Semiconductor wafer positioning jig

Abstract

The utility model discloses a semiconductor wafer positioning jig which comprises a workbench, the top of the workbench is fixedly connected with four supports, the four supports are fixedly connected with mounting plates, the four mounting plates are inserted with first electric push rods which are fixedly connected with the mounting plates, and the first electric push rods are fixedly connected with the mounting plates. One ends of the four first electric push rods are fixedly connected with positioning plates, one sides of the four positioning plates are inserted into the four mounting plates in a penetrating mode and are in sliding connection with the four mounting plates, rotating rods rotationally connected with the four mounting plates are inserted into the four mounting plates in a penetrating mode, and the four rotating rods are sleeved with gears fixedly connected with the rotating rods. Toothed plates meshed with the gears are fixedly connected to the tops of the four positioning plates. According to the utility model, before the wafer is positioned and clamped, the surface of the wafer is cleaned, so that the situation that dust and impurities are attached to the surface of the wafer is effectively avoided, the surface flatness of the wafer is improved, and the clamping stability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of positioning jigs, in particular to a semiconductor wafer positioning jig. Background Art

[0002] Semiconductor wafer positioning jigs are tools used to accurately position and fix wafers during the semiconductor manufacturing process. Their function is to ensure that the wafer can maintain an accurate position and posture in each processing step so as to perform various processing and measurement work.

[0003] When processing semiconductor wafers, a positioning jig is needed to position and clamp them. When the positioning jig is in contact with the wafer, due to environmental reasons, dust or other tiny impurities may adhere to the wafer on the surface. The dust and impurities will affect the surface flatness of the semiconductor wafer and cause a decrease in clamping stability. Therefore, a semiconductor wafer positioning jig is needed. Utility Model Content

[0004] In view of the problems existing in the prior art, the purpose of the present invention is to provide a semiconductor wafer positioning fixture that can improve the surface flatness of the wafer and enhance the stability of the clamping.

[0005] In order to solve the above problems, the utility model adopts the following technical solutions:

[0006] A semiconductor wafer positioning jig comprises a workbench, wherein four brackets are fixedly connected to the top of the workbench, and the four brackets are fixedly connected to mounting plates, and the four mounting plates are each inserted with an electric push rod fixedly connected thereto, and one end of the four electric push rods is each fixedly connected to a positioning plate, and one side of the four positioning plates is respectively inserted into the four mounting plates and slidably connected thereto, and the four mounting plates are each inserted with a rotating rod rotatably connected thereto, and the four rotating rods are each sleeved with a gear fixedly connected thereto, and the tops of the four positioning plates are each fixedly connected with a toothed plate meshing with the gear, and both ends of the four rotating rods are each fixedly connected with a rotating disk, and a clamping mechanism is provided on the eight rotating disks, and a cleaning block is fixedly connected to the opposite side of two adjacent rotating disks, and a storage plate is fixedly connected to the top of the workbench, and a wafer is positioned on the storage plate.

[0007] As a further description of the above technical solution:

[0008] The clamping mechanism comprises a support plate, one side of which is fixedly connected to the rotating disk, a second electric push rod fixedly connected to the support plate is inserted through the support plate, and one end of the second electric push rod is fixedly connected to a clamping plate.

[0009] As a further description of the above technical solution:

[0010] The clamping plate is in the shape of a semicircular ring, and the cleaning block is a cleaning sponge layer.

[0011] As a further description of the above technical solution:

[0012] A guide surface is provided on one side of the cleaning block, and the guide surface is inclined.

[0013] As a further description of the above technical solution:

[0014] A pressure sensor is fixedly connected to one side of the positioning plate, and a contact plate is fixedly connected to one side of the pressure sensor.

[0015] As a further description of the above technical solution:

[0016] A controller for controlling the opening and closing of the electric push rod 1 and the electric push rod 2 is installed on the top of the workbench.

[0017] Compared with the prior art, the advantages of the present invention are:

[0018] This solution cleans the wafer surface before positioning and clamping the wafer, thereby effectively preventing dust and impurities from adhering to the wafer surface, improving the wafer surface flatness, and improving the stability of clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is one of the three-dimensional diagrams of the utility model;

[0020] Figure 2 This is the second stereogram of the utility model;

[0021] Figure 3 It is a schematic diagram of the position of the clamping mechanism in the utility model;

[0022] Figure 4 This is a diagram showing the relationship between the tooth plate and the gear position in the utility model.

[0023] Description of the numbers in the figure:

[0024] 1. Workbench; 2. Bracket; 3. Mounting plate; 4. Electric push rod 1; 5. Positioning plate; 6. Rotating rod; 7. Gear; 8. Tooth plate; 9. Rotating disk; 10. Clamping mechanism; 101. Support plate; 102. Electric push rod 2; 103. Clamping plate; 11. Cleaning block; 12. Storage plate; 13. Wafer; 14. Guide surface; 15. Pressure sensor; 16. Contact plate; 17. Controller. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0026] See also Figures 1 to 4 In the utility model: a semiconductor wafer positioning fixture comprises a workbench 1, the top of the workbench 1 is fixedly connected with four brackets 2, the four brackets 2 are fixedly connected with mounting plates 3, the four mounting plates 3 are interspersed with electric push rods 4 fixedly connected thereto, one end of the four electric push rods 4 are fixedly connected with positioning plates 5, one side of the four positioning plates 5 is respectively interspersed with the four mounting plates 3 and slidably connected thereto, the four mounting plates 3 are interspersed with rotating rods 6 rotatably connected thereto, the four rotating rods 6 are sleeved with gears 7 fixedly connected thereto, the tops of the four positioning plates 5 are fixed A toothed plate 8 meshing with the gear 7 is fixedly connected, rotating disks 9 are fixedly connected to both ends of the four rotating rods 6, clamping mechanisms 10 are arranged on the eight rotating disks 9, cleaning blocks 11 are fixedly connected to the opposite sides of two adjacent rotating disks 9, a placement plate 12 is fixedly connected to the top of the workbench 1, and a wafer 13 is positioned on the placement plate 12; the clamping mechanism 10 includes a supporting plate 101, one side of the supporting plate 101 is fixedly connected to the rotating disk 9, an electric push rod 102 fixedly connected thereto is inserted on the supporting plate 101, and a clamping plate 103 is fixedly connected to one end of the electric push rod 102.

[0027] In the present invention, when in use, the wafer 13 is first placed in the center on the top of the storage plate 12, and then the user turns on the four electric push rods 4 at the same time. The electric push rods 4 will drive the four positioning plates 5 to approach the wafer 13 along the mounting plate 3 until the four positioning plates 5 are in contact with the edge of the wafer 13, thereby achieving the positioning of the wafer 13. In this process, the movement of the positioning plate 5 will drive the toothed plate 8 to move. Since the toothed plate 8 is meshed with the gear 7, the gear 7 will rotate and drive the rotating rod 6 to rotate. During the rotation of the rotating rod 6, the rotating disk 9 will be driven to rotate, and the rotating disk 9 will rotate. After that, it will drive the cleaning block 11 to slide over the top and bottom of the wafer 13. The cleaning block 11 will remove the dust and impurities attached to the top and bottom of the wafer 13, thereby achieving the effect of cleaning the wafer 13, until the positioning plate 5 contacts with the wafer 13, at which time the clamping plate 103 will be located on the outside of the wafer 13, and the user turns on all the electric push rods 102, and the electric push rods 102 will drive the clamping plate 103 to approach the wafer 13. After the clamping plate 103 contacts with the wafer 13, the wafer 13 will be clamped and fixed, and then the wafer 13 can be processed.

[0028] See also Figures 1 to 4 , wherein: the clamping plate 103 is in the shape of a semicircular ring, and the cleaning block 11 is a cleaning sponge layer.

[0029] In the utility model, the clamping plate 103 is arranged in a semicircular shape so that it can be used for wafers 13 of different sizes. No matter how far the positioning plate 5 moves, a part of the clamping plate 103 will be located on the outside of the wafer 13 after rotation, thereby maintaining the wafer 13.

[0030] See also Figure 4 , wherein: a guide surface 14 is provided on one side of the cleaning block 11, and the guide surface 14 is inclined.

[0031] In the present invention, the guide surface 14 provided on one side of the cleaning block 11 can facilitate the cleaning block 11 to slide over the wafer 13, thereby improving the smoothness of the device.

[0032] See also Figure 4 , wherein: a pressure sensor 15 is fixedly connected to one side of the positioning plate 5 , and a contact plate 16 is fixedly connected to one side of the pressure sensor 15 .

[0033] In the utility model, the contact plate 16 replaces the positioning plate 5 to contact the wafer 13, and the setting of the pressure sensor 15 can monitor the pressure between the wafer 13 and the wafer 13. When the values ​​of the four pressure sensors 15 are close, it can be determined that the wafer 13 is centered, and the positioning of the wafer 13 is completed, thereby improving the practicality of the device.

[0034] See also Figure 1 and 2 , wherein: a controller 17 for controlling the opening and closing of the electric push rod 1 4 and the electric push rod 2 102 is installed on the top of the workbench 1.

[0035] In the present invention, the controller 17 can be arranged to facilitate the user to control the opening and closing of the electric push rod 1 4 and the electric push rod 2 102, thereby improving the practicality of the device.

[0036] The above are only preferred specific implementations of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A semiconductor wafer positioning fixture, comprising a workbench (1), characterized in that: The top of the workbench (1) is fixedly connected with four brackets (2), and the four brackets (2) are fixedly connected with mounting plates (3), and the four mounting plates (3) are inserted with electric push rods (4) fixedly connected thereto, and one end of the four electric push rods (4) is fixedly connected with positioning plates (5), and one side of the four positioning plates (5) is respectively inserted with the four mounting plates (3) and slidably connected thereto, and the four mounting plates (3) are inserted with rotating rods (6) rotatably connected thereto, and the four rotating rods (6) are sleeved with gears (7) fixedly connected thereto; The tops of the four positioning plates (5) are fixedly connected to a toothed plate (8) meshing with the gear (7), the two ends of the four rotating rods (6) are fixedly connected to a rotating disk (9), a clamping mechanism (10) is provided on the eight rotating disks (9), the opposite sides of two adjacent rotating disks (9) are fixedly connected to a cleaning block (11), the top of the workbench (1) is fixedly connected to a placement plate (12), and a wafer (13) is provided for positioning the placement plate (12).

2. A semiconductor wafer positioning fixture according to claim 1, characterized in that: The clamping mechanism (10) comprises a support plate (101), one side of which is fixedly connected to the rotating disk (9), a second electric push rod (102) fixedly connected to the support plate (101) is inserted through the support plate (101), and one end of the second electric push rod (102) is fixedly connected to a clamping plate (103).

3. A semiconductor wafer positioning fixture according to claim 2, characterized in that: The clamping plate (103) is in the shape of a semicircular ring, and the cleaning block (11) is a cleaning sponge layer.

4. The semiconductor wafer positioning fixture according to claim 2, characterized in that: A guide surface (14) is provided on one side of the cleaning block (11), and the guide surface (14) is inclined.

5. The semiconductor wafer positioning fixture according to claim 1, characterized in that: A pressure sensor (15) is fixedly connected to one side of the positioning plate (5), and a contact plate (16) is fixedly connected to one side of the pressure sensor (15).

6. The semiconductor wafer positioning fixture according to claim 2, characterized in that: A controller (17) for controlling the opening and closing of the first electric push rod (4) and the second electric push rod (102) is installed on the top of the workbench (1).

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