Flexible circuit board structure convenient for laser welding

Abstract

The utility model discloses a flexible circuit board structure convenient for laser welding, which comprises an FPC, a soldering tin layer is arranged on a bonding pad at one end of the FPC, an enameled wire is arranged on the soldering tin layer, the FPC is also coated with a transparent viscous material layer, the transparent viscous material layer covers the enameled wire, and the transparent viscous material layer is coated with a transparent adhesive layer. By the adoption of the method, the varnished wire is arranged on the soldering tin layer, the varnished wire is fixedly bonded to the soldering tin layer through the transparent sticky substance layer, the plastic layer is arranged on the transparent sticky substance layer, when welding is carried out, welding work can be completed at a time, and the welding efficiency is improved. Compared with an existing machining scheme needing multiple sets of different machining devices, the machining method has the advantages that the working procedures become simple, the working efficiency is remarkably improved, the equipment investment cost and the labor cost are greatly reduced, and meanwhile the high yield can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a flexible circuit board structure which is convenient for laser welding. Background Art

[0002] FPC (flexible printed circuit board) is often used to connect two circuit boards due to its deformable and bendable characteristics. The gold fingers at both ends of the existing FPC are usually punched by immersion gold process or by a separate punching device, and then soldered by a soldering device. Using this method will greatly increase the overall cost of the product, resulting in reduced market competitiveness. In addition, the product welding is completed by multiple sets of different equipment, and the multi-station pick-up and placement of fine products will result in low product yield, and the processing procedures are complicated and the processing efficiency is low.

[0003] Therefore, there is an urgent need to design a flexible circuit board structure that is convenient for laser welding to overcome one or more of the above-mentioned deficiencies of the prior art. Utility Model Content

[0004] The utility model adopts a technical solution to solve the above technical problems: to provide a flexible circuit board structure that is convenient for laser welding, characterized in that it comprises: an FPC, a pad at one end of the FPC is provided with

[0005] A solder layer is provided, an enameled wire is provided on the solder layer, the enameled wire is also covered with a layer of transparent viscous material layer, and a transparent or translucent plastic layer is also provided above the transparent viscous material layer.

[0006] In a preferred embodiment, the enameled wire includes an insulating coating disposed on the outside.

[0007] In a preferred embodiment, the plastic layer is made of transparent or translucent PET material, PVC material or PP material.

[0008] The beneficial effect of the utility model is that by arranging the enameled wire on the solder layer, and using the transparent sticky material layer to fix the enameled wire on the solder layer, and arranging the transparent plastic layer on the transparent sticky material layer, when welding is performed, the welding work can be completed at one time. Compared with the existing solution that requires multiple sets of different processing equipment, the process becomes simple, the operation efficiency is significantly improved, the equipment investment cost and labor cost are greatly reduced, and at the same time a high welding yield rate can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a planar structural diagram of the utility model;

[0010] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0011] Figure 3 This is a state diagram of the utility model after welding is completed;

[0012] Figure 4 It is a three-dimensional schematic diagram of the utility model;

[0013] Figure 5 It is a three-dimensional state diagram of the utility model after welding is completed.

[0014] In the figure:

[0015] 10. FPC; 11. Soldering pad; 12. Solder layer; 13. Enameled wire; 131. Insulation coating; 14. Transparent viscous material layer; 15. Plastic layer. DETAILED DESCRIPTION

[0016] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0017] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms, "connection" and "installation" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. In addition, "connection" can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed" means that they are connected to each other and the relative position relationship after connection remains unchanged. The directional terms mentioned in the embodiments of the present utility model, such as "inside", "outside", "top", "bottom", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present utility model, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present utility model.

[0018] In the embodiments of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0019] In the embodiment of the present invention, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0020] References to "one embodiment" or "some embodiments" etc. described in this specification mean that one or more embodiments of the utility model include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. Therefore, the utility model is not limited to the specific embodiments disclosed below.

[0021] like Figure 1-Figure 5 As shown, the utility model provides a flexible circuit board structure that is convenient for laser welding, characterized in that it includes: FPC10, a solder layer 12 is provided on a pad 11 at one end of the FPC10, an enameled wire 13 is provided on the solder layer 12, a transparent viscous material layer 14 is further provided on the enameled wire 13, the transparent viscous material layer 14 covers the enameled wire 13, and a transparent or translucent plastic layer 15 is further provided above the transparent viscous material layer 14;

[0022] Furthermore, the enameled wire 13 includes an insulating coating 131 disposed on the outside;

[0023] Furthermore, the plastic layer 15 is made of PET material, PVC material or PP material;

[0024] Specifically, both ends of the FPC 10 are provided with gold fingers for connecting to an external circuit board, wherein the gold finger at one end is connected to the FPC socket of the PCB by a gold immersion process, a solder layer 12 is covered on the pad 11 of the gold finger at the other end, an enameled wire 13 with an outer insulating coating 131 is provided on the solder layer 12, and a transparent viscous material layer 14 covering the pad 11, the solder layer 12, and the enameled wire 13 is also provided on the FPC 10, the transparent viscous material layer 14 is a translucent or transparent viscous material, including but not limited to: self-adhesive, to fix the enameled wire 13, a plastic layer 15 is also provided above the transparent viscous material layer 14, and the plastic layer 15 is translucent or transparent as a whole, and the plastic layer 15 includes but is not limited to PET (Polyethylene terephtha l ate), PVC (Polyviny l ch l or ide), PP (Polypropy lene), PC (Poly lycarbonate), POM (Polyoxymethy l ene), ABS (Acrylonitrile Butadiene Styrene), etc.; in this embodiment, PET is preferred because it has good mechanical properties, and its impact strength is 3 to 5 times that of other films, and it has good folding resistance, and it has low gas and water vapor permeability, and it has excellent gas, water, oil and odor barrier properties, and it has high transparency, so as to facilitate alignment in subsequent welding; equipment work, firstly, the enameled wire 13 with a predetermined interval is coated inside by a transparent viscous material layer 14, and then the enameled wire 13 and the transparent viscous material layer 14 are isolated from the outside by a plastic layer 15 to form a semi-finished product, and then a solder layer 12 is coated on the pad 11 at one end of the FPC 10 away from the immersion gold process by electroplating. When welding, the semi-finished product is placed on a workbench, and the semi-finished product coated with the enameled wire 13 is connected to the FPC 10 coated with solder. The pads 11 of the layer 12 are aligned, and then the laser is emitted through the laser. The laser is irradiated on the plastic layer 15 to open holes according to the technical requirements, and the viscous material in the hole range is ablated and vaporized. Then, when the laser is irradiated on the enameled wire 13 coated with the insulating coating 131, the insulating coating 131 will be stripped and vaporized. At the same time, the laser is irradiated on the solder layer 12 to melt the solder, and the enameled wire 13 with the insulating coating 131 stripped off is welded on the pad 11, and is connected to the pad 11 through the solder, so that the enameled wire 13 and the FPC10 are connected. In the above manner, the original three process procedures are completed at one time, without the need to frequently change the operating equipment, thereby improving work efficiency, and since the work is completed at one time, there is no need to frequently pick up and place the mobile product, thereby ensuring the yield rate of the welded product.

[0025] In summary, the present application arranges enameled wire on the solder layer, uses a transparent sticky material layer to fix the enameled wire on the solder layer, and arranges a plastic layer on the transparent sticky material layer. When welding is performed, the welding work can be completed at one time. Compared with the existing solution that requires multiple sets of different processing equipment, the process becomes simple, the operating efficiency is significantly improved, the equipment investment cost and labor cost are greatly reduced, and a high yield rate can be guaranteed.

[0026] The present invention is not limited to what is described in the specification and implementation modes, and therefore, additional advantages and modifications can be easily realized by those familiar with the art. Therefore, without departing from the spirit and scope of the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details, representative devices, and illustrative examples shown and described herein.

Claims

1. A flexible circuit board structure that is convenient for laser welding, characterized in that: include: FPC, a solder layer is provided on the pad at one end of the FPC, an enameled wire is provided on the solder layer, the enameled wire is also covered with a layer of transparent viscous material layer, the transparent viscous material layer covers the enameled wire, and a transparent or translucent plastic layer is provided above the transparent viscous material layer.

2. The flexible circuit board structure convenient for laser welding according to claim 1, characterized in that: The enameled wire includes an insulating coating disposed on the outer side.

3. The flexible circuit board structure convenient for laser welding according to claim 1, characterized in that: The plastic layer is made of PET material, PVC material or PP material.

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