Packaging pressure sensor
By using Rubber as a medium in the pressure sensor for contact signal transmission, and combining EMC's fixed packaging technology, the problem of open-cavity structural pressure sensor is solved, and the reliability of the sensor is improved.
Patent Information
- Application Number
- CN202422004911.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-08-19
AI Technical Summary
In the prior art, the pores of the open-cavity structure pressure sensor are easily affected by the external environment (such as moisture, oil stains and other pollutants), resulting in the chip loss or the sensor testing accuracy becomes poor.
By using Rubber as a medium for connecting the pressure chip to the outside world, external signals can be transmitted in contact, avoid interference from external environment, and fixedly package the pressure chip and substrate through the cooperation of EMC and Rubber to protect the chip.
It effectively avoids interference caused by the external environment, improves the reliability of the pressure sensor, and prevents chip functions and poor sensor accuracy.
Smart Images
Figure CN222912964U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to a packaged pressure sensor. Background Art
[0002] Chip packaging is the shell used to install semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role in integrated circuits.
[0003] For customers with customized designs, especially those with special requirements for sensor packaging, chip packaging generally does not adopt traditional IC packaging. Instead, it adopts open-cavity packaging in which the sensing part of the sensor chip or the entire chip is exposed. The characteristic of open-cavity packaging is that the sensor chip is directly exposed in the cavity of a specific mold, and the functional chip is half-wrapped with plastic packaging material or exposed as a whole in the carrier board, so as to give full play to the performance of the sensor chip.
[0004] At present, most of the pressure sensors in the market are gauge pressure, absolute pressure and differential pressure sensors. These sensors have pores connected to the outside world, and the most common structural types are open-cavity structures such as substrate + metal shell, substrate + plastic tube shell + cover plate. The pores connect the outside world with the inside of the pressure sensor. Although the performance of the sensor chip can be brought into play, it is easy for the pressure chip to be affected by the external environment (such as moisture, oil stains and other pollutants), which will cause the loss of chip function or the deterioration of sensor test accuracy. Utility Model Content
[0005] In view of the problem that the air holes of the open-cavity structure pressure sensor in the prior art communicate with the outside world and the inside of the pressure sensor, the pressure chip is easily affected by the external environment such as moisture and oil stains, resulting in the loss of the pressure chip function or the deterioration of the test accuracy of the sensor, the utility model provides a packaged pressure sensor. By using Rubber as the medium to connect the pressure chip with the outside world, contact transmission of external signals is achieved, which effectively avoids interference caused by the external environment and improves the reliability of the pressure sensor.
[0006] The utility model provides a packaged pressure sensor, comprising a pressure chip, a substrate, and an EMC; the utility model also comprises a rubber, wherein the rubber is packaged in the EMC, the upper surface of the rubber is exposed at the upper end of the EMC, the lower surface of the rubber is in close contact with a sensing area on the upper surface of the pressure chip, the pressure chip is packaged in the EMC, and the substrate and the pressure chip are electrically connected.
[0007] Furthermore, the Rubber is a columnar elastic member with an arc-shaped upper end surface. The installation of the Rubber effectively avoids interference from the external environment and improves the reliability of the pressure sensor.
[0008] Furthermore, the substrate is in close contact with the EMC and is arranged at the bottom of the EMC. The substrate and the pressure chip are connected via gold wires. The exposed portion of the rubber is the pressure chip sensing area. The gold wires complete the electrical connection between the pressure chip and the substrate through heat pressing or ultrasonic energy.
[0009] Furthermore, the substrate is closely attached to the EMC and arranged at the upper end of the EMC, the substrate and the pressure chip are connected via solder balls, the exposed portion of the rubber is the pressure chip sensing area, and the solder balls are responsible for connecting electrical signals.
[0010] Furthermore, a hole is opened on the substrate, and the pressure chip is flipped on the substrate with the hole using a solder ball.
[0011] Furthermore, a TSV structure interface is provided on the pressure chip to realize vertical interconnection between the layers inside the chip. By drilling vertical through holes on the pressure chip and connecting signal lines through the electrodes, fast signal transmission and high packaging density between chips can be achieved.
[0012] Furthermore, the TSV structure interface is connected to the substrate PAD through solder ball welding.
[0013] The beneficial effects of the utility model are:
[0014] (1) The utility model uses a rubber elastic member as a medium to connect the pressure chip with the outside world, and transmits external signals by contact, which effectively avoids interference from the external environment and improves the reliability of the pressure sensor.
[0015] (2) In the utility model, the pressure chip and the substrate are fixedly packaged by the cooperation of EMC and Rubber. EMC is an epoxy resin plastic that protects the pressure chip. This solves the technical problem in the prior art that pores easily introduce external pollutants, resulting in loss of chip function or deterioration of sensor test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 This is a structural schematic diagram of Example 1 of the specific implementation method of the utility model.
[0018] Figure 2 This is a structural schematic diagram of Example 2 of the specific implementation method of the utility model.
[0019] Figure 3 This is a structural schematic diagram of Example 3 of the specific implementation method of the utility model.
[0020] In the figure, 1-Rubber, 2-pressure chip, 3-substrate, 4-EMC, 5-gold wire, 6-solder ball, 7-TSV structure. DETAILED DESCRIPTION
[0021] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0022] In this utility model, the meanings of English terms are as follows:
[0023] Rubber represents an elastic part made of soft rubber material, which is used to deform internally when subjected to external pressure and transmit pressure to the chip.
[0024] EMC stands for epoxy resin plastic, which is used to fix the packaging rubber, pressure chip, substrate, gold wire, solder ball, TSV structure, and can also protect the pressure chip.
[0025] The TSV structure represents the use of three-dimensional packaging technology to process and manufacture vertical through holes on the chip, penetrating electrodes to connect signal lines.
[0026] PAD represents a rectangular metal area on the chip, which is used to connect the chip to external circuits.
[0027] Die bond process stands for die bonding process, which refers to bonding the chip to a designated area through colloid to form an electrical path.
[0028] Wire Bond process stands for wire bonding process, which refers to the use of gold wire or metal wire to complete the connection between the pressure chip and the circuit by heat pressing.
[0029] Example 1
[0030] like Figure 1As shown, a packaged pressure sensor includes a pressure chip 2, a substrate 3, an EMC 4, and a gold wire 5; and also includes a Rubber 1, the Rubber 1 is packaged in the EMC 4, the upper surface of the Rubber 1 is exposed at the upper end of the EMC 4, the lower surface of the Rubber 1 is in close contact with the sensing area on the upper surface of the pressure chip 2, the pressure chip 2 is packaged in the EMC 4, and the substrate 3 is electrically connected to the pressure chip 2. Figure 1 Shown is the gold wire 5 connection;
[0031] Figure 1 The medium pressure chip 2 is glued to the pad of the substrate 3 through the Die Bond process, and then the PAD on the pressure chip 2 is connected to the PAD on the substrate 3 through the gold wire 5 through the Wire Bond process to generate an electrical signal; the pressure chip 2 sensing area is exposed through the EMC 4 window plastic sealing, and Rubber 1 is used to glue and contact the pressure chip 2 sensing area in the window channel, and a section of Rubber 1 is exposed. The exposed part of Rubber 1 is the pressure chip 2 sensing area.
[0032] Example 2
[0033] like Figure 2 As shown, a packaged pressure sensor includes a pressure chip 2, a substrate 3, an EMC 4, and a solder ball 5; and also includes a rubber 1, the rubber 1 is packaged in the EMC 4, the upper surface of the rubber 1 passes through the substrate 3 and is exposed at the upper end of the EMC 4, the lower surface of the rubber 1 is in close contact with the sensing area on the upper surface of the pressure chip 2, the substrate 3 is in close contact with the EMC 4 and is arranged at the upper end of the EMC 4, the substrate 3 and the pressure chip 2 are connected through the solder ball 5, a hole is opened on the substrate 3, the pressure chip 2 is flip-mounted on the substrate 3 with the hole by the solder ball 5, and the rubber 1 passes through the substrate 3 to expose the sensing area of the pressure chip 2;
[0034] The substrate 3 is processed for opening, and the pressure chip 2 is sealed around with a glue dispenser. The chip is packaged through EMC 4, and the sensing area of the pressure chip 2 in the substrate opening is glued with Rubber 1, and a section of Rubber 1 is exposed. The exposed part of Rubber 1 is the sensing area of the pressure chip 2.
[0035] Example 3
[0036] like Figure 3As shown, a packaged pressure sensor includes a pressure chip 2, a substrate 3, an EMC 4, a solder ball 5, a TSV 7 structure, and a Rubber 1. The Rubber 1 is packaged in the EMC 4. The substrate 3 is in close contact with the EMC 4 and is arranged at the bottom of the EMC 4. The pressure chip 2 is provided with a TSV 7 structure. The pressure chip 2 is soldered to the TSV 7 interface with the substrate 3 PAD through the solder ball 5 to achieve circuit conduction and generate an electrical signal.
[0037] After the pressure chip 2 is sealed around by using a dispensing machine, the chip is packaged through EMC 4; Rubber 1 is used to glue the pressure chip 2 sensing area in the opening of the substrate 3 and expose a section of Rubber 1. The exposed part of Rubber 1 is the pressure chip 2 sensing area.
[0038] The specific packaging process of the utility model is as follows:
[0039] Epoxy resin is injected into EMC 4 for curing, and Rubber 1, pressure chip 2, substrate 3, gold wire 5, solder ball 6, and TSV 7 structure are fixed in EMC 4. Rubber 1 is glued to the sensing area of the contact pressure chip 2 in the window channel, and a section of Rubber 1 is exposed. The lower surface of Rubber 1 is in close contact with the upper surface of the pressure chip 2. By squeezing the exposed Rubber 1 area, the pressure chip 2 is subjected to downward pressure. The PAD on the pressure chip 2 is connected to the PAD on the substrate 3 through the gold wire 5 or solder ball 6 to generate an electrical signal. The pressure chip 2 is provided with a TSV 7 structure. The TSV 7 interface is welded with the substrate 3 PAD through the solder ball 6 to achieve circuit conduction and generate an electrical signal. Rubber 1 serves as a medium for connecting the pressure chip 2 with the outside world. External signals are transmitted by contact, which effectively avoids interference caused by the external environment and improves the reliability of the pressure sensor.
[0040] Although the present invention is described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, a person skilled in the art may make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions shall be within the scope of the present invention. Any person skilled in the art who is familiar with the present technical field may easily think of changes or substitutions within the technical scope disclosed in the present invention, and these shall be within the scope of protection of the present invention.
Claims
1. A packaged pressure sensor, comprising a pressure chip, a substrate, and an EMC; characterized in that: It also includes Rubber, which is packaged in the EMC. The upper surface of the Rubber is exposed at the upper end of the EMC. The lower surface of the Rubber is in close contact with the sensing area on the upper surface of the pressure chip. The pressure chip is packaged in the EMC, and the substrate is electrically connected to the pressure chip.
2. A packaged pressure sensor as claimed in claim 1, characterized in that: Rubber is a columnar elastic member with an arc-shaped upper end surface.
3. A packaged pressure sensor as claimed in claim 1, characterized in that: The substrate is in close contact with the EMC and is arranged at the bottom of the EMC. The substrate and the pressure chip are connected via gold wires, and the exposed part of the rubber is the pressure chip sensing area.
4. A packaged pressure sensor as claimed in claim 1, characterized in that: The substrate is in close contact with the EMC and is arranged on the upper end of the EMC. The substrate and the pressure chip are connected via solder balls, and the exposed part of the rubber is the pressure chip sensing area.
5. A packaged pressure sensor as claimed in claim 4, characterized in that: A hole is opened on the substrate, and the pressure chip is flip-mounted on the substrate with the hole using a solder ball.
6. A packaged pressure sensor as claimed in claim 1, characterized in that: A TSV structure interface is provided on the pressure chip.
7. A packaged pressure sensor as claimed in claim 6, characterized in that: The TSV structure interface is connected to the substrate PAD through solder ball welding.