Vacuum film coating device for chip manufacturing

Abstract

The utility model discloses a vacuum film coating device for chip manufacturing, and relates to the technical field of chip manufacturing. The chip manufacturing vacuum film covering device comprises a bottom plate, a cutting mechanism and a turnover mechanism, two sets of vertical plates are fixedly installed at the top of the bottom plate, a containing plate is rotatably installed between the two sets of vertical plates, at least two sets of containing grooves are formed in the top of the containing plate, and a cover plate is installed on the outer surface of the front side of the containing plate in a hinged mode; the turnover mechanism is arranged on one set of vertical plates and comprises a rotating handle and an inserting rod, the rotating handle is rotationally installed on the outer surface of one side of one set of vertical plates, and a rotating shaft of the rotating handle is in transmission connection with the containing plate. According to the chip manufacturing vacuum film coating device, through cooperation of the placing plate, the turnover mechanism and the cover plate, after the chips in the placing grooves are coated with films, the placing plate can be turned over, so that the chips fall onto the cover plate and are collected into the collecting box along the cover plate, the discharging speed is high, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a vacuum coating device for chip manufacturing. Background Art

[0002] Chinese document CN212991052U discloses a vacuum coating device for chip manufacturing, comprising a workbench, a film pressing frame and an exhaust chamber, wherein an exhaust chamber is provided inside the workbench, a three-way valve is connected to the bottom of the exhaust chamber through a threaded groove, an electromagnetic valve is connected to one end of the bottom of the three-way valve through a threaded groove, an exhaust pump is installed at one end of the bottom of the workbench through a mounting frame, a reserved groove is provided on the top of the workbench, a chip groove is provided at the bottom of the reserved groove, mesh plates are installed on both sides of the chip groove through mounting grooves, the device has a simple structure, is easy to operate, can coat multiple chips at the same time, and is suitable for being widely promoted and used.

[0003] However, after laminating each chip, the above device needs to take it out from the groove one by one, which is inefficient and time-consuming and labor-intensive. Therefore, we propose a vacuum laminating device for chip manufacturing. Utility Model Content

[0004] The utility model aims to provide a vacuum coating device for chip manufacturing, which can solve the problem that some existing devices are time-consuming and labor-intensive in unloading.

[0005] To achieve the above purpose, the utility model provides the following technical solution: a vacuum coating device for chip manufacturing, comprising:

[0006] A bottom plate, on the top of which two groups of vertical plates are fixedly installed, a placement plate is rotatably installed between the two groups of vertical plates, at least two groups of placement grooves are opened on the top of the placement plate, and a cover plate is hingedly installed on the front outer surface of the placement plate;

[0007] A cutting mechanism, which is arranged between the two sets of vertical plates, and is used to cut the film;

[0008] A flipping mechanism is arranged on one of the groups of vertical plates. The flipping mechanism includes a rotating handle and an insertion rod. A rotating handle is rotatably installed on the outer surface of one side of one of the groups of vertical plates. The rotating shaft of the rotating handle is transmission-connected to the placement plate. The insertion rod is movably penetrated through the rotating handle. A plug hole is opened on one side of one of the groups of vertical plates, and one end of the plug rod is inserted into the plug hole.

[0009] Preferably, the flipping mechanism further comprises a fixed block and a spring, the other end of the insertion rod is fixedly mounted with the fixed block, the insertion rod is sleeved with a spring, one end of the spring is fixedly connected to the fixed block, and the other end of the spring is fixedly connected to the turning handle.

[0010] Preferably, the cutting mechanism includes a hanging plate, a limiting rod and a cutting knife. A hanging plate is arranged between the two groups of vertical plates. Two groups of through grooves are penetrated on the two groups of vertical plates. Two groups of limiting rods are fixedly installed on the outer surfaces of both sides of the hanging plate. The four groups of limiting rods are inserted into the corresponding through grooves. The bottom of the hanging plate is fixedly installed with cutting knives whose number and positions correspond to the placement grooves. A group of support plates are hingedly installed on the sides of the two groups of vertical plates away from each other, and the four groups of limiting rods are mounted on the corresponding support plates.

[0011] Preferably, a positioning plate is provided at the bottom of the hanging plate, and a rectangular groove corresponding to the size of the positioning plate is provided at the top of the placement plate, so that the hanging plate can be stably fitted with the placement plate when it moves downward.

[0012] Preferably, a vacuum pump is fixedly installed at the bottom of the placement plate, and an input end of the vacuum pump is communicated with the interior of each group of placement slots.

[0013] Preferably, a handle is fixedly mounted on the top of the hanging plate.

[0014] Preferably, a collection box is placed on the top of the bottom plate.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] (1) The chip manufacturing vacuum coating device, through the cooperation of the placement plate, the flipping mechanism and the cover plate, can flip the placement plate after the chips in each placement slot are coated, so that each chip falls onto the cover plate and is collected into a collection box along the cover plate. The material unloading speed is fast, which solves the problem that some existing devices need to take out each chip from the slot one by one after coating, resulting in low unloading efficiency, time and labor consumption, and improves the practicality of the device.

[0017] (2) The chip manufacturing vacuum coating device can cut the thin film on each chip to separate them individually after the thin film is coated on each chip through a cutting mechanism. At the same time, under the action of the support plate, the position of the cutting mechanism can be fixed, thereby ensuring the practicability of the device and facilitating the promotion and use of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0019] Figure 1 It is a front perspective view of the utility model;

[0020] Figure 2 for Figure 1 A magnified view of the structure at center A;

[0021] Figure 3 for Figure 1 A magnified view of the structure at B in the middle;

[0022] Figure 4 It is a bottom-up stereoscopic view of the hanging plate of the utility model and its upper part related parts;

[0023] Figure 5 It is a bottom-up stereoscopic view of the placement plate of the utility model and its upper related parts.

[0024] Figure numerals: 1. bottom plate; 2. vertical plate; 3. placement plate; 4. placement slot; 5. flip mechanism; 51. turning handle; 52. insertion rod; 53. fixing block; 54. spring; 6. cutting mechanism; 61. hanging plate; 62. limiting rod; 63. cutting knife; 7. positioning plate; 8. vacuum pump; 9. handle; 10. collection box; 11. cover plate; 12. support plate. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0026] See also Figure 1-5 The utility model provides a technical solution: a vacuum coating device for chip manufacturing, comprising a bottom plate 1, a cutting mechanism 6 and a flipping mechanism 5, two groups of vertical plates 2 are fixedly installed on the top of the bottom plate 1, a placing plate 3 is rotatably installed between the two groups of vertical plates 2, at least two groups of placing grooves 4 are opened on the top of the placing plate 3, a cover plate 11 is hingedly installed on the front outer surface of the placing plate 3, a cutting mechanism 6 is arranged between the two groups of vertical plates 2, and the cutting mechanism 6 is used to cut the film, a vacuum pump 8 is fixedly installed on the bottom of the placing plate 3, the input end of the vacuum pump 8 is communicated with the inside of each group of placing grooves 4, and a collecting box 10 is placed on the top of the bottom plate 1;

[0027] The flipping mechanism 5 is arranged on one group of vertical boards 2, and the flipping mechanism 5 includes a rotating handle 51 and an insertion rod 52. The rotating handle 51 is rotatably installed on the outer surface of one side of one group of vertical boards 2, and the rotating shaft of the rotating handle 51 is transmission-connected with the placement plate 3. The insertion rod 52 movably penetrates the rotating handle 51. A socket is opened on one side of one group of vertical boards 2, and one end of the insertion rod 52 is inserted into the socket.

[0028] The flipping mechanism 5 also includes a fixing block 53 and a spring 54. The other end of the insertion rod 52 is fixedly installed with the fixing block 53. The insertion rod 52 is sleeved with a spring 54. One end of the spring 54 is fixedly connected to the fixing block 53, and the other end of the spring 54 is fixedly connected to the turning handle 51. Through the cooperation of the placement plate 3, the flipping mechanism 5 and the cover plate 11, after the chips in each placement slot 4 are coated, the placement plate 3 can be flipped, so that each chip falls onto the cover plate 11 and is collected into the collection box 10 along the cover plate 11. The unloading speed is fast, which solves the problem that some existing devices need to take out each chip from the slot one by one after coating, which is inefficient and time-consuming, and labor-intensive. The practicability of the device is improved.

[0029] The cutting mechanism 6 includes a hanging plate 61, a limiting rod 62 and a cutting knife 63. A hanging plate 61 is arranged between the two groups of vertical plates 2. Two groups of through grooves are penetrated on the two groups of vertical plates 2. Two groups of limiting rods 62 are fixedly installed on the outer surfaces of both sides of the hanging plate 61. Four groups of limiting rods 62 are inserted in the corresponding through grooves. The bottom of the hanging plate 61 is fixedly installed with cutting knives 63 whose number and position correspond to the placement grooves 4. A group of supporting plates 12 are hingedly installed on the sides of the two groups of vertical plates 2 away from each other. Four groups of limiting rods 62 are carried on the corresponding supporting plates 12. A positioning plate 7 is opened at the bottom of the hanging plate 61, and a rectangular groove corresponding to the size of the positioning plate 7 is opened on the top of the placement plate 3. A handle 9 is fixedly installed on the top of the hanging plate 61. Through the cutting mechanism 6, the film on each chip can be cut to separate it separately after the film is covered on each chip. At the same time, under the action of the support plate 12, the position of the cutting mechanism 6 can be fixed, which ensures the practicability of the device and is conducive to the promotion and use of the device.

[0030] Working principle: Place each chip in each placement groove 4, then spread the film on the placement plate 3, then control the vacuum machine 8 to start, vacuum each placement groove 4, so that the film tightly covers each chip, then, move the two sets of support plates 12 and rotate, and after no longer jamming the limit rods 62, slide the hanging plate 61 down on the placement plate 3, and make each cutting knife 63 extend into each placement groove 4 to cut the film, so that each chip is covered with a separate piece of film, after completion, reset the cutting mechanism 6, remove the excess film, rotate the cover plate 11 and cover the placement plate 3, pull the fixing block 53 to drive the insertion rod 52 to disengage from the insertion hole, rotate the handle 51 to drive the placement plate 3 and the cover plate 11 to rotate and flip together, so that after each chip falls on the cover plate 11, slide the collection box 10 to the bottom of the cover plate 11, open the cover plate 11, and the chips on it will slide from the inclined cover plate 11 to the collection box 10 for collection, and reset it after completion.

[0031] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A vacuum coating device for chip manufacturing, characterized in that: include: A bottom plate (1) has two groups of vertical plates (2) fixedly mounted on its top, a placement plate (3) rotatably mounted between the two groups of vertical plates (2), at least two groups of placement grooves (4) are provided on the top of the placement plate (3), and a cover plate (11) is hingedly mounted on the front outer surface of the placement plate (3); A cutting mechanism (6), which is arranged between the two sets of vertical plates (2), and the cutting mechanism (6) is used to cut the film; The flip mechanism (5) is arranged on one of the groups of vertical plates (2), and comprises a rotating handle (51) and an insertion rod (52). The rotating handle (51) is rotatably mounted on the outer surface of one side of the group of vertical plates (2), and the rotating shaft of the rotating handle (51) is transmission-connected with the placement plate (3). The insertion rod (52) movably penetrates the rotating handle (51), and a plug hole is opened on one side of the group of vertical plates (2), and one end of the plug rod (52) is plugged into the plug hole.

2. A chip manufacturing vacuum coating device according to claim 1, characterized in that: The flip mechanism (5) further comprises a fixed block (53) and a spring (54); the other end of the insertion rod (52) is fixedly mounted with the fixed block (53); the insertion rod (52) is sleeved with the spring (54); one end of the spring (54) is fixedly connected to the fixed block (53); and the other end of the spring (54) is fixedly connected to the rotating handle (51).

3. A chip manufacturing vacuum coating device according to claim 2, characterized in that: The cutting mechanism (6) comprises a hanging plate (61), a limiting rod (62) and a cutting knife (63). The hanging plate (61) is arranged between the two groups of vertical plates (2). Two groups of through grooves are penetrated through the two groups of vertical plates (2). Two groups of limiting rods (62) are fixedly installed on the outer surfaces of both sides of the hanging plate (61). The four groups of limiting rods (62) are inserted into the corresponding through grooves. The bottom of the hanging plate (61) is fixedly installed with cutting knives (63) whose number and position correspond to the placement grooves (4). A group of supporting plates (12) are hingedly installed on the surfaces of the two groups of vertical plates (2) away from each other, and the four groups of limiting rods (62) are mounted on the corresponding supporting plates (12).

4. A chip manufacturing vacuum coating device according to claim 3, characterized in that: A positioning plate (7) is provided at the bottom of the hanging plate (61), and a rectangular groove corresponding to the size of the positioning plate (7) is provided at the top of the placement plate (3).

5. The vacuum coating device for chip manufacturing according to claim 4, characterized in that: A vacuum pump (8) is fixedly installed at the bottom of the placement plate (3), and an input end of the vacuum pump (8) is communicated with the interior of each group of placement slots (4).

6. The vacuum coating device for chip manufacturing according to claim 5, characterized in that: A handle (9) is fixedly mounted on the top of the hanging plate (61).

7. The vacuum coating device for chip manufacturing according to claim 6, characterized in that: A collection box (10) is placed on the top of the base plate (1).

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