Sample cooling device and scanning electron microscope

Abstract

The utility model discloses a sample cooling device and a scanning electron microscope, the sample cooling device comprises a metal shell, the metal shell is enclosed to form an accommodating space, one side of the metal shell is a bearing part, and the first side of the bearing part is used for bearing a sample; the first insulation heat conduction part is located in the containing space, and the first side of the first insulation heat conduction part is attached to the second side of the bearing part; the Peltier refrigeration device is located in the containing space, and the cold end of the Peltier refrigeration device is attached to the second side of the first insulation heat conduction piece; the insulating base is located in the containing space, and the hot end of the Peltier refrigerating device is attached to the insulating base. According to the sample cooling device and the scanning electron microscope, samples such as wafers can be cooled to a specific temperature, and the observation effect of the samples in the scanning electron microscope is improved.

Description

Technical Field

[0001] The present application relates to the technical field of detection equipment, and particularly to a sample cooling device and a scanning electron microscope. Background Art

[0002] In the semiconductor field, there has been no good way to confirm the size of photoresist on samples such as wafers. Limited by its magnification, it is usually difficult to use an optical microscope to confirm the critical dimension of photoresist.

[0003] In laboratory tests, samples are usually directly placed in a scanning electron microscope for measurement. Due to the test principle of the scanning electron microscope, high-energy electron beams often cause damage to the photoresist. The reason is that the energy of the high-energy electron beam is too strong, and the organic components will be decomposed. Therefore, during the general shooting process, a very low voltage is often used because the electron beam with low voltage has weak energy, causing less damage to such samples, reducing the intensity of decomposition of organic components, and extending the irradiation time of the samples. However, due to the weak energy of the electron beam, the resolution will also decrease, and it is difficult to take high-magnification scanning electron microscope pictures. If liquid nitrogen is used for cold extraction of the samples, due to the too low temperature of liquid nitrogen, the samples usually change in critical dimension due to thermal expansion and contraction.

[0004] Therefore, improvements are needed to at least partially solve the above problems. Summary of the Utility Model

[0005] A series of simplified concepts are introduced in the Summary of the Utility Model section, which will be further elaborated in the Detailed Implementation section. The Summary of the Utility Model section of the present utility model does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0006] To at least partially solve the above problems, according to the first aspect of the present utility model, there is provided a sample cooling device, which includes:

[0007] A metal housing, the metal housing encloses to form an accommodation space, one side of the metal housing is a bearing part, and the first side of the bearing part is used to bear the sample;

[0008] A first insulating heat-conducting member, the first insulating heat-conducting member is located in the accommodation space, and the first side of the first insulating heat-conducting member is attached to the second side of the bearing part;

[0009] A Peltier refrigeration device, the Peltier refrigeration device is located in the accommodation space, and the cold end of the Peltier refrigeration device is attached to the second side of the first insulating heat-conducting member;

[0010] An insulating base, the insulating base is located in the accommodation space, and the hot end of the Peltier cooling device is attached to the insulating base.

[0011] Exemplarily, the Peltier cooling device includes a plurality of Peltier cooling components and at least one second insulating and heat-conducting member;

[0012] The plurality of Peltier cooling components are arranged at intervals, and there is the second insulating and heat-conducting member between adjacent Peltier cooling components.

[0013] Exemplarily, the Peltier cooling component includes a plurality of P-type semiconductors, a plurality of N-type semiconductors, a plurality of first metal connecting sheets and a plurality of second metal connecting sheets;

[0014] The plurality of first metal connecting sheets are connected to the first sides of the plurality of P-type semiconductors and the first sides of the plurality of N-type semiconductors, the plurality of second metal connecting sheets are connected to the second sides of the plurality of P-type semiconductors and the second sides of the plurality of N-type semiconductors, and the plurality of P-type semiconductors and the plurality of N-type semiconductors form an alternating series connection through the plurality of first metal connecting sheets and the plurality of second metal connecting sheets.

[0015] Exemplarily, both the first insulating and heat-conducting member and the second insulating and heat-conducting member are insulating ceramic sheets;

[0016] The insulating base is a ceramic insulating base.

[0017] Exemplarily, the sample cooling device further includes a power supply component, the power supply component is located in the accommodation space and is connected to the Peltier cooling device.

[0018] Exemplarily, the power supply component is located between the first wall surface and the second wall surface which are oppositely arranged in the metal housing;

[0019] The power supply component includes a DC power supply, a positive electrode metal sheet, a negative electrode metal sheet, a first insulating member and a second insulating member;

[0020] The positive electrode metal sheet is arranged on the first side of the DC power supply and is respectively connected to the positive electrode of the DC power supply and the Peltier cooling device;

[0021] The negative electrode metal sheet is arranged on the second side of the DC power supply and is respectively connected to the negative electrode of the DC power supply and the Peltier cooling device;

[0022] The first insulating member is arranged between the side of the positive electrode metal sheet away from the DC power supply and the first wall surface;

[0023] The second insulating member is arranged between the side of the negative electrode metal sheet away from the DC power supply and the second wall surface.

[0024] Exemplarily, both the first insulating member and the second insulating member are insulating ceramic sheets;

[0025] The DC power supply is a button battery.

[0026] Exemplarily, the sample cooling device further includes a double-sided conductive tape, which is disposed on the first side of the carrying portion and is used to bond the sample to the carrying portion.

[0027] Exemplarily, the sample cooling device further includes a conductive silver paste, which is disposed on the first side of the carrying portion and is located between the sample and the carrying portion.

[0028] According to a second aspect of the present invention, there is provided a scanning electron microscope, which includes the sample cooling device as described above.

[0029] According to the sample cooling device and the scanning electron microscope of the present invention, through the settings of the metal housing, the first insulating and heat-conducting member, the Peltier refrigeration device, and the insulating base, the sample (such as a wafer with photoresist) can be effectively cooled. The sample cooling device can be sent into the scanning electron microscope together with the sample, and the sample can be continuously cooled during the sample observation process. Thus, the observation time of the sample in the scanning electron microscope can be effectively increased, and at the same time, the resolution of the sample can be increased, making the pictures taken by the scanning electron microscope clearer and more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The following drawings of the present application are hereby incorporated as part of the present application for understanding the present application. The embodiments and descriptions thereof of the present application are shown in the drawings to explain the device and principle of the present application. In the drawings,

[0031] Figure 1 is a top view schematic diagram of a sample cooling device according to an embodiment of the present application;

[0032] Figure 2 is a front view schematic diagram of a sample cooling device according to an embodiment of the present application;

[0033] Figure 3 is located in Figure 2 a schematic diagram of the structure of the devices inside the housing;

[0034] Figure 4 is Figure 3 a schematic diagram of the structure of the Peltier refrigeration assembly in

[0035] Figure 5 is Figure 3 a schematic diagram of the structure of the power supply assembly in

[0036] Description of the reference numerals in the drawings:

[0037] 10 - Sample

[0038] 100 - Metal housing, 110 - First part, 111 - Bearing part, 120 - Second part, 121 - First wall surface, 122 - Second wall surface

[0039] 200 - First insulating and heat - conducting component

[0040] 300 - Peltier refrigeration device, 310 - Peltier refrigeration module, 311 - P - type semiconductor, 312 - N - type semiconductor, 313 - First metal connecting piece, 314 - Second metal connecting piece, 320 - Second insulating and heat - conducting component

[0041] 400 - Insulating base

[0042] 500 - Power supply component, 510 - DC power supply, 520 - Positive metal sheet, 530 - Negative metal sheet, 540 - First insulating part, 550 - Second insulating part

[0043] 600 - Conductive silver paste Detailed implementation manners

[0044] In the following description, numerous specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other instances, some well - known technical features are not described to avoid confusion with the present application.

[0045] It should be understood that the present application can be implemented in different forms and should not be construed as limited to the embodiments presented herein. On the contrary, these embodiments are provided to make the disclosure thorough and complete, and to fully convey the scope of the present application to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0046] It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another. Thus, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be referred to as the second element, component, region, layer, or part.

[0047] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0048] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0049] Embodiments of the utility model are described herein with reference to cross-sectional views as schematic diagrams of ideal embodiments (and intermediate structures) of the present application. In this way, variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, the embodiments of the present application should not be limited to the specific shapes shown herein, but include shape deviations due to, for example, manufacturing. Therefore, what is shown in the figures is schematic in nature, and their shapes are not intended to display the actual shape of the device and are not intended to limit the scope of the present application.

[0050] Refer to the attached Figures 1-5 A sample cooling device according to an embodiment of the present application is schematically described. The sample cooling device includes a metal shell 100 , a first insulating heat-conducting member 200 , a Peltier cooling device 300 and an insulating base 400 .

[0051] The metal shell 100 is enclosed to form a storage space. The metal shell 100 may include a plurality of metal wall plates, which are connected and enclosed to form a storage space. One side of the metal shell 100 is a bearing portion 111, that is, the metal wall plate on one side of the metal shell 100 is the bearing portion 111, and the first side of the bearing portion 111 (that is, Figure 2 The upper side of the middle carrying portion 111 is used to carry the sample 10.

[0052] Exemplarily, the sample 10 may be a wafer coated with photoresist. The material of the metal housing 100 is a metal material with excellent thermal conductivity and electrical conductivity.

[0053] Exemplarily, the metal shell 100 may be a copper shell, an iron shell, an aluminum shell, or other metal shells 100 with excellent thermal conductivity and electrical conductivity.

[0054] The first insulating and heat-conducting member 200 is located in the accommodation space, and the first side of the first insulating and heat-conducting member 200 is attached to the second side of the bearing portion 111 ( Figure 2 the lower side of the bearing portion 111 in the middle, that is, the side of the bearing portion 111 facing the accommodation space) is attached.

[0055] The Peltier refrigeration device 300 is located in the accommodation space. The Peltier refrigeration device 300 is a device that refrigerates based on the Peltier effect. The Peltier effect is that when two different conductor or semiconductor materials form a pair of thermocouples and a DC voltage is applied across their two ends, heat will flow from one end to the other end, thereby achieving the effect of refrigeration or heating. The Peltier refrigeration device 300 has a cold end and a hot end. The cold end absorbs heat and the hot end releases heat. The cold end of the Peltier refrigeration device 300 is attached to the second side of the first insulating and heat-conducting member 200. Thus, when the Peltier refrigeration device 300 operates, its cold end can refrigerate the sample 10 located on the bearing portion 111 through the first insulating and heat-conducting member 200 and the bearing portion 111, so that it is at a lower temperature.

[0056] The first insulating and heat-conducting member 200 is used to achieve insulation and heat transfer between the Peltier refrigeration device 300 and the bearing portion 111. Thus, on the one hand, it can prevent the current when the Peltier refrigeration device 300 operates from conducting to the metal housing 100 and affecting the detection of the sample 10. On the other hand, it can effectively transfer heat between the cold end of the Peltier refrigeration device 300 and the bearing portion 111, so that the temperature of the sample 10 can be effectively reduced.

[0057] Exemplarily, the first insulating and heat-conducting member 200 can be an insulating ceramic sheet or other devices with good insulation and heat conductivity.

[0058] The insulating base 400 is located in the accommodation space. The hot end of the Peltier refrigeration device 300 is attached to the insulating base 400. The side of the insulating base 400 away from the Peltier refrigeration device 300 can be attached to the other side of the metal housing 100. The insulating base 400 mainly plays the roles of support, heat transfer and insulation. When the Peltier refrigeration device 300 operates, the heat of the sample 10 can be conducted to the insulating base 400 through the bearing portion 111, the first insulating and heat-conducting member 200 and the Peltier refrigeration device 300 in sequence, realizing the cooling of the sample 10. The insulating base 400 can also prevent the current when the Peltier refrigeration device 300 operates from conducting to the metal housing 100 and affecting the detection of the sample 10.

[0059] Exemplarily, the insulating base 400 is a ceramic insulating base 400 or other bases made of other materials with good insulation and heat conductivity.

[0060] Exemplarily, a heat sink may be provided on the outer side of the metal housing 100 adjacent to the insulating base 400 for dissipating heat from the insulating base 400.

[0061] The Peltier cooling device 300 has the advantages of no noise, no vibration, no pollution, etc. According to the sample cooling device of the present utility model, through the arrangement of the metal housing 100, the first insulating heat-conducting member 200, the Peltier cooling device 300, and the insulating base 400, the sample 10 (such as a wafer with photoresist) can be effectively cooled. The sample cooling device can be sent into a scanning electron microscope together with the sample 10, and the sample 10 can be continuously cooled during the observation of the sample 10 (for example, the wafer with photoresist can be cooled to below 10 °C and maintained below 10 °C). Thus, the observation time of the sample 10 in the scanning electron microscope can be effectively increased, and at the same time, the resolution of the sample 10 can be increased, making the pictures taken by the scanning electron microscope clearer and more accurate. Moreover, it can effectively prevent the current when the Peltier cooling device 300 works from being conducted to the metal housing 100, affecting the detection of the sample 10.

[0062] See attached Figure 3 、 4 As shown in the figures, in the embodiment of the present application, the Peltier cooling device 300 includes two Peltier cooling assemblies 310 and one second insulating heat-conducting member 320. Each Peltier cooling assembly 310 can refrigerate based on the Peltier effect, that is, each Peltier cooling assembly 310 has a cold end and a hot end. The two Peltier cooling assemblies 310 are arranged at intervals, and there is a second insulating heat-conducting member 320 between adjacent Peltier cooling assemblies 310, that is, the hot end of the previous Peltier assembly and the cold end of the next Peltier cooling assembly 310 are spaced apart by the second insulating heat-conducting member 320. Through the combined action of the two Peltier cooling assemblies 310, the sample 10 can be cooled more efficiently. The second insulating heat-conducting member 320 can be used to prevent short circuits and other situations between adjacent two Peltier cooling assemblies 310. In some other embodiments, there may be three or more Peltier cooling assemblies 310, and there may be two or more second insulating heat-conducting members 320, which are respectively located between adjacent Peltier cooling assemblies 310. In some other embodiments, the Peltier cooling device 300 may only have one Peltier cooling assembly 310.

[0063] Exemplarily, the second insulating heat-conducting member 320 can be an insulating ceramic sheet or other devices with good insulation and heat conductivity.

[0064] In an embodiment of the present application, the Peltier cooling component 310 includes a plurality of P-type semiconductors 311, a plurality of N-type semiconductors 312, a plurality of first metal connecting pieces 313, and a plurality of second metal connecting pieces 314. The plurality of first metal connecting pieces 313 are connected to the first sides of the plurality of P-type semiconductors 311 and the first sides of the plurality of N-type semiconductors 312, and the plurality of second metal connecting pieces 314 are connected to the second sides of the plurality of P-type semiconductors 311 and the second sides of the plurality of N-type semiconductors 312. The plurality of P-type semiconductors 311 and the plurality of N-type semiconductors 312 are alternately connected in series through the plurality of first metal connecting pieces 313 and the plurality of second metal connecting pieces 314, that is, they are connected in the order such as P-type semiconductor 311 → first metal connecting piece 313 → N-type semiconductor 312 → second metal connecting piece 314 → P-type semiconductor 311 → first metal connecting piece 313 → N-type semiconductor 312 → second metal connecting piece 314... A thermocouple pair is formed by connecting the N-type semiconductor 312 and the P-type semiconductor 311 through a metal connecting piece. When a DC voltage is applied across the two ends of the Peltier cooling component 310, electrons in the N-type semiconductor 312 and holes in the P-type semiconductor 311 move in opposite directions under the action of an electric field. During this process, the electrons and holes will cross the connecting piece and enter another semiconductor material from one semiconductor material. Due to the energy level difference between the two semiconductor materials, the electrons and holes will absorb or release heat when crossing the connecting piece. When electrons enter the P-type semiconductor 311 from the N-type semiconductor 312, heat is absorbed, causing the temperature near the metal connecting piece to decrease; conversely, when electrons enter the N-type semiconductor 312 from the P-type semiconductor 311, heat is released, causing the temperature near the metal connecting piece to increase. In this way, by controlling the direction and magnitude of the current, the refrigeration function can be achieved through the Peltier cooling component 310.

[0065] In an embodiment of the present application, the sample cooling device further includes a power supply component 500. The power supply component 500 is located in the accommodation space and is connected to the Peltier cooling device 300 for supplying power to the Peltier cooling device 300. In an embodiment of the present application, the metal housing 100 includes a first part 110 and a second part 120 arranged in parallel. The bearing part 111 is the first part 110. The first insulating and heat-conducting member 200, the Peltier cooling device 300, and the insulating base 400 are located in the accommodation space within the first part 110, and the power supply component 500 is located in the accommodation space within the second part 120.

[0066] In the embodiment of the present application, the power supply assembly 500 is located between the relatively arranged first wall surface 121 and the second wall surface 122 of the metal housing 100, and the first wall surface 121 and the second wall surface 122 are located in the second part 120 of the metal housing 100. The power supply assembly 500 includes a DC power supply 510, a positive metal sheet 520, a negative metal sheet 530, a first insulating member 540, and a second insulating member 550. The positive metal sheet 520 is disposed on the first side of the DC power supply 510 and is respectively connected to the positive electrode of the DC power supply 510 and the Peltier cooling device 300. The negative metal sheet 530 is disposed on the second side of the DC power supply 510 and is respectively connected to the negative electrode of the DC power supply 510 and the Peltier cooling device 300. The first insulating member 540 is disposed between the side of the positive metal sheet 520 away from the DC power supply 510 and the first wall surface 121, and the second insulating member 550 is disposed between the side of the negative metal sheet 530 away from the DC power supply 510 and the second wall surface 122.

[0067] Exemplarily, both the first insulating member 540 and the second insulating member 550 are insulating ceramic sheets, insulating rubber, or other devices with good insulation properties.

[0068] Exemplarily, the DC power supply 510 is a button battery or other device that can stably provide direct current.

[0069] In some other embodiments, the power supply assembly 500 may not be provided in the housing, but the Peltier cooling device 300 is electrically connected to a DC power supply outside the housing through a wire, and the DC power supply outside the housing supplies power to it.

[0070] In the embodiment of the present application, the sample cooling device further includes a double-sided conductive tape (not shown in the figure). The double-sided conductive tape is disposed on the first side of the carrying part 111, and the double-sided conductive tape is used to bond the sample 10 to the carrying part 111 so that the sample 10 is stably fixed to the carrying part 111.

[0071] In the embodiment of the present application, the sample cooling device further includes a conductive silver paste 600. The conductive silver paste 600 is disposed on the first side of the carrying part 111, between the sample 10 and the carrying part 111, for example, near the position of the sample 10 to be observed by a scanning electron microscope. The conductive silver paste 600 can enhance conductivity and can play a positioning role during observation.

[0072] The present application also provides a scanning electron microscope, which includes the sample cooling device as described above. The sample cooling device can be integrated into the sample stage of the scanning electron microscope to cool the sample placed thereon (i.e., placed on the carrying part 111), increase the observation time of the sample, increase the resolution of the sample, and make the pictures taken by the scanning electron microscope clearer and more accurate.

[0073] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.

[0074] In the specification provided herein, a number of specific details are set forth. However, it can be understood that embodiments of the present application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure an understanding of this specification.

[0075] Similarly, it should be understood that, in order to streamline the present application and assist in understanding one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the methods of the present application should not be construed as reflecting an intention that the claimed present application requires more features than are expressly recited in each claim. Rather, as reflected by the corresponding claims, the inventive point lies in that the corresponding technical problem can be solved by features less than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim itself serves as a separate embodiment of the present application.

[0076] Those skilled in the art can understand that, except for features being mutually exclusive, any combination can be adopted for all the features disclosed in this specification (including the accompanying claims, abstract, and drawings) and for all the processes or units of any method or device so disclosed. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) can be replaced by an alternative feature that provides the same, equivalent, or similar purpose.

[0077] In addition, those skilled in the art can understand that, although some of the embodiments described herein include certain features included in other embodiments but not other features, the combination of the features of different embodiments means being within the scope of the present application and forms different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0078] It should be noted that the above embodiments illustrate rather than limit the present application, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A sample cooling device, characterized in that: include: A metal shell, wherein the metal shell encloses a containing space, one side of the metal shell is a bearing portion, and a first side of the bearing portion is used for bearing a sample; A first insulating heat-conducting member, wherein the first insulating heat-conducting member is located in the accommodating space, and a first side of the first insulating heat-conducting member is in contact with a second side of the bearing portion; A Peltier cooling device, wherein the Peltier cooling device is located in the accommodating space, and a cold end of the Peltier cooling device is in contact with the second side of the first insulating heat-conducting member; An insulating base is located in the accommodating space, and a hot end of the Peltier cooling device is attached to the insulating base.

2. The sample cooling device according to claim 1, characterized in that: The Peltier cooling device comprises a plurality of Peltier cooling components and at least one second insulating heat conducting member; The plurality of Peltier cooling components are arranged at intervals, and the second insulating heat-conducting member is provided between adjacent Peltier cooling components.

3. The sample cooling device according to claim 2, characterized in that: The Peltier refrigeration assembly includes a plurality of P-type semiconductors, a plurality of N-type semiconductors, a plurality of first metal connecting plates, and a plurality of second metal connecting plates; The plurality of first metal connecting plates are connected to the first side of the plurality of P-type semiconductors and the first side of the plurality of N-type semiconductors, the plurality of second metal connecting plates are connected to the second side of the plurality of P-type semiconductors and the second side of the plurality of N-type semiconductors, and the plurality of P-type semiconductors and the plurality of N-type semiconductors are alternately connected in series through the plurality of first metal connecting plates and the plurality of second metal connecting plates.

4. The sample cooling device according to claim 2, characterized in that: The first insulating heat-conducting member and the second insulating heat-conducting member are both insulating ceramic sheets; The insulating base is a ceramic insulating base.

5. The sample cooling device according to claim 1, characterized in that: The sample cooling device also includes a power supply component, which is located in the accommodating space and connected to the Peltier cooling device.

6. The sample cooling device according to claim 5, characterized in that: The power supply assembly is located between a first wall surface and a second wall surface that are oppositely arranged in the metal shell; The power supply assembly includes a DC power supply, a positive metal sheet, a negative metal sheet, a first insulating member and a second insulating member; The positive electrode metal sheet is arranged on the first side of the DC power supply and is respectively connected to the positive electrode of the DC power supply and the Peltier cooling device; The negative electrode metal sheet is arranged on the second side of the DC power supply and is respectively connected to the negative electrode of the DC power supply and the Peltier cooling device; The first insulating member is disposed between a side of the positive electrode metal sheet away from the DC power supply and the first wall surface; The second insulating member is disposed between a side of the negative electrode metal sheet away from the DC power supply and the second wall surface.

7. The sample cooling device according to claim 6, characterized in that: The first insulating member and the second insulating member are both insulating ceramic sheets; The DC power supply is a button battery.

8. The sample cooling device according to claim 1, characterized in that: The sample cooling device further comprises a double-sided conductive tape, which is arranged on a first side of the supporting portion and is used to adhere the sample to the supporting portion.

9. The sample cooling device according to claim 1, characterized in that: The sample cooling device further comprises a conductive silver paste, which is arranged on a first side of the carrying portion and located between the sample and the carrying portion.

10. A scanning electron microscope, characterized in that: Comprising a sample cooling device as described in any one of claims 1-9.

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