Heat dissipation device and automobile

Abstract

The utility model discloses a heat dissipation device and an automobile. The heat dissipation device comprises a shell and a heat dissipation assembly. The heat dissipation assembly comprises a heat transfer part, a heat conduction part and a heat dissipation part; a plurality of heat transfer parts are arranged, so that at least part of the heat transfer parts correspond to the chip; each heat transfer part is provided with a first air inlet and a first air outlet, and a mounting space capable of mounting the heat conduction part is arranged around the first air outlets of the multiple heat transfer parts; the heat conduction part is provided with a containing space, and the heat dissipation part is arranged in the containing space. A second air inlet corresponding to the first air inlet is formed in the shell, and a second air outlet corresponding to the heat dissipation part is formed in the shell. The heat dissipation part is arranged between the heat transfer parts, so that the space of the whole vehicle can be reduced on the basis of ensuring the heat dissipation of the chip.

Description

Technical Field

[0001] The present application relates to the field of automobile technology, and in particular to a heat dissipation device and an automobile. Background Art

[0002] With the development of automotive electronic technology, in-vehicle entertainment systems have become a must-have among automotive components. Consumers have more and more functional requirements for in-vehicle entertainment systems, and the thermal power consumption of related core chips such as SOC, DDR, EMMC, and AMP has also increased, resulting in increased heat for the entire in-vehicle host. Heat dissipation is an important factor affecting whether the in-vehicle system can work normally and stably.

[0003] At present, the cooling device of the vehicle-mounted host mainly adopts passive cooling (that is, in the form of adding a fan). The core chip is fitted with the heat sink to increase its heat dissipation area. The heat sink needs to be designed with multiple ribs and form a guide air duct structure from one side to the other. The fan is arranged on the side of the vehicle-mounted host and adopts an exhaust or supply air cooling solution to take away the heat from the heat sink, increase the heat exchange efficiency of the internal fluid of the host, and reduce the junction temperature of the chip.

[0004] However, this structure has certain requirements for the installation layout space of the entire vehicle. It is necessary to reserve a certain gap on the left and right sides of the vehicle installation position (Y-axis direction) to facilitate the smooth cooling air duct of the vehicle host without generating noise. At the same time, the guide structure needs to be considered in the design of the heat sink, and the weight will also increase to a certain extent.

[0005] Therefore, there is an urgent need for a heat dissipation device and a car to solve the technical problems existing in the prior art to a certain extent. Utility Model Content

[0006] The purpose of the present application is to provide a heat dissipation device and a car to solve the technical problems arising in the prior art to a certain extent.

[0007] The present application provides a heat dissipation device for dissipating heat from a chip on a PCB board; the heat dissipation device comprises a housing and a heat dissipation component;

[0008] The heat dissipation assembly includes a heat transfer portion, a heat conduction portion and a heat dissipation portion;

[0009] The heat transfer part is provided with a plurality of parts, so that at least some of the heat transfer parts correspond to the chip; the heat transfer part has a first air inlet and a first air outlet, and a mounting space capable of mounting the heat transfer part is provided around the first air outlet of the plurality of heat transfer parts;

[0010] The heat conducting part is arranged in the installation space and has a containing space, and the heat dissipating part is arranged in the containing space;

[0011] A second air inlet is provided on the shell body corresponding to the first air inlet, and a second air outlet is provided corresponding to the heat dissipation portion.

[0012] In the above technical solution, further, the heat transfer part includes a bottom plate and a heat dissipation plate;

[0013] There are a plurality of heat dissipation plates, and the plurality of heat dissipation plates are arranged on the bottom plate along a first direction, so that a heat dissipation channel is formed between adjacent heat dissipation plates;

[0014] The heat dissipation channel has the first air inlet formed at one end along the second direction and the first air outlet formed at the other end.

[0015] In the above technical solution, further, two heat transfer parts are provided, the two heat transfer parts are arranged at intervals along the second direction, the first air inlets of the two heat transfer parts are arranged back to back, and the first air outlets of the two heat transfer parts are arranged opposite to each other.

[0016] In the above technical solution, further, the heat conducting part includes a heat conducting plate;

[0017] The heat conducting plate is in a groove shape, so that the heat conducting plate is surrounded by the accommodation space;

[0018] The two ends of the bottom wall of the heat conducting plate are respectively connected to the bottom plates of the two heat transfer parts;

[0019] Both ends of the side wall of the heat conducting plate are respectively connected to the heat dissipation plates at the ends of the two heat transfer parts along the first direction, so that the heat transfer parts are connected to the heat conducting plate.

[0020] In the above technical solution, further, the bottom wall of the heat conducting plate is in an arc-shaped structure and is bent toward the PCB board.

[0021] In the above technical solution, further, the heat dissipation part is a heat dissipation fan;

[0022] The cooling fan is arranged in the accommodation space and the axis of the cooling fan is perpendicular to the bottom wall of the cooling plate;

[0023] When the cooling fan starts, cold air outside the shell is drawn into the accommodating space by the cooling fan through the second air inlet, the first air inlet, and the heat dissipation channel in sequence, and is discharged from the shell through the second air outlet by the cooling fan.

[0024] In the above technical solution, further, the heat conducting plate is provided with a positioning column; the heat dissipation fan is fixed to the positioning column through a connecting piece, so that the heat dissipation fan is fixed to the heat conducting plate.

[0025] In the above technical solution, further, the housing includes a top shell and a bottom cover;

[0026] The top shell is buckled on the bottom cover;

[0027] The PCB board and the heat dissipation assembly are arranged along a third direction;

[0028] The chip is arranged on a side of the PCB facing the heat dissipation component;

[0029] The heat transfer part is fixed to the top shell through a connecting member.

[0030] In the above technical solution, further, the second air outlet and the second air inlet are both provided in plurality, and the plurality of the second air inlets can cover the first air inlet, and the plurality of the second air outlets can cover the first air inlet.

[0031] The present application also provides a car, comprising the above-mentioned heat dissipation device.

[0032] Compared with the prior art, this application has the following beneficial effects:

[0033] The present application provides a heat dissipation device for dissipating heat from a chip on a PCB board; the heat dissipation device comprises a housing and a heat dissipation component;

[0034] The heat dissipation assembly includes a heat transfer portion, a heat conduction portion and a heat dissipation portion;

[0035] The heat transfer part is provided with a plurality of parts, so that at least some of the heat transfer parts correspond to the chip; the heat transfer part has a first air inlet and a first air outlet, and a mounting space capable of mounting the heat transfer part is provided around the first air outlet of the plurality of heat transfer parts;

[0036] The heat conducting part has a containing space, and the heat dissipating part is arranged in the containing space;

[0037] A second air inlet is provided on the shell body corresponding to the first air inlet, and a second air outlet is provided corresponding to the heat dissipation portion.

[0038] In summary, the present application arranges the heat dissipation part between the heat transfer parts, which can reduce the space of the entire vehicle while ensuring the heat dissipation of the chip.

[0039] The present application also provides a car, comprising the above-mentioned heat dissipation device, and thus having all the beneficial effects of the heat dissipation device, which will not be elaborated in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 1 A schematic diagram of the overall structure of the heat dissipation device provided in this application;

[0042] Figure 2 An exploded view of the heat dissipation device provided for this application;

[0043] Figure 3 A schematic diagram of the structure of a fan in the heat dissipation device provided in this application;

[0044] Figure 4 A schematic diagram of the structure of the heat dissipation component in the heat dissipation device provided in the present application at a first viewing angle;

[0045] Figure 5 A schematic diagram of the structure of the heat dissipation component in the heat dissipation device provided in the present application at a second viewing angle;

[0046] Figure 6 A schematic diagram of the structure of the heat dissipation component in the heat dissipation device provided in the present application from a third viewing angle;

[0047] Figure 7 This is a schematic diagram of the structure of the hidden shell in the heat dissipation device provided in this application.

[0048] Figure markings: 1-PCB board; 2-AMP chip; 3-SOS chip; 4-housing; 5-first direction; 6-heat dissipation assembly; 7-first air inlet; 8-first air outlet; 9-bottom plate; 10-accommodating space; 13-second air inlet; 14-second air outlet; 16-heat dissipation plate; 17-heat dissipation channel; 18-second direction; 19-heat conducting plate; 20-bottom wall of heat conducting plate; 22-side wall of heat conducting plate; 23-cooling fan; 24-positioning column; 25-top shell; 26-bottom cover; 27-third direction; 28-back cover; 29-front cover. DETAILED DESCRIPTION

[0049] The following specific embodiments are provided to help the reader obtain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, in order to improve clarity and brevity, descriptions of features known in the art may be omitted.

[0050] The features described herein may be implemented in different forms and should not be interpreted as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0051] Throughout the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, “bound to”, “over”, or “covering” another element, it may be directly “on”, “connected to”, “bound to”, “over”, or “covering” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, “directly bound to”, “directly over”, or “directly covering” another element, there may be no other elements present between them.

[0052] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0053] Although terms such as "first," "second," and "third" may be used herein to describe various components, assemblies, regions, layers, or portions, these components, assemblies, regions, layers, or portions are not limited by these terms. Rather, these terms are only used to distinguish one component, component, region, layer, or portion from another component, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, a first component, component, region, layer, or portion referred to may also be referred to as a second component, component, region, layer, or portion.

[0054] For ease of description, spatial relational terms such as "above", "upper", "below", and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element will subsequently be "below" or "lower" relative to the other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0055] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "include", "comprising" and "having" list the stated features, quantities, operations, components, elements and / or combinations thereof that exist, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or combinations thereof.

[0056] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0057] The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0058] Embodiment 1

[0059] Combine the following Figure 1-Figure 7 A heat dissipation device provided by the present application is described in detail.

[0060] In this embodiment, a heat dissipation device is provided for dissipating heat from a chip on a PCB board 1 ; in this embodiment, the heat dissipation device includes a housing 4 and a heat dissipation assembly 6 .

[0061] Specifically, the heat dissipation component 6 includes a heat transfer part, a heat conducting part and a heat dissipation part; wherein, a plurality of heat transfer parts are provided, so that at least some of the heat transfer parts correspond to the chip; the heat transfer part has a first air inlet 7 and a first air outlet 8, and the side of the first air outlet 8 of the plurality of heat transfer parts is provided with an installation space capable of installing the heat conducting part; Figure 6As shown, taking the case where there are two heat transfer parts as an example, the two heat transfer parts are arranged at intervals along the second direction 18, and the second direction 18 here is preferably the length direction of the heat dissipation device; further, one of the heat transfer parts corresponds to the AMP chip 2, and the other heat transfer part corresponds to the SOS chip 3; the first air inlets 7 of the two heat transfer parts are arranged in opposite directions, that is, the first air inlets 7 are close to the housing 4; the first air outlets 8 of the two heat transfer parts are arranged opposite to each other, that is, the space enclosed between the two heat transfer parts is the installation space.

[0062] Specifically, the heat conduction part is arranged in the installation space, and the heat conduction part is communicated with the heat transfer parts on both sides of it, that is, the air can pass through the first air inlet 7 - the first air outlet 8 - the heat conduction part in sequence.

[0063] Specifically, the heat conduction part has an accommodation space 10, and the heat dissipation part is arranged in the accommodation space 10, that is, it can be understood that the heat dissipation part is arranged between the two heat transfer parts.

[0064] Specifically, a second air inlet 13 is opened on the housing 4 corresponding to the first air inlet 7, and a second air outlet 14 is opened corresponding to the heat dissipation part.

[0065] In the actual working process, the heat generated by the operation of the AMP chip 2 and the SOS chip 3 will be transferred to the heat transfer part, and the heat transfer part will dissipate the heat generated by the operation in sequence; then the heat dissipation part is used for secondary heat dissipation. When the heat dissipation part is turned on, the cold air outside the housing 4 will be extracted through the second air inlet 13, the first air inlet 7, the heat transfer part, and the first air outlet 8 to the heat conduction part. When the cold air passes through the heat transfer part, it will exchange heat with the heat transfer part, and the air after heat exchange will be discharged outside the housing 4 through the heat dissipation part from the second air outlet 14, thereby realizing the secondary heat dissipation of the chip and reducing the temperature of the chip.

[0066] In summary, in the present application, the heat dissipation part is arranged between the heat transfer parts, which can reduce the space of the whole vehicle on the basis of ensuring the heat dissipation of the chip.

[0067] In this embodiment, in combination with Figure 6 As shown, the heat transfer part includes a bottom plate 9 and a heat dissipation plate 16.

[0068] Specifically, a plurality of heat dissipation plates 16 are provided, and the plurality of heat dissipation plates 16 are arranged on the bottom plate 9 along the first direction 5. The first direction 5 here preferably refers to the width direction of the heat dissipation device; after the plurality of heat dissipation plates 16 are arranged along the first direction 5, a heat dissipation channel 17 is formed between adjacent heat dissipation plates 16, and this heat dissipation channel 17 can be used to conduct cold air.

[0069] Further, a first air inlet 7 is formed at one end of the heat dissipation channel 17 along the second direction 18, and a first air outlet 8 is formed at the other end.

[0070] In the actual working process, when the heat dissipation part is opened, the cold air outside the shell 4 can pass through the second air inlet 13-the first air inlet 7-the heat dissipation channel 17 in sequence, and finally reach the heat conduction part.

[0071] In this embodiment, the heat conducting portion includes a heat conducting plate 19 .

[0072] Specifically, combined Figure 4-Figure 6 As shown, the heat conducting plate 19 is in a groove shape, so that the heat conducting plate 19 surrounds a receiving space 10 .

[0073] Specifically, both ends of the bottom wall 20 of the heat conducting plate are respectively connected to the bottom plates 9 of the two heat transfer parts;

[0074] Both ends of the side wall 22 of the heat conducting plate are respectively connected to the heat dissipation plates 16 at the ends of the two heat transfer parts along the first direction 5 , so that the heat transfer parts are connected to the heat conducting plate 19 .

[0075] More specifically, the bottom wall 20 of the heat conducting plate is in an arc-shaped structure and is bent toward the PCB board 1. The reason why the bottom wall 20 of the heat conducting plate is set to an arc-shaped structure is that the fluid flow characteristics are fully taken into consideration. The arc-shaped structure is low on the left and right and high in the middle, which greatly reduces wind resistance and improves the heat dissipation efficiency of the heat dissipation part.

[0076] In this embodiment, the heat dissipation unit is a heat dissipation fan 23 .

[0077] Specifically, the cooling fan 23 is arranged in the accommodating space 10 and the axis of the cooling fan 23 is perpendicular to the bottom wall of the heat sink 16, that is, the air inlet of the cooling fan 23 is toward the bottom wall of the heat sink 16, and the air outlet of the cooling fan 23 is toward the second air outlet 14 of the shell 4.

[0078] During actual use, when the cooling fan 23 starts, the cold air outside the shell 4 passes through the second air inlet, the first air inlet 7, the heat dissipation channel 17, and the accommodating cavity in turn, and is discharged from the shell 4 through the second air outlet 14 under the action of the cooling fan 23, thereby taking away the heat generated by the chip.

[0079] In this embodiment, the heat conducting plate 19 is provided with positioning posts 24 ; the heat dissipation fan 23 is fixed to the positioning posts 24 via a connecting piece, so that the heat dissipation fan 23 is fixed to the heat conducting plate 19 .

[0080] Preferably, the connecting member is a screw.

[0081] In this embodiment, the housing 4 includes a top shell 25 and a bottom cover 26 .

[0082] Specifically, the top shell 25 is buckled on the bottom cover 26 and surrounded by a placement space, in which the PCB board 1 and the heat dissipation component 6 are arranged. The PCB board 1 and the heat dissipation component 6 are arranged along a third direction 27, where the third direction 27 refers to the vertical direction of the heat dissipation device.

[0083] Specifically, the chip is arranged on the side of the PCB facing the heat dissipation assembly 6, and the heat transfer part is fixed to the top shell 25 through a connecting member. Preferably, the connecting member is a screw.

[0084] More specifically, the housing 4 further includes a rear cover 28 and a front cover 29 , which are respectively disposed at two ends of the housing 4 along the first direction 5 .

[0085] In this embodiment, a plurality of second air outlets 14 and a plurality of second air inlets 13 are provided, and the plurality of second air inlets 13 can cover the first air inlet 7 , and the plurality of second air outlets 14 can cover the first air inlet 7 .

[0086] Embodiment 2

[0087] The present application also provides a car, comprising the above-mentioned vehicle-mounted camera double-layer plate mounting structure. Therefore, it has all the beneficial effects of the vehicle-mounted camera double-layer plate mounting structure, which will not be elaborated in detail here.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device for dissipating heat from a chip on a PCB; characterized in that: The heat dissipation device comprises a housing and a heat dissipation component; The heat dissipation assembly includes a heat transfer portion, a heat conduction portion and a heat dissipation portion; The heat transfer part is provided with a plurality of parts, so that at least some of the heat transfer parts correspond to the chip; the heat transfer part has a first air inlet and a first air outlet, and a mounting space capable of mounting the heat transfer part is provided around the first air outlet of the plurality of heat transfer parts; The heat conducting part is arranged in the installation space and has a containing space, and the heat dissipating part is arranged in the containing space; A second air inlet is provided on the shell body corresponding to the first air inlet, and a second air outlet is provided corresponding to the heat dissipation portion.

2. The heat dissipation device according to claim 1, characterized in that: The heat transfer part includes a bottom plate and a heat dissipation plate; There are a plurality of heat dissipation plates, and the plurality of heat dissipation plates are arranged on the bottom plate along a first direction, so that a heat dissipation channel is formed between adjacent heat dissipation plates; The heat dissipation channel has the first air inlet formed at one end along the second direction and the first air outlet formed at the other end.

3. The heat dissipation device according to claim 2, characterized in that: Two heat transfer parts are provided, the two heat transfer parts are arranged at intervals along the second direction, the first air inlets of the two heat transfer parts are arranged opposite to each other, and the first air outlets of the two heat transfer parts are arranged opposite to each other.

4. The heat dissipation device according to claim 3, characterized in that: The heat conducting part comprises a heat conducting plate; The heat conducting plate is in a groove shape, so that the heat conducting plate is surrounded by the accommodation space; The two ends of the bottom wall of the heat conducting plate are respectively connected to the bottom plates of the two heat transfer parts; Both ends of the side wall of the heat conducting plate are respectively connected to the heat dissipation plates at the ends of the two heat transfer parts along the first direction, so that the heat transfer parts are connected to the heat conducting plate.

5. The heat dissipation device according to claim 4, characterized in that: The bottom wall of the heat conducting plate is in an arc-shaped structure and is bent toward the PCB board.

6. The heat dissipation device according to claim 4, characterized in that: The heat dissipation part is a heat dissipation fan; The cooling fan is arranged in the accommodation space and the axis of the cooling fan is perpendicular to the bottom wall of the cooling plate; When the cooling fan starts, cold air outside the shell is drawn into the accommodating space by the cooling fan through the second air inlet, the first air inlet, and the heat dissipation channel in sequence, and is discharged from the shell through the second air outlet by the cooling fan.

7. The heat dissipation device according to claim 6, characterized in that: The heat conducting plate is provided with a positioning column; the heat dissipation fan is fixed to the positioning column through a connecting piece, so that the heat dissipation fan is fixed to the heat conducting plate.

8. The heat dissipation device according to claim 1, characterized in that: The housing comprises a top shell and a bottom cover; The top shell is buckled on the bottom cover; The PCB board and the heat dissipation assembly are arranged along a third direction; The chip is arranged on a side of the PCB facing the heat dissipation component; The heat transfer part is fixed to the top shell through a connecting member.

9. The heat dissipation device according to claim 1, characterized in that: The second air outlet and the second air inlet are both provided in plurality, and the plurality of the second air inlets can cover the first air inlet, and the plurality of the second air outlets can cover the first air inlet.

10. An automobile, characterized in that: A heat dissipation device comprising any one of claims 1 to 9.

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