Wafer ultrasonic cleaning machine
By integrating drying cabinets and drying parts in an ultrasonic cleaning machine, automatic drying of wafers is solved, and the problem of dust adsorption during wafer drying in existing equipment is solved, improving the cleaning effect.
Patent Information
- Application Number
- CN202421932151.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-08-09
AI Technical Summary
现有的超声波清洗设备不具备干燥功能，导致晶圆在干燥过程中容易吸附灰尘，影响清洁效果。
A wafer ultrasonic cleaning machine is designed, including a drying box, a placing box, a drying piece and a driving piece. The drive-drive placement box moves up and down between the cleaning machine main body and the drying box, and drying the wafer using a drying member (such as a hot air fan) to reduce the possibility of water droplets adsorbing dust.
It effectively reduces the possibility that water droplets on the wafer surface adsorb dust, improves the cleaning effect of the wafer, and simplifies the operation process.
Smart Images
Figure CN222914745U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of ultrasonic cleaning, and particularly relates to a wafer ultrasonic cleaning machine. Background Art
[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. Various circuit element structures can be processed and fabricated on the silicon wafer to become an IC product with specific electrical functions. The raw material of the wafer is silicon. When processing the wafer, it needs to be cleaned. When cleaning, the wafer is usually cleaned by an ultrasonic cleaning machine.
[0003] Existing ultrasonic cleaning equipment does not have a drying function. After the wafer is cleaned, it needs to be taken out and then dried. During the process of taking it out for drying, the water droplets on the wafer are likely to adsorb dust, and then will adhere to the wafer after drying, thus affecting the cleaning effect. Utility Model Content
[0004] In order to improve the cleaning effect on the wafer, the present application provides a wafer ultrasonic cleaning machine.
[0005] A wafer ultrasonic cleaning machine provided by the present application adopts the following technical solutions:
[0006] A wafer ultrasonic cleaning machine includes a cleaning machine main body. A drying box is provided at the discharge port of the cleaning machine main body. A lifting hole communicating with the cleaning machine main body is opened at the bottom of the drying box. A placement box for placing the wafer is slidably connected in the lifting hole. A plurality of ventilation through holes are opened on the side wall of the placement box. A drying member for drying the wafer in the placement box is provided in the drying box. A driving member for driving the placement box to move up and down is provided in the drying box.
[0007] By adopting the above technical solutions, during use, the placement box is driven by the driving member to move into the cleaning machine main body, and the ultrasonic cleaning machine main body is started for cleaning. After completion, the placement box is moved into the drying box again by the driving member, and the wafer is dried by the drying member, reducing the possibility of the water droplets on the wafer surface adsorbing dust and improving the wafer cleaning effect.
[0008] Optionally, the driving member includes a first motor, a lead screw, a guide rod and a nut block. The first motor is arranged on the drying box. The output shaft of the first motor is coaxially and fixedly connected to the lead screw. One end of the lead screw is inserted into the cleaning machine main body. One end of the guide rod is connected to the drying box, and the other end is inserted into the cleaning machine main body. The nut block is threadedly connected to the lead screw. One end of the nut block is connected to the placement box. One end of the guide rod penetrates through the nut block and is slidably matched with the nut block.
[0009] By adopting the above technical solution, during use, the rotation of the lead screw is driven by the first motor. Under the action of the guide rod, the nut block moves up and down, and drives the placement box to move up and down during the movement, thus realizing the up and down movement of the placement box.
[0010] Optionally, the inner wall of the drying box is hollowly arranged to form a hot air cavity. A drying component, i.e., a hot air blower, is provided in the drying box. The hot air blower is arranged on the side wall of the drying box, and the air outlet is communicated with the hot air cavity. A plurality of drying holes communicated with the hot air cavity are opened on the inner wall of the drying box.
[0011] By adopting the above technical solution, during use, when the hot air blower is started, the hot air generated by the hot air blower passes through the hot air cavity and then blows towards the ventilation through hole through the plurality of drying holes, drying the wafers in the placement box, which is convenient to operate.
[0012] Optionally, a second motor is provided on the drying box. The output shaft of the second motor is connected with a rotating square rod through a connecting piece. One end of the rotating square rod penetrates through the lifting hole and is inserted into the cleaning machine main body. An annular groove is opened on the side wall of the placement box, and one end of the nut block is inserted into the annular groove and is in sliding fit with the annular groove.
[0013] By adopting the above technical solution, during use, when the second motor is started, the second motor drives the rotating square rod to rotate through the connecting piece. The rotation of the rotating square rod drives the rotation of the placement box, making the nut block in sliding fit with the annular groove, so that the hot air can perform circumferential drying on the wafers in the placement box, further improving the drying effect.
[0014] Optionally, a material taking hole is provided at the top of the drying box. A plugging plate is slidably connected to the material taking hole. A material taking through groove is opened on the side wall of the placement box. A shielding door is rotatably connected to the material taking through groove. The shielding plate is connected to the placement box through a locking piece. When the nut block abuts against the inner top wall of the drying box, the shielding door is located outside the drying box.
[0015] By adopting the above technical solution, the setting of the material taking plate facilitates the taking out of the dried wafers. The setting of the plugging plate can reduce the heat loss in the drying box. When it is necessary to take out the wafers, the locking piece is opened, the placement box is taken out of the drying box, and the shielding door is opened, which is convenient to operate.
[0016] Optionally, the locking piece is a buckle.
[0017] By adopting the above technical solution, the opening and closing of the buckle are convenient and fast, and the cost is low.
[0018] Optionally, a plurality of mounting grooves are provided on the top wall of the drying box, and a tension spring is connected in each of the plurality of mounting grooves, and one end of each of the plurality of tension springs is connected to the plugging plate.
[0019] By adopting the above technical solution, by arranging the tension spring, the plugging plate can be pressed tightly against the drying box to improve the sealing performance. When it is necessary to open the plugging plate, as the placement box moves upward, the plugging plate is continuously pushed upward. At this time, the tension spring deforms, realizing the opening of the material taking hole. When it is necessary to close it, the placement box is moved downward, the tension spring resets, and the tension spring pulls the plugging plate downward, which is convenient to operate.
[0020] Optionally, the connecting member includes a first driving rod, a second driving rod, a first bevel gear and a second bevel gear. The output shaft of the second motor is coaxially connected to the first driving rod. The second driving rod penetrates through the plugging plate and is connected to the rotating square rod. The first bevel gear is sleeved on the first driving rod, the second bevel gear is sleeved on the second driving rod, and the first bevel gear meshes with the second bevel gear.
[0021] By adopting the above technical solution, in use, the output shaft of the second motor drives the first driving rod to rotate. Under the cooperation of the first bevel gear and the second bevel gear, the second driving rod rotates, and then the rotation of the rotating square rod is realized, which is convenient to operate.
[0022] In summary, the present application includes at least one of the following beneficial technical effects:
[0023] 1. In the present application, by arranging a drying box, a placement box, a drying member and a driving member, the driving member drives the placement box to move into the cleaning machine main body, starts the ultrasonic cleaning machine main body for cleaning. After completion, the placement box is moved into the drying box again through the driving member, and the wafer is dried by the drying member, reducing the possibility of water droplets on the wafer surface adsorbing dust and improving the cleaning effect of the wafer;
[0024] 2. In the present application, through the hot air blower and the drying holes, when the hot air blower is started, the hot air generated by the hot air blower passes through the hot air cavity and then blows to the ventilation through holes through the plurality of drying holes to dry the wafers in the placement box, which is convenient to operate. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 is a schematic structural diagram of the present application.
[0026] Figure 2 is a schematic diagram of the internal structure of the drying box in the embodiment of the present application.
[0027] Figure 3 is a schematic diagram of the structure of the placement box in the embodiment of the present application.
[0028] Description of the reference numerals: 1. Main body of the cleaning machine; 2. Drying box; 3. Lifting hole; 4. Placing box; 5. Ventilation through-hole; 6. First motor; 7. Lead screw; 8. Guide rod; 9. Nut block; 10. Hot air chamber; 11. Hot air blower; 12. Drying hole; 13. Second motor; 14. Rotating square rod; 15. Ring groove; 16. Material taking hole; 17. Sealing plate; 18. Material taking through groove; 19. Shading door; 20. Buckle; 21. Installation groove; 22. Tension spring; 23. Gantry; 131. First driving rod; 132. Second driving rod; 133. First bevel gear; 134. Second bevel gear. Detailed implementation mode
[0029] The following will further describe the present application in detail with reference to the attached Figures 1-3 drawings.
[0030] Embodiment 1
[0031] A wafer ultrasonic cleaning machine provided by an embodiment of the present application, referring to Figure 1 、 Figure 2 as shown, includes a main body 1 of the cleaning machine, and a drying box 2 is provided at the discharge port at the top of the main body 1 of the cleaning machine. A lifting hole 3 communicating with the main body 1 of the cleaning machine is opened at the bottom of the drying box 2, and a placing box 4 for placing wafers is slidably connected in the lifting hole 3. Inside the drying box 2, a drying member for drying the wafers in the placing box 4 is provided, and the drying member is a hot air blower 11, which is installed on the side wall of the drying box 2.
[0032] Referring to Figure 1 、 Figure 2 and Figure 3 as shown, a driving member for driving the placing box 4 to move up and down is provided on the drying box 2. A plurality of ventilation through-holes 5 are opened on the side wall of the placing box 4 to facilitate the circulation of hot air and dry the wafers. Specifically, the driving member includes a first motor 6, a lead screw 7, a guide rod 8 and a nut block 9. The first motor 6 is installed on the top of the drying box 2, and its output shaft is coaxially and fixedly connected to the lead screw 7. One end of the lead screw 7 penetrates through the drying box 2 and is inserted into the main body 1 of the cleaning machine, and one end of the guide rod 8 is connected to the drying box 2, and the other end is also inserted into the main body 1 of the cleaning machine. The nut block 9 is threadedly connected to the lead screw 7, and one end of the nut block 9 is connected to the placing box 4. The guide rod 8 penetrates through the nut block 9 and is slidably matched with the nut block 9 to ensure that the nut block 9 can move up and down stably.
[0033] Referring to Figure 1 、 Figure 2 and Figure 3, the inner wall of the drying box 2 is hollowly arranged to form a hot air cavity 10. The air outlet of the hot air blower 11 is communicated with the hot air cavity 10, and a plurality of drying holes 12 communicated with the hot air cavity 10 are formed on the inner wall of the drying box 2. When the hot air blower 11 is started, the generated hot air will pass through the hot air cavity 10 and then blow from the plurality of drying holes 12 to the ventilation through holes 5 of the placement box 4 to dry the wafers.
[0034] The implementation principle of this embodiment is as follows: during use, first, the placement box 4 is driven by the first motor 6 to move into the cleaning machine main body 1 for cleaning. After cleaning, the placement box 4 is moved into the drying box 2 by the first motor 6 again. Then, the hot air blower 11 is started to dry the wafers with hot air. This method can effectively reduce the possibility of water droplets on the wafer surface adsorbing dust, thereby improving the cleaning effect of the wafers.
[0035] Embodiment 2
[0036] Refer to Figure 1 、 Figure 2 and Figure 3 , on the basis of Embodiment 1, a gantry 23 is further installed on the drying box 2 of this embodiment. A second motor 13 is installed on the gantry 23, and the output shaft of the second motor 13 is connected with a rotating square rod 14 through a connecting piece. One end of the rotating square rod 14 penetrates through the lifting hole 3 and is inserted into the cleaning machine main body 1. A ring groove 15 is formed on the side wall of the placement box 4, and one end of the nut block 9 is inserted into the ring groove 15 and is slidably matched with the ring groove 15.
[0037] In addition, a material taking hole 16 is formed at the top of the drying box 2, and a plugging plate 17 is slidably connected to the material taking hole 16. A material taking through groove 18 is formed on the side wall of the placement box 4, and a shielding door 19 is rotatably connected to the material taking through groove 18. The shielding door 19 is connected to the placement box 4 through a locking member. In particular, when the top surface of the nut block 9 abuts against the inner top wall of the drying box 2, the shielding door 19 will be located outside the drying box 2.
[0038] The connecting piece includes a first driving rod 131, a second driving rod 132, a first bevel gear 133 and a second bevel gear 134. The output shaft of the second motor 13 is coaxially connected to the first driving rod 131. One end of the second driving rod 132 penetrates through the plugging plate 17 and is connected to the rotating square rod 14, and the other end is rotatably arranged on the gantry 23. The first bevel gear 133 is sleeved on the first driving rod 131, the second bevel gear 134 is sleeved on the second driving rod 132, and the first bevel gear 133 meshes with the second bevel gear 134.
[0039] For more convenient operation, the locking part selected is the buckle 20. In addition, a plurality of mounting grooves 21 are formed in the top wall of the drying box 2, and a tension spring 22 is connected in each mounting groove 21. One end of these tension springs 22 is connected to the blocking plate 17. When it is necessary to take out the wafer, take out the placement box 4 from the drying box 2, open the buckle 20, and then open the shielding door 19. This design not only facilitates the material taking operation, but also the setting of the blocking plate 17 can effectively reduce the heat loss in the drying box 2. At the same time, the design of the tension spring 22 enables the blocking plate 17 to closely fit on the drying box 2, improving the sealing performance.
[0040] When it is necessary to open the blocking plate 17, just gradually push open the blocking plate 17 as the placement box 4 moves upward.
[0041] When it is necessary to dry the wafer more comprehensively, first, drive the placement box 4 into the drying box 2 through the driving part, and start the second motor 13. The output shaft of the second motor 13 drives the first driving rod 131 to rotate. Under the cooperation of the first bevel gear 133 and the second bevel gear 134, the second driving rod 132 rotates, and then the rotation of the rotating square rod 14 is realized, which is convenient for operation. The second motor 13 drives the rotating square rod 14 to rotate through the connecting part, and then drives the placement box 4 to rotate in the drying box 2. In this way, the hot air can blow more evenly to the wafer to achieve circumferential drying, further improving the drying effect.
[0042] In summary, through the setting of components such as the drying box 2, the placement box 4, the drying part, and the driving part in this application, the comprehensive and efficient drying of the wafer is realized, effectively improving the cleaning effect of the wafer.
[0043] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.
Claims
1. A wafer ultrasonic cleaning machine, comprising a cleaning machine body (1), characterized in that: The discharge port of the cleaning machine body (1) is provided with a drying box (2); the bottom of the drying box (2) is provided with a lifting hole (3) connected to the cleaning machine body (1); a placement box (4) for placing wafers is slidably connected in the lifting hole (3); a side wall of the placement box (4) is provided with a plurality of ventilation holes (5); a drying part for drying the wafers in the placement box (4) is provided in the drying box (2); and a driving part for driving the placement box (4) to move up and down is provided in the drying box (2).
2. The wafer ultrasonic cleaning machine according to claim 1, characterized in that: The driving member comprises a first motor (6), a lead screw (7), a guide rod (8) and a nut block (9); the first motor (6) is arranged on the drying box (2); the output shaft of the first motor (6) is coaxially fixedly connected to the lead screw (7); one end of the lead screw (7) is inserted into the cleaning machine body (1); one end of the guide rod (8) is connected to the drying box (2), and the other end is inserted into the cleaning machine body (1); the nut block (9) is threadedly connected to the lead screw (7); one end of the nut block (9) is connected to the placement box (4); one end of the guide rod (8) passes through the nut block (9) and is slidably matched with the nut block (9).
3. The wafer ultrasonic cleaning machine according to claim 1, characterized in that The inner wall of the drying box (2) is hollow to form a hot air cavity (10), and a drying element is provided in the drying box (2), which is a hot air blower (11). The hot air blower (11) is arranged on the side wall of the drying box (2), and the air outlet is connected to the hot air cavity (10). The inner wall of the drying box (2) is provided with a plurality of drying holes (12) connected to the hot air cavity (10).
4. The wafer ultrasonic cleaning machine according to claim 2, characterized in that: The drying box (2) is provided with a second motor (13), the output shaft of the second motor (13) is connected to a rotating square rod (14) through a connecting piece, one end of the rotating square rod (14) passes through the lifting hole (3) and is inserted into the cleaning machine body (1), a ring groove (15) is provided on the side wall of the placement box (4), one end of the nut block (9) is inserted into the ring groove (15) and slidably matches with the ring groove (15).
5. The wafer ultrasonic cleaning machine according to claim 4, characterized in that: The top of the drying box (2) is provided with a material taking hole (16), and a blocking plate (17) is slidably connected to the material taking hole (16). The side wall of the placement box (4) is provided with a material taking slot (18), and a shielding door (19) is rotatably connected to the material taking slot (18). The shielding plate is connected to the placement box (4) through a locking member. When the nut block (9) contacts the inner top wall of the drying box (2), the shielding door (19) is located outside the drying box (2).
6. The wafer ultrasonic cleaning machine according to claim 5, characterized in that: The locking piece is a buckle (20).
7. The wafer ultrasonic cleaning machine according to claim 5, characterized in that: A plurality of mounting grooves (21) are provided on the top wall of the drying box (2), and tension springs (22) are connected to the plurality of mounting grooves (21), and one end of the plurality of tension springs (22) is connected to the blocking plate (17).
8. The wafer ultrasonic cleaning machine according to claim 7, characterized in that: The connecting member comprises a first driving rod (131), a second driving rod (132), a first bevel gear (133) and a second bevel gear (134); the output shaft of the second motor (13) is coaxially connected to the first driving rod (131); the second driving rod (132) passes through the blocking plate (17) and is connected to the rotating square rod (14); the first bevel gear (133) is disposed outside the first driving rod (131); the second bevel gear (134) is disposed outside the second driving rod (132); the first bevel gear (133) is meshed with the second bevel gear (134).