Novel semiconductor automatic film covering device

Abstract

The utility model belongs to the field of semiconductor frame film covering, and provides a novel semiconductor automatic film covering device which comprises a cabin body. The feeding device is provided with a first lifting assembly, the lifting distances of the first lifting assembly each time are the same, so that the interlayer of the cartridge clip corresponds to the first conveying track, and the feeding device is mainly used for automatic carrying of the semiconductor frame; the film laminating device is provided with a film pasting platform and is mainly used for automatic film pasting of the semiconductor frame; the preheating device comprises a plurality of preheating platforms which are arranged in a collinear manner and is used for baking and heating the semiconductor frame after film pasting; and the discharging device is mainly used for carrying and storing the preheated semiconductor frame. The feeding device, the film laminating device, the preheating device and the discharging device are arranged in the sealed cabin, the processes of feeding, film laminating, preheating, discharging and storing are automatically completed through the devices, manual participation is not needed, the environment is relatively stable, the film laminating efficiency is guaranteed, and meanwhile the film laminating quality is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor frame laminating, in particular to a novel semiconductor automatic laminating device. Background Art

[0002] Semiconductors have increasingly played an irreplaceable and important role in today's social production and life, and have penetrated into every aspect of our daily lives. In the semiconductor industry, integrated circuits have always been the main subdivision of the semiconductor industry. Lead frames, as chip carriers of integrated circuits, are a key structural component that uses composite materials to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are important basic materials in the electronic information industry. Lead frames need to be coated during preparation.

[0003] Since the transmission process of the semiconductor frame during the lamination process is relatively cumbersome, how to achieve seamless connection of the loading process of the semiconductor frame while ensuring the orderly transmission of the semiconductor frame while maintaining the loading efficiency of the entire loading process and realizing fully automated lamination is an urgent problem that people in this field need to solve. Utility Model Content

[0004] The utility model provides a novel semiconductor automatic laminating device to solve the problem of how to make the semiconductor frame loading seamless during the semiconductor frame laminating process in the above-mentioned background technology, improve the loading efficiency of the semiconductor frame while ensuring the orderly transmission of the semiconductor frame, realize full-automatic laminating and improve the efficiency of full-automatic laminating.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] Cabin;

[0007] A loading device is arranged in the cabin, and comprises a first loading platform, a first recovery platform, a first lifting assembly, a first pushing assembly, a first conveying track, a first clamping assembly and a first handling assembly. The first loading platform is arranged below the first recovery platform. A plurality of clips with semiconductor frames are arranged on the first loading platform. The first lifting assembly is arranged on one side of the first loading platform, and is used to drive the clips to rise and fall. The first pushing assembly is arranged on the same side as the first lifting assembly. The first pushing assembly is used to push the semiconductor frame. The first conveying track is arranged close to the first lifting assembly, and is used to convey the semiconductor frame. The first clamping assembly is arranged on the first conveying track and is used for the translation of the semiconductor frame along the first conveying track. The first handling assembly is arranged above the first conveying track and is used to move the semiconductor frame away from the first conveying track. The first lifting assembly rises the same distance each time, so that the interlayer of the clip corresponds to the first conveying track.

[0008] A film laminating device is arranged in the cabin and is provided with a film laminating platform. The film laminating device is arranged on one side of the first conveying track and is used for laminating a semiconductor frame.

[0009] A preheating device is located in the cabin and is disposed on the other side of the first conveying track. The preheating device is provided with a plurality of preheating platforms, and the plurality of preheating platforms are used for baking and preheating the semiconductor frame after film pasting;

[0010] The unloading device is located in the cabin and is arranged on one side of the preheating device. The unloading device is used for recovering and storing the semiconductor frames with the films attached after baking.

[0011] In some embodiments, a first translation mechanism is further provided on the first loading platform, a first push block is provided on the first translation mechanism, and the first translation mechanism drives the first push block to perform reciprocating linear movement.

[0012] In some embodiments, the first translation mechanism includes two parallel first guide rods arranged at the bottom of the outer side of the first loading platform, and a first guide slider is arranged on the two first guide rods, wherein a first clearance groove is provided on the first loading platform, and the first guide slider partially passes through the first clearance groove and is connected to the first push block.

[0013] In some embodiments, the first clearance groove is arranged parallel to the first guide rod, and the first clearance groove extends to one side of the first lifting assembly, so that the first pushing block can push the magazine with the semiconductor frame onto the first lifting assembly.

[0014] In some embodiments, the first lifting assembly includes a first lifting rail arranged vertically, a first lifting slider movably arranged on the first lifting rail, and a first lifting bracket connected to the first lifting slider, wherein the first lifting bracket is provided with a first bracket, and the first bracket can move horizontally relative to the first lifting bracket.

[0015] In some embodiments, the first lifting bracket is provided with a reset guide sleeve, a reset guide shaft, a horizontal pushing cylinder and a reset spring, the reset guide sleeve is fixedly arranged on the first lifting bracket, the reset guide shaft is movably arranged on the reset guide sleeve, one end of the reset guide shaft is fixedly connected to the first bracket, a reset spring is arranged between the other end of the reset guide shaft and the reset guide sleeve, and the push rod of the horizontal pushing cylinder is connected to the first bracket.

[0016] In some embodiments, a second push block is disposed on the first bracket, a second push cylinder is disposed on the first lifting bracket, and a push rod of the second push cylinder is connected to the second push block so that the second push block can move horizontally relative to the first bracket.

[0017] In some embodiments, the plurality of preheating platforms of the preheating device are collinearly arranged and collinear with the translation route of the first transport assembly, wherein an ion static removal mechanism is arranged on one side of the plurality of preheating platforms.

[0018] In some embodiments, the first transport assembly includes a first lifting mechanism, which includes a shell, a first lifting cylinder arranged on the shell, a first guide sleeve arranged on the shell, and a first guide shaft arranged on the first guide sleeve, one end of the first guide shaft is connected to the push rod of the first lifting cylinder, the other end of the first guide shaft is provided with a first lifting base plate, the first lifting base plate is provided with a first rotating mechanism, and the first rotating mechanism is provided with a second clamp that can be opened and closed.

[0019] In some embodiments, the unloading device includes a second conveying component, a second conveying track, a second clamping component, a second lifting component, a second loading platform and a second recovery platform, wherein the second conveying component has the same structure as the first conveying component, the second conveying track is the same as the first conveying track, the second clamping component has the same structure as the first clamping component, the second lifting component has the same structure as the first lifting component, the second loading platform has the same structure as the first loading platform, the second recovery platform has the same structure as the second recovery platform, wherein the second conveying component and the first conveying component are arranged on the same track.

[0020] Compared with the prior art, the beneficial effects brought by the utility model are:

[0021] 1. The present application forms a closed film-laminating environment by placing the loading device, laminating device, preheating device and unloading device all in the cabin. At the same time, the loading device, laminating device, preheating device and unloading device are fully automated, without the need for manual intervention, thereby improving the film-laminating efficiency.

[0022] 2. By setting up a magazine equipped with multiple semiconductor frames, the magazine is driven to move up and down by the first lifting component, and the magazine rises the same distance each time, so that the interlayer of the magazine can accurately correspond to the first conveying track, so that the semiconductor frame can be seamlessly pushed to the first conveying track to enter the next process, thereby shortening the time and simplifying the control program.

[0023] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a first three-dimensional structural schematic diagram of the semiconductor frame coating mechanism of the utility model;

[0025] Figure 2 It is a second three-dimensional structural schematic diagram of the semiconductor frame coating mechanism of the utility model;

[0026] Figure 3 This is a schematic structural diagram of a semiconductor frame laminating mechanism of the utility model in which a film pulling device is located at a film cutting position;

[0027] Figure 4 It is a schematic diagram of the three-dimensional structure of the film pasting side of the film pasting platform of the semiconductor frame film pasting mechanism of the utility model;

[0028] Figure 5 for Figure 4 The enlarged view of point A in the middle;

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of the non-film pasting side of the film pasting platform of the semiconductor frame film pasting mechanism of the utility model;

[0030] Figure 7 It is a first-perspective exploded view of the drive control of the film puller and the film cutting knife of the semiconductor frame laminating mechanism of the utility model;

[0031] Figure 8 It is a second-angle exploded view of the drive control of the film puller and the film cutting knife of the semiconductor frame laminating mechanism of the utility model;

[0032] Fig. 9 It is a structural schematic diagram of a film pulling device of a semiconductor frame coating mechanism of the utility model;

[0033] Fig.10 It is a structural schematic diagram of a material storage place of a feeding device of a novel semiconductor automatic laminating device of the utility model;

[0034] Fig.11 It is a schematic diagram of the driving structure of the clip of the feeding device of a novel semiconductor automatic laminating device of the utility model;

[0035] Fig.12 It is a schematic diagram of the assembly of a first lifting component and a first loading platform of a feeding device of a novel semiconductor automatic laminating device of the utility model;

[0036] Fig.13 It is a schematic diagram of the transmission structure of the first lifting component and the first pushing component of the feeding device of a novel semiconductor automatic laminating device of the utility model;

[0037] Fig.14 for Fig.13 Enlarged view of point B in the middle;

[0038] Fig.15 It is a first three-dimensional structural schematic diagram of a first conveying track of a novel semiconductor automatic coating device of the utility model;

[0039] Fig.16 It is a second three-dimensional structural schematic diagram of a first conveying track of a novel semiconductor automated coating device of the utility model;

[0040] Fig.17 It is a three-dimensional structural schematic diagram of a first conveying mechanism and a second conveying mechanism of a novel semiconductor automatic coating device of the utility model;

[0041] Fig.18 This is a schematic diagram of the internal structure of a first transport mechanism of a novel semiconductor automated coating device of the utility model;

[0042] Fig.19 It is a structural schematic diagram of the second clamping claw of the first transport mechanism of a novel semiconductor automated coating device of the utility model;

[0043] Fig. 20 This is a schematic structural diagram of a preheating device for a novel semiconductor automated film coating device of the utility model;

[0044] Fig.21 A top view of the internal structure of a novel semiconductor automatic coating device of the utility model;

[0045] Fig. 22 This is a first stereoscopic diagram of a novel semiconductor automatic coating device of the utility model;

[0046] Fig.23This is a second stereoscopic view of a novel semiconductor automated coating device according to the utility model. DETAILED DESCRIPTION

[0047] The present application is further described in detail below in conjunction with specific drawings. In the description of this embodiment, unless otherwise specified, the terms "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the present application must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application.

[0048] like Figure 1 and Figure 2 As shown, a new type of semiconductor automated laminating device laminating mechanism 100 provided by the utility model mainly includes a mounting bracket 101, a first reel 102, a tensioning assembly 103, a film laminating platform 104, a film puller 105, a film cutting knife 106 and a second reel 107.

[0049] Specifically, the first reel 102 is rotatably disposed on the mounting bracket 101, and a film 1021 is disposed on the first reel 102. The film 1021 includes a base film 10211 and a yellow film for film application (not marked in the figure, the base film 10211 and the yellow film can be separated). It should be particularly noted that the winding path of the film 1021 and the recovery path of the base film 1021 are projected on a straight line on the bottom surface of the mounting bracket 101. Furthermore, the width of the film roll of the first reel 102 can be adjusted, and the outer adjustment side plate of the first reel 102 is manually adjusted according to the actual width of the film 1021.

[0050] The tensioning assembly 103 is arranged on the mounting bracket 101, and the film paper 1021 is sent out from the first reel 102 and is partially wound on the tensioning assembly 103. The film paper 1021 is tensioned and adjusted by the tensioning assembly 103 so that the film paper 1021 is in a straightened state.

[0051] The film pasting platform 104 is arranged on the mounting bracket 101, and the film pasting platform 104 is arranged close to one side of the tensioning assembly 103. In this embodiment, the film pasting platform 104 is a guide rail structure, and its width is close to the width of the film paper 1021. A film pasting area is arranged on the film pasting platform 104, and a first negative pressure area is arranged on the film pasting area. The first negative pressure area is used to adsorb and fix the film paper 1021.

[0052] The film puller 105 is movably arranged just above the film pasting platform 104, and a second negative pressure area is arranged on the film puller 105. Part of the film paper 1021 is fixed by the second negative pressure area, so that the film paper 1021 can be transported and laid to the film pasting area on the film pasting platform 104. The film puller 105 reciprocates above the film pasting platform 104 to realize the transportation of the film paper 1021 and the separation of the bottom film 10211 and the yellow film.

[0053] The film cutting knife 106 is arranged on one side of the film pasting platform 104, that is, on a side perpendicular to the film feeding direction, and is used to cut the yellow film. Specifically, when the base film 1021 and the yellow film are separated to the actual film pasting length of the semiconductor frame, the film cutting knife 106 cuts the light film adsorbed and fixed on the film pasting platform to prepare for the film pasting of the semiconductor frame.

[0054] The second reel 107 is rotatably arranged on the mounting bracket 101, and one end of the bottom film 10211 is wound through the film puller 105 and then connected to the second reel 107. The bottom film 10211 is recycled through the rotation of the second reel 107, thereby realizing the automatic delivery of the film 10211. Specifically, a first motor 1071 is arranged on the mounting bracket 101 at a position corresponding to the second reel 107, and the output shaft of the first motor 1071 is connected to the second reel 107. The bottom film 10211 is recycled through the forward or reverse rotation of the first motor 1071. When the second reel 10211 rotates forward to recycle the bottom film 10211, the second reel 107 rotates counterclockwise to cooperate with the film puller 105 to deliver the film, and vice versa. Optionally, the second reel 107 can also be set to an active structure when the base film 10211 is recovered, that is, the first motor 1071 drives the second reel 107 to rotate. When in the film feeding state, the first motor is stationary, and the second reel 107 can automatically rotate driven by the base film 10211 to adapt to the movement of the film puller 105 to feed the film.

[0055] In one embodiment, Figure 2 As shown, the mounting bracket 101 is provided with a first rotating shaft which can rotate relatively, the first reel 102 is fixedly arranged on the first rotating shaft, and a damper 1022 is arranged at the other end of the first rotating shaft, and the damper 1022 is mainly used for torque adjustment of the first reel 102. According to the film supply state, the required torque holding force is adjusted so that the film paper 1021 needs to exceed a certain torque when it is separated from the first reel 102, thereby ensuring that the film paper 1021 is always kept in a straightened state during the film feeding process. At the same time, it can also prevent the film paper 1021 from transitionally separating from the first reel 02, thereby keeping the film feeding state stable.

[0056] In one embodiment, to further facilitate the adjustment of the state of the film paper 021, the tensioning assembly 103 for winding the film paper 1021 includes a first guide wheel 1031, a second guide wheel 1034, a driven counterweight wheel 1032, and an active lifting wheel 1033. Specifically, the first guide wheel 1031 is arranged near the first reel 102, and is used to support and guide the film paper 1021 to be separated from the first reel 102. It is composed of a ball bearing roller, and the surface roughness is less than 1.6, so as to reduce the friction between the film paper 1021 and the first guide wheel 1031, so as to make the film feeding process smoother; the second guide wheel 1034 is arranged on the side close to the film laminating platform 104, and its principle and structure are the same as those of the first guide wheel 1031, and no further elaboration is made here.

[0057] Furthermore, the driven counterweight wheel 1032 can be lifted and slid to achieve active placement in different positions, and the active lifting wheel 1033 can be actively lifted and adjusted, thereby achieving tension adjustment of the film paper 1021. When the film is sent and the bottom film 10211 is recovered, the film paper 10211 can be kept in a straightened state. Specifically, the film paper 10211 is wound from the bottom of the driven counterweight wheel 1032 and then extends to the top of the active lifting wheel 1033. Then, the film paper 1021 passes under the second guide wheel 1034 and then extends to the film laminating platform 104. After the film paper 1021 is wound in this way, the active lifting wheel 1032 can drive the driven counterweight wheel 1032 to lift and adjust. The driven counterweight wheel 1032 can straighten the film paper 1021. On the one hand, the relative movement of the active lifting wheel 1033 and the driven counterweight wheel 1032 is beneficial to the film paper. 1021 overcomes the resistance of the first reel 102 for transportation, avoiding excessive pulling force to cause greater pulling force to the film paper 1021. On the other hand, the film paper 1021 can also be stored. When the bottom film 10211 is recovered, the film puller 105 needs to move to the side of the tensioning component 103. By adjusting the distance between the first guide wheel 101, the driven counterweight wheel 1032, the active lifting wheel 1033 and the second guide wheel 1034, the film paper 1021 can be stored, the film paper 1021 can be avoided from wrinkles, and the film paper 1021 can always be in a straightened state.

[0058] Furthermore, if Figure 3As shown, a first guide rail 10321 is provided on the mounting bracket 101, and a driven counterweight wheel 1032 is slidably provided on the first guide rail 10321 through a first slider. The first guide rail 10321 is provided vertically, and the film paper 1021 is driven by the active lifting wheel 1033, so that the driven counterweight wheel 1032 is slidably adjusted on the first guide rail 10321. It should be particularly pointed out that three position sensors are also provided on one side of the first guide rail 10321, namely, a first sensor 10322, a second sensor 10324, which are located at the same level at both ends of the first guide rail 10321, and a third sensor 10323, which is located at the same level in the middle of the first guide rail 10321. The driven counterweight wheel 1032 moves between the first sensor 10322 and the second sensor 10324 according to different states of film feeding, and its initialization position is confirmed by the third sensor 10323. Specifically, when the first reel 102 is chucked or the damping is too great to be pulled, the driven counterweight wheel 1032 slides up, and when the driven counterweight wheel 1032 is located at the first sensor 10322, the film feeding action stops; when the film paper 1021 is used up, the driven counterweight wheel 1032 slides down, and the driven counterweight wheel slides to the second sensor 10324, and the film feeding action stops; the position of the driven counterweight wheel 1032 is determined by the driven counterweight wheel 1032 sliding downward or upward through the third sensor 10323, and the active lifting wheel 1033 locates and feedbacks the position of the driven counterweight wheel 1032 according to the third sensor 10323, and chooses whether to perform lifting and lowering adjustment.

[0059] Furthermore, the active lifting wheel 1033 is arranged on the second slider 10332, the second slider 10332 is connected to the second push rod of the second cylinder 10331, the axis of the second push rod is parallel to the first guide rail 10321, the second slider 10332 is slidably arranged on the second guide rail 10333, the second guide rail 10333 is fixed on the mounting bracket 101 and the second guide rail 10333 is arranged parallel to the first guide rail 10321. In this embodiment, in order to facilitate the installation of the second cylinder 10321, a second notch (not shown in the figure) is arranged on the mounting bracket 101 to make way, the active lifting wheel 1033 is connected to the second slider 10332 through the second notch, so that the second cylinder 10331 is arranged on the other side of the mounting bracket 101, thereby achieving a reasonable installation layout of the entire device. The lifting and lowering adjustment of the active lifting wheel 1033 is achieved by moving the second push rod of the second cylinder 10331. Optionally, the adjustment method of the second cylinder 10331 can be replaced by a screw slider mechanism or a synchronous belt and synchronous wheel structure. It can be understood that in this embodiment, it is only necessary to realize the lifting and lowering movement of the second slider 10332, and the driving method of the second slider 10332 is not limited by the present invention.

[0060] Specifically, the action of the tensioning assembly 103 is as follows: after the laminating mechanism 100 starts to operate automatically, the film puller 105 first drives the film paper 1021 to move to the right through the adsorption force of the second negative pressure zone until one end of the film laminating platform 104 is away from the limit position of the tensioning assembly 103. During this process, the active lifting wheel 1033 moves downward synchronously, that is, the second push rod of the second cylinder 10331 begins to extend from the contracted state. At this time, the driven counterweight wheel 1032 begins to descend synchronously with the action of the active lifting wheel 1033 due to the action of gravity. When the film puller 105 delivers the film paper 1021 to the set position, the second push rod of the second cylinder 1031 is also fully extended at this time and reaches the lowest state. At the same time, the position of the driven counterweight wheel 1032 is also completely lowered, and its specific position is between the third sensor 10323 and the second sensor 10324. During this process, the second reel 107 has no film-retracting action, that is, the first stepping motor 1071 does not rotate.

[0061] When the film feeding is completed, the first negative pressure area of ​​the film sticking platform 104 is activated, and then the vacuum generator of the film stretcher 105 breaks the vacuum, and the film paper 1021 is transferred to the film sticking platform 104 for adsorption and fixation, and then the film stretcher 105 starts to move to the side of the tensioning component 103. At the same time, the second reel 107 synchronously reels the film and tears off the bottom film 10211 covering the yellow film. The relative speeds of the two are consistent, or the speed of recovering the bottom film 1021 is slightly slower than the speed of moving the film stretcher 105. To ensure that the bottom film 10211 does not exert any force on the yellow film other than tearing the film, while tearing the bottom film 10211, the second push rod of the second cylinder 10331 contracts synchronously, and the synchronous action with the film puller 105 is completed. After reaching the film cutting position, the yellow film is cut by the film cutting knife 106. At this time, the second cylinder 10331 will perform another extension and retraction action, the purpose of which is to lift the position of the driven counterweight wheel 1032 to between the third sensor 10323 and the first sensor 10322.

[0062] When the film puller 105 tears the film and retreats to the initial position, the second cylinder 10331 will choose whether to move according to the position of the sensing bracket of the driven counterweight wheel 1032, that is, if the position of the driven counterweight wheel 1032 is between the first sensor 10322 and the third sensor 10323, the second cylinder 10331 will have no corresponding action; if the driven counterweight wheel 1032 is between the second sensor 10324 and the third sensor 10323, the second cylinder 10331 will complete a telescopic action so that the driven counterweight wheel 1032 is always located between the third sensor 10323 and the first sensor 10322 before the next film delivery; if the driven counterweight wheel 1032 is not within this range, the unit cannot be initialized.

[0063] In one embodiment, since the width of the film paper 1021 may vary according to the structural changes of different products, in order to better guide the film paper 1021 to the film pasting platform 104, a guide support platform 108 is provided on the side of the film pasting platform 104 close to the tensioning assembly 103, and a smooth first guide surface 1081 is provided on the guide support platform 108. The film paper 1021 passes under the second guide wheel 1034 and then passes through the guide support platform 108 to be transported to the film pasting platform 104. Specifically, the first guide surface 1081 is an arc structure, which is tangent to the plane where the film pasting platform 104 is located, thereby reducing the friction between the film paper 1021 and the guide support platform 108. Optionally, the first guide surface 1081 can also be set as a roller structure to convert sliding friction into rolling friction, further reducing the friction between the film paper 1021 and the guide support platform 108 during the conveying process; it should be noted that the guide support platform 108 and the film laminating platform 104 are in the same horizontal plane, thereby ensuring the lamination of the film paper 1021 and the film laminating platform 104. Further, in order to facilitate the replacement of the guide support platform 108, in this embodiment, the guide support platform 108 is locked and adjusted by bolts, and the guide support platform 108 can also be fixed by snap-on. It can be understood that the fixing method of the guide support platform 108 is not limited by the present utility model.

[0064] In one embodiment, in order to fix the yellow film and prevent the yellow film from being damaged by external mechanical structures, a plurality of first adsorption holes 1041 are arranged in the film sticking area of ​​the film sticking platform 104, and the plurality of first adsorption holes 1041 are evenly arranged to form a first negative pressure area. In this embodiment, the first adsorption holes 1041 are connected through an external negative pressure mechanism, and the distribution area of ​​the first adsorption holes 1041 is larger than the required area of ​​the yellow film, so that the yellow film is completely fixed. At the same time, the negative pressure mechanism fixes the yellow film without contact, avoiding mechanical damage to the yellow film when other devices are used for fixation. The first adsorption holes 1041 are evenly distributed, so that the adsorption force on the yellow film is uniform, thereby ensuring the flatness of the yellow film. Furthermore, since the negative pressure requirements for each area are different in different stages of film fixing, film tearing, and film sticking, the first negative pressure area is set into two relatively independent first adsorption areas 1045 and second adsorption areas 1046, such as Figure 6 As shown, the baffle 1044 is set in the middle for independent isolation, wherein the first adsorption area 1045 and the second adsorption area 1046 are provided with negative pressure by different negative pressure mechanisms. After the film paper 1021 is delivered to the right place, the first adsorption area 1045 and the second adsorption area 1046 work to adsorb and fix the film paper 1021. When tearing the film, the first adsorption area 1045 reduces the pressure but does not break the vacuum, and the second adsorption area 1046 works normally, so that the bottom film 10211 and the yellow film are better separated. It should be noted that, as Figure 4As shown, there are a plurality of film pasting clearance grooves 1042 on the film pasting platform 104 for making way when film pasting is applied to the semiconductor frame.

[0065] In one embodiment, the film puller 105 is used to transport the film paper 1021, and the method of fixing the film paper 1021 is also controlled by negative pressure adsorption to prevent the film paper 1021 from being damaged. Specifically, the film puller 105 is provided with a first adsorption plane 1059 on one side close to the film pasting platform 104, wherein the first adsorption plane 1059 is arranged parallel to the film pasting platform 104, and a plurality of second adsorption holes 10591 are arranged on the first adsorption plane 1059, and the plurality of second adsorption holes 10591 are evenly arranged to form a second negative pressure area. When conveying the film paper 1021, the second negative pressure zone generates negative pressure to fix the film paper 1021, and the film stretcher 105 drives the film paper 1021 to move. After reaching the destination, the first negative pressure zone starts to work, generating a downward adsorption force on the film paper 1021. At the same time, the second negative pressure zone on the film stretcher 105 maintains the adsorption force, and the film stretcher 105 is moved upward to separate the bottom film 10211 from the yellow film. Then the film stretcher 105 moves to the side of the tensioning component 103 to achieve film tearing.

[0066] Furthermore, if Fig. 9 As shown, in order to realize smoother recovery of the base film 10211, a second guide surface 1058 is provided on the side of the film puller 105 away from the tensioning assembly 103, and the base film 10211 passes through the second adsorption area and then passes through the second guide surface 1058 to be connected to the second reel 107. Specifically, the second guide surface 1058 is inclined toward the side of the second reel 107, and the inclination angle is small, generally less than 45, such as 40°, 30°, etc. If the resistance of the film puller 105 to the base film 10211 is not considered, the inclination angle of the second guide surface 1058 can also be greater than 45°. Further, a smooth fillet 10581 is provided between the second guide surface 1058 and the first adsorption plane 1059 for transition, and the smooth fillet 10581 is tangent to both the first adsorption plane 1059 and the second guide surface 1058, so that the friction resistance between the base film 10211 and the film puller 105 is smaller, and the second reel 107 recovers the base film more smoothly. Optionally, a roller structure may be provided at the transition point between the second guide surface 1058 and the first adsorption plane 1058 , wherein the roller structure is tangent to the first adsorption plane 1059 and the second guide surface 1508 , respectively, thereby reducing the resistance during the recovery process of the base film 10211 .

[0067] In order to better provide guidance for the film paper 1021 and keep the film paper 1021 flat during transportation, a guide plate 1055 is set on the side of the film puller 105 close to the tensioning assembly 103, and a first limiting surface 10551 is set on the guide plate 1055 close to the side of the film laminating platform 104, wherein the first limiting surface 10551 and the first adsorption plane 1059 are coplanar, so that the film paper 1021 can maintain a horizontal state during transportation. Specifically, the width of the guide plate 1055 is the same as the width of the film paper 1021, and the guide plate 1055 has a certain length in the conveying direction of the film paper 1021, thereby realizing the guidance of the film paper 1021 during transportation.

[0068] In order to realize the reciprocating movement of the film-feeding device 105, as Figure 7 and Figure 8 As shown, the film laminating mechanism 100 also includes a first translation assembly placed on the mounting bracket 101, and the film puller 105 is arranged on the first translation assembly, wherein the film puller 105 can be lifted and lowered relative to the first translation assembly. Specifically, the first translation assembly includes a third guide rail 1052, the third guide rail 1052 is arranged horizontally, a third slider 1051 is arranged on the third guide rail 1052, the film puller 105 is connected to the third slider 1051, the third slider 1051 is also connected to the third synchronous belt 1053, the third synchronous belt 1053 is sleeved on the third synchronous wheel 1054, the third synchronous wheel 1054 is connected to the third motor 109, and the reciprocating movement of the grinder 105 is realized through the forward and reverse rotation of the third motor 109, so as to realize the film feeding or cooperate with the second reel 107 to realize the recovery of the bottom film 1071. Optionally, the translation of the film puller 105 can also be achieved through a screw slider structure, or the extension and retraction of the cylinder push rod. It can be understood that the translation of the film puller 105 is the target point, and the translation method and drive of the film puller 105 are not limited by the present invention.

[0069] Furthermore, since the film stretcher 105 needs to deliver and tear the film, the film stretcher 105 can be raised and lowered relative to the first translation assembly. During the film delivery process, the film stretcher 105 needs to maintain a distance from the film sticking platform 104 to avoid interference between the two during the movement of the film stretcher 105. Therefore, during the film delivery process, the film stretcher 105 is raised and lowered relative to the film sticking platform. In this embodiment, in order to avoid a large lifting and floating of the film stretcher 105, the lifting distance of the film stretcher 105 is 1 mm. Specifically, as a preferred embodiment, the lifting structure of the film stretcher 105 includes a third cylinder 1056 fixedly connected to the third slider 1051, and the third push rod 1057 of the third cylinder 1056 is fixedly connected to the film stretcher 105. The lifting and lowering adjustment of the film stretcher 105 is achieved by adjusting the telescopic adjustment of the third push rod 1057. After the film paper 1021 reaches the target position, the film puller 105 descends. At this time, the film puller 105 is attached to the surface of the film sticking platform 104. When the film paper 1021 is adsorbed and fixed by the film sticking platform 104, the film puller 105 rises 1mm and moves horizontally to the side of the tensioning component 103, thereby realizing film tearing.

[0070] In one embodiment, when the yellow film is torn to a preset length, the yellow film needs to be cut and separated. To facilitate the cutting of the yellow film, a film cutting knife 106 is disposed on the first translation assembly. The film cutting knife 106 is disposed along the edge of the film stretcher 105, that is, the moving route of the film cutting knife 106 is tangent to the intersection of the second guide surface 1058 and the first adsorption plane 1059 of the film stretcher 105. By disposing the film cutting knife 106 on the first translation assembly, the film cutting knife 106 and the film stretcher 105 keep moving synchronously, and when the length of the yellow film changes, there is no need to adjust the position of the film cutting knife 106.

[0071] Furthermore, if Figure 5 As shown, a first clearance groove 1043 is provided on the film sticking platform 104. When the film cutting knife 106 moves to the first clearance groove 1043, the film cutting knife 105 can pass through the first clearance groove 1043 to cut the yellow film. Furthermore, the reciprocating movement of the film cutting knife 106 is realized by the fourth cylinder 1061 in this embodiment, and the fourth push rod 1062 on the fourth cylinder 1061 drives the film cutting knife 106 to reciprocate. Optionally, the reciprocating movement of the film cutting knife 106 can also be realized by means of hydraulic pressure or a screw slider assembly. It can be understood that the movement mode of the film cutting knife 106 is not limited by the present utility model.

[0072] In one embodiment, Figure 21-23As shown, a new type of semiconductor automatic laminating device provided by the utility model includes: a cabin 300 with an installation space, a laminating mechanism 100, which is arranged in the installation space of the cabin 300 through an installation bracket 101, a loading device 200 arranged in the cabin 300, used for placing, transporting and laminating semiconductor frames that are not laminating; a preheating device 207 arranged in the cabin 300, used for heating and baking the semiconductor frames after laminating; and a unloading device 208 arranged in the cabin 300, used for recycling the baked semiconductor frames. In this embodiment, the cabin 300 is provided with a plurality of hatches, which can form a closed space when the hatches are closed, so as to avoid direct convection between the internal mechanism of the cabin 300 and the external environment of the cabin 300, and ensure that the environment in the cabin 300 reaches the stable environment required for laminating.

[0073] Specifically, Fig.10 , Fig.12 , Fig.15 as well as Fig.17 As shown, the loading device 200 includes a first loading platform 201 , a first recovery platform 202 , a first lifting assembly 203 , a first pushing assembly 2032 , a first conveying track 204 , a first clamping assembly 2043 , and a first handling assembly 205 .

[0074] A plurality of magazines 2015 are disposed on the first loading platform 201, and each magazine 2015 is provided with a plurality of interlayers 20152 disposed in parallel. Fig.14 As shown, the interlayer 20152 is composed of a notch, and a third guide surface 20151 is provided at both ends of the notch constituting the interlayer 20152. The third guide surface 20151 expands outward along the notch. The interlayer 20152 is horizontally arranged for placing the semiconductor frame, wherein the semiconductor frame can move relative to the clip 2015 under the action of an external force. Fig.11As shown, a first clearance groove 2011 is provided on the first loading platform 201, and the first clearance groove 2011 is provided in parallel with the first guide rod 2013, and the first clearance groove 2011 extends to one side of the first lifting assembly 203, so that the first push block 2012 can push the clip 2015 carrying the semiconductor frame onto the first lifting assembly 203. A first translation structure is provided at the outer bottom of the first loading platform 201, and the first translation mechanism includes two parallel first guide rods 2013, and a first guide slider 2014 is provided on the first guide rod 2013. The first guide slider 2014 is connected to the first push block 2012 provided on the same side of the clip 2015 through the first clearance groove 2011, and the first push block 2012 is driven to move by the first guide slider 2014, so as to realize the movement of the clip 2015 and push the clip 2015 onto the first lifting assembly 203. In this embodiment, as a preferred implementation, the first guide slider 2014 is driven by a motor-driven synchronous belt and synchronous wheel structure. Optionally, the first guide slider 2014 can also be driven by a screw slider structure or a cylinder structure.

[0075] The first lifting assembly 203 is disposed on one side of the first loading platform 201. The first lifting assembly 203 is provided with a first bracket 20315. In the initial position, the first bracket 20315 is disposed coplanar with the first loading platform 201. A second push block 20316 is disposed on the first bracket 20315. The second push block 20316 can move horizontally relative to the first bracket 20315. When the semiconductor frame on the interlayer 20152 of the clip 2015 is transported, the first bracket 20315 is disposed coplanar with the first recovery platform 202, so that the second push block 20316 pushes the empty clip 2015 to the first recovery platform 202. The first recovery platform 202 is disposed parallel to the first loading platform 201. In this embodiment, as the best embodiment, the second push block 20316 is telescopically moved by the second push cylinder 203161.

[0076] The first lifting assembly 203 also includes a first lifting guide rail 20314 arranged vertically, and a first lifting slider 20313 arranged on the first lifting guide rail 20314. The first lifting slider 20313 moves and drives the first bracket 20315 to be lifted and lowered. In this embodiment, the first lifting slider 20313 realizes lifting and lowering adjustment through the structure of the first screw rod 20311 and the first nut 20312, and the screw rod is combined with the motor to realize forward and reverse rotation. Optionally, the lifting and lowering adjustment can also be realized through a synchronous belt and synchronous wheel structure, or a guide shaft and guide sleeve and other structures. Further, as Fig.13As shown, in order to enable the first bracket 20315 to move toward the first loading platform 201, a first lifting bracket 203155 is arranged between the first lifting slider 20313 and the first bracket 20315, the first lifting bracket 203155 is connected to the first nut 20312, a reset guide shaft 203153 and a reset guide sleeve 203152 arranged on the outer side of the reset guide shaft 203153 are arranged on the first lifting bracket 203155, a reset spring 203154 is arranged on the reset guide shaft 203153, and a horizontal push cylinder 203151 is also arranged on the first lifting bracket 203155. The push rod of 203151 is connected to the first bracket 20315, and one end of the reset guide shaft 203153 is connected to the first bracket 20315. When the push rod of the horizontal push cylinder 203151 drives the first bracket 20315 to move toward the first loading platform 201, the reset spring 203154 is compressed. When the horizontal push cylinder 203151 loses pressure, the first bracket 20315 returns to the initial position under the action of the reset spring 203154, that is, the interlayer 20152 of the clip 2015 corresponds to the first guide groove 20412, that is, the two are horizontally aligned, and the semiconductor frame can be transported to the first guide groove 20412. It should be noted that, in order to facilitate control, the aforementioned second push cylinder 203161 is also arranged on the first lifting bracket 203155, and is lifted and lowered synchronously with the first bracket 20315.

[0077] Furthermore, in order to make the clip 2015 more stably fixed during the transportation of the semiconductor frame, a first fixed cylinder 2033 is also arranged above the clip 2015, and a first fixed block is provided on the first fixed cylinder 2033. The first fixed block is disengaged from or pressed against the clip 2015 by lifting and lowering the push rod of the first fixed cylinder 2033, so that the clip 2015 is clamped and fixed on the first bracket 20315. It should be noted that the second push block 20316 and its corresponding control structure are lifted and lowered synchronously with the first bracket 20315, and the first fixed cylinder 2033 is lifted and lowered synchronously with the first bracket 20315.

[0078] The first pushing assembly 2032 includes a third pushing block 20325, a third pushing guide rail 20324, a third pushing slider 20323 arranged on the third pushing guide rail 20324, and a third pushing cylinder 30321. The third pushing cylinder 20321 is provided with a third linear push rod 20322, the third linear push rod 20322 is connected to the third pushing block 20325 and to the third pushing slider 20323, the third pushing guide rail 20324 is horizontally arranged, thereby limiting the third pushing block 20325 from making horizontal linear reciprocating movements, and the third linear push rod 20322 is controlled by the third pushing cylinder 20321, so that the third pushing block 20325 pushes the semiconductor frame out of the interlayer 20152 of the clip 2015. In this embodiment, the third push block 20325 is fixed in the vertical direction and only moves back and forth in a straight line in the horizontal direction. When the first lifting assembly 203 drives the clip 2015 to rise, the lifting distance each time is the same, so that the position of the semiconductor frame arranged on different interlayers 20152 of the clip 2015 corresponds to the position of the third push block 20325. It should be particularly noted that the center distance between the notches of two adjacent interlayers 20152 is the same as the height of the first lifting assembly 203, so as to achieve a one-to-one correspondence between the positions of the interlayers 20152 and the third push block 20325. Optionally, the third push cylinder 20321 can be replaced by a synchronous belt synchronous wheel structure or a screw slider structure or a hydraulic transmission method, so that the third push slider 20323 moves linearly along the third push guide rail 20324.

[0079] The first conveying track 204 is arranged close to the first lifting assembly 203. When the first lifting assembly 203 is loaded with the clip 2015, one end of the first conveying track 204 is relatively close to one end of the clip 2015, so that the third pushing block 20325 can push the semiconductor frame from the clip 2015, and the semiconductor frame can be smoothly conveyed to the first guide groove 20412 of the first conveying track 204. The first guide groove 20412 has the same width as the semiconductor frame, and the semiconductor frame can move in a straight line along the first guide groove 20412. The length direction of the first guide groove 20412 is parallel to the length direction of the clip 2015, and the lower end surface of the notch of the interlayer 20152 is flush with the groove surface of the first guide groove 20412, so that the semiconductor frame can be smoothly pushed to the first guide groove 20412 without a height difference.

[0080] like Fig.15As shown, when the semiconductor frame is transported to the first guide groove 20412, the first clamping assembly 2043 disposed above the first guide groove 20412 clamps the semiconductor frame and drags the semiconductor frame along the first guide groove 20412 to the target position, that is, the position where the first transport assembly 205 can clamp the semiconductor frame. Specifically, the first clamping assembly 2043 includes two first clamping cylinders, and the two first clamping cylinders are respectively provided with first clamps that can move toward or away from each other. The first clamps are controlled by the first clamping cylinders to achieve clamping and dragging of the semiconductor frame. It should be noted that the first clamps do not move the semiconductor frame in the vertical direction, and only make the semiconductor frame do translational motion along the first guide groove 20412. The first clamping assembly also includes a first clamping guide shaft 2044 arranged in parallel, a first clamping slider 2047 arranged on the first clamping guide shaft 2044, the first clamping slider 2047 is connected to the first clamping synchronous belt 2045, the first clamping synchronous belt 2045 is wound with a synchronous wheel, and the synchronous wheel is connected to the first translation motor 2046. Through the forward and reverse rotation of the first translation click 2046, the first clamping jaw can achieve reciprocating linear movement along the first guide groove 20412. It should be noted that when the semiconductor frame is transported to the first guide groove 20412, the detection mechanism 2042 will detect the product to determine whether the product is a good product or a defective product. If it is a good product, it will enter the next process along the first guide groove 20412. If it is a defective product, it will be returned to the clip 2015 along the original path. If the semiconductor frame is upside down, it will continue to proceed to the next process normally. Before the first transport assembly 205 clamps the semiconductor frame for the next process, the first transport mechanism rotates 180 degrees so that the semiconductor frame position corresponds to the film-sticking process. In this embodiment, the detection structure 2042 is a visual inspection system or a 2D code scanning mechanism.

[0081] Furthermore, due to different processing requirements, the width of the first conveying track 204 can be adjusted. In the present application, the first conveying track 204 is composed of two independently arranged clamps 2041, one of which is fixedly arranged, and the other clamp 2041 is arranged on the bottom wall of the cabin 300 through a guide rail slider structure. In this embodiment, in order to further meet the automation requirements, the clamps 2041 arranged on the guide rail slider are driven by a motor to adjust the spacing, which can be adjusted according to actual processing requirements.

[0082] The first transport component 205 is movably arranged in the cabin 300, and includes a first lifting mechanism and a second clamp 20561 arranged on the first lifting structure. The second clamp 20561 is used to clamp the semiconductor frame to the coating mechanism for coating, and transport the semiconductor frame with coating to the preheating device 207 for preheating and baking, and then return to the first conveying track 204 to continue clamping new semiconductor frames, and repeat this cycle. In this embodiment, the first lifting mechanism includes a first lifting cylinder 2051, a first guide shaft 2052, a first guide sleeve 2053, a first lifting base plate 2054 and a first rotating mechanism 2055. The first guide sleeve 2053 is fixed to the housing of the first lifting mechanism. The first guide shaft 2052 is arranged on the first guide sleeve 2053 and can move axially along the first guide sleeve 2053. The push rod of the first lifting cylinder 2051 is fixedly connected to one end of the first guide shaft 2052, and the other end of the first guide shaft 2052 is fixedly connected to the first lifting base plate 2054. The first rotating mechanism 2055 is arranged below the first lifting base plate 2054. Fig.18 and 19 As shown, the second clamping jaw 20561 is movably arranged on the first rotating mechanism 2055 through the first mounting plate 2056. The first rotating mechanism 2055 is used to adjust the head and tail positions of the semiconductor frame, that is, to rotate the semiconductor frame 180°. Similar to the principle of the first clamping jaw, the second clamping jaw 20561 is also opened and closed by pneumatic control. It should be particularly noted that the second clamping jaw 20561 is an L-shaped structure, and the maximum distance between the two corresponding second clamping jaws 20561 is equal to the width of the semiconductor frame. When the second clamping jaw 20561 clamps the semiconductor frame for transportation or semiconductor When the film is applied to the body frame, the second clamping jaw 20561 only applies a lifting force in the opposite direction of the gravity of the semiconductor frame to the semiconductor frame. At the same time, during the film application process, the plurality of film application clearance grooves 1042 provided on the film application platform 104 are used to make way. At this time, the second clamping jaw 20561 has no force on the semiconductor frame, thereby applying the film. At the same time, an upwardly concave pressing plate is provided under the first rotating mechanism 2055. At this time, the upward direction is the opposite direction of gravity. The pressing plate only exerts downward pressure on the edge of the semiconductor frame to apply the film, thereby preventing the pressing plate from squeezing the chip in the middle of the semiconductor frame. Further, a plurality of second clearance grooves 20411 are provided on the first conveying track 204. The second clearance grooves 20411 are used to make way for the second clamping jaw 20561, so that the second clamping jaw 20561 can clamp the semiconductor frame through the second clearance grooves 20411.

[0083] Furthermore, the first transport mechanism can also move horizontally, specifically, Fig.17As shown, the first transport assembly also includes a second guide shaft (marked in the figure, and arranged in the same horizontal plane as the second linear guide rail) arranged in the cabin 300, a second guide sleeve arranged on the second guide shaft, a second linear guide rail 2057, and a second translation slider 2056 arranged on the second linear guide rail 2057, wherein the second linear guide rail 2057 is arranged parallel to the second guide shaft and is located in the same horizontal plane, the first lifting mechanism is connected to the second guide sleeve and the second translation slider 2056 respectively, and the first lifting mechanism is arranged horizontally, and the horizontal movement adjustment of the first lifting structure is realized by the movement of the second translation slider 2056, thereby realizing the transportation of the semiconductor frame. In this embodiment, the second translation slider 2056 is connected to the second synchronous belt, and the second synchronous belt is wound around two second synchronous wheels, one of which is connected to the output shaft of the second motor, thereby realizing the movement of the second translation slider. Optionally, the second translation slider 2056 can also be realized by a screw slider structure, or a linear cylinder structure. It can be understood that the movement of the second translation slider 2056 is not limited by the present utility model. It should be noted that in order to simplify the movement trajectory of the first lifting mechanism, the first conveying track 204 and the film laminating platform 104 and the preheating device 207 of the laminating mechanism 100 are located on the same straight line. The first lifting structure only needs to move in a straight line to complete the transportation, lamination and preheating of the semiconductor frame.

[0084] In one embodiment, Fig. 20 As shown, the preheating device 207 includes a plurality of preheating platforms 2071 arranged in parallel, and each preheating platform 2071 is provided with two heating rods 20711 and a thermocouple 20712, so that the temperature difference of a single preheating platform 2071 is within a small range from the temperature difference of each preheating platform 2071, thereby avoiding the situation where the temperature difference of a single preheating platform 2071 is too large. Furthermore, the preheating device 207 also includes an ion static elimination mechanism 2072, which eliminates product static electricity for the semiconductor frame on the preheating platform 2071 that has been filmed.

[0085] In one embodiment, Fig.23As shown, in order to ensure that the film-laminating environment in the cabin 300 is qualified, an environmental monitor (not marked in the figure) and an air filtering mechanism are also provided inside the cabin 300. When the film-laminating device starts to run, the environmental detector runs synchronously. The environmental monitor is arranged near the film-laminating mechanism. When the film-laminating environment reaches the set critical value, the environmental monitor will issue a prompt. At this time, the air filtering mechanism starts to work, continuously providing a steady stream of filtered clean air to the cabin, and at the same time discharging the hot air inside the cabin to the outside of the cabin. Specifically, the air filtration structure includes an air inlet 301 provided with a filter screen, and an air inlet fan is arranged at the air inlet 301 to transport the outside air to the cabin 300. At the same time, an exhaust duct 2073 is arranged near the preheating platform 2071. One end of the exhaust duct 2073 faces the preheating platform 2071, and the other end of the exhaust duct 2073 is connected to the air inlet of the exhaust fan. The exhaust port of the exhaust fan extends out of the cabin 300, and the air inside the cabin 300 and the hot air generated by the preheating platform 2071 are continuously discharged to the outside of the equipment. Combined with the ion static removal mechanism 2072, the film pasting operation environment in the entire cabin 300 is guaranteed to be qualified. In this embodiment, in order to achieve seamless connection of the semiconductor frame, that is, transportation, film pasting, and preheating, the time required for preheating, transportation time, and film pasting time are calculated according to the semiconductor frame model in this embodiment, and 6 preheating platforms 2071 are arranged, that is, just meeting the seamless connection of the entire process of the semiconductor frame, avoiding too much waiting time and reducing the film pasting efficiency.

[0086] In one embodiment, after the semiconductor frame with film attached is preheated, it needs to be moved from the preheating platform 2071 to a storage location, so a material unloading device 208 is provided to recycle and store the preheated semiconductor frame.

[0087] Specifically, the unloading device 208 includes a second loading platform, a second recovery platform 2081, a second lifting assembly 2082, a second conveying track 2083, a second clamping assembly and a second handling assembly 2084. A plurality of empty clips 2015 are placed on the second loading platform for storing semiconductor frames with films attached. It should be noted that the second loading platform has the same structure and principle as the first loading platform 201, the second recovery platform 2081 has the same structure and principle as the first recovery platform 202, the second lifting assembly 2082 has the same structure and principle as the first lifting assembly 203, the second conveying track 2083 has the same structure and principle as the first conveying track 204, the second clamping assembly has the same structure and principle as the first clamping assembly 2043, and the second handling assembly 2084 has the same structure and principle as the first handling assembly 205. The above description has been made clear and will not be repeated here. It should be noted that, in order to simplify the structure and the movement trajectory of the second transport component 2084, the second transport component 2084 and the first transport component 205 share the second guide shaft, but the drive control of the second transport component 2084 and the first transport component 205 are independent of each other, and the movement of the second transport component 2084 is achieved by setting an independent synchronous belt and synchronous wheel mechanism.

[0088] The above is only a preferred embodiment of the present invention. It should be noted that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be considered as the protection scope of the present invention.

Claims

1. A novel semiconductor automatic coating device, characterized in that: include: Cabin; A loading device is arranged in the cabin, and comprises a first loading platform, a first recovery platform, a first lifting assembly, a first pushing assembly, a first conveying track, a first clamping assembly and a first handling assembly. The first loading platform is arranged below the first recovery platform. A plurality of clips with semiconductor frames are arranged on the first loading platform. The first lifting assembly is arranged on one side of the first loading platform, and is used to drive the clips to rise and fall. The first pushing assembly is arranged on the same side as the first lifting assembly. The first pushing assembly is used to push the semiconductor frame. The first conveying track is arranged close to the first lifting assembly, and is used to convey the semiconductor frame. The first clamping assembly is arranged on the first conveying track and is used for the translation of the semiconductor frame along the first conveying track. The first handling assembly is arranged above the first conveying track and is used to move the semiconductor frame away from the first conveying track. The first lifting assembly rises the same distance each time, so that the interlayer of the clip corresponds to the first conveying track. A film laminating device is arranged in the cabin and is provided with a film laminating platform. The film laminating device is arranged on one side of the first conveying track and is used for laminating a semiconductor frame. A preheating device is located in the cabin and is disposed on the other side of the first conveying track. The preheating device is provided with a plurality of preheating platforms, and the plurality of preheating platforms are used for baking and preheating the semiconductor frame after film pasting; The unloading device is located in the cabin and is arranged on one side of the preheating device. The unloading device is used for recovering and storing the semiconductor frames with the films attached after baking.

2. A novel semiconductor automatic coating device according to claim 1, characterized in that: The first loading platform is also provided with a first translation mechanism, on which a first push block is provided, and the first translation mechanism drives the first push block to perform reciprocating linear movement.

3. A novel semiconductor automatic coating device according to claim 2, characterized in that: The first translation mechanism includes two parallel first guide rods arranged at the outer bottom of the first loading platform, and first guide sliders are arranged on the two first guide rods, wherein a first clearance groove is provided on the first loading platform, and the first guide slider partially passes through the first clearance groove and is connected to the first push block.

4. A novel semiconductor automated coating device according to claim 3, characterized in that: The first clearance groove is arranged in parallel with the first guide rod, and the first clearance groove extends to one side of the first lifting assembly, so that the first pushing block can push the magazine with the semiconductor frame onto the first lifting assembly.

5. A novel semiconductor automatic coating device according to claim 1, characterized in that: The first lifting assembly includes a first lifting guide rail arranged vertically, a first lifting slider movably arranged on the first lifting guide rail, and a first lifting bracket connected to the first lifting slider. The first lifting bracket is provided with a first bracket, and the first bracket can move horizontally relative to the first lifting bracket.

6. A novel semiconductor automated coating device according to claim 5, characterized in that: The first lifting bracket is provided with a reset guide sleeve, a reset guide shaft, a horizontal pushing cylinder and a reset spring. The reset guide sleeve is fixedly arranged on the first lifting bracket, and the reset guide shaft is movably arranged on the reset guide sleeve. One end of the reset guide shaft is fixedly connected to the first bracket, and a reset spring is arranged between the other end of the reset guide shaft and the reset guide sleeve. The push rod of the horizontal pushing cylinder is connected to the first bracket.

7. A novel semiconductor automated coating device according to claim 5, characterized in that: A second push block is disposed on the first bracket, a second push cylinder is disposed on the first lifting bracket, and a push rod of the second push cylinder is connected to the second push block so that the second push block moves horizontally relative to the first bracket.

8. The novel semiconductor automatic coating device according to claim 1 is characterized in that: The plurality of preheating platforms of the preheating device are arranged in a collinear manner and in a collinear manner with the translation route of the first transport component, wherein an ion static removal mechanism is arranged on one side of the plurality of preheating platforms.

9. The novel semiconductor automatic coating device according to claim 1, characterized in that: The first transport assembly includes a first lifting mechanism, which includes a shell, a first lifting cylinder arranged on the shell, a first guide sleeve arranged on the shell, and a first guide shaft arranged on the first guide sleeve, one end of the first guide shaft is connected to the push rod of the first lifting cylinder, the other end of the first guide shaft is provided with a first lifting base plate, the first lifting base plate is provided with a first rotating mechanism, and the first rotating mechanism is provided with a second clamping claw that can be opened and closed.

10. The novel semiconductor automatic coating device according to claim 1, characterized in that: The unloading device includes a second conveying component, a second conveying track, a second clamping component, a second lifting component, a second loading platform and a second recovery platform, wherein the second conveying component has the same structure as the first conveying component, the second conveying track is the same as the first conveying track, the second clamping component has the same structure as the first clamping component, the second lifting component has the same structure as the first lifting component, the second loading platform has the same structure as the first loading platform, the second recovery platform has the same structure as the second recovery platform, wherein the second conveying component and the first conveying component are arranged on the same track.

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