Compact type silicon wafer drying equipment

Abstract

The utility model belongs to the technical field of drying equipment, and relates to compact type silicon wafer drying equipment which comprises a drying groove body and a plurality of flower baskets, a plurality of vertical type air knives are arranged in the drying groove body, the vertical type air knives extend along the XZ face and divide the interior of the drying groove body into two drying cavities containing the plurality of flower baskets, and a plurality of silicon wafers are inserted in the flower baskets. The surface of the silicon wafer is along the YZ surface, the blowing direction of the vertical air knife faces the two sides of the Y direction, two sets of blowing pipes are further arranged in the drying groove body, the two sets of blowing pipes are located in the two drying cavities respectively and located at the opposite positions of the vertical air knife in the Y direction, and the blowing direction of the blowing pipes is along the Y direction and faces the vertical air knife. A hollowed-out supporting frame and a drainage mechanism are arranged on the lower portion of the drying groove body, the supporting frame supports the flower basket, and the drainage mechanism is located below the supporting frame. According to the equipment, a plurality of silicon wafers in the flower basket can be simultaneously dried by utilizing hot air blown out by the vertical air knife and the air blowing pipe, water can be drained from the bottom, and the equipment is compact in structure and high in drying efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of drying equipment, and particularly relates to a compact silicon wafer drying equipment. Background Art

[0002] In the preparation process of solar cell silicon wafers, efficient drying of silicon wafers is one of the important processes. After the silicon wafers are cleaned, a lot of liquid droplets will adhere to the surface, and these liquid droplets need to be removed immediately.

[0003] Chinese Patent CN 218179431U discloses a silicon wafer drying device. This device blows hot air between the silicon wafers from both sides of the flower basket through a blowing air pipe. A flow equalizing plate is provided at the bottom inside the shell, and the water droplets on the low rod of the flower basket can be dried by the heat radiation of the flow equalizing plate. However, in the middle position of the flower basket of this device, it is far from the blowing air pipe, the wind force is weakened, and the drying effect is not good.

[0004] Therefore, it is necessary to improve the drying equipment to solve the above problems. Summary of the Invention

[0005] The main purpose of the utility model is to provide a compact silicon wafer drying equipment, which can dry multiple silicon wafers in the flower basket at the same time, and the equipment has a compact structure and high drying efficiency.

[0006] The utility model realizes the above purpose through the following technical solutions: a compact silicon wafer drying equipment, including a drying tank body and several flower baskets. Several vertical air knives are arranged in the drying tank body. The vertical air knives extend along the XZ plane and divide the interior of the drying tank body into two drying chambers for accommodating several of the flower baskets. Several silicon wafers are inserted in the flower baskets, and the plate surfaces of the silicon wafers are all along the YZ plane. The blowing direction of the vertical air knives is towards both sides in the Y direction. Two groups of blowing air pipes are also arranged in the drying tank body. The two groups of blowing air pipes are respectively located in the two drying chambers and are in the Y-direction opposite positions of the vertical air knives. The blowing direction of the blowing air pipes is along the Y direction and towards the vertical air knives. A hollow support frame and a drainage mechanism are arranged at the lower part of the drying tank body. The support frame supports the flower basket, and the drainage mechanism is located below the support frame.

[0007] Specifically, a cover plate is arranged on each side in the Y direction of the drying tank body. The cover plate is rotatably connected to the upper edge of the drying tank body. When the two cover plates are in the horizontal position, the open mouth of the drying tank body is closed.

[0008] Furthermore, two inclined push cylinders are symmetrically arranged on one side in the X direction of the drying tank body. The axis of the inclined push cylinder is always located in the YZ plane. A swing block is arranged at the X-direction end of the rotating shaft of each cover plate. The two ends of the inclined push cylinder are respectively hinged to the outer wall of the drying tank body and the outer end of the swing block.

[0009] Further, a gas collecting box is provided on the other side of the drying tank body in the X direction. The gas collecting box is located inside the drying tank body and has a number of air suction holes.

[0010] Specifically, the inside of the flower basket is a storage space for silicon wafers. The flower basket includes two end plates on both sides of the storage space in the X direction, a number of side blocking rods on both sides of the storage space in the Y direction, a number of lower blocking rods below the storage space, and a number of upper blocking rods above the storage space. The side blocking rods, the lower blocking rods, and the upper blocking rods are all connected between the two end plates and their axes are all along the X direction.

[0011] Further, all the side blocking rods and all the lower blocking rods are fixedly connected to the end plates. The upper part of the lower blocking rods and the inner sides of the side blocking rods are provided with silicon wafer insertion seams corresponding in position. The upper part of the end plates is provided with clamping notches for clamping the ends of the upper blocking rods.

[0012] Further, two hooks are provided on the upper part of each end plate.

[0013] The beneficial effects of the technical solution of the present utility model are as follows:

[0014] In this equipment, all silicon wafers are arranged in parallel in the flower basket. The flower basket and the silicon wafers form an integral body and are placed in the drying tank body in a positioned manner. The vertical air knife forms a blocking effect on the internal space of the drying tank body, thereby forming a number of relatively independent drying chambers. Since the silicon wafers in the drying tank body are all along the YZ direction, the air flow blown out from the air blowing holes on the vertical air knife and the air blowing pipe is along the surface of the silicon wafer, so the surface of the silicon wafer can be quickly dried. This equipment has a compact structure and high drying efficiency. Description of the Drawings

[0015] Figure 1 It is a sectional view of the silicon wafer drying equipment in the closed cover state along the YZ plane for the embodiment;

[0016] Figure 2 It is a right view of the silicon wafer drying equipment in the open cover state for the embodiment;

[0017] Figure 3 It is a sectional view of the silicon wafer drying equipment in the open cover state along the XZ plane for the embodiment;

[0018] Figure 4 It is a three-dimensional view of the silicon wafer drying equipment with the cover removed for the embodiment;

[0019] Figure 5 It is a three-dimensional view of the flower basket.

[0020] The numbers in the figures represent:

[0021] 1 - Silicon wafer drying equipment,

[0022] 11 - Drying tank body, 111 - Vertical air knife, 1111 - Air blowing holes, 112 - Air blowing pipes, 113 - Drying cavity, 114 - Support frame, 115 - Drainage mechanism, 116 - Air collecting box, 1161 - Air suction holes,

[0023] 12 - Flower basket, 121 - End plate, 1211 - Clamping notch, 1212 - Hook, 122 - Side blocking rod, 123 - Lower blocking rod, 124 - Upper blocking rod,

[0024] 13 - Cover plate, 131 - Swing block,

[0025] 14 - Inclined push cylinder;

[0026] 2 - Silicon wafer. Specific implementation manner

[0027] The present utility model will be further described in detail below in conjunction with specific embodiments.

[0028] Embodiment:

[0029] As Figure 1 , Figure 3 and Figure 4 shown, a compact silicon wafer drying device 1 of the present utility model includes a drying tank body 11 and a plurality of flower baskets 12. A vertical air knife 111 and two groups of air blowing pipes 112 are arranged in the drying tank body 11. The vertical air knife 111 extends along the XZ plane and divides the interior of the drying tank body 11 into two drying cavities 113 for accommodating the flower baskets 12. The two groups of air blowing pipes 112 are respectively located in the two drying cavities 113 and are in opposite positions to the vertical air knife 111. A plurality of silicon wafers 2 are inserted in the flower baskets 12, and the plate surfaces of the silicon wafers 2 are all along the YZ plane. The air blowing direction of the vertical air knife 111 is towards both sides in the Y direction, and the air blowing direction of the air blowing pipes 112 is along the Y direction and towards the vertical air knife 111.

[0030] All the silicon wafers 2 are arranged in parallel in the flower basket 12. The flower basket 12 and the silicon wafers 2 form a whole and are placed in the drying tank body 11 in a positioned manner. The vertical air knife 111 acts as a partition for the internal space of the drying tank body 11, thus forming several relatively independent drying chambers 113. Since the silicon wafers 2 in the drying tank body 11 are all along the YZ direction, the air flow blown out from the air blowing holes 1111 on the vertical air knife 111 is along the surface of the silicon wafers 2, so the surface of the silicon wafers 2 can be quickly dried. The hot air blown out from the air blowing pipe 112 is also along the surface of the silicon wafers 2. Theoretically, the wind force in the area farther away from the air blowing holes 1111 is smaller, so the hot air flow velocity near the edge of the drying tank body 11 will decrease. The air blowing pipe 112 can strengthen the drying effect in this area, thus ensuring the stability of the drying quality of the entire surface. In the embodiment, only one vertical air knife 111 is provided in the drying tank body 11, so it is divided into two drying chambers 113. In other embodiments, multiple vertical air knives 111 can be used, and the number of drying chambers 113 is 1 more than the number of vertical air knives 111. The structure of this equipment is compact and the drying efficiency is high.

[0031] As Figures 1 to 3 shown, a hollow support frame 114 and a drainage mechanism 115 are provided at the lower part of the drying tank body 111. The support frame 114 supports the flower basket 12, and the drainage mechanism 115 is located below the support frame 114.

[0032] If there is more liquid remaining on the silicon wafers 2, then at the beginning of drying, affected by the hot air, it will more or less drip downwards. Therefore, here the support frame 114 is needed to hold the flower basket 12, and at the same time, the liquid droplets can pass through the support frame 114 and then be drained away through the drainage mechanism 115.

[0033] As Figures 1 to 3 shown, a cover plate 13 is provided on each side of the drying tank body 111 in the Y direction. The cover plate 13 is rotatably connected to the upper edge of the drying tank body 111. When the two cover plates 13 are in the horizontal position, they close the open mouth of the drying tank body 1. Two inclined push cylinders 14 are symmetrically provided on one side of the drying tank body 111 in the X direction. The axis of the inclined push cylinder 14 is always located in the YZ plane. A swing block 131 is provided at the X-direction end of the rotating shaft of each cover plate 13. The two ends of the inclined push cylinder 14 are respectively hinged to the outer wall of the drying tank body 111 and the outer end of the swing block 131.

[0034] During the drying process, it is also necessary to prevent dust in the air from entering the drying chamber 113 and then contaminating the surface of the silicon wafers 2. Therefore, a rotatable opening cover plate 13 should be provided on the drying tank body 111. The cover plate 13 only needs to be opened when the flower basket 12 is sent into and out of the drying chamber 113. The inclined push cylinder 14 enables the opening of the cover plate 13 to be automated, so that the normal operation of the equipment can be carried out without personnel.

[0035] As Figure 1 、 Figure 3and Figure 4 As shown in Figure 4 , on the other side of the drying tank body 111 in the X direction, there is a gas collecting box 116. The gas collecting box 116 is located inside the drying tank body 111 and has a number of suction holes 1161.

[0036] When the cover plate 13 is closed, the inside of the drying tank body 111 is airtight. Since it is impossible to have air inlet without air outlet, it is necessary to set up the gas collecting box 116 to discharge the excess hot air. In order to stagger the position of the inclined push cylinder 14 from the pipeline of the gas collecting box 116, the gas collecting box 116 should be arranged on the opposite side of the inclined push cylinder 14.

[0037] As Figure 5 shown in Figure 5 , the inside of the flower basket 12 is the storage space for the silicon wafers 2. The flower basket 12 includes two end plates 121 located on both sides of the storage space in the X direction, a number of side blocking rods 122 located on both sides of the storage space in the Y direction, a number of lower blocking rods 123 located below the storage space, and a number of upper blocking rods 124 located above the storage space. The side blocking rods 122, the lower blocking rods 123 and the upper blocking rods 124 are all connected between the two end plates 121 and their axes are all along the X direction. All the side blocking rods 122 and all the lower blocking rods 123 are fixedly connected to the end plates 121. There are corresponding silicon wafer insertion joints (details not shown) on the upper part of the lower blocking rods 123 and the inner sides of the side blocking rods 122. There are clamping notches 1211 on the upper part of the end plates 121 for clamping the ends of the upper blocking rods 124. There are two hooks 1212 on the upper part of each end plate 121.

[0038] Since the flower basket 12 not only has to support the silicon wafers 2 but also allows hot air to blow in, it is designed as a hollow framework structure surrounded by two end plates 121, a number of side blocking rods 122, a number of lower blocking rods 123 and a number of upper blocking rods 124. The silicon wafer insertion joints are used to keep the spacing between the silicon wafers, otherwise the hot air cannot pass through between the two silicon wafers 2. The side blocking rods 122 and the lower blocking rods 123 are fixed on the end plates 121. Only the upper blocking rods 124 can be removed from the clamping notches 1211 of the end plates 121. At this time, the silicon wafers 2 can be inserted downward into the flower basket 121. After installing the upper blocking rods 124, the silicon wafers 2 have no relative movement space. When the silicon wafers 2 and the flower basket 12 are assembled into a whole, the hoisting device hoists the whole into the drying chamber 113 through the four hooks 1212, saving manpower.

[0039] The working process of this silicon wafer drying equipment 1 is as follows: The wafer basket 12 completes the insertion of the silicon wafers 2 outside the drying tank body 11 to form an integral body; two inclined push cylinders 14 respectively drive the two cover plates 13 to open to the vertical state, and the lifting device places the above-mentioned integral body into the drying tank body 11 from top to bottom. When all the drying chambers 113 are full, the cover plates 13 are closed; on the one hand, the vertical air knives 111 and the air blowing pipes 112 blow air onto the surface of the silicon wafers 2, and on the other hand, the air collecting box 116 initially sucks air. The liquid drops on the silicon wafers 2 that fall to the bottom of the drying tank body 11 will also be drained away by the drainage mechanism 115, thereby completing the drying of the silicon wafers 2; after the silicon wafers 2 are dried, the air blowing and air suction are stopped, the cover plates 13 are opened, and the wafer basket 12 is then lifted out and removed.

[0040] The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the creative concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A compact silicon wafer drying device, characterized in that: It includes a drying trough body and a plurality of flower baskets. The drying trough body is provided with a plurality of upright air knives. The upright air knives extend along the XZ plane and divide the interior of the drying trough body into two drying chambers for accommodating the plurality of flower baskets. A plurality of silicon wafers are inserted in the flower baskets. The plate surfaces of the silicon wafers are all along the YZ plane. The blowing direction of the upright air knives is toward both sides of the Y direction. The drying trough body is also provided with two groups of blowing pipes. The two groups of blowing pipes are respectively located in the two drying chambers and are at the Y-direction relative position of the upright air knives. The blowing direction of the blowing pipes is along the Y direction and toward the upright air knives. A hollow supporting frame and a drainage mechanism are provided at the lower part of the drying trough body. The supporting frame supports the flower baskets, and the drainage mechanism is located below the supporting frame.

2. The compact silicon wafer drying equipment according to claim 1, characterized in that: A cover plate is respectively provided on both sides of the drying tank body in the Y direction. The cover plates are rotatably connected to the upper edge of the drying tank body. When the two cover plates are in a horizontal position, the open opening of the drying tank body is closed.

3. The compact silicon wafer drying equipment according to claim 2, characterized in that: Two oblique thrust cylinders are symmetrically arranged on one side of the drying trough body in the X direction, the axis of the oblique thrust cylinder is always located in the YZ plane, a swing block is arranged at the X-direction end of the rotating shaft of each cover plate, and the two ends of the oblique thrust cylinder are respectively hinged to the outer wall of the drying trough body and the outer end of the swing block.

4. The compact silicon wafer drying equipment according to claim 3, characterized in that: An air collecting box is provided on the other side of the drying tank body in the direction X. The air collecting box is located inside the drying tank body and has a plurality of air suction holes.

5. The compact silicon wafer drying equipment according to claim 1, characterized in that: The flower basket contains a storage space for silicon wafers. The flower basket includes two end plates located on both sides of the storage space in the X direction, a plurality of side baffles located on both sides of the storage space in the Y direction, a plurality of lower baffles located below the storage space, and a plurality of upper baffles located above the storage space. The side baffles, the lower baffles, and the upper baffles are all connected between the two end plates, and their axes are all along the X direction.

6. The compact silicon wafer drying equipment according to claim 5, characterized in that: All side baffles and all lower baffles are fixedly connected to the end plate, the upper part of the lower baffle and the inner side of the side baffle are provided with corresponding silicon chip insertion seams, and the upper part of the end plate is provided with a clamping notch for clamping the end of the upper baffle.

7. The compact silicon wafer drying equipment according to claim 5, characterized in that: Two hooks are provided on the upper portion of each end plate.

Images