Copper-plated anode plate and electroplating equipment

Abstract

The utility model relates to the technical field of current collector electroplating, in particular to a copper-plated anode plate and electroplating device.The copper-plated anode plate comprises an upper anode plate body and a lower anode plate body which are the same in structure, the anode plate body internally comprises a plurality of anode boxes, and the anode boxes are internally provided with conductive areas formed by splicing a plurality of trapezoidal titanium meshes; wherein the titanium meshes of the conducting areas are connected through bevel edges and the same top edges or bottom edges, current access points of the titanium meshes are located in the middle positions of the trapezoidal titanium meshes along the long edges or the short edges of the conducting areas on the edges of the anode boxes, only one current access point exists in the titanium meshes, and high-current areas and low-current areas of the titanium meshes between the adjacent anode boxes are distributed in a staggered mode. Wherein the current access points of the titanium mesh can also be distributed at the intersection points of the four vertex angles and the center line of the titanium mesh. And the titanium meshes of the conductive regions are connected through bevel edges, different top edges or bottom edges. The current distribution uniformity of the electroplating titanium mesh can be improved, the fluctuation of square resistance is reduced, and the electroplating uniformity is improved.

Description

Technical Field

[0001] This application relates to the technical field of current collector electroplating, and particularly relates to a copper plating anode plate and electroplating equipment. Background Art

[0002] In the composite current collector industry, when using a bilateral edge-clamping roll-type horizontal coating equipment to electroplate a copper layer on a composite copper current collector, there is only one current access point in the middle of the edge of the trapezoidal electroplated titanium mesh on the equipment. The thickness of the electroplated copper layer of the composite copper current collector near the high-current area in the middle of the titanium mesh is thick, and the conductivity in the MD direction is high. The current is weak in the triangular area at the long side of the lower bottom of the trapezoidal titanium mesh, especially at the junction of the titanium meshes. The thickness of the electroplated copper layer of the composite copper current collector near this low-current area is thin, and the conductivity in the MD direction is low. Therefore, there is a large difference in the thickness of the electroplated copper layer in different areas of the same composite copper current collector, and the sheet resistance cannot fluctuate within the range of 19 mΩ to 21 mΩ, and can only fluctuate within the range of 19 mΩ to 23 mΩ at most, resulting in problems such as poor conductivity and decreased product performance of the produced composite copper current collector. Such a composite copper current collector with a large conductivity difference will have a certain impact on the battery capacity and performance after being made into a battery. Utility Model Content

[0003] In order to overcome the problems existing in the prior art, this application provides a copper plating anode plate and electroplating equipment.

[0004] The copper plating anode plate and electroplating equipment provided by this application adopt the following technical solutions:

[0005] A copper plating anode plate includes an upper anode plate and a lower anode plate with the same structure. The anode plate includes several anode boxes. Each anode box is provided with a conductive area assembled by multiple trapezoidal titanium meshes. The titanium meshes in the conductive area are connected by hypotenuses, the same top edges or bottom edges. The current access point of the titanium mesh is at the middle position of the long side or short side of the trapezoidal titanium mesh along the edge of the conductive area of the anode box, and there is only one current access point for the titanium mesh. The high-current areas and low-current areas of the titanium meshes between adjacent anode boxes are staggered.

[0006] Preferably, the high-current area of the conductive area is the conductive area distributed along the central cross of the titanium mesh, and the low-current area is the conductive area around the central frame of the titanium mesh.

[0007] By adopting the above technical solutions, the adjacent titanium meshes in the anode box are connected between hypotenuses, top edges and top edges, and bottom edges and bottom edges. The high-current area of the formed conductive area is at the short-side center or long-side center of the titanium mesh at the edge of the anode box. The conductive areas in adjacent two anode boxes are vertically offset, and the high-current area is moved 10 - 15 cm to one side, realizing the staggered distribution of the high-current area and low-current area of the titanium mesh, and reducing the conductivity difference between the anode boxes.

[0008] A copper-plated anode plate includes an upper anode plate and a lower anode plate with the same structure. The above anode plate includes a number of anode boxes. A conductive area assembled by a plurality of trapezoidal titanium meshes is provided in the anode box. Among them, the titanium meshes in the conductive area are connected by the hypotenuse, the same top side or bottom side. The current access points of the titanium mesh are distributed at the four top corners and the intersection of the center lines of the titanium mesh. Among them, the high-current areas and low-current areas of the titanium mesh between adjacent anode boxes are staggered.

[0009] A copper-plated anode plate includes an upper anode plate and a lower anode plate with the same structure. The above anode plate includes a number of anode boxes. A conductive area assembled by a plurality of trapezoidal titanium meshes is provided in the anode box. Among them, the titanium meshes in the conductive area are connected by the hypotenuse, different top sides or bottom sides. The current access points of the titanium mesh are distributed at the four top corners and the intersection of the center lines of the titanium mesh. Among them, the high-current areas and low-current areas of the titanium mesh between adjacent anode boxes are staggered.

[0010] Preferably, the high-current area of the conductive area is located in the short-side area, the long-side end area and the central area of the trapezoidal titanium mesh, and the low-current area of the conductive area is located in the area between the long-side end and the center of the trapezoidal titanium mesh.

[0011] By adopting the above technical solution, the current access points of the titanium mesh are distributed at the four top corners and the intersection of the center lines of the titanium mesh, thereby changing the distribution of the high-current area and the low-current area on the titanium mesh. Therefore, when arranging the titanium mesh in the anode box, one connection method is to connect between the hypotenuses, between the top sides, and between the bottom sides. The conductive areas on adjacent anode boxes are vertically offset, and the low-current areas located in the short-side area and the long-side end of the trapezoidal titanium mesh are corresponded to the areas between the long-side end and the center of the trapezoidal titanium mesh on the adjacent anode box, so as to realize the staggered distribution of the high-current area and the low-current area of the titanium mesh in adjacent anode boxes. Another method is to connect between the hypotenuses and between the top side and the bottom side. The conductive areas on adjacent anode boxes are horizontally distributed, and the low-current areas located in the short-side area and the long-side end of the trapezoidal titanium mesh can be corresponded to the areas between the long-side end and the center of the trapezoidal titanium mesh on the adjacent anode box. Both methods can improve the uniformity of the titanium mesh current distribution.

[0012] An electroplating device includes the above copper-plated anode plate.

[0013] In summary, the present application includes at least one of the following beneficial technical effects:

[0014] 1. In the present application, the high-current area and the low-current area can be perfectly staggered and overlapped by the staggered movement of the titanium mesh in the anode box, so that the sheet resistance uniformity of the electroplated composite copper current collector is good, and the conductivity and thickness difference of the electroplated copper layer in different areas are small;

[0015] 2. In this application, the titanium mesh changes from single-point current introduction to multi-point current introduction, making the current distribution more uniform, thereby improving the electroplating uniformity and thickness consistency. Description of the Drawings

[0016] Figure 1 is a schematic structural diagram of a copper-plated anode plate in Example 1;

[0017] Figure 2 is a schematic structural diagram of a copper-plated anode plate in Example 2;

[0018] Figure 3 is a schematic structural diagram of a copper-plated anode plate in Example 3;

[0019] Figure 4 is a schematic structural diagram of the titanium mesh of a copper-plated anode plate in Example 1;

[0020] Figure 5 is a schematic structural diagram of the titanium mesh of a copper-plated anode plate in Examples 2 and 3.

[0021] Description of the Reference Numerals: 1, titanium mesh; 11, high-current region; 12, low-current region; 13, current access point; 2, copper-plated anode plate; 21, anode box; 22, upper anode plate; 23, lower anode plate. Detailed Description of the Embodiments

[0022] The following further describes the present application in detail with reference to the Figures 1 - 5 drawings.

[0023] Example 1

[0024] The embodiment of the present application discloses a copper-plated anode plate and an electroplating device.

[0025] Referring to Figure 1 and Figure 4, a copper-plated anode plate 2, comprising an upper anode plate 22 and a lower anode plate 23 with the same structure. The above anode plate includes several anode boxes 21. A conductive area assembled by multiple trapezoidal titanium meshes 1 is provided in the anode box 21. Among them, the titanium meshes 1 in the conductive area are connected by the hypotenuse, the same top side or bottom side. The current access point 13 of the titanium mesh 1 is at the middle position of the long side or short side of the conductive area along the edge of the anode box 21 of the trapezoidal titanium mesh 1, and there is only one current access point 13 for the titanium mesh 1. Among them, the high-current areas 11 and low-current areas 12 of the titanium meshes 1 between adjacent anode boxes 21 are distributed alternately. Preferably, the high-current area 11 of the conductive area is a conductive area distributed along the central cross of the titanium mesh 1, and the low-current area 12 is the conductive area around the central frame of the titanium mesh 1. The adjacent titanium meshes 1 in the anode box 21 are connected between the hypotenuses, between the top sides, and between the bottom sides. The high-current area 11 of the formed conductive area is at the center of the short side or the long side of the titanium mesh 1 at the edge of the anode box 21. The conductive areas in the adjacent two anode boxes 21 are vertically offset, and the high-current area 11 is moved 10 cm to one side, realizing the staggered distribution of the high-current area 11 and the low-current area 12 of the titanium mesh 1, and reducing the linear difference in conductivity between the anode boxes 21.

[0026] An electroplating device, comprising the above copper-plated anode plate 2.

[0027] Example 2

[0028] The embodiment of the present application discloses a copper-plated anode plate 2 and an electroplating device.

[0029] Refer to Figure 2 and Figure 5, A copper-plated anode plate 2, comprising an upper anode plate 22 and a lower anode plate 23 with the same structure. The above anode plate includes a number of anode boxes 21. A conductive area assembled by multiple trapezoidal titanium meshes 1 is provided in the anode box 21. Among them, the titanium meshes 1 in the conductive area are connected by the hypotenuse, the same top side or bottom side. The current access points 13 of the titanium mesh 1 are distributed at the four top corners and the intersection of the center lines of the titanium mesh 1. Among them, the high-current areas 11 and low-current areas 12 of the titanium mesh 1 between adjacent anode boxes 21 are staggered. The high-current area 11 of the conductive area is located in the short-side area, the long-side end area and the central area of the trapezoidal titanium mesh 1. The low-current area 12 of the conductive area is located in the area between the long-side end and the center of the trapezoidal titanium mesh 1. By distributing the current access points 13 of the titanium mesh 1 at the four top corners and the intersection of the center lines of the titanium mesh 1, the distribution of the high-current area 11 and the low-current area 12 on the titanium mesh 1 is changed. Therefore, when arranging the titanium mesh 1 in the anode box 21, a connection method of connecting between the hypotenuses, between the top sides, and between the bottom sides is adopted. The conductive areas on adjacent anode boxes 21 are vertically offset. The low-current area 12 between the short-side area and the long-side end of the trapezoidal titanium mesh 1 is corresponded to the low-current area 12 between the long-side end and the center of the trapezoidal titanium mesh 1 on the adjacent anode box 21. In this way, the high-current area 11 and the low-current area 12 of the titanium mesh 1 in adjacent anode boxes 21 are staggered, which can improve the uniformity of the current distribution of the titanium mesh 1.

[0030] An electroplating device, comprising the above copper-plated anode plate 2.

[0031] Example 3

[0032] The embodiment of the present application discloses a copper-plated anode plate 2 and an electroplating device.

[0033] Refer to Figure 3 and Figure 5, A copper-plated anode plate 2, comprising an upper anode plate 22 and a lower anode plate 23 with the same structure. The above anode plate includes a number of anode boxes 21. Inside the anode box 21, there is a conductive area assembled by multiple trapezoidal titanium meshes 1. Among them, the titanium meshes 1 in the conductive area are connected by the hypotenuse, different top edges or bottom edges. The current access points 13 of the titanium mesh 1 are distributed at the four top corners of the titanium mesh 1 and the intersection of the center lines. Among them, the high-current areas 11 and low-current areas 12 of the titanium mesh 1 between adjacent anode boxes 21 are staggered. The high-current area 11 of the conductive area is located in the short-side area, the long-side end area and the central area of the trapezoidal titanium mesh 1, and the low-current area 12 of the conductive area is located in the area between the long-side end and the center of the trapezoidal titanium mesh 1. By distributing the current access points 13 of the titanium mesh 1 at the four top corners of the titanium mesh 1 and the intersection of the center lines, the distribution of the high-current area 11 and the low-current area 12 on the titanium mesh 1 is changed. Therefore, when arranging the titanium mesh 1 in the anode box 21, a connection method of connecting between the hypotenuses and connecting the top edge and the bottom edge is adopted, and the horizontal distribution of the conductive areas on adjacent anode boxes 21 can achieve the correspondence between the low-current area 12 located in the short-side area and the long-side end of the trapezoidal titanium mesh 1 and the area between the long-side end and the center of the trapezoidal titanium mesh 1 on the adjacent anode box 21. In this way, the high-current area 11 and the low-current area 12 of the titanium mesh 1 in adjacent anode boxes 21 are staggered, which can improve the uniformity of the current distribution of the titanium mesh 1.

[0034] The above are all the preferred embodiments of this application, and the protection scope of this application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape and principle of this application should be covered within the protection scope of this application.

Claims

1. A copper-plated anode plate, characterized in that: The invention comprises an upper anode plate (22) and a lower anode plate (23) of the same structure, wherein the anode plate comprises a plurality of anode boxes (21), wherein the anode box (21) is provided with a conductive area assembled from a plurality of trapezoidal titanium meshes (1), wherein the titanium meshes (1) in the conductive area are connected by oblique edges, the same top edge or the same bottom edge, and the current access point (13) of the titanium mesh (1) is located in the middle of the long side or the short side of the conductive area of ​​the trapezoidal titanium mesh (1) along the edge of the anode box (21), and the titanium mesh (1) has only one current access point, wherein the high current area (11) and the low current area (12) of the titanium mesh (1) between adjacent anode boxes (21) are staggeredly distributed.

2. The copper-plated anode plate according to claim 1, characterized in that: The high current region (11) of the conductive zone is a conductive region distributed along the central cross of the titanium mesh (1), and the low current region (12) is a conductive region around the central frame of the titanium mesh (1).

3. A copper-plated anode plate, characterized in that: The invention comprises an upper anode plate (22) and a lower anode plate (23) of the same structure, wherein the anode plate comprises a plurality of anode boxes (21), wherein the anode box (21) is provided with a conductive area assembled from a plurality of trapezoidal titanium meshes (1), wherein the titanium meshes (1) in the conductive area are connected by oblique edges, the same top edges or bottom edges, and the current access points (13) of the titanium meshes (1) are distributed at the four top corners of the titanium meshes (1) and at the intersection of the center line, wherein the high current areas (11) and the low current areas (12) of the titanium meshes (1) between adjacent anode boxes (21) are staggeredly distributed.

4. A copper-plated anode plate, characterized in that: The invention comprises an upper anode plate (22) and a lower anode plate (23) of the same structure, wherein the anode plate comprises a plurality of anode boxes (21), wherein the anode box (21) is provided with a conductive area assembled from a plurality of trapezoidal titanium meshes (1), wherein the titanium meshes (1) in the conductive area are connected by oblique edges, different top edges or bottom edges, and the current access points (13) of the titanium meshes (1) are distributed at the four top corners of the titanium meshes (1) and at the intersection of the center line, wherein the high current areas (11) and low current areas (12) of the titanium meshes (1) between adjacent anode boxes (21) are staggeredly distributed.

5. A copper-plated anode plate according to claim 3 or 4, characterized in that: The high current region (11) of the conductive zone is located in the short side region, the long side end region and the central region of the trapezoidal titanium mesh (1), and the low current region (12) of the conductive zone is located in the region between the long side end and the center of the trapezoidal titanium mesh (1).

6. An electroplating device, characterized in that: A copper-plated anode plate comprising any one of claims 1 to 5.

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