Power supply packaging structure with electromagnetic shielding and heat dissipation functions
By designing a power package structure including heat dissipation fins, fans and aluminum alloy shell, the heat dissipation and electromagnetic shielding problems of the power package structure in the prior art under high power and compact volume are solved, and more efficient heat dissipation and electromagnetic shielding effects are achieved.
Patent Information
- Application Number
- CN202421818807.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-07-30
AI Technical Summary
In the context of the development of high power, high voltage and compact volume, it is difficult to effectively solve the problems of heat dissipation and electromagnetic shielding, which affects working performance and the use of surrounding electronic products.
A power packaging structure including a shell, power supply component, board, heat dissipation fin, fan and aluminum alloy shell is designed. Effective heat dissipation is achieved through the combination of heat dissipation fin and fan; at the same time, the aluminum alloy shell provides electromagnetic shielding effect.
This structure significantly improves the heat dissipation effect of the board and power supply components, reduces the accumulation of heat, and enhances the electromagnetic shielding ability and improves the overall performance through the shielding body of the aluminum alloy shell.
Smart Images
Figure CN222897182U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power supply components, in particular to a power supply packaging structure with electromagnetic shielding and heat dissipation. Background Art
[0002] The power supply contains a variety of electronic components, such as transformers, capacitors, inductors, etc., which convert the voltage into the voltage required by the device. However, these electronic components are often very fragile and can be easily damaged if they are not packaged.
[0003] Especially in the current context of the development of high voltage, high current and compact packaging of power devices, the heat dissipation problem of the packaging structure has become particularly prominent. The heat generated by the power supply will affect the working performance; at the same time, electronic devices will generate electromagnetic radiation interference, affecting the use of other electronic products around them, so the packaging structure also needs to consider electromagnetic shielding.
[0004] Therefore, there is an urgent need for a power supply packaging structure with electromagnetic shielding and heat dissipation. Utility Model Content
[0005] The utility model aims to provide a power supply packaging structure with electromagnetic shielding and heat dissipation to solve the problems existing in the background technology.
[0006] The purpose of this utility model is achieved through the following technical solutions:
[0007] A power supply packaging structure with electromagnetic shielding and heat dissipation, comprising a shell and a power supply component and a board located in the shell, a slot for inserting the board is provided on the top of the shell, a first heat dissipation component is provided on one side of the shell in the front-to-back direction, and a second heat dissipation component is provided on one side of the shell in the left-to-right direction; the first heat dissipation component is fixed to the outside of the shell close to the side of the power supply component, and the first heat dissipation component comprises heat dissipation fins and a first fan; the second heat dissipation component comprises a second fan and a side plate, two of the second fans are located on one side of the shell, and the side plate is located on the other side of the shell corresponding to the second fans, a ventilation grid is provided on the side plate corresponding to the second fan, a connected air duct is provided between the second fan and the ventilation grid in the shell, and the air duct is located on both sides of the board.
[0008] Furthermore, the heat dissipation fins are arranged vertically, and the plurality of first fans are located at the bottom of the heat dissipation fins.
[0009] Furthermore, the area of the heat dissipation fins is adapted to the area of the power supply component.
[0010] Furthermore, the area of the ventilation grid is larger than the cross-sectional area of the air duct.
[0011] Furthermore, the shell and the side panels are made of aluminum alloy.
[0012] The beneficial effects of the utility model are:
[0013] 1) Improve the heat dissipation effect of the board. There are through air ducts on both sides of the board, and the second fan and ventilation grid are respectively provided on both sides of the air duct. The second fan can effectively remove the heat generated by the board from the shell to reduce heat accumulation.
[0014] 2) Improve the heat dissipation effect of the power supply component. The power supply component is located on one side of the shell, and the first heat dissipation component is located on the outer side of the shell corresponding to the power supply component. When the power supply component generates heat, the heat will be conducted to the heat dissipation fins, and then the heat will be taken away by the first fan.
[0015] 3) Improve electromagnetic shielding effect. The power supply components and boards are located in the shell, and a shielding body is formed by the aluminum alloy shell. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a three-dimensional diagram of a power supply packaging structure with electromagnetic shielding and heat dissipation of the utility model;
[0017] Figure 2 This is a top view of a power supply packaging structure with electromagnetic shielding and heat dissipation according to the utility model;
[0018] Figure 3 This is an internal schematic diagram of a power supply packaging structure with electromagnetic shielding and heat dissipation of the utility model;
[0019] In the figure, 1-housing, 11-slot, 2-first heat dissipation component, 21-heat dissipation fins, 22-first fan, 3-second heat dissipation component, 31-second fan, 32-side panel, 33-ventilation grid, 4-power supply component. DETAILED DESCRIPTION
[0020] The following will be combined with the embodiments to clearly and completely describe the technical solution of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1-Figure 3 , the utility model provides a technical solution:
[0022] like Figure 1-Figure 3As shown, a power supply packaging structure with electromagnetic shielding and heat dissipation includes a shell 1 and a power supply component 4 and a board located in the shell 1, a slot 11 for inserting the board is provided on the top of the shell 1, a first heat dissipation component 2 is provided on one side of the shell 1 in the front-back direction, and a second heat dissipation component 3 is provided on one side of the shell 1 in the left-right direction; the first heat dissipation component 2 is fixed to the outside of the shell 1 close to the side of the power supply component 4, the first heat dissipation component 2 includes heat dissipation fins 21 and a first fan 22; the second heat dissipation component 3 includes a second fan 31 and a side plate 32, two of the second fans 31 are located on one side of the shell 1, the side plate 32 is located on the other side of the shell 1 corresponding to the second fan 31, a ventilation grid 33 is provided on the side plate 32 corresponding to the second fan 31, a connected air duct is provided between the second fan 31 and the ventilation grid 33 in the shell 1, and the air duct is located on both sides of the board.
[0023] Through the above technical solution, the board is vertically inserted into the shell 1 through the slot 11. Multiple boards can be inserted by evenly arranging multiple slots 11, which is convenient for plugging and unplugging. At the same time, different from the horizontal arrangement of boards in the shell 1, vertically inserting boards can reduce space occupancy.
[0024] At the same time, since through air ducts are provided on both sides of the board, a second fan 31 and a ventilation grid 33 are provided on both sides of the air duct respectively. The second fan 31 can effectively remove the heat generated by the board from the housing 1 to reduce heat accumulation.
[0025] Furthermore, the area of the ventilation grid 33 is larger than the cross-sectional area of the air duct.
[0026] Through the above technical solution, it is possible to prevent the heat brought out by the second fan 31 from being reflected by the side plate 32 , and it is possible to ensure that the hot air in the air duct can be blown out from the ventilation grid 33 .
[0027] The power supply component 4 is located on one side of the shell 1, and the first heat dissipation component 2 is located on the outer side of the shell 1 corresponding to the power supply component 4. When the power supply component 4 generates heat, the heat is conducted to the heat dissipation fins 21, and then taken away by the first fan 22.
[0028] Furthermore, the heat dissipation fins 21 are arranged vertically, and the plurality of first fans 22 are located at the bottom of the heat dissipation fins 21 .
[0029] Through the above technical solution, since the cooling fins 21 are arranged vertically and the first fan 22 is located at the bottom of the cooling fins 21, the first fan 22 can blow air from bottom to top, and the cold air will blow upward along the grooves of the cooling fins 21, thereby taking the heat away from bottom to top, avoiding heat accumulation and improving the heat dissipation effect.
[0030] Furthermore, the area of the heat dissipation fins 21 matches the area of the power supply assembly 4 .
[0031] Through the above technical solution, the heat dissipation effect of the power supply component 4 can be improved, and the heat of the power supply component 4 can be prevented from being quickly transferred to the heat dissipation fins 21.
[0032] Furthermore, the shell 1 and the side plate 32 are both made of aluminum alloy.
[0033] Through the above technical solution, the power supply assembly 4 and the board are located in the housing 1, and a shielding body is formed by the aluminum alloy housing 1, which plays the role of absorbing energy, reflecting energy and offsetting energy for both external interference electromagnetic waves and internal electromagnetic waves. It can be known that the mesh aperture of the ventilation grid 33 is smaller than the wavelength of the electromagnetic wave, so as to prevent the electromagnetic wave from leaking from the ventilation grid 33.
[0034] The above is only a preferred embodiment of the utility model. It should be understood that the utility model is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art do not deviate from the spirit and scope of the utility model, and should be protected by the claims attached to the utility model.
Claims
1. A power supply packaging structure with electromagnetic shielding and heat dissipation, comprising a housing (1) and a power supply component (4) and a board located in the housing (1), characterized in that: The top of the shell (1) is provided with a slot (11) for inserting the board, a first heat dissipation component (2) is provided on one side in the front-to-back direction of the shell (1), and a second heat dissipation component (3) is provided on one side in the left-to-right direction of the shell (1); The first heat dissipation component (2) is fixed outside the housing (1) on a side close to the power supply component (4), and the first heat dissipation component (2) comprises heat dissipation fins (21) and a first fan (22); The second heat dissipation component (3) comprises a second fan (31) and a side plate (32), wherein two second fans (31) are located on one side of the housing (1), and the side plate (32) is located on the other side of the housing (1) corresponding to the second fans (31), a ventilation grid (33) is provided at a position of the side plate (32) corresponding to the second fans (31), and a communicating air duct is provided in the housing (1) between the second fans (31) and the ventilation grid (33), and the air duct is located on both sides of the board.
2. The power supply packaging structure with electromagnetic shielding and heat dissipation according to claim 1, characterized in that: The heat dissipation fins (21) are arranged vertically, and the plurality of first fans (22) are located at the bottom of the heat dissipation fins (21).
3. The power supply packaging structure with electromagnetic shielding and heat dissipation according to claim 1, characterized in that: The area of the heat dissipation fins (21) is adapted to the area of the power supply component (4).
4. The power supply packaging structure with electromagnetic shielding and heat dissipation according to claim 1, characterized in that: The area of the ventilation grid (33) is larger than the cross-sectional area of the air duct.
5. The power supply packaging structure with electromagnetic shielding and heat dissipation according to claim 1, characterized in that: The housing (1) and the side plates (32) are both made of aluminum alloy.