Photovoltaic nondestructive laser cutting equipment

Abstract

The photovoltaic nondestructive laser cutting equipment comprises a bearing table, a laser cutting module, an x-direction driving mechanism, a y-direction driving mechanism, a visual positioning module and a restoration module, a sample is placed on the bearing table, the x-direction driving mechanism drives the bearing table to move back and forth in the x direction, and the y-direction driving mechanism drives the bearing table to move back and forth in the y direction; the sample is conveyed to the position below the laser cutting module after being corrected at the correcting module, the y-direction driving mechanism drives the laser cutting module to move back and forth in the y direction, and the visual positioning module detects the position of the sample on the bearing table; during cutting, the x-direction driving mechanism and the y-direction driving mechanism operate synchronously, the x-direction driving mechanism drives the sample to move to the position below the laser cutting module, and the y-direction driving mechanism moves the laser cutting module according to a detection result of the visual positioning module, so that a laser scanning path of the laser cutting module coincides with a preset cutting path of the sample. In the whole process, the sample does not need to be rectified, the sample does not need to be carried frequently, and the fragment rate and cost are low.

Description

Technical Field

[0001] This application belongs to the technical field of solar cell production. Specifically, it relates to a photovoltaic non-destructive laser cutting device. Background Art

[0002] During the production and processing of silicon wafers, a large solar cell or silicon wafer needs to be cut into two or more small solar cells or silicon wafers in the middle by a photovoltaic cutting device.

[0003] With the rapid development of the semiconductor industry, the market demand for silicon wafers is increasing day by day, and the quality requirements for silicon wafers are also getting higher and higher. Therefore, high precision is required for the photovoltaic cutting process, and the cutting surface should not have unevenness. Among them, the photovoltaic non-destructive cutting process is a cutting method widely used in the photovoltaic industry at present because of its small cutting damage.

[0004] When performing non-destructive cutting, due to the high precision requirements, the position of the silicon wafer needs to be corrected accurately before scribing, so that the laser scanning path coincides with the preset cutting path of the silicon wafer. This method will make the handling of silicon wafers relatively frequent, which is not conducive to the control of the fragmentation rate and the cost is also relatively high. Summary of the Utility Model

[0005] In view of this, this application provides a photovoltaic non-destructive laser cutting device. By moving the bearing table in the x direction and cooperating with the laser cutting module moving in the y direction, the laser scanning path coincides with the preset cutting path of the sample.

[0006] A photovoltaic non-destructive laser cutting device includes a bearing table, a laser cutting module, an x-direction driving mechanism, a y-direction driving mechanism, a visual positioning module and a rectifying module. In the x direction, the rectifying module is located upstream of the laser cutting module. A sample is placed on the bearing table. The x-direction driving mechanism drives the bearing table to move back and forth in the x direction, so that the sample is rectified at the rectifying module and then conveyed to the lower part of the laser cutting module. The y-direction driving mechanism drives the laser cutting module to move back and forth in the y direction. The visual positioning module detects the position of the sample on the bearing table;

[0007] During cutting, the x-direction driving mechanism and the y-direction driving mechanism run synchronously. The x-direction driving mechanism drives the sample to move to the lower part of the laser cutting module. The y-direction driving mechanism moves the laser cutting module according to the detection result of the visual positioning module, so that the laser scanning path of the laser cutting module coincides with the preset cutting path of the sample.

[0008] Preferably, it has a loading station, a cutting station, and an unloading station arranged in sequence along the x direction. The laser cutting module is located above the cutting station. The alignment module is arranged at the loading station. The x-direction driving mechanism drives the carrier table to reciprocate between the loading station, the cutting station, and the unloading station;

[0009] The laser cutting module includes a laser, optical devices, and a galvanometer. After the laser beam emitted by the laser is shaped by the optical devices to obtain a suitable light spot, the galvanometer scans the sample. The y-direction driving mechanism drives the laser, the optical devices, and the galvanometer to move back and forth in the y direction together.

[0010] Preferably, the moving distance of the laser cutting module in the y direction is less than or equal to 2 mm.

[0011] Preferably, a plurality of adsorption zones are provided on the surface of the carrier table in contact with the sample.

[0012] Preferably, the adsorption zones include two first adsorption zones and two second adsorption zones. Each first adsorption zone includes a plurality of first adsorption holes arranged at intervals along the x direction. Each second adsorption zone includes a plurality of second adsorption holes arranged at intervals along the x direction;

[0013] Along the x direction, the two first adsorption zones are located in the middle of the carrier table, and a gap is formed between the two first adsorption zones. The two second adsorption zones are located on both sides of the carrier table. Both sides of the sample are adsorbed on the carrier table through the second adsorption zones. The middle of the sample is adsorbed on the carrier table through the first adsorption zones, and the preset cutting path of the sample is located above the gap.

[0014] Preferably, the adsorption area of the first adsorption zone is smaller than the adsorption area of the second adsorption zone.

[0015] Preferably, a spraying unit is provided downstream of the laser cutting module along the x direction. The spraying unit sprays a cooling medium along the laser scanning path;

[0016] A heating unit is provided in the carrier table. The heating unit heats the carrier table when the spraying unit sprays the cooling medium.

[0017] Preferably, an unloading conveyor unit is provided at the unloading station. An adsorption part is provided on the surface of the unloading conveyor unit in contact with the sample. A drying unit is provided above the unloading conveyor unit.

[0018] Preferably, a hidden crack detection mechanism and a rotary unloading mechanism are provided on the unloading conveyor unit;

[0019] Along the x-direction, the hidden crack detection mechanism is arranged upstream of the drying unit, and the rotary blanking mechanism is arranged downstream of the drying unit.

[0020] Preferably, it further includes an interaction module. The x-direction driving mechanism drives the interaction module to move. There are two loading platforms, and the two loading platforms are arranged on the interaction module. Under the action of the interaction module, while one loading platform moves from the loading station to the cutting station, the other loading platform moves from the cutting station to the blanking station.

[0021] The beneficial effects of this application are as follows: When laser cutting a sample, the x-direction driving mechanism and the y-direction driving mechanism operate synchronously. The x-direction driving mechanism drives the sample to move below the laser cutting module, and the y-direction driving mechanism moves the laser cutting module according to the detection results of the visual positioning module, so that the laser scanning path of the laser cutting module coincides with the preset cutting path of the sample. Throughout the process, there is no need to correct the deviation of the sample, and there is no need to frequently transport the sample, resulting in a lower fragmentation rate and cost. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0023] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions that can be implemented in the present application. Therefore, they do not have technical substantive significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application.

[0024] Figure 1 It is a top view of the photovoltaic non-destructive laser cutting equipment;

[0025] Figure 2 It is a schematic structural diagram of the adsorption area on the loading platform;

[0026] Figure 3 It is a schematic structural diagram after the sample is cut.

[0027] In the figure: 1 - bearing platform; 2 - laser cutting module; 3 - y-direction driving mechanism; 4 - vision positioning module; 5 - sample; 51 - cutting surface; 6 - adsorption area; 61 - first adsorption area; 611 - first adsorption hole; 62 - second adsorption area; 621 - second adsorption hole; 63 - gap; 7 - blanking conveying unit; 71 - adsorption part; 72 - hidden crack detection mechanism; 73 - rotary blanking mechanism; 8 - drying unit. Detailed implementation manners

[0028] Next, the embodiments in the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0029] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0030] The present application provides a photovoltaic non-destructive laser cutting device. Refer to Figures 1-3 , including a bearing platform 1, a laser cutting module 2, an x-direction driving mechanism (not shown in the figure), a y-direction driving mechanism 3, a vision positioning module 4, and a rectifying module (not shown in the figure). In the x direction, the rectifying module is located upstream of the laser cutting module 2. A sample 5 is placed on the bearing platform 1. The x-direction driving mechanism drives the bearing platform 1 to move back and forth in the x direction, so that the sample 5 is rectified at the rectifying module and then conveyed to the lower part of the laser cutting module 2. The y-direction driving mechanism 3 drives the laser cutting module 2 to move back and forth in the y direction. The vision positioning module 4 detects the position of the sample 5 on the bearing platform 1.

[0031] During cutting, the x-direction driving mechanism and the y-direction driving mechanism 3 operate synchronously. The x-direction driving mechanism drives the sample 5 to move to the lower part of the laser cutting module 2. The y-direction driving mechanism 3 moves the laser cutting module 2 according to the detection result of the vision positioning module 4, so that the laser scanning path of the laser cutting module 2 coincides with the preset cutting path of the sample 5.

[0032] The sample 5 in this embodiment refers to a silicon wafer or a battery chip. As Figure 3 shown, after laser cutting, the sample 5 is split into two along the preset cutting path and has two opposite cutting surfaces 51. Of course, according to the actual situation, the sample 5 can also be split into four, or more. The present application does not make specific limitations on this.

[0033] Before laser cutting the sample 5, the position of the sample 5 on the carrier table 1 is rectified by the rectifying module to make the sample 5 as upright as possible on the carrier table 1. Subsequently, the position of the sample 5 on the carrier table 1 is detected by the vision positioning module 4, that is, the offset distance L1 of the preset cutting path on the carrier table 1 is detected. When laser cutting the sample 5, the y-direction driving mechanism 3 moves the laser cutting module 2 according to the result detected by the vision positioning module 4, that is, the moving distance L2 of the laser cutting module 2 in the y direction is equal to L1. And during cutting, the x-direction driving mechanism and the y-direction driving mechanism 3 are started simultaneously. During the process of the carrier table 1 moving along the x direction, one end to the other end of the sample 5 is gradually moved under the laser cutting module 2. Cooperating with the movement of the laser cutting module 2 in the y direction, even if the position of the sample 5 on the carrier table 1 is not rectified and there is an offset distance L1 of the preset cutting path on the carrier table 1, the laser scanning path of the laser cutting module 2 can still coincide with the preset cutting path of the sample 5, ensuring that the laser scanning path does not deviate, and completing the cutting of the sample 5.

[0034] The laser cutting module 2 in this embodiment includes a grooving laser unit and a thermal cracking laser unit. During cutting, first, the grooving laser unit performs laser grooving along the preset cutting path, and then the thermal cracking laser unit performs laser thermal cracking along the preset cutting path. Specifically, along the x direction, the grooving laser unit is located upstream of the thermal cracking laser unit. In this way, during the process of the grooving laser unit grooving the sample 5, the thermal cracking laser unit can perform thermal cracking on the sample 5 along the preset cutting path.

[0035] The y-direction driving mechanism drives the grooving laser unit and the thermal cracking laser unit to move simultaneously in the y direction. In order to enable both the grooving laser unit and the thermal cracking laser unit to perform laser scanning along the preset cutting path, the moving distance of the grooving laser unit and the thermal cracking laser unit in the y direction is determined according to L1 detected by the vision positioning module 4. And in the x direction, the light-emitting point of the grooving laser unit is located upstream of the light-emitting point of the thermal cracking laser unit, and the light-emitting points of the grooving laser unit and the thermal cracking laser unit are close to coinciding. In this way, the scanning paths of the grooving laser unit and the thermal cracking laser unit can both coincide with the preset cutting path. The specific processes of grooving and thermal cracking are prior art and will not be described in detail here.

[0036] Specifically, the photovoltaic non-destructive laser cutting device further includes a control module (not shown in the figure). The vision positioning module 4, the x-direction driving mechanism, the y-direction driving mechanism, and the laser cutting module 2 are all connected to the control module. The vision positioning module 4 uploads the detection result to the control module. When the carrier table 1 moves to the cutting station, the control module controls the synchronous operation of the y-direction driving mechanism and the x-direction driving mechanism. During the process of moving the sample 5 along the x direction, the y-direction driving mechanism moves the grooving laser unit and the thermal cracking laser unit according to the detection result of the vision positioning module 4. Since the light-emitting point of the grooving laser unit is located upstream of the thermal cracking laser unit along the x direction, the preset cutting path of the sample 5 is first grooved and then thermally cracked to complete the cutting.

[0037] In this embodiment, the specific structures of the x-direction driving mechanism and the y-direction driving mechanism 3 are not limited, as long as they can enable the carrier table 1 to move back and forth in the x direction and the laser cutting module 2 to move back and forth in the y direction.

[0038] It can be understood that L1 and L2 can be positive values or negative values. When L1 is a positive value, the laser cutting module 2 moves L2 along the y direction. When L1 is a negative value, the laser cutting module 2 moves L2 along the direction opposite to the y direction. In addition, L1 and L2 can be a fixed value or represent a range value. When it is a fixed value, the offset distance of the preset cutting path on the carrier table 1 as a whole is the same. When it is a range value, the offset distance of the preset cutting path on the carrier table 1 as a whole gradually decreases or gradually increases along the x direction.

[0039] Further, the photovoltaic non-destructive laser cutting device of this embodiment has a loading station, a cutting station, and an unloading station arranged in sequence along the x direction. The laser cutting module 2 is located above the cutting station. The alignment module is located at the loading station. The x-direction driving mechanism drives the carrier table 1 to reciprocate between the loading station, the cutting station, and the unloading station.

[0040] The laser cutting module 2 includes a laser, an optical device, and a galvanometer. After the laser beam emitted by the laser is shaped by the optical device to obtain a suitable light spot, it scans the sample 5 through the galvanometer. The y-direction driving mechanism drives the laser, the optical device, and the galvanometer to move back and forth in the y direction together.

[0041] It can be understood that the grooving laser unit includes a grooving laser, a grooving optical device, and a grooving galvanometer, and the thermal cracking laser unit includes a thermal cracking laser, a thermal cracking optical device, and a thermal cracking galvanometer.

[0042] The sample 5 is loaded at the loading station, aligned by the alignment module, then transferred from the loading station to the cutting station for laser cutting. The cut sample 5 is then transferred to the unloading station for unloading and transferred to the next process for processing.

[0043] Before loading, the carrier table 1 moves to the loading station, and the sample 5 to be cut is conveyed onto the carrier table 1 at the loading station, and then is aligned by the alignment module. The alignment module used in this embodiment is a prior art, as long as it can align the sample 5. For example, the alignment module can be alignment plates driven by cylinders and arranged on both sides of the loading station along the x direction. In this way, one alignment plate is provided on each side of the carrier table 1. When the carrier table 1 moves between the two alignment plates, the alignment plates on both sides are driven by the cylinders to move towards the carrier table 1 until both sides of the sample 5 on the carrier table 1 are in contact with the alignment plates, and the surfaces of the two alignment plates in contact with the sample 5 are both parallel to the x direction, so that the preset cutting path is as parallel as possible to the x direction, and the offset distance L1 of the preset cutting path on the carrier table 1 is minimized.

[0044] Usually during non-destructive cutting, a reference line is set on the carrier table 1, and the scanning path of the laser cutting module 2 is set according to the position of the reference line. After the sample 5 is conveyed onto the carrier table 1, the sample 5 is corrected by the deviation correction mechanism so that the preset cutting path coincides with the reference line. In this way, after the sample 5 is conveyed below the laser cutting module 2, it is not necessary to move the laser cutting module 2 to make the laser scanning path coincide with the preset cutting path to complete the cutting of the sample 5. However, in this application, there is no need to set a deviation correction mechanism. When there is an offset distance L1 between the preset cutting path and the reference line on the carrier table 1, during the process of cutting the sample 5 by moving the carrier table 1 in the x direction, the laser cutting module 2 moves in the y direction according to the detection result of the visual positioning module 4, so that it is not necessary to correct the sample 5 to make the laser scanning path coincide with the preset cutting path. The whole process does not require sample correction, does not require frequent sample handling, and has a low fragmentation rate and cost.

[0045] When the sample 5 on the carrier table 1 is aligned by the alignment module and then conveyed to the cutting station, the moving distance L2 of the laser cutting module 2 in the y direction is ≤ 2 mm.

[0046] When the sample 5 is conveyed to the cutting station, the offset distance between the laser scanning path and the preset cutting path is very small. Specifically, when one end of the sample 5 moves below the laser cutting module 2, the y-direction driving mechanism moves the laser cutting module 2 by L2 according to the detection result of the vision positioning module, so that the light-emitting point of the laser cutting module 2 is directly opposite to one end of the preset cutting path. The x-direction driving mechanism and the y-direction driving mechanism operate synchronously, so that the laser cutting module 2 performs laser scanning along the preset cutting path to complete the cutting of the sample 5. When the offset distance L1 is a fixed value, after the light-emitting point of the laser cutting module 2 is directly opposite to one end of the preset cutting path, the laser cutting module 2 remains stationary, and the carrier 1 is moved by the x-direction driving mechanism, so that one end to the other end of the preset cutting path gradually passes through the light-emitting point of the laser cutting module 2 to complete the cutting of the sample 5.

[0047] As Figure 2 shown, multiple adsorption areas 6 are provided on the surface of the carrier 1 in contact with the sample 5. After the sample 5 is aligned by the alignment module, the sample 5 is adsorbed on the carrier 1, and then is sequentially conveyed to the cutting station and the blanking station. During the conveying process, the sample 5 is always adsorbed on the carrier 1, so as to ensure that the position of the sample 5 does not shift during the conveying and cutting processes.

[0048] Furthermore, the adsorption area 6 includes two first adsorption areas 61 and two second adsorption areas 62. Each first adsorption area 61 includes a plurality of first adsorption holes 611 arranged at intervals in the x direction, and each second adsorption area 62 includes a plurality of second adsorption holes 621 arranged at intervals in the x direction;

[0049] Along the x direction, the two first adsorption areas 61 are located in the middle of the carrier 1, and a gap 63 is formed between the two first adsorption areas 61. The two second adsorption areas 62 are located on both sides of the carrier 1. Both sides of the sample 5 are adsorbed on the carrier 1 through the second adsorption areas 62, the middle of the sample 5 is adsorbed on the carrier 1 through the first adsorption areas 61, and the preset cutting path of the sample 5 is located above the gap 63.

[0050] An adsorption cavity is provided in the carrier 1. The adsorption cavity is communicated with a vacuum generator. The first adsorption holes 611 and the second adsorption holes 621 are both communicated with the adsorption cavity. The vacuum generator evacuates the adsorption cavity to generate negative pressure, so as to adsorb the sample 5 on the carrier 1 through each first adsorption hole 611 and second adsorption hole 621.

[0051] The adsorption area of the first adsorption zone 61 is smaller than that of the second adsorption zone 62. After the sample 5 is adsorbed on the carrier table 1, the preset cutting path is located above the gap 63, so that the suction force of the first adsorption zone 61 on both sides of the preset cutting path is smaller than that of the second adsorption zone 62 on both sides of the sample 5. In this way, a slight movement to both sides can occur after laser cutting, which is beneficial for the segmentation after cutting. Specifically, the pore area of the first adsorption zone 61 is smaller than that of the second adsorption zone 62. It can be that the number of the first adsorption holes 611 is the same as that of the second adsorption holes 621, and the diameter of the first adsorption holes 611 is smaller than that of the second adsorption holes 621. Or it can be that the diameter of the first adsorption holes 611 is equal to that of the second adsorption holes 621, and the number of the first adsorption holes 611 is smaller than that of the second adsorption holes 621.

[0052] Along the x direction, a spraying unit (not shown in the figure) is further provided downstream of the laser cutting module 2, that is, a spraying unit is provided downstream of the thermal cracking laser unit. When the sample 5 is conveyed below the spraying unit, the liquid outlet of the spraying unit is directly opposite to the cutting path on the sample 5. In this way, when the sample 5 is successively grooved and thermally cracked, the spraying unit sprays the cooling medium along the laser scanning path, and a heating unit is provided in the carrier table 1. The heating unit heats the carrier table 1 when the spraying unit sprays the cooling medium, so that the sample 5 placed on the carrier table 1 is heated, so as to utilize the temperature difference between the high-temperature sample 5 and the low-temperature cooling medium to achieve a large temperature gradient, so that no bad phenomena such as wavy stripes will occur on the cut surface 51 after segmentation, and the quality of the cut surface 51 is improved.

[0053] In the blanking station of this embodiment, a blanking conveying unit 7 is provided. An adsorption part 71 is provided on the surface of the blanking conveying unit 7 in contact with the sample 5, and a drying unit 8 is provided above the blanking conveying unit 7.

[0054] After the sample 5 is cut, the carrier table 1 is conveyed to the blanking station, and the vacuum generator is turned off, so that the adsorption force of the adsorption zone 6 on the sample 5 is zero. Then the sample 5 is conveyed from the carrier table 1 to the blanking conveying unit 7. The blanking conveying unit 7 includes a conveyor belt. The adsorption part 71 is a plurality of adsorption holes provided on the upper surface of the conveyor belt. The sample 5 is adsorbed on the conveyor belt through the adsorption holes, so that the position of the sample 5 will not shift when the cut sample 5 is dried by the drying unit 8.

[0055] When the sample 5 is conveyed to the lower part of the drying unit 8 by the conveyor belt, the air outlet of the drying unit 8 is directly opposite to the cutting part of the sample 5, so that the hot air generated by the drying unit 8 can directly act on the two cut surfaces 51, and the residual water stains after the sample 5 is cut can be quickly cleaned. The drying unit 8 used in this embodiment is a prior art, and its specific structure is not specifically limited, as long as it can generate hot air to remove the residual water stains on the sample 5.

[0056] Reference Figure 1 , a crack detection mechanism 72 and a rotary blanking mechanism 73 are provided on the blanking conveyor unit 7; along the x direction, the crack detection mechanism 72 is arranged upstream of the drying unit 8, and the rotary blanking mechanism 73 is arranged downstream of the drying unit 8.

[0057] After the sample 5 is cut and conveyed from the cutting station to the blanking station, the crack detection mechanism 72 is used to detect the contour line of the sample 5 to observe the cutting smoothness of the cutting surface 51 and detect the hidden cracks of the sample 5. Preferably, the crack detection mechanism 72 is a camera. After the sample 5 is detected by the crack detection mechanism 72, it is conveyed to the lower part of the drying unit 8 for drying. After drying, the qualified sample 5 is carried by the rotary blanking mechanism 73 to the blanking belt and then conveyed to the next process for processing, while the unqualified sample 5 flows out from the end of the conveyor belt and is separately collected, so as not to affect the overall production rhythm. The rotary blanking mechanism 73 of this embodiment is a prior art and will not be described in detail here.

[0058] The photovoltaic non-destructive laser cutting equipment of this embodiment further includes an interaction module (not shown in the figure), and the x-direction driving mechanism drives the interaction module to move. Reference Figure 1 and Figure 2 , there are two bearing platforms 1, and the two bearing platforms 1 are arranged on the interaction module. Under the action of the interaction module, while one bearing platform 1 moves from the loading station to the cutting station, the other bearing platform 1 moves from the cutting station to the blanking station. In this way, when one sample 5 is cut, the next sample 5 to be cut can be quickly conveyed to the cutting station, improving the cutting efficiency. The structure of the interaction module and the process of realizing the interaction between the two bearing platforms 1 are both prior arts, and this embodiment will not describe them in detail.

[0059] In this specification, each embodiment is described in a progressive, or parallel, or a combination of progressive and parallel ways. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts between each embodiment can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the method part.

[0060] It should be noted that in the description of this application, it should be understood that the orientation or positional relationships indicated by terms such as "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. This is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present simultaneously.

[0061] It should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the article or device comprising the above elements.

[0062] The above description of the disclosed embodiments enables those skilled in the art to implement or use this application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A photovoltaic lossless laser cutting device, characterized in that: The invention comprises a carrier platform (1), a laser cutting module (2), an x-direction driving mechanism, a y-direction driving mechanism (3), a visual positioning module (4) and a correction module. In the x-direction, the correction module is located upstream of the laser cutting module (2). A sample (5) is placed on the carrier platform (1). The x-direction driving mechanism drives the carrier platform (1) to move back and forth in the x-direction, so that the sample (5) is corrected at the correction module and then transferred to the bottom of the laser cutting module (2). The y-direction driving mechanism (3) drives the laser cutting module (2) to move back and forth in the y-direction. The visual positioning module (4) detects the position of the sample (5) on the carrier platform (1). During cutting, the x-axis driving mechanism and the y-axis driving mechanism (3) operate synchronously, the x-axis driving mechanism drives the sample (5) to move to the bottom of the laser cutting module (2), and the y-axis driving mechanism (3) moves the laser cutting module (2) according to the detection result of the visual positioning module (4), so that the laser scanning path of the laser cutting module (2) coincides with the preset cutting path of the sample (5).

2. The photovoltaic lossless laser cutting device according to claim 1, characterized in that: It has a loading station, a cutting station and a unloading station arranged in sequence along the x-direction, the laser cutting module (2) is located above the cutting station, the alignment module is arranged at the loading station, and the x-direction driving mechanism drives the carrier platform (1) to reciprocate between the loading station, the cutting station and the unloading station; The laser cutting module (2) comprises a laser, an optical device and a galvanometer. The laser beam emitted by the laser is shaped by the optical device to obtain a suitable light spot, and then scans the sample (5) through the galvanometer. The y-direction driving mechanism drives the laser, the optical device and the galvanometer to move back and forth in the y direction.

3. The photovoltaic lossless laser cutting device according to claim 2, characterized in that: The moving distance of the laser cutting module (2) in the y direction is less than or equal to 2 mm.

4. A photovoltaic lossless laser cutting device according to any one of claims 1 to 3, characterized in that: A plurality of adsorption areas (6) are provided on a side of the carrier platform (1) that contacts the sample (5).

5. The photovoltaic lossless laser cutting device according to claim 4, characterized in that: The adsorption area (6) comprises two first adsorption areas (61) and two second adsorption areas (62), each of the first adsorption areas (61) comprises a plurality of first adsorption holes (611) arranged at intervals along the x direction, and each of the second adsorption areas (62) comprises a plurality of second adsorption holes (621) arranged at intervals along the x direction; Along the x direction, the two first adsorption areas (61) are located in the middle of the carrier platform (1), and a gap (63) is formed between the two first adsorption areas (61), and the two second adsorption areas (62) are located on both sides of the carrier platform (1), and both sides of the sample (5) are adsorbed on the carrier platform (1) through the second adsorption areas (62), and the middle of the sample (5) is adsorbed on the carrier platform (1) through the first adsorption area (61), and the preset cutting path of the sample (5) is located above the gap (63).

6. The photovoltaic lossless laser cutting device according to claim 5, characterized in that: The adsorption area of ​​the first adsorption zone (61) is smaller than the adsorption area of ​​the second adsorption zone (62).

7. A photovoltaic lossless laser cutting device according to claim 2 or 3, characterized in that: Along the x direction, a spraying unit is provided downstream of the laser cutting module (2), and the spraying unit sprays a cooling medium along the laser scanning path; A heating unit is provided inside the support platform (1), and the heating unit heats the support platform (1) when the spraying unit sprays the cooling medium.

8. The photovoltaic lossless laser cutting device according to claim 7, characterized in that: A material unloading conveying unit (7) is provided at the unloading station, a side of the material unloading conveying unit (7) in contact with the sample (5) is provided with an adsorption portion (71), and a drying unit (8) is provided above the material unloading conveying unit (7).

9. The photovoltaic lossless laser cutting device according to claim 8, characterized in that: The material unloading and conveying unit (7) is provided with a hidden crack detection mechanism (72) and a rotary material unloading mechanism (73); Along the x direction, the hidden crack detection mechanism (72) is arranged upstream of the drying unit (8), and the rotary unloading mechanism (73) is arranged downstream of the drying unit (8).

10. The photovoltaic lossless laser cutting device according to claim 2, characterized in that: It also includes an interactive module, wherein the x-axis driving mechanism drives the interactive module to move, and two carrying platforms (1) are provided, and the two carrying platforms (1) are arranged on the interactive module. Under the action of the interactive module, one of the carrying platforms (1) moves from the loading station to the cutting station, while the other carrying platform (1) moves from the cutting station to the unloading station.

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