Optical laminate and transparent display comprising same

Abstract

The utility model relates to an optical laminated body and a transparent display comprising the same. The optical laminated body comprises a glass substrate; an adhesive layer formed on one surface of the glass substrate; a metal layer pattern formed on one surface of the adhesive layer; and a functional layer provided on a portion on one surface of the adhesive layer where the metal layer pattern is not formed, the adhesive layer including a silicon-based adhesive, and the functional layer including one or more selected from the group consisting of an optically clear adhesive resin (OCR) and an optically clear adhesive (OCA).

Description

Technical Field

[0001] The present utility model relates to an optical laminate and a transparent display including the same. Background Art

[0002] Recently, in the display market, due to technological advancements, the demand for large-area display devices has been gradually increasing. Advanced electronic circuit and display fields such as Micro-LED (Micro Light Emitting Diode) and Mini-LED (Mini Light Emitting Diode), which can separately control the contrast and brightness per unit area, are also emerging. In addition, photolithography methods for manufacturing electronic devices that simultaneously meet large-area dimensions and high-resolution and contrast quality are being studied.

[0003] Korean Patent Publication No. 10-2019-0003025 also discloses a circuit board and a manufacturing method thereof that adopt a patterning method of a metal layer on a glass substrate.

[0004] However, in the past, as methods for realizing low-resistance metal wiring on a glass substrate, various methods such as electroplating or evaporation of metal thin films have been used, but each of these methods has limitations due to the large area of the display.

[0005] To overcome such limitations, recently, a technique has been attempted to pattern a metal thin film using a photolithography method after bonding the metal thin film to a glass substrate.

[0006] However, the problem with this method of bonding a metal thin film to a glass substrate is that not only is the adhesion force between the metal thin film and the glass substrate insufficient, but also the underlying adhesive layer exposed after patterning the metal layer is damaged due to contact with the metal etchant.

[0007] Furthermore, especially when used in electronic devices such as transparent displays that are exposed to the external environment for a long time, heat resistance and reliability in a high-temperature and high-humidity environment are very important. However, in the case of acrylic adhesives or epoxy adhesives used in existing metal thin films, there are problems of insufficient heat resistance and reliability in a high-temperature and high-humidity environment.

[0008] To solve this problem, when using a silicone-based adhesive to bond a metal thin film to a glass substrate, the surface shape of the originally laminated metal remains on the surface of the adhesive peeled off after patterning the metal thin film, resulting in roughness on the surface. Correspondingly, when applied to a display, light scatters on the surface of the adhesive layer where the metal thin film pattern is not formed, increasing the haze, and thus there is a problem of decreased visibility.

[0009] Therefore, there is a need to develop an optical laminate and a transparent display that not only have adhesion to a glass substrate, chemical resistance to a metal layer etching solution, heat resistance, and reliability in a high-temperature and high-humidity environment, but also have improved visibility.

[0010] Prior art documents

[0011] Patent documents

[0012] Patent Document 1: Korean Patent Publication No. 10-2019-0003025 Summary of the utility model

[0013] An object of the present utility model is to provide an optical laminate that not only has excellent adhesion to a glass substrate, but also has excellent chemical resistance to an etching solution, heat resistance, and reliability, that is, an optical laminate and a transparent display that improve visibility by reducing the haze on the surface.

[0014] The present utility model adopts the following technical solutions to achieve the above object. The present utility model provides an optical laminate, including: a glass substrate; an adhesive layer formed on one surface of the glass substrate; a metal layer pattern formed on one surface of the adhesive layer; and a functional layer provided on a portion of one surface of the adhesive layer where the metal layer pattern is not formed, the adhesive layer includes a silicon-based adhesive, and the functional layer includes one or more selected from optical clear resin (OCR) and optical clear adhesive (OCA).

[0015] According to the present utility model, the functional layer may be provided on the metal layer pattern.

[0016] According to the present utility model, the thickness of the metal layer may be 3 μm to 120 μm.

[0017] According to the present utility model, in a third aspect, the metal layer may include one or more selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), and tungsten (W).

[0018] According to the present utility model, the thickness of the adhesive layer may be 5 μm to 50 μm.

[0019] According to the present utility model, no separate component may be included between the metal layer and the adhesive layer.

[0020] According to the present utility model, the adhesion between the adhesive layer and the glass substrate may be 5B or more.

[0021] The present utility model provides a transparent display including the optical laminate and a light-emitting diode (LED).

[0022] According to the present utility model, a transparent cover may further be included in the outermost contour portion corresponding to the glass substrate of the optical laminate.

[0023] According to the present utility model, the transparent cover may be glass.

[0024] According to the present utility model, the transparent cover may be one selected from wired glass, colored glass, and holographic glass.

[0025] The effects of the present utility model are as follows.

[0026] According to the optical laminate and the transparent display of the present utility model, by reducing the surface roughness and decreasing the haze, the effect of improving visibility can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 are diagrams showing an optical laminate according to one or more embodiments of the present utility model.

[0028] Figure 2 are diagrams showing a transparent display according to one or more embodiments of the present utility model.

[0029] Figure 3 is a diagram showing a method of manufacturing a transparent display according to an embodiment of the present utility model.

[0030] Figure 4 The method of manufacturing a transparent display showing an example of the present utility model is a diagram showing a step of forming a functional layer on a metal layer pattern formed with a light emitting diode 70 (LED).

[0031] REFERENCE SIGNS

[0032] 10: metal layer, 20: adhesive layer, 30: protective film, 40: glass substrate, 50: photoresist pattern, 60: functional layer, 70: light emitting diode. DETAILED DESCRIPTION

[0033] The present utility model relates to an optical laminate and a transparent display having an adhesive layer including a silicon-based adhesive. Since a functional layer is included on the surface of the adhesive peeled off after metal thin film patterning, the surface roughness is reduced and the haze is decreased, thereby having the effect of improving visibility.

[0034] More specifically, the present utility model relates to an optical laminate and a transparent display. The optical laminate includes: a glass substrate; an adhesive layer formed on one surface of the glass substrate; a metal layer pattern formed on one surface of the adhesive layer; and a functional layer provided on a portion of the one surface of the adhesive layer where the metal layer pattern is not formed. The adhesive layer includes a silicon-based adhesive, and the functional layer includes one or more selected from optical clear resin (OCR) and optical clear adhesive (OCA).

[0035] The embodiments of the present utility model will be described more specifically with reference to the accompanying drawings below. However, the following drawings attached to this specification illustrate the preferred embodiments of the present utility model and are used together with the above-mentioned utility model content to further understand the technical idea of the present utility model. Therefore, the present utility model should not be construed as being limited to the matters described in such drawings.

[0036] The terms used in this specification are for describing the embodiments and are not intended to limit the present utility model. In this specification, unless otherwise stated in the context, the singular form also includes the plural form. For example, the "protective film" used in this specification may refer to at least one of the first protective film and the second protective film.

[0037] The "comprises" and / or "comprising" used in this specification are used in the sense of not excluding the existence or addition of one or more other components, steps, actions, and / or elements other than the mentioned components, steps, actions, and / or elements. Throughout the specification, the same reference numerals refer to the same components.

[0038] As terms of spatial relativity, such as "below", "bottom surface", "lower part", "above", "top surface", "upper part", etc. can be used as shown in the drawings to facilitate the description of the relative relationship between one element or component and another element or component. Terms of spatial relativity should be understood to include terms in directions different from each other when the elements are in use or operation in addition to the directions shown in the drawings. For example, when the element shown in the drawing is flipped, the element described as "below" or "lower part" of another element can also be placed "above" another element. Therefore, the exemplary term "below" can include both the upper and lower directions. The element can also be oriented in other directions, and accordingly, the terms of spatial relativity can also be interpreted according to the orientation.

[0039] The "substantially" used in this specification can be interpreted to include not only the case where it is physically exactly the same or consistent, but also the case within the error range in the measurement or manufacturing process, for example, within an error range of 0.1% or less.

[0040] <Optical laminate and transparent display>

[0041] Figure 1 FIG. is a view showing an optical laminate according to one or more embodiments of the present invention. Additionally, Figure 2 FIG. is a view showing a transparent display according to one or more embodiments of the present invention.

[0042] Referring to Figure 1 and Figure 2 , an optical laminate according to one or more embodiments of the present invention may include a glass substrate 40, an adhesive layer 20, a metal layer 10 pattern, and a functional layer 60. Additionally, a transparent display according to the present invention may include the optical laminate and a light-emitting diode (LED). Additionally, the transparent display may further include a transparent cover, and may also include a transparent cover (not shown) at the outermost contour corresponding to the glass substrate of the optical laminate. The transparent cover may be glass. Additionally, according to the present invention, when the transparent cover is glass, it may be one selected from wired glass, colored glass, and holographic glass.

[0043] There is no particular limitation on the glass substrate 40 as long as it does not hinder the optical properties of the optical laminate. For example, it may include oxide glasses such as silicate glass, borate glass, and phosphate glass. In this case, it has the advantages of not undergoing thermal shrinkage during subsequent process steps, etc., and being able to impart a predetermined hardness to the optical laminate.

[0044] In one or more embodiments, the thickness of the glass substrate 40 may be 0.5 mm to 20 mm. When the thickness of the glass substrate 40 satisfies the above range, it has excellent hardness and can achieve thinning, and can prevent deformation or cracks in the metal layer 10. Specifically, when it is less than 0.5 mm, it may be difficult to protect the metal layer 10 or other laminated components from external impacts, while when it exceeds 20 mm, it may be disadvantageous in terms of thinning or weight reduction.

[0045] In one or more embodiments, the glass substrate 40 may have a single-layer or multi-layer structure. For example, the glass substrate 40 may have a single-layer structure formed by a single glass substrate, but is not necessarily limited thereto, and may also be a multi-layer structure having multiple glass substrates laminated.

[0046] In one embodiment, the optical laminate may include an adhesive layer 20 on one surface of the glass substrate 40.

[0047] The adhesive layer 20 can be manufactured from an adhesive layer composition including a silicone-based adhesive. The adhesive layer composition of the present utility model includes a silicone-based additive and a solvent, and may further contain an additive. Specifically, in the case of an adhesive layer formed using an existing acrylic adhesive or epoxy adhesive, there are problems such as insufficient adhesion to a glass substrate or damage to the adhesive layer by an etching solution used for etching a metal layer formed on the upper portion of the adhesive layer. Further, in the case of a transparent display, when used for a product mainly used outdoors, there are problems such as a decrease in the adhesion between the adhesive layer and the glass substrate or yellowing of the adhesive layer, which causes product defects.

[0048] To solve this problem, the inventors of the present utility model proposed the present utility model by focusing on the following aspects: when the adhesive layer 20 includes a silicone-based adhesive, it not only has excellent adhesion to a glass substrate, but also has excellent chemical resistance to an etching solution, and excellent heat resistance and reliability in a high-temperature and high-humidity environment.

[0049] The silicone-based adhesive may be one or more of a silicone-based compound and a siloxane compound.

[0050] There is no special limitation on the use of the silicon compound as long as it is a compound including a silicon (Si) atom. In addition, the siloxane compound may be a compound including a siloxane bond including an Si-O bond without limitation. More specifically, in an example of the present utility model, the silicon compound and the siloxane compound may be one or more of trimethylated silica, vinyl terminated polydimethylsiloxane, hexamethyl disiloxane, trisiloxane, and tetrakis(trimethylsilyloxy)silane.

[0051] In particular, preferably, the silicone-based adhesive of the present utility model is contained in an amount of 40% to 60% based on the total weight of the adhesive layer composition. Thus, the silicone-based adhesive of the present utility model can be added by dilution at a concentration lower than that of conventional adhesives. Accordingly, when the adhesive layer of the present utility model is bonded to a metal layer or a glass substrate, the adhesion to the metal layer or the glass substrate can be maximized, and thus there is an advantage that bonding can be achieved without additional treatment such as UV curing of the adhesive layer.

[0052] There is no special limitation on the solvent, as long as it can dilute the silicon-based adhesive. For example, it can be toluene, xylene, PGME, and / or PGMEA. In terms of the stability of the adhesive coating thickness under the metal layer, it is preferred that the solvent of the present invention is contained in an amount of 40% to 55% based on the total weight of the adhesive layer composition.

[0053] The additive can be one or more of an anchorage, a cross linker, and a catalyst.

[0054] The anchorage is added for the purpose of increasing the bonding force with the metal layer when coating the adhesive layer, and can prevent the adhesive layer from detaching from the metal layer. Generally, as long as it is a substance used as an anchorage, there is no special limitation, but it is preferably not thermally deformed below 200°C.

[0055] The cross linker is a substance added for chemical bonding between the components of the adhesive layer composition, and is preferably a product that does not undergo thermal deformation below 200°C.

[0056] The catalyst is a component added for curing the adhesive layer composition, and helps the adhesive layer composition to deform from a liquid phase to a solid phase. As a specific example, a platinum catalyst, a palladium catalyst, and / or an osmium catalyst can be used.

[0057] In terms of the stability of the adhesive force, it is preferred that the additive of the present invention is contained in an amount of 0.1% to 10% based on the total weight of the adhesive layer composition.

[0058] The adhesive layer 20 of the present invention can be formed by heating and curing the adhesive layer composition at a temperature of 100°C to 180°C.

[0059] The thickness of the adhesive layer 20 can be 5 μm to 50 μm. Preferably, the thickness can be 5 μm to 30 μm. Preferably, the thickness can be 5 μm to 25 μm. When the thickness of the adhesive layer 20 is less than 5 μm, sufficient adhesive force with other components cannot be maintained, and when it exceeds 50 μm, it may be disadvantageous in terms of increasing the product thickness.

[0060] In one embodiment, the adhesive layer 20 may not include separate components, such as an intermediate layer or a protective layer, at the contact interface with the metal layer 10. Specifically, in the case of forming the adhesive layer using a conventional acrylic adhesive or epoxy adhesive, there are problems such as damage to the adhesive layer due to the etching solution used for etching the metal layer above the adhesive layer as described above. For example, in the case of an adhesive layer formed by an epoxy adhesive, the opacity of the adhesive layer increases when it comes into contact with the etching solution. Therefore, in a conventional optical laminate, in order to prevent the adhesive layer from being damaged by the etching solution, a component such as an intermediate layer or a protective layer is separately included between the adhesive layer and the metal layer. However, when such a separate component is included, not only does the processability decrease and the manufacturing cost increase due to the increase in the manufacturing process, but there is also a problem that is disadvantageous in the production of thin films. However, in the present utility model, as described above, by using a silicone-based adhesive having excellent chemical resistance to the etching solution to form the adhesive layer, damage to the adhesive due to the etching solution does not occur. Therefore, a component such as an intermediate layer or a protective layer provided for protecting the adhesive in the past is not separately included. By not including a separate member, not only is the processability improved, but there are also advantages in reducing the manufacturing cost, and further advantages in thinning the film.

[0061] In one embodiment, the adhesion force between the adhesive layer 20 and the glass substrate 40 may be 5B or more. As described above, since the adhesive layer 20 includes a silicone-based adhesive, it is characterized by excellent adhesion to the glass substrate 40.

[0062] In one embodiment, the adhesion force of the adhesive layer 20 to the glass substrate 40 can be evaluated by measuring standard ISO2409: Standard Test Methods for Measuring Adhesion by Tape Test.

[0063] The metal layer 10 can be used as an electrode in electronic devices such as display devices including the optical laminate.

[0064] There is no particular limitation on the metal layer 10 as long as it has conductivity. For example, it may include one or more selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), and tungsten (W).

[0065] The metal layer 10 can be formed by a known metal thin film process. For example, it can be formed by preparing and attaching a metal thin film, or by using at least one of electroless deposition, Electrodeposition, Sputtering, Thermal evaporation, and E-beam evaporation, and is not limited thereto.

[0066] The thickness of the metal layer 10 can be 3 μm to 120 μm. Preferably, the thickness can be 3 μm to 110 μm. More preferably, the thickness can be 18 μm to 105 μm. When the thickness of the metal layer 10 is less than 3 μm, it may be difficult to form a uniform thin film or pattern, and when it exceeds 120 μm, there may be a problem that it cannot be applied to an electronic device of a thin film structure.

[0067] The functional layer 60 is formed on the portion of the adhesive layer 20 where the pattern of the metal layer 10 is not formed, that is, on the adhesive layer 20 exposed due to etching the metal layer when forming the pattern of the metal layer 10. The functional layer 60 can be formed by filling Figure 1 the portion where the pattern of the metal layer 10 is not formed as shown. More specifically, as Figure 2 shown, it can also be formed in a form that is connected to the portion of the adhesive layer 20 where the metal layer 10 is not formed and laminated on the metal layer pattern 10 where the light emitting diode 70 (LED) is formed.

[0068] On the other hand, as described above, the metal layer 10 is laminated on one side of the adhesive layer 20 of the present utility model, and the metal layer 10 can have a surface roughness (Rz) of 0.1 to 20 μm.

[0069] At this time, since the adhesive layer 20 includes a silicon-based adhesive layer, the surface morphology of the metal layer 10 is directly reflected in the adhesive layer 20. Therefore, when the metal layer 10 is peeled off after patterning, the surface of the adhesive layer 20 exposed by etching the metal layer generates irregularities derived from the metal layer having a certain surface roughness. Therefore, when applied to a transparent display, light scattering occurs, and there is a problem of increased haze.

[0070] Therefore, a functional layer 60 is provided on the portion of the adhesive layer 20 where the pattern of the metal layer 10 is not formed to prevent the surface irregularities of the adhesive layer 20, thereby preventing scattering and reducing haze to improve visibility.

[0071] In this regard, the surface roughness (Rz) of the functional layer 60 may be 5.0 μm or less. When the surface roughness (Rz) exceeds 5.0 μm, scattering occurs, the haze increases, and there is a problem of visual blurring.

[0072] The functional layer 60 may be formed of one or more selected from acrylic resins such as ethylene-vinyl acetate (EVA) in the form of an optically clear adhesive resin (OCR) or an optically clear adhesive (OCA), polyethylene compounds such as polyvinyl butyral (PVB), and silicone resins, and is preferably formed of an acrylic resin or a silicone resin.

[0073] In the functional layer 60, the thickness laminated on the metal layer 10 may be 1 μm to 3 mm.

[0074] As the light-emitting diode 70 (LED) of the present invention, a well-known light-emitting diode (LED) can be applied without limitation.

[0075] <Method for manufacturing an optical laminate and a transparent display>

[0076] The method for manufacturing an optical laminate according to an embodiment of the present invention includes: a step of preparing a metal thin film, wherein the metal thin film includes a silicone-based adhesive layer 20 formed on one surface of the metal layer 10, and includes a first protective film 30-1 provided on one surface of the silicone-based adhesive layer 20, and a second protective film 30-2 provided on the other surface of the metal layer 10; a step of peeling the first protective film 30-1 of the metal thin film; a step of bonding the metal thin film in such a manner that the adhesive layer 20 is disposed on one surface of the glass substrate 40; a step of peeling the second protective film 30-2 of the metal thin film; a step of patterning the metal layer 10 to form a metal layer pattern; and a step of forming a functional layer 60 in a portion where the metal layer 10 pattern is not formed.

[0077] In addition, the method for manufacturing a transparent display of the present invention further includes a step of mounting a light-emitting diode 70 (LED) in the method for manufacturing the optical laminate. Specifically, before the step of forming the functional layer 60, it may further include a step of mounting a light-emitting diode 70 (LED) on the metal layer pattern. In addition, after the step of mounting a light-emitting diode 70 (LED) on the metal layer pattern, it may further include a step of covering a glass cover (not shown) on one surface of the optical laminate of the present invention, that is, on the opposite surface of the glass substrate 40.

[0078] Figure 3 and Figure 4 is a diagram showing the method for manufacturing a transparent display according to an embodiment of the present invention.

[0079] Specifically, in the step of peeling off the first protective film provided on the metal film, the first protective film 30-1 disposed on the lower surface of the adhesive layer 20 of the metal film can be peeled off.

[0080] The protective film 30 may be provided to protect the surfaces of the metal layer 10 and / or the adhesive layer 20 from external damage. For example, it may be provided in the form of a second protective film 30-2 formed on one surface of the metal layer 10 to protect the surface of the adhesive layer 20, the first protective film 30-1 formed on one surface of the adhesive layer 20, and the surface of the metal layer 10.

[0081] In one embodiment, the protective film can be used as Figure 2 a single-layer structure formed as one layer as shown, but is not limited thereto, and can also be used as a multi-layer structure in which one or more protective films are continuously laminated.

[0082] In one embodiment, for the protective film 30, the second protective film 30-2 and the first protective film 30-1 can be laminated on one surface of the metal layer 10 and the adhesive layer 20 respectively by using a laminator.

[0083] The protective film 30 is not particularly limited as long as it is used to protect the surface of the metal layer 10 and / or the adhesive layer 20. For example, it may include one selected from the group consisting of polyethylene terephthalate (PET), polyethylene isophthalate (PEI), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), diacetyl cellulose, triacetyl cellulose (TAC), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polymethyl acrylate (PMA), polyimide (PI), polymethyl methacrylate (PMMA), polyethyl acrylate (PEA), polyethyl methacrylate (PEMA), and cyclic olefin polymer (COP). In terms of ease of access and processing convenience, etc., polyethylene terephthalate (PET), triacetyl cellulose (TAC), polycarbonate (PC), polyimide (PI), and cyclic olefin polymer (COP) can be preferably used.

[0084] The thickness of the protective film 30 is not particularly limited. For example, it can be 10 μm to 200 μm.

[0085] On the other hand, although the above metal thin film is exemplified by a metal thin film having protective films 30 on one side of the metal layer 10 and the adhesive layer 20 respectively, it is not limited thereto. For example, it may also include only one of the protective film formed on one side of the metal layer and the protective film formed on one side of the adhesive layer.

[0086] In the step of peeling the first protective film provided on the metal thin film, the first protective film 30-1 disposed on the lower surface of the adhesive layer 20 of the metal thin film can be peeled.

[0087] The peeling of the first protective film 30-1 can be appropriately performed within the scope that does not hinder the purpose of the present utility model, and the method used in the peeling process of the conventional release film can also be used.

[0088] In the step of bonding the metal thin film in such a manner that the adhesive layer is disposed on one surface of the glass substrate, it may also be to bond the surface of the adhesive layer 20 exposed by peeling the first protective film 30-1 to one surface of the glass substrate 40.

[0089] The bonding of the adhesive layer 20 and the glass substrate 40 can be appropriately performed within the scope that does not hinder the purpose of the present utility model. For example, bonding can be performed using a laminator or the like.

[0090] In the step of peeling the second protective film provided on the metal thin film, the second protective film 30-2 disposed on the upper surface of the metal layer 10 of the metal thin film can be peeled.

[0091] The peeling of the second protective film 30-2 can be performed by a method substantially the same as the peeling of the first protective film 30-1.

[0092] On the other hand, although the manufacturing method of the above Figure 3 transparent display is described by taking the method of manufacturing a transparent display using a metal thin film as an example, it is not limited thereto.

[0093] For example, in another embodiment of the present utility model, when the metal thin film does not have the second protective film 30-2, the step of peeling the second protective film provided on the metal thin film can also be omitted.

[0094] The step of forming the pattern of the metal layer 10 of the optical laminate in one embodiment of the present utility model may include: the step of forming a photoresist pattern 50 on one surface of the metal layer 10; the step of etching the exposed area of the metal layer 10 through the photoresist pattern; and the step of peeling the photoresist pattern.

[0095] Specifically, the step of forming a photoresist pattern 50 on one surface of the metal layer 10 may include: the process of coating a composition for forming a photoresist pattern on the metal layer 10 by spin coating, slot coating, inkjet printing, etc., and the process of drying and heat-treating the coated composition for forming a photoresist pattern to form a photoresist film, and the process of forming a photoresist pattern 50 by selectively exposing and developing the photoresist film to dissolve and remove the photoresist film corresponding to the exposed area or the non-exposed area.

[0096] The step of forming the photoresist pattern 50 can be performed by a well-known method, and the detailed content is omitted here.

[0097] The step of etching the exposed area of the metal layer 10 through the photoresist pattern 50 is not particularly limited and can be performed by a dry etching process or a wet etching process.

[0098] In one embodiment, the wet etching process can be performed using an etching solution including at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid. As described above, the adhesive layer 20 is characterized by including a silicon-based adhesive and having excellent chemical resistance to an etching solution including at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid. Therefore, when the etching process is performed by wet etching based on an etching solution including at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid, not only is the etching performance of the metal layer 10 excellent, but also even when the adhesive layer 20 located below the metal layer 10 is exposed to the etching solution, damage (physical and chemical damage and clouding phenomenon) of the adhesive layer 20 can be prevented.

[0099] The dry etching process or the wet etching process can be performed by a well-known method, and the detailed content is omitted here.

[0100] The step of stripping the photoresist pattern can be performed by immersing the substrate on which the resist pattern 50 is formed in a resist stripping solution, or by spraying the stripping solution onto the corresponding substrate, etc. In addition, in this case, physical treatments such as ultrasonic irradiation, rotation, or contact with a brush that swings left and right can be used in combination.

[0101] In one embodiment, as the resist stripping conditions, the temperature can be about 15°C to 100°C, preferably 30°C to 70°C, and the immersion or spraying time is preferably about 1 minute to 20 minutes, but is not limited thereto and can be appropriately modified according to the needs of the user.

[0102] In one embodiment, after the resist stripping solution treatment, a cleaning treatment can be further performed to remove the stripping solution remaining on the substrate. Except for using water or isopropyl alcohol instead of the stripping solution, the cleaning treatment can be performed in the same manner as the above stripping process.

[0103] In the present utility model, the step of mounting the light-emitting diode 70 (LED) on the metal layer pattern can be performed by a method such as surface mounting (SMT: Surface Mount Technology) of the device by soldering, but is not limited thereto.

[0104] More specifically, the patterned metal layer 10 of the metal thin film substrate may further include a solder layer (not shown), and a light emitting diode 70 (LED) can be mounted through the solder layer. The arrangement interval or density of the light emitting diodes (LEDs) is not particularly limited, but can be configured in a grid pattern. In this case, the upper, lower, left, and right spacings can be 1 to 50 mm, and the spacings of multiple light emitting diodes (LEDs) can be the same or different from each other. When forming a light emitting diode (LED) on the metal thin film substrate of the present utility model, it has the advantage of being a transparent display that can emit and play images on a substrate with transparency.

[0105] After the step of mounting the light emitting diode 70 (LED) on the metal layer pattern, it may further include the step of covering a glass cover (not shown) on one side of the optical laminate of the present utility model, that is, the opposite side of the glass substrate 40.

[0106] More specifically, in the step of forming the functional layer 60 described later, when applying an optically clear adhesive resin (OCR), after the step of mounting the light emitting diode 70 (LED) on the metal layer pattern and before the step of forming the functional layer 60, after covering a transparent cover on the opposite side of the glass substrate 40 of the optical laminate of the present utility model, an optically clear adhesive resin (OCR) can be injected between the transparent cover and the glass substrate 40.

[0107] In addition, in the step of forming the functional layer 60 described later, when applying an optically clear adhesive (OCA), after the step of mounting the light emitting diode 70 (LED) on the metal layer pattern, the functional layer 60 can be formed by attaching an optically clear adhesive (OCA), and a transparent cover (not shown) can be covered on the opposite side of the glass substrate 40 of the optical laminate of the present utility model.

[0108] Specifically, Figure 4 A manufacturing method of a transparent display showing an example of the present utility model is a diagram showing the step of forming a functional layer on a metal layer pattern formed with a light emitting diode 70 (LED). In an embodiment of the present utility model, for the step of forming the functional layer 60, it can be formed by one or more of acrylic resins such as ethylene-vinyl acetate (EVA), polyethylene compounds such as polyvinyl butyral (PVB), and silicone resins in the form of an optically clear adhesive resin (OCR) or an optically clear adhesive (OCA). Preferably, it can be formed by an acrylic resin or a silicone resin.

[0109] There is no particular limitation on the method of forming the functional layer 60, but it can be manufactured by coating and curing the optically clear adhesive resin (OCR), and can be manufactured by cutting and attaching the optically clear adhesive (OCA) in accordance with the position to be attached.

[0110] The coating can be carried out by known methods, generally by a doctor coater, a roll coater, a calender coater, a comma coater, etc. In addition, depending on the coating thickness or the viscosity of the resin, an intaglio coater, a bar coater, etc. can also be used.

[0111] The optical laminate of the present utility model exhibits the above characteristics, and thus has the advantages that it can be suitably used for display devices requiring a large area and low resistance, and is particularly suitable for devices such as transparent displays that may be exposed to the external environment for a long time in terms of excellent heat resistance and reliability in a high-temperature and high-humidity environment.

[0112] Hereinafter, experimental examples including specific examples and comparative examples will be presented to help understand the present utility model, but these are only illustrative of the present utility model and do not limit the scope of the appended claims. For those skilled in the art, it is obvious that various changes and modifications can be made to the examples within the scope and technical concept of the present utility model, and obviously such changes and modifications also fall within the scope of the appended claims. In addition, unless otherwise stated, "%" and "parts" indicating content hereinafter are based on weight.

[0113] Examples and Comparative Examples: Fabrication of Optical Laminate

[0114] Example 1

[0115] 4 kg of 99% toluene was added to 10 kg of a silicone-based adhesive (DOWSIL 96-083 Silicone Adhesive Kit, DOW; solid content 70%) to prepare a composition with a silicone-based adhesive content of 50%. After stirring it with a stirrer (5 hp), 0.5 g of an anchor agent (SYL-OFF TM SL-9250, DOW), 0.8 g of a crosslinking agent (SYL-OFF TM 7678, DOW), and 1 g of a platinum catalyst were further mixed to prepare an adhesive layer composition.

[0116] Then, the adhesive layer composition was coated on one side of a 35-μm-thick copper metal substrate (surface roughness (Rz) 9.0 μm) using the gravure coating method, and then cured at 150°C for 2 minutes to prepare a metal film having a 10-μm-thick silicone-based adhesive layer formed on one side of the metal substrate.

[0117] After that, after disposing the adhesive layer of the metal thin film on one surface of a glass substrate with a thickness of 2 mm, the metal thin film was bonded by a sheet-to-sheet method to laminate a metal layer.

[0118] After that, as Figure 3 shown, a metal layer pattern was formed by patterning the metal layer by a photolithography method.

[0119] By filling an optically transparent adhesive (CEF 8319-6, 3M) in a portion where the metal layer pattern was not formed on the adhesive layer as Figure 1 shown, and coating it onto the metal layer to form a functional layer, an optical laminate of Example 1 was manufactured. At this time, the thickness of the portion laminated on the metal layer of the functional layer was 1500 μm.

[0120] Example 2

[0121] Except that an optically transparent resin (Scotchcast TM Resin 8, 3M) was used instead of the optically transparent adhesive (CEF 8319-6, 3M), an optical laminate was manufactured in the same manner as in Example 1 above.

[0122] Example 3

[0123] Except that a copper metal substrate with a thickness of 35 μm (surface roughness (Rz) 0.9 μm) was used, an optical laminate was manufactured in the same manner as in Example 1 above.

[0124] Comparative Example 1

[0125] Except that no functional layer was formed, an optical laminate was manufactured in the same manner as in Example 1 above.

[0126] Comparative Example 2

[0127] Except that no functional layer was formed, an optical laminate was manufactured in the same manner as in Example 3 above.

[0128] Experimental Example

[0129] (1) Transmittance and haze evaluation

[0130] The transmittance and haze of the optical laminates of the examples and comparative examples were measured using a haze meter HM-150N (Murakami), and the results are shown in Table 1 below.

[0131]

Table 1

[0132] Classification Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Transmittance (%) 80.9 80.1 88.4 78.6 85.3 Haze 17.5 16.9 4.1 79.1 12.5

[0133] As can be confirmed with reference to Table 1 above, the optical laminate of the embodiment including the functional layer of the present invention has excellent transmittance and significantly lower haze compared to the comparative example not including the functional layer of the present invention.

[0134] That is, when comparing the optical laminates of Examples 1 and 2 and Comparative Example 1 using metal substrates having the same surface roughness (Rz), and when comparing the optical laminates of Example 3 and Comparative Example 2, it can be confirmed that the optical laminate of the embodiment including the functional layer of the present invention has excellent transmittance and significantly lower haze compared to the comparative example not including the functional layer of the present invention.

Claims

1. An optical laminate, characterized in that: include: Glass substrate; an adhesive layer formed on one surface of the glass substrate; a metal layer pattern formed on one side of the adhesive layer; as well as a functional layer provided on a portion of the adhesive layer on which the metal layer pattern is not formed, The adhesive layer includes a silicon-based adhesive, The functional layer includes at least one selected from an optically transparent adhesive resin and an optically transparent adhesive.

2. The optical layered body according to claim 1, wherein: The functional layer is disposed on the metal layer pattern.

3. The optical laminate according to claim 1, wherein: The thickness of the metal layer is 3 μm to 120 μm.

4. The optical layered body according to claim 1, wherein: The metal layer includes at least one selected from the group consisting of copper, aluminum, nickel, chromium, silver, iron, gold, cobalt, titanium, and tungsten.

5. The optical layered body according to claim 1, wherein: The adhesive layer has a thickness of 5 μm to 50 μm.

6. The optical layered body according to claim 1, wherein: No separate components are included between the metal layer and the adhesive layer.

7. The optical layered body according to claim 1, wherein: The adhesion between the adhesive layer and the glass substrate is 5B or more.

8. A transparent display, characterized in that: include: The optical laminate according to any one of claims 1 to 7; as well as Light Emitting Diode.

9. The transparent display according to claim 8, characterized in that: The optical laminate further includes a transparent cover at the outermost portion corresponding to the glass substrate.

10. The transparent display according to claim 9, characterized in that: The transparent cover is glass.

11. The transparent display according to claim 10, characterized in that: The transparent cover is one selected from wired glass, colored glass, and holographic glass.

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