Electronic component packaging and forming equipment

Abstract

The utility model discloses electronic component packaging and forming equipment which comprises a rack, a lifting mechanism, a middle mechanism, a forming die, a connecting rod structure and a connecting mechanism. The rack is provided with a top plate and two side plates, and the lifting mechanism is arranged below the top plate and comprises a liftable lifting table; the middle mechanism comprises a middle platen and a connecting plate, and the connecting plate is slidably connected with the side plates. The forming die comprises a first forming die body and a second forming die body which are fixed to the top plate, the middle platen and the lifting table correspondingly. The connecting rod mechanism is composed of two connecting rod assemblies and is connected with the lifting table and the middle table plate, and linkage lifting is achieved. The connecting mechanism is slidably connected with the connecting plate through the connecting block, and the elastic piece provides elastic force to enable the connecting block and the connecting plate to be away from each other. According to the packaging forming equipment provided by the utility model, floating connection between the connecting rod mechanism and the middle bedplate is realized through the connecting mechanism, fault tolerance of mold closing distance deviation is realized, and the elastic piece can absorb part of counter-acting force, so that the connecting rod mechanism is prevented from being damaged.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component packaging, and particularly relates to an electronic component packaging and forming device. Background Art

[0002] In modern electronic devices, the packaging technology of chips is particularly important. The packaging technology can not only protect the chips from the influence of the external environment, but also enhance the mechanical strength of the chips, improve their heat dissipation performance, and ensure the reliability and stability of the chips during use.

[0003] In the existing chip packaging technology, the compression molding method is widely used because it can achieve high-precision packaging effects. However, with the continuous improvement of the requirements for chip packaging efficiency and quality in electronic devices, a single molding die can no longer meet the production needs. Therefore, a synchronous mold closing method using multiple molding dies is usually adopted to achieve the simultaneous packaging of multiple chips.

[0004] During the synchronous mold closing process of multiple molding dies, a linkage mechanism is used to achieve the synchronous movement of the molding dies. The design and manufacture of the linkage mechanism largely determine the efficiency and quality of the packaging process. However, in the existing packaging equipment, there are high-precision requirements for the mold closing distance of each molding die. If there is a deviation in the mold closing distance, it will not only affect the packaging effect of the chips, resulting in uneven packaging or waste of packaging materials, but also easily damage the linkage mechanism.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a new solution. Summary of the Utility Model

[0006] The purpose of the utility model is to provide an electronic component packaging and forming device, which can reduce the precision requirements for the mold closing distance during multi-molding die packaging and reduce the damage risk of the equipment linkage mechanism.

[0007] To achieve the above purpose, the technical solution provided by the utility model is as follows:

[0008] In the first aspect, the utility model provides an electronic component packaging and forming device, which includes:

[0009] A frame having a top plate and two side plates fixed to both sides of the top plate;

[0010] A lifting mechanism including a lifting table disposed below the top plate and capable of lifting relative to the top plate;

[0011] An intermediate mechanism including a liftable intermediate platen and connecting plates fixed to both sides of the intermediate platen. The intermediate platen is disposed between the top plate and the lifting table, and the connecting plates are slidably connected to the side plates;

[0012] The forming die includes a first forming die and a second forming die. The upper die of the first forming die is fixed to the lower surface of the top plate, the lower die of the first forming die is fixed to the upper surface of the intermediate platen, the upper die of the second forming die is fixed to the lower surface of the intermediate platen, and the lower die of the first forming die is fixed to the upper surface of the lifting table.

[0013] The link mechanism includes two sets of link assemblies respectively arranged on both side plates. The link assemblies connect the lifting table and the intermediate platen, so that the lifting of the intermediate platen is linked to the lifting of the lifting table.

[0014] The connection mechanism includes a connection block slidably connected to the connection plate. The connection block can slide up and down relative to the connection plate. The connection block is connected to the link assembly. An elastic member that can expand and contract in the up and down direction is provided between the connection block and the connection plate. The elastic member is used to provide an elastic force that makes the connection block and the connection plate tend to move away from each other.

[0015] In one or more embodiments, a sliding portion is provided on the connection block, and a vertically extending sliding groove matching the sliding portion is provided on the connection plate. The sliding portion is slidably arranged in the sliding groove.

[0016] In one or more embodiments, abutting portions are provided on both sides of the sliding portion, abutting portions are provided on both sides of the sliding groove, the abutting portions are located above the abutting portions, one end of the elastic member is connected to the abutting portion, and the other end is connected to the abutting portion.

[0017] In one or more embodiments, a vertically extending guide post is fixedly connected to the abutting portion, a guide hole matching the guide post is provided on the abutting portion, and the guide post passes through the guide hole.

[0018] In one or more embodiments, the link assembly includes a first link, a second link, a limiting groove and a connection block. The lower end of the first link is rotatably connected to the connection block, the connection block is fixedly connected to the lifting table, the upper end of the first connecting rod is rotatably connected to the lower end of the second link, the upper end of the second link is slidably connected to the limiting groove, the limiting groove is an arc-shaped groove, and the connection block is rotatably connected to the middle of the second link.

[0019] In one or more embodiments, the distance between the connection points at the upper and lower ends of the first link is equal to the radius of the arc-shaped groove. The midpoint of the connection line between the connection point in the middle of the second link and the connection points at the upper and lower ends of the second link coincides. The connection point at the lower end of the first link, the connection point in the middle of the second link and the center of the limiting groove are located on the same straight line.

[0020] In one or more embodiments, the connecting lines of the lower end connection points of the first linkages, the middle connection points of the second linkages, and the centers of the limiting grooves on the two side plates coincide with each other in the projection on any one of the side plates.

[0021] In one or more embodiments, a linearly extending guide rail extending vertically is provided on one of the connecting plate and the side plate, and a slider slidably connected to the linearly extending guide rail is provided on the other; and / or a linearly extending guide rail extending vertically is provided on one of the lifting table and the side plate, and a slider slidably connected to the linearly extending guide rail is provided on the other.

[0022] In one or more embodiments, the lifting table is driven to lift by a driving mechanism, the driving mechanism includes a motor, a ball screw assembly, and a synchronous belt, an output shaft of the motor is drivingly connected to the ball screw assembly through the synchronous belt, and the ball screw assembly is connected to the lifting table.

[0023] In one or more embodiments, an adjusting assembly for adjusting the parallelism of the molds is provided between the top plate and the upper mold of the first molding die. The adjusting assembly includes a base plate, a support plate, and adjusting columns. The base plate is provided with a plurality of through holes arranged in an array. The support plate is arranged at the bottom of the base plate and covers the through holes. The adjusting columns are replaceably arranged in the through holes, and the upper mold of the first molding die is attached to the bottom surface of the support plate; and / or

[0024] An adjusting assembly for adjusting the parallelism of the molds is provided between the intermediate platen and the upper mold of the second molding die. The adjusting assembly includes a base plate, a support plate, and adjusting columns. The base plate is provided with a plurality of through holes arranged in an array. The support plate is arranged at the bottom of the base plate and covers the through holes. The adjusting columns are replaceably arranged in the through holes, and the upper mold of the second molding die is attached to the bottom surface of the support plate.

[0025] Compared with the prior art, the electronic component packaging and molding equipment provided by the present utility model realizes the floating connection between the linkage mechanism and the intermediate platen through the coupling mechanism, and realizes the tolerance of the deviation of the mold closing distance; the elastic member of the coupling mechanism provides a certain tolerance space, so that during the mold closing process, if there is a deviation in the mold closing distance, the elastic member can absorb part of the reaction force, thereby avoiding damage to the linkage mechanism. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 Schematic three-dimensional structure diagram of an electronic component encapsulation and molding device in an embodiment of the present utility model;

[0028] Figure 2 Front view of an electronic component encapsulation and molding device in an embodiment of the present utility model;

[0029] Figure 3 Schematic structure diagram of a lifting mechanism in an embodiment of the present utility model;

[0030] Figure 4 Schematic structure diagram of an intermediate mechanism in an embodiment of the present utility model;

[0031] Figure 5 Schematic structure diagram of a connecting rod assembly in an embodiment of the present utility model;

[0032] Figure 6 Schematic diagram of the configuration relationship of a connecting rod mechanism in an embodiment of the present utility model;

[0033] Figure 7 Schematic structure diagram of a driving mechanism in an embodiment of the present utility model;

[0034] Figure 8 Schematic structure diagram of an adjustment assembly in an embodiment of the present utility model;

[0035] Figure 9 is Figure 8 Cross-sectional view of the adjustment assembly shown.

[0036] Main reference numeral description:

[0037] 1 - Frame, 11 - Top plate, 12 - Side plate, 13 - Base, 2 - Lifting mechanism, 21 - Lifting table, 3 - Intermediate mechanism, 31 - Intermediate table plate, 32 - Connecting plate, 321 - Sliding groove, 322 - Contact portion, 323 - Guide post, 4 - Molding die, 41 - First molding die, 42 - Second molding die, 5 - Link structure, 50 - Connecting rod assembly, 51 - First connecting rod, 52 - Second connecting rod, 53 - Limit groove, 54 - Connecting block, 6 - Connecting mechanism, 61 - Connecting block, 611 - Sliding portion, 612 - Contact portion, 613 - Guide hole, 62 - Elastic member, 71 - Linear guide rail, 72 - Slide block, 8 - Driving mechanism, 81 - Motor, 82 - Ball screw assembly, 83 - Synchronous belt, 9 - Adjustment assembly, 91 - Substrate, 92 - Support plate, 93 - Adjustment column, 94 - Through hole. Detailed implementation manners

[0038] To enable those skilled in the art to better understand the technical solutions in the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0039] Unless otherwise clearly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "having" etc. will be understood to include the stated elements or components, without excluding other elements or other components.

[0040] In the existing chip packaging technology, the compression molding method is widely used due to its high-precision packaging effect. However, when multiple molding dies are closed synchronously, the accuracy requirement for the closing distance is extremely high, and even a slight deviation may cause damage to the linkage mechanism. This not only affects the packaging effect but also increases the equipment maintenance cost and production difficulty.

[0041] During the analysis of the existing technology, the inventor found that in the current equipment, the synchronous closing of multiple molding dies is achieved through a rigidly connected link mechanism. If there is a deviation in the closing distance between the molding dies during the closing process, when the lifting table continues to rise, it will generate a huge reaction force on the link mechanism, resulting in damage to the linkage mechanism. Such a design cannot effectively cope with the minute errors in the closing distance and there is a large room for improvement.

[0042] To solve the above problems, the present utility model proposes an innovative technical implementation idea, that is, by setting a floating connection structure between the link mechanism and the intermediate platen to achieve fault tolerance for the deviation of the closing distance. Specifically, elastic members are used to provide a certain fault tolerance space, so that during the closing process, if there is a deviation in the closing distance, the elastic members can absorb part of the reaction force, thus avoiding damage to the link mechanism. The core of this technical idea lies in the design of the floating connection and the elastic members to ensure that the equipment can achieve high-precision closing while having the ability to cope with minute errors, thereby improving the reliability and durability of the equipment.

[0043] Please refer to Figures 1 to 6 As shown, the electronic component packaging and molding equipment in an embodiment of the present utility model includes: a frame 1, a lifting mechanism 2, an intermediate mechanism 3, a molding die 4, a link structure 5, and a coupling mechanism 6.

[0044] Please refer to Figure 1 and Figure 2As shown, the frame 1 has a top plate 11 and two side plates 12 fixed to both sides of the top plate 11. The lifting mechanism 2 includes a lifting table 21 disposed below the top plate 11 and capable of lifting relative to the top plate 11. The intermediate mechanism 3 includes a liftable intermediate table plate 31 and connecting plates 32 fixed to both sides of the intermediate table plate 31. The intermediate table plate 31 is disposed between the top plate 11 and the lifting table 21, and the connecting plates 32 are slidably connected to the side plates 12.

[0045] Please refer to Figure 1 and Figure 2 As shown, the molding die 4 includes a first molding die 41 and a second molding die 42. The upper die of the first molding die 41 is fixed to the lower surface of the top plate 11, the lower die of the first molding die 41 is fixed to the upper surface of the intermediate table plate 31, the upper die of the second molding die 42 is fixed to the lower surface of the intermediate table plate 31, and the lower die of the first molding die 41 is fixed to the upper surface of the lifting table 21.

[0046] Please refer to Figure 1 and Figure 6 As shown, the connecting rod mechanism includes two sets of connecting rod assemblies 50 respectively disposed on the two side plates 12. The connecting rod assemblies 50 connect the lifting table 21 and the intermediate table plate 31 to make the lifting of the intermediate table plate 31 linked to the lifting of the lifting table 21. The coupling mechanism 6 includes a coupling block 61 slidably connected to the connecting plate 32. The coupling block 61 can slide up and down relative to the connecting plate 32. The coupling block 61 is connected to the connecting rod assembly 50. An elastic member 62 that can expand and contract in the vertical direction is provided between the coupling block 61 and the connecting plate 32. The elastic member 62 is used to provide an elastic force that tends to move the coupling block 61 and the connecting plate 32 away from each other.

[0047] The frame 1, as the basic structure of the entire device, has a top plate 11 and two side plates 12 fixed to both sides of the top plate 11, providing a stable support frame for the device. The top plate 11 provides a fixed reference for other components. The side plates 12 ensure the smooth operation of each component in the up and down (vertical) direction through sliding connections with other parts. The frame 1 also includes a base 13 for supporting the entire device, and the lower ends of the two side plates 12 are fixed to the base 13.

[0048] The lifting mechanism 2 is one of the core functional components of the device, installed directly below the top plate 11. It includes a lifting table 21 that can move up and down relative to the top plate 11. The design of the lifting table 21 enables the device to achieve height adjustment during operation, thus meeting different packaging requirements. The up and down movement of the lifting mechanism 2 directly affects the mold closing and mold opening operations of the molding die 4 and is the key to the entire device's packaging process.

[0049] The intermediate mechanism 3 is located between the top plate 11 and the lifting table 21, and includes a liftable intermediate platen 31 and connecting plates 32 fixed to both sides of the intermediate platen 31. The intermediate platen 31 is slidably connected to the side plates 12 through the connecting plates 32, ensuring that the intermediate platen 31 can move smoothly in the vertical direction. The setting of the intermediate platen 31 enables the device to be configured with multiple forming dies, thereby encapsulating multiple electronic components simultaneously.

[0050] The forming die 4 is composed of a first forming die 41 and a second forming die 42, which are respectively fixed on different platens. Specifically, the upper die of the first forming die 41 is fixed to the lower surface of the top plate 11, and the lower die is fixed to the upper surface of the intermediate platen 31; the upper die of the second forming die 42 is fixed to the lower surface of the intermediate platen 31, and the lower die is fixed to the upper surface of the lifting table 21. This layout design of the upper and lower dies enables the device to complete the encapsulation operations at two different positions during a single lifting process, greatly improving the encapsulation efficiency.

[0051] The link mechanism is a transmission component connecting the lifting table 21 and the intermediate platen 31, and includes two sets of link assemblies 50 respectively arranged on the two side plates 12. The link assemblies 50 make the lifting of the intermediate platen 31 synchronous with the lifting of the lifting table 21 through mechanical linkage, realizing the coordinated movement of the intermediate platen 31 and the lifting table 21. The design of the link mechanism ensures the synchronism of each forming die 4 during the mold closing and mold opening processes.

[0052] The coupling mechanism 6 further optimizes the connection method of the link mechanism, and includes a coupling block 61 slidably connected to the connecting plate 32. The coupling block 61 can slide up and down relative to the connecting plate 32 and is connected to the link assembly 50. An elastic member 62 that can expand and contract in the vertical direction is provided between the coupling block 61 and the connecting plate 32, providing elastic buffering for the entire system. While providing thrust, the elastic member 62 also absorbs part of the reaction force during the lifting process, avoiding mechanical shock caused by rigid connection and protecting the stable operation of the device.

[0053] In the electronic component encapsulation and forming device, if there is a deviation in the mold closing distance of the forming die 4, it will cause inconsistent situations during the mold closing process. For example, the first forming die 41 may have completed mold closing, while the second forming die 42 has not. To ensure that all forming dies 4 can complete mold closing smoothly, the lifting table 21 needs to continue to rise to push the second forming die 42 to close. However, if there is a rigid connection between the intermediate platen 31 and the link mechanism during this process, the intermediate platen 31 will generate a large reaction force on the link mechanism, which may cause damage to the link mechanism. To solve this problem, the present utility model provides a coupling mechanism 6 to form a floating connection between the link mechanism and the intermediate platen 31, thereby providing a tolerance space during the mold closing process and avoiding damage to the link mechanism.

[0054] Specifically, in the initial stage of mold clamping, the elastic member 62 is in the maximum elongation state, ensuring the buffering space for the link mechanism and providing sufficient movement space for the link mechanism. As the lifting table 21 rises, it drives the link mechanism to rise together. At this time, the elastic member 62 will be gradually compressed (not fully compressed). During the compression process, the elastic member 62 not only provides a certain thrust force, transmitting the thrust force generated when the link mechanism rises to the connecting plate 32, thereby overcoming the gravity of the intermediate mechanism 3 to push the intermediate platen 31 upward, but also can absorb part of the reaction force, reducing the direct impact on the link mechanism.

[0055] When the first forming mold 41 completes mold clamping first while the second forming mold 42 has not yet been clamped, the lifting table 21 continues to rise, driving the link mechanism to continue rising at this time. The elastic member 62 is further compressed, thereby providing a buffering space for the link mechanism, being able to absorb and relieve the force impact caused by mold deviation during the mold clamping process, avoiding the huge reaction force during rigid connection, and ensuring the safety of the link mechanism.

[0056] In one embodiment, the specific encapsulation process of the electronic component encapsulation and forming equipment provided by the present utility model includes:

[0057] Before the equipment starts running, the operator needs to adjust the positions of components such as the top plate 11, the lifting table 21, and the intermediate platen 31 according to the specific encapsulation requirements. Ensure that the upper and lower molds of the first forming mold 41 and the second forming mold 42 are in the correct positions. The initial state of the equipment is that the elastic member 62 is in the maximum elongation state, and the intermediate platen 31 and the lifting table 21 are in the lowest positions, ready for mold clamping operation.

[0058] Then, the electronic component chip to be encapsulated and the encapsulation material are respectively placed on the lower molds of the first forming mold 41 and the second forming mold 42. Ensure that the position of the chip is accurate so as to achieve the best effect during the encapsulation process.

[0059] After the equipment is started, the lifting table 21 begins to rise, driving the link mechanism and the intermediate platen 31 to rise together. During this process, the elastic member 62 maintains its incompletely compressed state, overcoming the gravity of the intermediate mechanism 3 by providing a thrust force to ensure the smooth rise of the intermediate platen 31.

[0060] As the lifting table 21 rises further, the upper and lower molds of the first forming mold 41 gradually approach, and finally the mold clamping process is completed. At this stage, if the mold clamping distance is accurate, both the first forming mold 41 and the second forming mold 42 will successfully complete mold clamping.

[0061] If the second forming die 42 has not been closed yet at this time, the lifting table 21 needs to continue to rise to push the second forming die 42 to complete the closing. During this process, since the first forming die 41 has already been closed, the continuously rising lifting table 21 will generate an additional thrust on the intermediate platen 31 through the linkage mechanism. At this time, the elastic member 62 is gradually compressed, providing a certain buffer space to absorb part of the reaction force and ensuring that the linkage mechanism is not damaged.

[0062] As the first forming die 41 and the second forming die 42 are successively closed, the encapsulation material is compressed and formed under high pressure, firmly encapsulating the chip therein. After the encapsulation is completed, the lifting table 21 begins to descend, driving the linkage mechanism and the intermediate platen 31 to descend together and return to the initial state. At this time, the finished electronic component that has been encapsulated can be taken out for subsequent quality inspection and packaging.

[0063] In an exemplary embodiment, please refer to Figure 1 、 Figure 4 and Figure 5 As shown, the connecting block 61 is provided with a sliding portion 611, and the connecting plate 32 is provided with a vertically extending sliding groove 321 that matches the sliding portion 611. The sliding portion 611 is slidably disposed within the sliding groove 321. The connecting block 61, as a transmission component connecting the linkage mechanism and the intermediate platen 31, is provided with the sliding portion 611. The sliding portion 611 is a key component of the connecting block 61 and is designed to be able to move up and down within the sliding groove 321.

[0064] The connecting plate 32 is a component fixed to both sides of the intermediate platen 31, and is provided with a vertically extending sliding groove 321 that matches the sliding portion 611. The design of the sliding groove 321 matches the size and shape of the sliding portion 611 to ensure that the sliding portion 611 can slide freely within the sliding groove 321.

[0065] The design that the sliding portion 611 is slidably disposed within the sliding groove 321 forms a flexible sliding connection between the connecting block 61 and the connecting plate 32. During the mold closing process, when the lifting table 21 drives the linkage mechanism to rise or fall, the connecting block 61 slides up and down within the sliding groove 321 through the sliding portion 611. While transmitting the motion, it also provides a certain buffer space. Such a design effectively solves the problem of reaction force caused by rigid connection and avoids damage to the linkage mechanism due to mechanical shock.

[0066] Specifically, please refer to Figure 4 and Figure 5 As shown, both sides of the sliding portion 611 are provided with abutting portions 612, both sides of the sliding groove 321 are provided with abutting portions 322, the abutting portions 322 are located above the abutting portions 612, and one end of the elastic member 62 is connected to the abutting portion 612 and the other end is connected to the abutting portion 322.

[0067] The abutting portion 612 is designed to be able to withstand and transmit the force of the elastic member 62. The abutting portion 322 is located above the abutting portion 612 and plays a role in fixing and transmitting force by connecting with the elastic member 62. The design of the abutting portion 322 needs to consider the matching with the abutting portion 612 and the elastic member 62 to ensure smooth and effective force transmission during the mold closing process. The elastic member 62 plays a role in buffering and absorbing mechanical shocks in the whole structure. The elastic member 62 is preferably a compression spring.

[0068] Further, please refer to Figure 4 As shown, a guide post 323 extending vertically (up and down) is fixedly connected to the abutting portion 322, and a guide hole 613 matching the guide post 323 is provided on the abutting portion 612. The guide post 323 is inserted into the guide hole 613. Through the cooperation of the guide post 323 and the guide hole 613, the connection and movement path between the coupling block 61 and the connecting plate 32 are further optimized, ensuring the stability and accuracy of the equipment during the mold closing process.

[0069] The guide post 323 is designed as a rigid structure extending in the vertical (up and down) direction and is usually made of high-strength materials to ensure that it does not bend or deform during operation and maintain the verticality of the guide post 323. The main function of the guide post 323 is to provide a stable guiding path to ensure smooth movement of the coupling block 61 in the vertical direction.

[0070] The guide post 323 is inserted into the guide hole 613. Through the cooperation of the guide post 323 and the guide hole 613, the movement of the coupling block 61 in the vertical direction is effectively guided and restricted. The guide post 323 provides a rigid support path, while the guide hole 613 ensures the accuracy and stability of the coupling block 61 during up and down movement.

[0071] In an exemplary embodiment, please refer to Figure 5 As shown, the connecting rod assembly 50 includes a first connecting rod 51, a second connecting rod 52, a limiting groove 53 and a connecting block 54. The lower end of the first connecting rod 51 is rotatably connected to the connecting block 54, the connecting block 54 is fixedly connected to the lifting table 21, the upper end of the first connecting rod is rotatably connected to the lower end of the second connecting rod 52, the upper end of the second connecting rod 52 is slidably connected to the limiting groove 53, the limiting groove 53 is an arc-shaped groove, and the coupling block 61 is rotatably connected to the middle of the second connecting rod 52. The aforementioned rotational connection of the structure can be realized through components such as bearing seats and rotating shafts, reducing the wear between the connecting rod and the shaft.

[0072] The lower end of the first connecting rod 51 is connected to the connecting block 54 through a rotational connection, and the connecting block 54 is fixedly connected to the lifting platform 21. This structure enables the first connecting rod 51 to move up and down with the movement of the lifting platform 21, while the rotational connection provides a certain degree of flexibility, reducing stress concentration caused by rigid connection. The main function of the first connecting rod 51 is to transmit the movement of the lifting platform 21 and provide a certain degree of flexibility through the rotational connection.

[0073] The upper end of the first connecting rod 51 is connected to the lower end of the second connecting rod 52 through a rotational connection, enabling the two connecting rods to move synergistically with each other in the vertical direction. The design of the rotational connection allows the connecting rod assembly 50 to freely adjust the angle during movement, ensuring the stable operation of the equipment under different working conditions.

[0074] The upper end of the second connecting rod 52 is slidably connected to the limiting groove 53. The limiting groove 53 is an arc-shaped groove. This design not only provides a guiding path for the movement of the second connecting rod 52 but also limits the movement range of the second connecting rod 52 to a certain extent. The radian of the limiting groove 53 needs to adapt to the trajectory of the second connecting rod 52 during movement. The second connecting rod 52 plays a role of connecting the upper and lower parts in the connecting rod assembly 50, transmitting the movement of the first connecting rod 51 to the coupling block 61.

[0075] Specifically, please refer to Figure 5 and Figure 6 As shown, the distance L3 between the connection points (7a, 7b) at the upper and lower ends of the first connecting rod 51 is equal to the radius L1 of the arc-shaped groove. The middle connection point 7c of the second connecting rod 52 coincides with the midpoint of the line connecting the upper and lower connection points (7b, 7d) of the second connecting rod 52, that is, the distance between the upper and lower connection points (7b, 7d) of the second connecting rod 52 is equal to twice the distance L2 between the middle connection point 7c of the second connecting rod 52 and the upper and lower connection point 7b of the second connecting rod 52. The lower connection point 7a of the first connecting rod 51, the middle connection point 7c of the second connecting rod 52, and the center A of the limiting groove 53 are located on the same straight line.

[0076] The lower connection point 7a of the first connecting rod 51, the middle connection point 7c of the second connecting rod 52, and the center A of the limiting groove 53 are located on the same straight line. This collinear design ensures that the force transmission between the connection points during the movement of the connecting rod assembly 50 follows a predetermined path, reducing mechanical wear and equipment failures caused by movement deviation.

[0077] Due to the aforementioned geometric relationship of the connection points of the first connecting rod 51 and the second connecting rod 52, as well as their special layout design with the limiting groove 53, the moving distance of the lifting platform 21 is twice that of the intermediate platen 31 during the movement process. This means that when the lifting platform 21 rises or falls a certain distance, the intermediate platen 31 will move half of that distance accordingly.

[0078] When the mold closing distances of the first molding die 41 and the second molding die 42 are equal, the coordinated movement of the lifting table 21 and the intermediate platen 31 can ensure that the two molding dies complete the mold closing operation simultaneously. The realization of this synchronous mold closing reduces the packaging quality deviation caused by the difference in mold closing time and ensures the quality consistency of each package.

[0079] Further, please refer to Figure 6 As shown, the connecting lines of the lower end connection points 7a of the first link 51, the middle connection points 7c of the second link 52, and the center A of the limiting groove 53 of the two sets of link assemblies 50 on the two side plates 12 coincide with each other in the projection on any one of the side plates 12. That is, the projections of the two sets of link assemblies 50 on the side plate 12 intersect with each other and are symmetric about the connecting line of the lower end connection point 7a of the first link 51 and the middle connection point 7c of the second link 52.

[0080] Due to the intersecting and symmetric layout of the projections of the two sets of link assemblies 50, the intermediate structure can maintain a good balance state during the movement. This symmetric design ensures that when the device is in motion, the forces between the link assemblies 50 are evenly distributed and no large lateral force is generated, thereby reducing the swing or tilt of the intermediate platen 31 during the movement.

[0081] In an exemplary embodiment, please refer to Figure 1 and Figure 2 As shown, a linear guide rail 71 extending vertically is provided on one of the connecting plate 32 and the side plate 12, and a slider 72 slidably connected to the linear guide rail 71 is provided on the other. A linear guide rail 71 extending vertically is provided on one of the lifting table 21 and the side plate 12, and a slider 72 slidably connected to the linear guide rail 71 is provided on the other.

[0082] A linear guide rail 71 extending vertically is provided on one of the connecting plate 32 and the side plate 12, and a slider 72 slidably connected to the linear guide rail 71 is provided on the other. This design enables the connecting plate 32 to slide up and down along the linear guide rail 71 on the side plate 12. The linear guide rail 71 provides a fixed sliding path, while the slider 72 ensures the smoothness and accuracy of the connecting plate 32 during the movement. The cooperation of the guide rail and the slider 72 enables the connecting plate 32 to slide freely in the vertical direction while avoiding lateral swing or offset.

[0083] Similarly, a linear guide rail 71 extending vertically is provided on one of the lifting table 21 and the side plate 12, and a slider 72 slidably connected to the linear guide rail 71 is provided on the other. With this design, the lifting table 21 can slide up and down along the linear guide rail 71 on the side plate 12. The guide rail provides an accurate movement path, and the slider 72 ensures the smoothness and accuracy of the lifting table 21 during movement. The cooperation of the guide rail and the slider 72 enables the lifting table 21 to operate smoothly in the vertical direction while avoiding the interference of lateral forces.

[0084] In an exemplary embodiment, please refer to Figure 1 and Figure 7 As shown, the lifting table 21 is driven to lift by a driving mechanism 8. The driving mechanism 8 includes a motor 81, a ball screw assembly 82, and a timing belt 83. The output shaft of the motor 81 is drivingly connected to the ball screw assembly 82 through the timing belt 83, and the ball screw assembly 82 is connected to the lifting table 21.

[0085] The motor 81 is the core component of the driving mechanism 8, and its main function is to provide a power source. The output shaft of the motor 81 transmits power to the ball screw assembly 82 through the timing belt 83. The selection of the motor 81 needs to consider its power, speed, and torque to ensure that it can provide sufficient power to support the normal operation of the equipment.

[0086] As a transmission medium, the timing belt 83 transmits the power of the motor 81 from the output shaft to the ball screw assembly 82. The design of the timing belt 83 needs to have high wear resistance and tensile strength to ensure that it is not easily broken or worn during long-term operation. At the same time, the tooth profile structure of the timing belt 83 can ensure the precise fit between the output shaft of the motor 81 and the ball screw assembly 82, avoiding slipping and ensuring the smoothness and efficiency of the transmission.

[0087] The main function of the ball screw assembly 82 is to convert the rotational motion transmitted by the timing belt 83 into the linear motion of the lifting table 21. The ball screw assembly 82 achieves this conversion through screw drive. Its high transmission efficiency and precise motion control enable the lifting table 21 to lift smoothly and accurately. The lifting table 21 is connected to the ball screw assembly 82, and the lifting is achieved through the linear motion of the ball screw assembly 82.

[0088] In an exemplary embodiment, please refer to Figure 1 、 Figure 2 、 Figure 8 and Figure 9As shown, an adjusting component 9 for adjusting the parallelism of the mold is provided between the top plate 11 and the upper mold of the first forming mold 41. The adjusting component 9 includes a base plate 91, a support plate 92, and an adjusting column 93. The base plate 91 is provided with a plurality of through holes 94 arranged in an array. The support plate 92 is arranged at the bottom of the base plate 91 and covers the through holes 94. The adjusting column 93 is replaceably arranged in the through holes 94. The upper mold of the first forming mold 41 is attached to the bottom surface of the support plate 92

[0089] An adjusting component 9 for adjusting the parallelism of the mold is provided between the intermediate platen 31 and the upper mold of the second forming mold 42. The adjusting component 9 includes a base plate 91, a support plate 92, and an adjusting column 93. The base plate 91 is provided with a plurality of through holes 94 arranged in an array. The support plate 92 is arranged at the bottom of the base plate 91 and covers the through holes 94. The adjusting column 93 is replaceably arranged in the through holes 94. The upper mold of the second forming mold 42 is attached to the bottom surface of the support plate 92.

[0090] The base plate 91 serves as the basic structure of the adjusting component 9 and is provided with a plurality of through holes 94 arranged in an array. The design of the base plate 91 needs to have high rigidity and stability to support the support plate 92 and the adjusting column 93. The array arrangement design of the through holes 94 enables the adjusting column 93 to be installed at different positions, thereby providing more adjustment points to achieve more parallelism adjustment. The height of the adjusting column 93 can be set to be greater than the depth of the through holes 94, so that the inclination of the support plate 92 can be adjusted by placing the adjusting column 93 in different through holes 94.

[0091] The support plate 92 is arranged at the bottom of the base plate 91 and covers the through holes 94. Its main function is to adjust the parallelism of the forming mold 4 through the adjusting column 93. The support plate 92 can adapt to different height and angle changes under the support of the adjusting column 93. The design of the support plate 92 ensures the smooth fitting of the forming mold 4 at different heights and angles, improving the adjustment accuracy.

[0092] In summary, the electronic component packaging and forming equipment provided by the present utility model realizes the floating connection between the link mechanism and the intermediate platen through the connection mechanism, achieving fault tolerance for the deviation of the mold closing distance; the elastic member of the connection mechanism provides a certain fault tolerance space, so that during the mold closing process, if there is a deviation in the mold closing distance, the elastic member can absorb part of the reaction force, thereby avoiding damage to the link mechanism.

[0093] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, in any regard, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0094] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An electronic component packaging and molding device, characterized in that: include: A frame having a top plate and two side plates fixed to both sides of the top plate; A lifting mechanism, comprising a lifting platform disposed below the top plate and capable of being lifted and lowered relative to the top plate; The intermediate mechanism comprises a liftable intermediate platform and connecting plates fixed on both sides of the intermediate platform, wherein the intermediate platform is arranged between the top plate and the lifting platform, and the connecting plates are slidably connected with the side plates; A molding die, comprising a first molding die and a second molding die, wherein the upper die of the first molding die is fixed to the lower surface of the top plate, the lower die of the first molding die is fixed to the upper surface of the middle platen, the upper die of the second molding die is fixed to the lower surface of the middle platen, and the lower die of the first molding die is fixed to the upper surface of the lifting platform; A connecting rod mechanism, comprising two groups of connecting rod assemblies respectively arranged on two side plates, wherein the connecting rod assemblies connect the lifting platform and the middle platen, so that the lifting and lowering of the middle platen are linked to the lifting and lowering of the lifting platform; The connecting mechanism includes a connecting block slidably connected to the connecting plate, the connecting block can slide up and down relative to the connecting plate, the connecting block is connected to the connecting rod assembly, and an elastic member that can be extended and retracted in the up and down directions is provided between the connecting block and the connecting plate, and the elastic member is used to provide an elastic force that causes the connecting block and the connecting plate to tend to move away from each other.

2. The electronic component packaging molding equipment according to claim 1, characterized in that: The connecting block is provided with a sliding part, the connecting plate is provided with a sliding groove extending up and down and matching with the sliding part, and the sliding part is slidably arranged in the sliding groove.

3. The electronic component packaging molding equipment according to claim 2, characterized in that: Abutment parts are provided on both sides of the sliding part, abutment parts are provided on both sides of the sliding groove, the abutment parts are located above the abutment parts, one end of the elastic member is connected to the abutment part, and the other end is connected to the abutment part.

4. The electronic component packaging molding equipment according to claim 3, characterized in that: A guide column extending up and down is fixedly connected to the abutting portion, a guide hole matching with the guide column is provided on the abutting portion, and the guide column is passed through the guide hole.

5. The electronic component packaging molding equipment according to claim 1, characterized in that: The connecting rod assembly includes a first connecting rod, a second connecting rod, a limiting groove and a connecting block, the lower end of the first connecting rod is rotatably connected to the connecting block, the connecting block is fixedly connected to the lifting platform, the upper end of the first connecting rod is rotatably connected to the lower end of the second connecting rod, the upper end of the second connecting rod is slidably connected to the limiting groove, the limiting groove is an arc groove, and the connecting block is rotatably connected to the middle part of the second connecting rod.

6. The electronic component packaging molding equipment according to claim 5, characterized in that: The distance between the connection points at the upper and lower ends of the first connecting rod is equal to the radius of the arc groove, the middle connection point of the second connecting rod coincides with the midpoint of the line connecting the upper and lower connection points of the second connecting rod, and the lower end connection point of the first connecting rod, the middle connection point of the second connecting rod and the center of the limit groove are located on the same straight line.

7. The electronic component packaging molding equipment according to claim 6, characterized in that: The projections of the connecting lines of the lower end connection point of the first connecting rod, the middle connection point of the second connecting rod and the center of the limiting groove of the two groups of connecting rod assemblies on the two side plates on any of the side plates overlap with each other.

8. The electronic component packaging molding equipment according to claim 1, characterized in that: A linear guide rail extending up and down is disposed on one of the connecting plate and the side plate, and a sliding block slidably connected to the linear guide rail is disposed on the other one; and / or One of the lifting platform and the side plate is provided with a linear guide rail extending up and down, and the other is provided with a sliding block slidably connected with the linear guide rail.

9. The electronic component packaging molding equipment according to claim 1, characterized in that: The lifting platform is driven to lift by a driving mechanism, which includes a motor, a ball screw assembly and a synchronous belt. The output shaft of the motor is transmission-connected to the ball screw assembly through the synchronous belt, and the ball screw assembly is connected to the lifting platform.

10. The electronic component packaging molding equipment according to claim 1, characterized in that: An adjustment component for adjusting the parallelism of the mold is provided between the top plate and the upper mold of the first molding mold, the adjustment component comprises a base plate, a support plate and an adjustment column, the base plate is provided with a plurality of through holes arranged in an array, the support plate is provided at the bottom of the base plate and covers the through holes, the adjustment column is replaceably provided in the through holes, and the upper mold of the first molding mold is in contact with the bottom surface of the support plate; and / or An adjustment component for adjusting the parallelism of the mold is provided between the middle platen and the upper mold of the second molding mold, and the adjustment component includes a base plate, a support plate and an adjustment column. The base plate is provided with a plurality of through holes arranged in an array, the support plate is provided at the bottom of the base plate and covers the through holes, and the adjustment column is replaceably provided in the through holes, and the upper mold of the second molding mold is in contact with the bottom surface of the support plate.

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