Dispensing device of die bonder

Abstract

The utility model discloses a die bonder glue dispensing device used for LED lamp bead die bonding, the die bonder glue dispensing device comprises a control assembly and a glue dispensing pipe, the control assembly comprises an industrial personal computer and a controller, the controller is arranged on a die bonder, the industrial personal computer is arranged on one side of the controller and is electrically connected with the controller, the industrial personal computer is used for controlling the controller, and the glue dispensing pipe is electrically connected with the controller. The dispensing pipe is fixedly connected with the controller, the upper end of the dispensing pipe is connected with the industrial personal computer through an air pressure pipe, the lower portion of the dispensing pipe is connected with a through groove formed in the lower end of the controller through a pipeline, and a heating piece is arranged in the length direction of the bottom of the through groove. The valve body is arranged between the through groove and the nozzle in the vertical direction, the valve body is used for achieving communication between the through groove and the nozzle, the nozzle faces the LED lamp beads, and the controller is electrically connected with the heating piece and the valve body; according to the utility model, the nozzle is used for discharging glue, and the glue is stored through the dispensing pipe, so that the service life of the glue is prolonged, the production quality is ensured and the production cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of die bonders, in particular to a dispensing device for a die bonder. Background Art

[0002] The packaging process of LED lamp beads needs to go through die bonding, wire bonding, dispensing, spectral analysis, taping, packaging, etc. Die bonding is the first and particularly important link in packaging.

[0003] The existing die bonding method is that a dispensing head dips the die bonding glue from a glue tray, dots and presses the die bonding glue onto the bracket pad, and then a die bonding suction head grabs the chip and places it on the die bonding glue in the bracket pad, and it forms after drying.

[0004] The existing bracket pads are relatively soft in texture and thin in coating. When the dispensing head dips the glue and dots and presses it to the bottom of the bracket cup, due to uneven force, the coating at the bottom of the bracket will be punctured, resulting in damage to the bracket and losses; in addition, the die bonding glue is placed in the glue tray and completely exposed to the air, which will cause the glue to oxidize with the air, the glue will change in quality, and there is a risk of affecting the production quality and increasing the production cost. Summary of the Utility Model

[0005] In view of the above situation, it is necessary to provide a dispensing device for a die bonder to solve the problem of the glue in the glue tray of the existing die bonder being exposed and deteriorated.

[0006] A dispensing device for a die bonder is used for die bonding of LED lamp beads. The dispensing device for the die bonder includes a control component and a dispensing tube. The control component includes an industrial computer and a controller. The controller is arranged on the die bonder. The industrial computer is arranged on one side of the controller and is electrically connected to the controller. The industrial computer is used to control the controller. The dispensing tube is adjacent to the controller and is fixed on one side of the controller. The upper end of the dispensing tube is connected to the industrial computer through a pneumatic tube. The lower end of the dispensing tube is connected to a through groove at the lower end of the controller through a pipeline. A heating element is arranged at the bottom of the through groove. An adhesive discharging mechanism is arranged at the lower end of the through groove. The adhesive discharging mechanism includes a first nozzle and a first valve body. The lower end of the through groove is connected to the nozzle through the valve body. The valve body is used to realize the on-off between the through groove and the nozzle. One end of the nozzle extends towards the direction of the LED lamp bead. The controller is electrically connected to the heating element and the valve body respectively.

[0007] In this utility model, an industrial control computer is connected to a controller. The industrial control computer is powered on and corresponding parameters are set. The heating element starts heating. The die bonding glue is loaded into the dispensing tube. Under the combined action of its own gravity and the gas pressure in the air pressure tube, the die bonding glue flows from the dispensing tube into the through groove and is continuously heated in the through groove to reach a molten state. At this time, the die bonder drives the dispensing device to move to a preset position (without contacting the bottom plating of the die bonder bracket). The controller is controlled by the industrial control computer, and the controller adopts a pulse control mode to realize the opening and closing control of the valve body. After reaching the position, the controller switches from a low pulse to a high pulse, and at this time the valve body opens, and the glue flows out from the nozzle. Before switching to the next dispensing position, the controller switches from a high pulse to a low pulse, and at this time the valve body closes and the glue does not flow out. The die bonder drives the dispensing device to move to the next preset position, and the controller repeats the above actions to control the valve body to realize dispensing. In this utility model, nozzle dispensing is adopted, without directly contacting the bottom plating of the die bonder bracket, so that the situation of the dispensing head touching the bottom plating of the bracket and puncturing the plating will not occur, and the amount of the ejected glue is evenly controlled, so that the situation of too much or too little glue will not occur, and the defective rate is reduced. By storing the die bonding glue in the glue tube, the situation of oxidation due to direct exposure to the air is avoided, and the risk of quality change of the die bonding glue is reduced. Now, through the storage in the glue tube, the service life of the die bonding glue is extended, the stagnant time during operation is extended, the production quality of die bonding is ensured, and the production cost is saved.

[0008] Further, the industrial control computer includes a first control board and a second control board, and the first control board and the second control board are arranged oppositely.

[0009] Further, a pressure regulating knob and a display screen are arranged on the first control board. The display screen is arranged on one side of the pressure regulating knob. The pressure regulating knob is used for regulating the gas pressure. The display screen is a touch-type liquid crystal display screen, and the display screen is used for setting parameters and displaying information.

[0010] Further, a plurality of functional interface components, a power supply interface, a power switch and a cooling fan are arranged on the second control board. The plurality of functional interface components include input / output interfaces, network interfaces, gas interfaces and valve body interfaces. The power supply interface and the network interface are arranged on the opposite sides of the second control board. The power switch and the cooling fan are both arranged adjacent to the power supply interface. The input / output interface is arranged adjacent to the network interface. The gas interface and the valve body interface are both arranged between the power supply interface and the network interface.

[0011] Further, the controller is movably connected to the die bonder through a bracket. Along the horizontal direction, the distance from the upper end of the dispensing tube to the controller is greater than the distance from the lower end of the dispensing tube to the controller.

[0012] In this utility model, the die bonder drives the bracket to move the controller up and down, back and forth, and left and right. The dispensing tube is inclined relative to the controller in the horizontal direction, which is more conducive to the loading and flow of the die bonding glue.

[0013] Further, the heating element is a heating wire or a heating tube.

[0014] Further, the dispensing tube is provided with a cover body. The cover body is provided with a through hole for accommodating the air pressure tube. The cover body is movably connected to the dispensing tube, and one end of the air pressure tube is placed inside the dispensing tube.

[0015] Further, the glue dispensing mechanism further includes a plurality of second nozzles and a plurality of second valve bodies, and the number of the plurality of second valve bodies is the same as that of the plurality of second nozzles.

[0016] In this utility model, to save the dispensing time and improve the production efficiency, the glue dispensing mechanism further includes a plurality of second nozzles and a plurality of second valve bodies, and can simultaneously perform glue dispensing at a plurality of corresponding positions. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the die bonder dispensing device in the first embodiment of this utility model;

[0018] Figure 2 is a schematic diagram of the first control board of the industrial control computer in the first embodiment of this utility model;

[0019] Figure 3 is a schematic diagram of the second control board of the industrial control computer in the first embodiment of this utility model;

[0020] Figure 4 is a schematic diagram of the dispensing tube and the controller in the first embodiment of this utility model;

[0021] Figure 5 is a schematic diagram of the dispensing tube and the controller in the second embodiment of this utility model.

[0022] Reference numerals: 1, control assembly; 100, industrial control computer; 110, first control board; 111, pressure adjustment knob; 112, display screen; 120, second control board; 121, function interface assembly; 122, input / output interface; 123, network interface; 124, valve body interface; 125, gas interface; 126, power supply interface; 127, cooling fan; 128, power switch; 200, controller; 201, through slot; 202, heating element; 203, glue dispensing mechanism; 204, first nozzle; 205, first valve body; 206, connecting wire; 207, second nozzle; 208, second valve body; 2, dispensing tube; 20, cover body; 21, pipeline; 3, air pressure tube; 4, bracket pressing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixedly provided on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used herein in the specification of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Moreover, the embodiments of the present utility model, the features between the embodiments, and the features of the embodiments can be freely combined on the premise of no obvious conflict.

[0026] Embodiment 1

[0027] A die bonding machine dispensing device for die bonding of LED lamp beads, as Figure 1 shown, the die bonding machine dispensing device includes a control assembly 1, a dispensing tube 2 and a pneumatic tube 3.

[0028] Specifically, as Figure 1 and Figure 2 shown, the control assembly 1 includes an industrial personal computer 100 and a controller 200. The controller 200 is provided on the die bonding machine. The industrial personal computer 100 is provided on one side of the controller 200 and is electrically connected to the controller 200. The industrial personal computer 100 is used to control the controller 200.

[0029] Specifically, as Figure 2 and Figure 3 shown, the industrial personal computer 100 includes a first control board 110 and a second control board 120. The first control board 110 and the second control board 120 are arranged opposite to each other.

[0030] Specifically, a pressure adjustment knob 111 and a display screen 112 are provided on the first control board 110. The display screen 112 is disposed on one side of the pressure adjustment knob 111. The pressure adjustment knob 111 is connected to the air pressure tube 3 and is used to adjust the gas pressure. The display screen 112 is a touch liquid crystal display screen and is used to set parameters and display information.

[0031] Specifically, a plurality of functional interface components 121, a power supply interface 126, a power switch 128, and a heat dissipation fan 127 are provided on the second control board 120. The plurality of functional interface components 121 include an input / output interface 122, a network interface 123, a valve body interface 124, and a gas interface 125. The power supply interface 126 and the network interface 123 are disposed on opposite sides of the second control board 120. The power switch and the heat dissipation fan 127 are both adjacent to the power supply interface 126. The input / output interface 122 is disposed adjacent to the network interface 123. The valve body interface 124 and the gas interface 125 are both disposed between the power supply interface 126 and the network interface 123.

[0032] Specifically, as Figure 1 and Figure 4 shown, the controller 200 is movably connected to the die bonder through a bracket (not shown). Along the horizontal direction, the distance from the upper end of the dispensing tube 2 to the controller 200 is greater than the distance from the lower end of the dispensing tube 2 to the controller 200. A through groove 201 is provided at the lower end of the controller 200. A heating element 202 is provided along the bottom of the through groove 201. The heating element 202 is a heating wire or a heating tube. A glue discharging mechanism 203 is provided at the lower end of the through groove 201. The glue discharging mechanism includes at least one nozzle 204 and at least one valve body 205. The through groove 201 is connected to the nozzle 204 through the valve body 205. The valve body 205 is used to realize the on-off between the through groove 201 and the nozzle 204. One end of the nozzle 204 extends toward the LED lamp bead direction. The controller 200 is electrically connected to the heating element 202 and the valve body 205 respectively.

[0033] Specifically, the dispensing tube 2 is adjacent to the controller 200 and is fixedly provided on one side of the controller 200. A cover body 20 is provided on the dispensing tube 2. The cover body 20 is provided with a through hole for accommodating the air pressure tube 3. The cover body 20 is movably connected to the dispensing tube 2. One end of the air pressure tube 3 is placed inside the dispensing tube 2. The upper end of the dispensing tube 2 is connected to the industrial control computer 100 through the air pressure tube 3. The lower end of the dispensing tube 2 is connected to the through groove 201 at the lower end of the controller through a pipeline 21.

[0034] Embodiment 2

[0035] The difference from Embodiment 1 is that, asFigure 5 As shown, the glue dispensing mechanism 203 includes a plurality of second nozzles 207 and a plurality of second valve bodies 208, and the number of the plurality of second valve bodies 207 is the same as that of the plurality of second nozzles 208.

[0036] To save the glue dispensing time and improve the production efficiency, the glue dispensing mechanism 203 includes a plurality of second nozzles 207 and a plurality of second valve bodies 208, and can simultaneously perform glue dispensing at corresponding positions of multiple objects.

[0037] In this utility model, first, the bowl cup bracket is tightly pressed by the bracket pressing plate 4. The connecting wires 206 of the controller 200 are respectively connected to the valve body interface 124 and the power supply interface 126 of the industrial control computer 100. One end of the air pressure tube 3 is connected to the gas interface 125, and the other end of the air pressure tube 3 extends into the glue dispensing tube 2. The power switch 128 is turned on to power on the industrial control computer 100, and then the corresponding parameters are set through the display screen 112. The heating element 202 starts to heat up. The die bonding glue is loaded into the glue dispensing tube 2. The glue dispensing tube 2 is inclined relative to the controller 200 in the horizontal direction, which is more conducive to the loading and flowing of the die bonding glue. Under the combined action of its own gravity and the gas pressure in the air pressure tube 3, the die bonding glue flows from the glue dispensing tube 2 into the through groove 201 and is continuously heated in the through groove 201 to reach a molten state. At this time, the die bonder drives the glue dispensing device to move up and down, left and right, and back and forth to the preset position (without touching the bottom coating of the die bonder bracket). The industrial control computer 100 controls the controller. The controller 100 is in a pulse control mode to realize the opening and closing control of the valve body 205. After reaching the position, the controller 200 switches from a low pulse to a high pulse, and at this time the valve body 205 opens, and the glue flows out from the nozzle 204. Before switching to the next glue dispensing position, the controller 200 switches from a high pulse to a low pulse, and at this time the valve body 205 closes and the glue does not flow out. The die bonder drives the glue dispensing device to move to the next preset position, and the controller 200 repeats the above actions to control the valve body 205 to realize glue dispensing. The network interface 123 is used to connect with external devices for network data communication to collect relevant data. The cooling fan 127 ensures that the inside of the industrial control computer 100 is within the normal working temperature range; in this utility model, the nozzle 204 is used for glue dispensing, without directly touching the bottom coating of the die bonder bracket, so there will be no situation where the glue dispensing head touches the bottom coating of the bracket and punctures the coating. The amount of the sprayed glue is evenly controlled, and there will be no situation of too much or too little glue, and the defective rate is reduced. By storing the die bonding glue in the glue dispensing tube 2, the situation of direct exposure to the air and oxidation is avoided, and the risk of quality change of the die bonding glue is reduced. Now, through storage in the glue tube, the service life of the die bonding glue is extended, the stagnant time during operation is prolonged, the production quality of die bonding is ensured, and the production cost is saved.

[0038] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0039] The above-described embodiments only express the implementation manners of the present utility model, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. A dispensing device for a die bonder, used for LED lamp bead die bonding, characterized by: The dispensing device of the crystal bonding machine includes a control component and a dispensing tube. The control component includes an industrial computer and a controller. The controller is arranged on the crystal bonding machine, and the industrial computer is arranged on one side of the controller and is electrically connected to the controller. The industrial computer is used to control the controller. The dispensing tube is adjacent to the controller and is fixed on one side of the controller. The upper end of the dispensing tube is connected to the industrial computer through an air pressure tube, and the lower end of the dispensing tube is connected to the through groove at the lower end of the controller through a pipeline. A heating element is provided at the bottom of the through groove, and a dispensing mechanism is provided at the lower end of the through groove. The dispensing mechanism includes a first nozzle and a first valve body. The lower end of the through groove is connected to the nozzle through the valve body. The valve body is used to realize the connection and disconnection of the through groove and the nozzle. One end of the nozzle extends toward the direction of the LED lamp bead, and the controller is electrically connected to the heating element and the valve body respectively.

2. The dispensing device for a die bonder according to claim 1, characterized in that: The industrial computer includes a first control board and a second control board, and the first control board and the second control board are arranged opposite to each other.

3. The dispensing device for a die bonder according to claim 2, characterized in that: The first control panel is provided with a pressure regulating knob and a display screen. The display screen is provided on one side of the pressure regulating knob. The pressure regulating knob is used to regulate the gas pressure. The display screen is a touch-type liquid crystal display screen. The display screen is used to set parameters and display information.

4. The dispensing device for a die bonder according to claim 3, characterized in that: The second control board is provided with a plurality of functional interface components, a power interface, a power switch and a cooling fan, wherein the plurality of functional interface components include an input / output interface, a network interface, a gas interface and a valve body interface, wherein the power interface and the network interface are arranged on opposite sides of the second control board, the power switch and the cooling fan are both arranged adjacent to the power interface, the input / output interface is arranged adjacent to the network interface, and the gas interface and the valve body interface are both arranged between the power interface and the network interface.

5. The dispensing device for a die bonder according to claim 1, characterized in that: The controller is movably connected to the die bonding machine via a bracket, and the distance from the upper end of the dispensing tube to the controller in the horizontal direction is greater than the distance from the lower end of the dispensing tube to the controller.

6. The dispensing device for a die bonder according to claim 1, characterized in that: The heating element is a heating wire or a heating tube.

7. The dispensing device for a die bonder according to claim 1, characterized in that: The dispensing tube is provided with a cover body, the cover body is provided with a through hole for accommodating the air pressure tube, the cover body is movably connected to the dispensing tube, and one end of the air pressure tube is placed in the dispensing tube.

8. The dispensing device for a die bonder according to claim 1, characterized in that: The glue discharging mechanism further includes a plurality of second nozzles and a plurality of second valve bodies, and the number of the plurality of second valve bodies is the same as the number of the plurality of second nozzles.

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