Semiconductor intelligent distributed SIC power device test equipment
By designing an intelligent distributed SIC power device test equipment, using independent aging seats and heating plates, the test interruption problem caused by defective product failures in traditional aging tests is solved, and the test efficiency and result accuracy are improved.
Patent Information
- Application Number
- CN202421654282.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-13
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-13
AI Technical Summary
In traditional aging tests, poor quality SIC power devices are prone to short circuits and other failures in high temperature environments, causing the aging box to stop working, and the aging tests of other devices to be tested are forced to terminate, affecting the test efficiency and the accuracy of the results.
A semiconductor intelligent distributed SIC power device testing device is designed, using multiple independent aging seats and heating plates. Each SIC power device corresponds to an independent heating zone. When a certain SIC power device fails, the corresponding heating plate can stop heating and avoid affecting the testing of other devices.
It realizes the mutual impact of the aging test links between each SIC power device, improves the testing efficiency, and ensures the accuracy and safety of the aging test results.
Smart Images

Figure CN222913796U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of testing equipment, and specifically to semiconductor intelligent distributed SIC power device testing equipment. Background Art
[0002] SIC power devices generally refer to silicon carbide power devices, which are a new type of power semiconductor devices with higher operating temperature, higher switching speed and lower conduction loss compared to traditional silicon power devices.
[0003] In order to evaluate the long-term stability and reliability of SIC power devices, they are usually subjected to aging tests. Traditional aging tests place SIC power devices in an aging box, where the heating elements simulate a high-temperature environment to detect whether the SIC power devices can maintain the stability of their performance and functions in a high-temperature environment.
[0004] Since the traditional aging chamber controls its internal heating elements to heat the entire interior of the aging chamber, the temperature acts on multiple SIC power devices at the same time, so that each SIC power device is in a high-temperature environment. However, this batch of devices to be tested may be mixed with SIC power devices of poor quality. These defective products cannot fully adapt to the high-temperature environment, which will cause short circuits and other phenomena. In order to prevent the short-circuited SIC power devices from continuing to be in a high-temperature environment and causing safety accidents, the aging chamber is usually stopped to ensure the safety of the aging test, resulting in the forced termination of the aging test of other SIC power devices that have not completed the test, causing some SIC power devices to need to repeat the aging test, affecting the test efficiency of the SIC power devices, and repeated testing is also likely to affect the accuracy of the final test results. Utility Model Content
[0005] The utility model provides semiconductor intelligent distributed SIC power device testing equipment, which solves the problem in the related art that some SIC power devices need to undergo repeated aging tests, which affects the test efficiency of the SIC power devices.
[0006] The technical solution of the utility model is as follows:
[0007] Semiconductor intelligent distributed SIC power device testing equipment includes a box body, which has a power supply and a control panel for monitoring and controlling the power supply current output. A plurality of aging boards are arranged inside the box body, each of which includes a connecting plate body and a plurality of aging seats, each of which is fixedly arranged on the connecting plate body, and the connecting plate body is detachably connected to the box body; each of the aging seats has a heating groove, each of which is provided with a heating plate, and each of the heating plates is electrically connected to the power supply.
[0008] Furthermore, the box body has a plurality of test cavities, each of which has an opening on the surface of the box body, and each of the connecting plates is slidably connected to each of the test cavities in a one-to-one correspondence.
[0009] Furthermore, the connecting plate body is provided with a heat sink, the heat sink is electrically connected to the power supply, and a heat dissipation port is provided at one end of the test cavity away from the opening, and the inner wall of the heat dissipation port abuts against the outer surface of the heat sink.
[0010] Furthermore, the width of the projection surface of the heat dissipation port on the vertical horizontal plane is smaller than the width of the opening on the vertical horizontal plane, and the end of the test cavity away from the opening is provided with a power supply contact post for facilitating the power supply to the radiator and the heating plate, and the connecting plate body is provided with a connecting hole for cooperating with the power supply contact post.
[0011] Furthermore, slide rails are provided on both sides of the test cavity, each of the slide rails extends to the opening, and slide grooves are provided on both sides of the connecting plate body, and each of the slide grooves corresponds to each slide rail one by one.
[0012] Furthermore, the adjacent aging seats are staggered and distributed on the connecting plate body.
[0013] Furthermore, the box body is provided with a plurality of limit rod frames at each opening, each of the limit rod frames comprises a limit rod and a rotating rod, the limit rod is fixedly connected to the rotating rod, the rotating rod is a damping shaft and is rotatably connected to the box body.
[0014] The working principle and beneficial effects of the utility model are:
[0015] The utility model mainly includes a box body, which has a power supply, a control panel for monitoring and controlling the power supply current output, and a plurality of aging boards; each aging board includes a connecting plate body and a plurality of aging seats for installing the SIC power devices to be tested. Each aging seat is fixedly arranged on the connecting plate body, and the connecting plate body is detachably connected to the box body, so that the staff can install each SIC power device to be tested in each aging seat one by one, and then install the connecting plate body into the box body for aging test:
[0016] Each aging seat has a heating groove, each heating groove is provided with a heating plate, each heating plate is electrically connected to a power supply, each heating plate is independent of each other, and corresponds to each SIC power device to be tested. That is, the utility model has a number of independent temperature rise areas, and when a certain SIC power device fails, the corresponding heating plate can be controlled to stop heating, so that the aging test links between the SIC power devices do not affect each other, ensuring the test efficiency of the SIC power device and the accuracy of the final result of the aging test. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0018] Figure 1 This is a structural schematic diagram of Example 1;
[0019] Figure 2 This is a schematic diagram of the structure of the aging plate when it slides in Example 1;
[0020] Figure 3 This is a front view of the box in Example 1;
[0021] Figure 4 This is a schematic diagram of the position of the heat dissipation port on the box body in Example 1;
[0022] Figure 5 It is a structural schematic diagram of the aging board in Example 1;
[0023] Figure 6 for Figure 5 A partial enlarged view of the middle part;
[0024] Figure 7 Schematic diagram of the position of the connecting hole on the aging board in Example 1;
[0025] Figure 8 This is a schematic diagram of the structure of the heat sink in Embodiment 1 when it is combined with the heat dissipation port;
[0026] Fig. 9 It is a structural schematic diagram of the limiting rod frame in Example 1;
[0027] Fig.10 This is a schematic diagram of the structure of the aging seat in Example 1 in conjunction with the device to be tested.
[0028] In the figure:
[0029] 1. Box body; 11. Test cavity; 12. Heat dissipation port; 13. Power supply contact column; 2. Control panel; 3. Aging board; 31. Connecting plate body; 311. Connecting hole; 312. Slide groove; 32. Aging seat; 321. Heating groove; 322. Heating plate; 4. Radiator; 5. Slide rail; 6. Limit rod bracket; 61. Limit rod; 62. Rotating rod. DETAILED DESCRIPTION
[0030] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0031] Example 1
[0032] like Figure 1-2 As shown, this embodiment proposes a semiconductor intelligent distributed SIC power device testing equipment, which mainly includes a box 1, the box 1 has a power supply, and a control panel 2 for monitoring and controlling the power supply current output. The control panel 2 mainly includes a display screen, that is, the internal working conditions of this embodiment are displayed in real time through the display screen, which is convenient for the staff to take targeted measures.
[0033] like Figure 2 , Figure 5 to Figure 7 As shown, a plurality of aging boards 3 are arranged inside the box 1, each aging board 3 includes a connecting board body 31 and a plurality of aging seats 32, and a circuit board is arranged inside the connecting board body 31, that is, when each aging board 3 is installed in the box 1, the aging board 3 should be electrically connected to the power supply inside the box 1, so that the aging board 3 can perform aging test on the SIC power device installed thereon;
[0034] The connecting plate body 31 is detachably connected to the box body 1, so that the staff can first assemble each SIC power device on each aging seat 32 on the connecting plate body 31, and then put the aging board 3 into the box body 1, which facilitates the installation of each SIC power device in this embodiment.
[0035] like Figure 6 , Fig.10 As shown, each aging seat 32 in this embodiment has a heating groove 321, and each heating groove 321 is provided with a heating plate 322. Each heating plate 322 is electrically connected to the power supply through the connecting plate body 31, so that the power supply can be used as the energy source of each heating plate 322, so that the heating plate 322 generates heat, thereby increasing the ambient temperature of the location where the SIC power device is located, thereby simulating the high-temperature working environment of the SIC power device and detecting the stability of the SIC power device working in the high-temperature environment; and the circuit of each heating plate 322 should be connected to the power supply in parallel, so that each heating plate 322 is independent of each other, so that when a certain SIC power device fails, the heating work of the matching heating plate 322 can be stopped without stopping the entire aging test work, thereby ensuring the aging test efficiency of this embodiment.
[0036] At the same time, the top surface of the aging seat 32 has an interface for connecting the SIC power device, and the heating plate 322 is located at the bottom of the heating groove 321, so that there is a certain height difference between the SIC power device and the heating plate 322, so that the heat emitted by the heating plate 322 does not directly contact the SIC power device, but by increasing the ambient temperature around the SIC power device, the SIC power device is placed in a high temperature environment, which better simulates the actual temperature environment and ensures the accuracy and authenticity of the detection results.
[0037] Each aging seat 32 is fixedly arranged on the connecting plate body 31, and each aging seat 32 has a test module inside. Each test module mainly includes a detection circuit and an ammeter. By connecting each test module in parallel to the circuit board inside the plate body 31, the current can flow to the detection circuit through the circuit board, but the detection circuit is in an interrupted state under normal circumstances. When the SIC power device needs to be assembled to the aging seat 32, the SIC power device is used to enable the current to pass through the detection circuit normally, so that the ammeter can normally measure the current passing through the detection circuit; and when the SIC power device has a short circuit or other faults due to the aging test (affected by high temperature), the current cannot pass through the detection circuit normally, so that the ammeter cannot measure the current, and the ammeter has a wireless communication module. When the ammeter does not measure the current, it can send a signal to the control panel 2 through the wireless communication module, so that the corresponding information is displayed on the display screen of the control panel 2, thereby informing the staff that the SIC power device on a certain aging seat 32 has a fault, so that the staff can take countermeasures. That is, the aging test equipment in this embodiment preferably adopts the method of electrical parameter monitoring to monitor whether each SIC power device has a fault.
[0038] When the control panel 2 detects that a SIC power device on an aging seat 32 somewhere fails, the staff can turn off the corresponding switch and control the power supply to stop supplying power to the aging seat 32 and the heating plate 322 in the aging seat 32, so as to prevent current from still passing through the aging seat 32 and the heating plate 322 from still heating the faulty SIC power device, thereby negatively affecting other components and circuits, thereby ensuring the safety of this embodiment.
[0039] like Figure 1 to Figure 3 As shown, the box body 1 in this embodiment has a plurality of test cavities 11, each test cavity 11 has an opening on the surface of the box body 1, and each connecting plate body 31 is slidably connected to each test cavity 11 one by one, that is, the connecting plate body 31 can be removed from the box body 1 or installed into the box body 1 by sliding, which facilitates the disassembly and installation work between the aging board 3 and the box body 1; and after the aging board 3 is installed into the box body 1, the test cavity 11 can present a closed test environment, which can more accurately control various variables in the test process, making the test results more reliable and accurate.
[0040] Considering that in a closed test environment, each heating plate 322 is in a long-term heating state, which may cause the overall temperature inside the test cavity 11 to rise, so that the faulty SIC power device is still in an environment with a certain temperature, there is still a certain safety hazard. Figure 3 to Figure 5 , Figure 8As shown, the connecting plate body 31 in this embodiment has a radiator 4, and the radiator 4 is electrically connected to the power supply. The rotation of the fan inside the radiator 4 drives the gas to flow, thereby discharging the temperature radiated from each heating plate 322 to the test cavity 11, so that the temperature in the test cavity 11 will not change significantly, thereby ensuring the safety of this embodiment; at the same time, a heat dissipation port 12 is provided at one end of the test cavity 11 away from the opening, and the inner wall of the heat dissipation port 12 abuts against the outer surface of the radiator 4, that is, after the aging board 3 is installed on the box body 1, the test cavity 11 can still present a relatively closed test environment.
[0041] The width dimension of the projection surface of the heat dissipation port 12 on the vertical horizontal plane is smaller than the width dimension of the opening on the vertical horizontal plane, that is, a limit plate is provided at the end of the test cavity 11 away from the opening, and the heat dissipation port 12 is opened between the limit plate and the box body. The existence of the limit plate can effectively limit the movement of the connecting plate body 31 in the test cavity 11, and prevent the connecting plate body 31 from appearing in the embarrassing situation of entering from the left and exiting from the right during the installation process; the end of the test cavity 11 away from the opening is provided with a power supply contact post 13 for facilitating the power supply to supply power to the radiator 4 and the heating plate 322, and the connecting plate body 31 is provided with a connecting hole 311 for cooperating with the power supply contact post 13, that is, when the installation between the aging board 3 and the box body 1 is completed, the power supply can start to supply power to the aging board 3, thereby improving the power-on efficiency between the power supply and the aging board 3, and the hole axis between the connecting hole 311 and the power supply contact post 13 cooperates, and to a certain extent, the connecting hole 311 can also play a role in protecting the power supply contact post 13, thereby ensuring the safety of the power supply contact post 13.
[0042] Both sides of the test cavity 11 are provided with slide rails 5, each of which extends to the opening, and both sides of the connecting plate 31 are provided with slide grooves 312, each of which corresponds to each slide rail 5. The cooperation between the slide rails 5 and the slide grooves 312 can not only meet the sliding connection between the connecting plate 31 and the test cavity 11, but also ensure the high-precision positioning and stability of the connecting plate 31 during the sliding process, ensure that the connecting hole 311 can just match the power contact column 13, and ensure the accuracy of the matching between the two. .
[0043] like Figure 5 to Figure 7 As shown, the adjacent aging seats 32 in this embodiment are staggered and distributed on the connecting plate body 31, so as to expand the distance between the adjacent aging seats 32. Under the condition of ensuring the capacity, it is avoided that the temperature emitted by the heating plates 322 on the adjacent aging seats 32 radiates mutually, affecting the accuracy of the aging test of the adjacent SIC power devices.
[0044] like Figure 1-2 , Fig. 9As shown, the box body 1 in this embodiment is provided with a plurality of limit rod frames 6 at each opening, and each limit rod frame 6 includes a limit rod 61 and a rotating rod 62. The limit rod 61 is fixedly connected to the rotating rod 62, and the rotating rod 62 is a damping shaft and is rotatably connected to the box body 1. That is, after the aging boards 3 are slid into the test cavities 11 one by one, the limit rod 61 can be used to restrict the aging boards 3 from leaving the box body 1 by rotating the rotating rod 62. The rotating rod 62 is a damping shaft and has a certain self-locking performance, which fully guarantees the stability of the overall structure of this embodiment after installation.
[0045] Example 2
[0046] Based on the same concept as the above-mentioned embodiment 1, this embodiment further proposes that: a temperature sensor can also be set in the heating tank 321, and the temperature applied to the SIC power device when the aging seat 32 is working can be detected by the temperature sensor, and the temperature can be sent to the control panel 2 through the internal signal module thereof, and displayed on the display screen. Specifically, the signal module of the temperature sensor can also receive the signal sent by the wireless communication module of the ammeter, so that the temperature sensor stops feeding back the real-time temperature to the display screen, and the temperature value on the display screen is kept at the value at the moment when the SIC power device fails (short circuit).
[0047] Example 3
[0048] Based on the same concept as the above-mentioned embodiment 1 or embodiment 3, this embodiment further proposes:
[0049] The control panel 2 has a control module, which can also receive the signal sent by the wireless communication module of the ammeter to generate a control program, automatically close the corresponding switch, realize the automatic control function, and improve the safety of this embodiment. The specific control program should be determined according to the system selected by the control panel 2, and will not be repeated in this embodiment.
[0050] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A semiconductor intelligent distributed SIC power device testing device, comprising a box (1), wherein the box (1) has a power supply and a control panel (2) for monitoring and controlling the power supply current output; wherein a plurality of aging boards (3) are arranged inside the box (1), wherein each of the aging boards (3) comprises a connecting board (31) and a plurality of aging seats (32), wherein each of the aging seats (32) is fixedly arranged on the connecting board (31), and the connecting board (31) is detachably connected to the box (1); Each of the aging seats (32) has a heating groove (321), each of the heating grooves (321) is provided with a heating plate (322), and each of the heating plates (322) is electrically connected to a power source.
2. The semiconductor intelligent distributed SIC power device test equipment according to claim 1, characterized in that: The box body (1) has a plurality of test cavities (11), each of the test cavities (11) has an opening on the surface of the box body (1), and each of the connecting plates (31) is slidably connected to each of the test cavities (11) in a one-to-one correspondence.
3. The semiconductor intelligent distributed SIC power device test equipment according to claim 2, characterized in that: The connecting plate body (31) is provided with a heat sink (4), the heat sink (4) is electrically connected to a power source, and a heat dissipation port (12) is provided at one end of the test cavity (11) away from the opening, the inner wall of the heat dissipation port (12) abuts against the outer surface of the heat sink (4).
4. The semiconductor intelligent distributed SIC power device test equipment according to claim 3, characterized in that: The width dimension of the projection surface of the heat dissipation port (12) on the vertical horizontal plane is smaller than the width dimension of the opening on the vertical horizontal plane. The end of the test cavity (11) away from the opening is provided with a power supply contact post (13) for facilitating the power supply to the heat sink (4) and the heating plate (322). The connecting plate body (31) is provided with a connecting hole (311) for cooperating with the power supply contact post (13).
5. The semiconductor intelligent distributed SIC power device testing equipment according to claim 2 or 4, characterized in that: Slide rails (5) are provided on both sides of the test cavity (11), and each of the slide rails (5) extends to an opening. Slide grooves (312) are provided on both sides of the connecting plate body (31), and each of the slide grooves (312) corresponds to each of the slide rails (5) one by one.
6. The semiconductor intelligent distributed SIC power device test equipment according to claim 1, characterized in that: Adjacent aging seats (32) are staggered and distributed on the connecting plate body (31).
7. The semiconductor intelligent distributed SIC power device testing equipment according to claim 2, characterized in that: The box body (1) is provided with a plurality of limit rod frames (6) at each opening, each of the limit rod frames (6) comprising a limit rod (61) and a rotating rod (62), the limit rod (61) being fixedly connected to the rotating rod (62), the rotating rod (62) being a damping shaft and being rotatably connected to the box body (1).