide plates 15, a backplane reinforcement plate 25 and a second fan 30, and the module rack left side plate 26 and the module rack right side plate 18 are respectively fixed to the air guide bottom plate The upper side of the board 14, the module frame cover plate 20 is fixed to the upper side of the module frame left side board 26 and the module frame right side board 18, the passive backplane 19 is fixed to the left side board 26 of the module frame, the right side board 18 of the module frame and the rear side of the module frame cover plate 20, the passive backplane 19 is connected to the left side board 7 and the right side board 10 respectively, and the front panel 8 is fixedly connected to the left side board 7, the right side board 10, the module frame left side board 26, the module frame right side board 18, the air guide bottom plate 14, the air duct cover plate 9, the module frame cover plate 20 and the upper cover plate 13, as shown in FIG. Figure 4 As shown, the rear panel assembly 11 includes a rear panel 27 and a first fan 23, and the rear panel 27 is fixedly connected to the left side panel 7, the right side panel 10, the air guide bottom plate 14, the air duct cover plate 9 and the upper cover plate 13. The module frame assembly 6 is used to insert the pluggable electronic disk assembly 3, the pluggable power module 4 and the pluggable mainboard module 2. The power module guide plate 15 is used to realize the plugging and unplugging of the pluggable power module 4.

[0024] The front panel 8, the rear panel 27, the left side panel 7, the right side panel 10, the upper cover 13, the wind guide bottom plate 14, the wind shield 12 and the maintenance door assembly 5 form a closed structure, and the overlapping surfaces of the front panel 8 and the left side panel 7, the overlapping surfaces of the front panel 8 and the right side panel 10, the overlapping surfaces of the front panel 8 and the wind guide bottom plate 14, the overlapping surfaces of the front panel 8 and the upper cover 13, the overlapping surfaces of the left side panel 7 and the wind guide bottom plate 14, the overlapping surfaces of the left side panel 7 and the upper cover 13, the overlapping surfaces of the left side panel 7 and the rear panel 27, the overlapping surfaces of the right side panel 10 and the wind guide bottom plate 14, the overlapping surfaces of the right side panel 10 and the upper cover 13, the overlapping surfaces of the right side panel 10 and the rear panel 27, the overlapping surfaces of the wind shield 12 and the rear panel 27, the overlapping surfaces of the wind shield 12 and the wind guide bottom plate 14, and the overlapping surfaces of the rear panel 27 and the upper cover 13 are all installed with sealing strips, such as Figure 5 As shown, the maintenance door assembly 5 includes a maintenance door 28 and a conductive rubber strip 29. A rubber groove is formed on the maintenance door 28. The size of the rubber groove is larger than the size of the opening of the front panel. The conductive rubber strip 29 is installed in the rubber groove. Thus, a closed space is formed between the front panel 8, the rear panel 27, the left side panel 7, the right side panel 10, the upper cover 13, the wind guide bottom plate 14, the wind shield 12 and the maintenance door assembly 5 to prevent external moisture from entering.

[0025] A rear panel air outlet is provided on the rear panel 27, and the first fan 23 is installed in the rear panel air outlet. An air guide bottom plate air inlet is provided on the front side of the air guide bottom plate 14, and an air guide bottom plate air outlet is provided on the upper side of the air guide bottom plate 14. The wind shield 12 is hollow and includes two openings. One opening of the wind shield 12 is connected to the rear panel air outlet, and the other opening of the wind shield 12 is connected to the air guide bottom plate air outlet. A wind passage space is formed in the wind shield 12. In this embodiment, the first fan 23 is composed of two fans, and the wind direction of the fans is to draw air backwards. The air guide bottom plate 14 is hollow and has a bottom opening on a side panel outside the enclosed space. The bottom opening of the air guide bottom plate 14 cooperates with the air duct cover 9 to form an air passage. The air guide bottom plate 14, the wind shield 12, the rear panel assembly 11 and the air duct cover 9 form an air guide structure. The air enters the air passage through the air guide bottom plate air inlet, and then passes through the wind passage space and is discharged through the rear panel air outlet. Figure 6 As shown, an air guide baffle 32 and a plurality of heat sink fins 31 are provided in the air passage, and the air guide baffle 32 and the heat sink fins 31 are installed on the air guide base plate 14. The heat sink fins 31 are conducive to the heat dissipation of the pluggable motherboard module 2. The extension path of the air guide baffle 32 is from the air inlet of the air guide base plate to the air outlet of the air guide base plate. The air guide baffle 32 is installed in contact with the air guide base plate 14 and the air duct cover plate 9 at the same time, and the air guide baffle 32 is used to guide the wind to the air outlet of the air guide base plate. When the pluggable motherboard module 2 is inserted into the module frame assembly 6, its heat conduction surface is tightly attached to the air guide base plate 14 through the locking strip, and then the heat conduction base plate quickly conducts the heat to the heat sink fins 31, and the heat is brought to the outside air through the first fan 23 on the rear panel 27.

[0026] The lower sides of the left side plate 16 of the mainboard module and the right side plate 17 of the mainboard module are connected to the air guide bottom plate 14, the upper sides of the left side plate 16 of the mainboard module and the right side plate 17 of the mainboard module are connected to the bottom plate of the electronic disk rack, the lower sides of the left side plate 24 of the electronic disk rack, the right side plate 21 of the electronic disk rack and the middle partition plate 22 of the electronic disk rack are connected to the bottom plate of the electronic disk rack, the upper sides of the left side plate 24 of the electronic disk rack, the right side plate 21 of the electronic disk rack and the middle partition plate 22 of the electronic disk rack are connected to the module rack cover plate 20, the pluggable power supply module guide plate 15 is fixed to the upper side of the air guide bottom plate 14, and the backplane reinforcement plate 25 is fixed to the rear side of the passive backplane 19, as shown in FIG. Figure 7As shown, three passive backplane air vents are formed on the passive backplane 19, three backplane reinforcement plate air vents are formed on the backplane reinforcement plate 25, the backplane reinforcement plate air vents correspond to the passive backplane air vents one by one, and the second fan 30 is installed on the middle backplane reinforcement plate air vent. The backplane reinforcement plate 25 is not only used to increase the rigidity of the passive backplane 19 to prevent the passive backplane 19 from deforming when the pluggable module is inserted, but also used to install the second fan 30. When the second fan 30 is working, the air between the partition plates 22 in the middle of the two electronic disk racks flows backward, and the module rack assembly 6 is drawn out by the second fan 30, and the air flows forward into the space between the left side plate 24 of the electronic disk rack and the middle partition plate 22 of the electronic disk rack, and the space between the right side plate 21 of the electronic disk rack and the middle partition plate 22 of the electronic disk rack through the back plate reinforcement plate air outlets and the passive back plate air outlets on both sides, and flows into the space between the middle partition plates 22 of the two electronic disk racks through the gap between the middle partition plate 22 of the electronic disk rack and the maintenance door assembly 5, forming the flow of air in the module rack assembly 6. The second fan 30 can accelerate the heat exchange between the pluggable electronic disk assembly 3 and the air, and improve the heat dissipation capacity of the pluggable electronic disk assembly 3.

[0027] A 3U disk array chassis suitable for high humidity and heat environment in this embodiment can work normally in a high temperature environment of 55°C and a power consumption of 200W for the whole machine. At the same time, the pluggable electronic disk assembly 3, the pluggable power module 4 and the pluggable mainboard module 2 are all designed as pluggable modules. During maintenance, the pluggable electronic disk assembly 3, the pluggable power module 4 and the pluggable mainboard module 2 can be replaced by simply opening the maintenance door 28, which effectively improves the maintainability of the product. This embodiment can accommodate up to 24 electronic disks, which can expand the storage capacity to a larger extent.

[0028] The above-mentioned embodiments only express one or several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A 3U disk array chassis suitable for high humidity and heat environment, characterized in that: It includes a chassis assembly, a maintenance door assembly, a mainboard module, a power module and an electronic disk assembly. The chassis assembly includes a module frame assembly, a front panel, a rear panel assembly, a left side panel, a right side panel, an upper cover, a wind shield and an air duct cover; The module frame assembly, the front panel, the rear panel assembly, the left side panel, the right side panel, the upper cover, the wind shield and the maintenance door assembly form a closed space, and the mainboard module, the power module and the electronic disk assembly are installed in the closed space; The module frame assembly includes an air guide base plate, which is hollow and has a bottom opening on a side plate surface located outside the enclosed space, the bottom opening of the air guide base plate cooperates with the air duct cover plate to form an air passage, the air guide base plate is provided with an air guide base plate air inlet and an air guide base plate air outlet, the wind shield is hollow and includes two openings, the rear panel assembly includes a rear panel and a first fan, the rear panel is provided with a rear panel air outlet, the first fan is installed in the rear panel air outlet, one opening of the wind shield is connected to the rear panel air outlet, the other opening of the wind shield is connected to the air guide base plate outlet, and a wind passage space is formed in the wind shield.

2. The 3U disk array chassis suitable for high humidity and heat environment according to claim 1, characterized in that: The module rack assembly also includes a left side plate of the module rack, a right side plate of the module rack, a cover plate of the module rack, a passive backplane, a left side plate of the mainboard module, a right side plate of the mainboard module, a left side plate of the electronic disk rack, a right side plate of the electronic disk rack, a plurality of middle partitions of the electronic disk rack, a bottom plate of the electronic disk rack, a plurality of guide plates of the power supply modules, a backplane reinforcement plate and a second fan. The left side plate of the module rack and the right side plate of the module rack are respectively fixed on the upper side of the air guide bottom plate, the cover plate of the module rack is fixed on the upper side of the left side plate of the module rack and the right side plate of the module rack, the passive backplane is fixed on the rear side of the left side plate of the module rack, the right side plate of the module rack and the cover plate of the module rack, the lower side of the left side plate of the mainboard module and the right side plate of the mainboard module are connected to the air guide bottom plate, and the The upper sides of the left side plate of the mainboard module and the right side plate of the mainboard module are connected to the bottom plate of the electronic disk rack, the lower sides of the left side plate of the electronic disk rack, the right side plate of the electronic disk rack and the middle partition of the electronic disk rack are connected to the bottom plate of the electronic disk rack, the upper sides of the left side plate of the electronic disk rack, the right side plate of the electronic disk rack and the middle partition of the electronic disk rack are connected to the module rack cover plate, the power module guide plate is fixed on the upper side of the air guide bottom plate, the backplane reinforcement plate is fixed on the rear side of the passive backplane, a plurality of passive backplane air outlets are opened on the passive backplane, a plurality of backplane reinforcement plate air outlets are opened on the backplane reinforcement plate, the backplane reinforcement plate air outlets correspond one-to-one to the passive backplane air outlets, and the second fan is installed on one of the backplane reinforcement plate air outlets.

3. The 3U disk array chassis suitable for high-humidity and high-heat environment according to claim 1, characterized in that: The module frame assembly, front panel, rear panel, left panel, right panel, upper cover, wind shield and maintenance door assembly form a closed space, including: the overlapping surface of the front panel and the left panel, the overlapping surface of the front panel and the right panel, the overlapping surface of the front panel and the wind guide bottom plate, the overlapping surface of the front panel and the upper cover, the overlapping surface of the left panel and the wind guide bottom plate, the overlapping surface of the left panel and the upper cover, the overlapping surface of the left panel and the rear panel, the overlapping surface of the right panel and the wind guide bottom plate, the overlapping surface of the right panel and the upper cover, the overlapping surface of the right panel and the rear panel, the overlapping surface of the wind shield and the rear panel, the overlapping surface of the wind shield and the wind guide bottom plate, and the overlapping surface of the rear panel and the upper cover are all installed with sealing strips, the maintenance door assembly includes a maintenance door and a sealing strip, the maintenance door is provided with a sealing groove, the front panel is provided with a front panel opening matching the size of the module frame assembly, the size of the sealing groove is larger than the size of the front panel opening, and the sealing strip is installed in the sealing groove.

4. The 3U disk array chassis suitable for high-humidity and heat environment according to claim 1, characterized in that: A plurality of heat dissipation fins are arranged in the air passage, and the heat dissipation fins are mounted on the air guide bottom plate.

5. The 3U disk array chassis suitable for high-humidity and heat environment according to claim 4, characterized in that: An air guide baffle is also provided in the air passage, and the air guide baffle extends from the air inlet of the air guide bottom plate to the air outlet of the air guide bottom plate, and the air guide baffle is installed in contact with the air guide bottom plate and the air duct cover plate at the same time.

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