Semiconductor packaging structure

Abstract

The utility model provides a semiconductor packaging structure, comprising a flexible substrate which comprises a signal receiving area and an element setting area; the first primer layer is arranged on the signal receiving area of the flexible substrate; the second primer layer is arranged on the first primer layer; and the silica gel layer covers the flexible substrate and the second primer layer. The utility model aims to provide a semiconductor packaging structure so as to at least enhance the reliability of the semiconductor packaging structure.

Description

Technical Field

[0001] The utility model relates to a semiconductor packaging structure. Background Art

[0002] In recent years, with the rapid development of the Internet of Things, mobile communication devices and micro sensors, it can be found that wearable devices have gradually moved from single-function applications to combined multi-function application devices, and these devices mostly have intelligent communication connection capabilities (such as Bluetooth, Wi-Fi, etc.) for real-time data transmission. As people's functional requirements for wearable devices are getting higher and higher, the manufacturing process of products becomes more difficult. Therefore, at the product design stage, it is necessary to consider various requirements in combination with the existing manufacturing level. Among them, in addition to the increasing requirements for various biological detection and sensing devices, the size also needs to be thin, light, short and small to meet market expectations. At the same time, the comfort of users also needs to be considered. In order to meet ergonomics, a flexible printed circuit (FPC) is used as the bottom plate, and a soft material such as conductive silicone is combined as the encapsulation material to contact the human body. The conductive silicone has a contact surface that contacts the human body and transmits physiological signals back to the detection element on one side of the FPC. However, as Figure 1 shown, in actual production, it is found that the bonding force between the FPC 1 and the silicone 2 is very weak due to different material properties, and the FPC 1 is easily delaminated from the silicone 2, resulting in poor reliability of the product.

[0003] In the prior art, various types of silicone 2 are directly attached to the surface of the FPC 1 by dispensing or injection molding, but the bonding force between the FPC 1 and the silicone 2 is very weak due to different material properties, and the silicone 2 can be easily peeled off by hand. Summary of the Utility Model

[0004] Aiming at the problems existing in the related art, the purpose of the utility model is to provide a semiconductor packaging structure to at least enhance the reliability of the semiconductor packaging structure.

[0005] To achieve the above purpose, the utility model provides a semiconductor packaging structure, including: a flexible substrate, including a signal receiving area and a component setting area; a first primer layer, disposed on the signal receiving area of the flexible substrate; a second primer layer, disposed on the first primer layer; and a silicone layer, covering the flexible substrate and the second primer layer.

[0006] In some embodiments, the flexible substrate includes terminals, and the projections of the terminals on the first primer layer and the second primer layer in the vertical direction do not overlap.

[0007] In some embodiments, the semiconductor packaging structure further includes: an electronic component, disposed on the flexible substrate and electrically connected to the terminals.

[0008] In some embodiments, the silicone layer encapsulates the electronic component.

[0009] In some embodiments, the semiconductor package structure further includes: leads, and the electronic component is electrically connected to the terminals through the leads.

[0010] In some embodiments, the silicone layer encapsulates the leads.

[0011] In some embodiments, the electronic component is disposed in the component setting area.

[0012] In some embodiments, the electronic component is disposed on the terminal and is directly electrically connected to the terminal.

[0013] In some embodiments, the semiconductor package includes a plurality of electronic components, and a part of the silicone layer is filled between the electronic components.

[0014] In some embodiments, the projections of the first primer layer and the second primer layer overlap in the vertical direction.

[0015] In some embodiments, the sides of the first primer layer and the second primer layer are flush.

[0016] In some embodiments, the outermost side of the silicone layer is flush with the sides of the flexible substrate, the first primer layer, and the second primer layer.

[0017] In some embodiments, the first primer layer and the second primer layer are made of conductive materials.

[0018] In some embodiments, the silicone layer is made of a conductive material.

[0019] In some embodiments, the materials of the first primer layer and the second primer layer are different.

[0020] In some embodiments, the flexible substrate is a flexible circuit board.

[0021] Embodiments of the present application further provide a semiconductor package structure, including: a flexible substrate; an electronic component disposed on the flexible substrate and electrically connected to the flexible substrate; a first primer layer disposed on the flexible substrate, the first primer layer being disposed around the electronic component and spaced apart from the electronic component; a second primer layer disposed on the first primer layer; and a silicone layer encapsulating the flexible substrate, the electronic component, and the second primer layer above.

[0022] In some embodiments, the flexible substrate includes terminals, and the electronic component is disposed on the terminals.

[0023] In some embodiments, the electronic component is directly electrically connected to the terminal or electrically connected to the terminal through a lead.

[0024] In some embodiments, partial sides of the first primer layer and the second primer layer are in contact with the silicone layer.

[0025] The beneficial technical effects of the present utility model are as follows:

[0026] By providing the first primer layer and the second primer layer between the flexible substrate and the silicone layer in the embodiments of the present application, the bonding force between the flexible substrate and the silicone layer is enhanced, and the stability of the semiconductor packaging structure is improved. Description of the Drawings

[0027] Figure 1 Shows the FPC and silicone of the prior art.

[0028] Figure 2 Shows the semiconductor packaging structure of the embodiments of the present application.

[0029] Figure 3 Shows Figure 2 the A area in

[0030] Figure 4 Shows a more detailed schematic diagram of the A area.

[0031] Figure 5 Shows a top view of the tensile test on the structure of the present application using the first primer layer and the second primer layer.

[0032] Figure 6 Shows Figure 2 the semiconductor packaging structure of an embodiment different from Detailed Description of the Embodiments

[0033] To better understand the spirit of the embodiments of the present application, the following further describes some preferred embodiments of the present application.

[0034] The embodiments of the present application will be described in detail below. Throughout the specification of the present application, components that are the same or similar and components having the same or similar functions are denoted by similar reference numerals. The embodiments of the drawings described herein are illustrative, diagrammatic, and are used to provide a basic understanding of the present application. The embodiments of the present application should not be construed as a limitation of the present application.

[0035] As used herein, the terms "substantially", "essentially", "substantially", and "about" are used to describe and account for small variations. When used in conjunction with an event or situation, such terms can refer to instances where the event or situation occurs exactly and instances where the event or situation occurs very nearly.

[0036] In this specification, unless specifically specified or limited otherwise, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "upper", "lower", "top", "bottom" and their derivatives (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or shown in the drawings. These relative terms are only for convenience in description and do not require the present application to be constructed or operated in a specific direction.

[0037] For convenience of description, "first", "second", "third", etc. may be used herein to distinguish different components of a figure or a series of figures. "First", "second", "third", etc. are not intended to describe corresponding components.

[0038] Figure 2 A semiconductor package structure 100 according to an embodiment of the present application is shown. Figure 3 is shown Figure 2 (and Figure 6 ) the A region in Figure 4 A more detailed schematic diagram of the A region is shown. The semiconductor package structure 100 includes: a flexible substrate 10, including a signal receiving region 12 and a component setting region 14; a first primer layer 21, disposed on the signal receiving region 12 of the flexible substrate 10; a second primer layer 22, disposed on the first primer layer 21; and a silicone layer 30, covering the flexible substrate 10 and the second primer layer 22. By providing the first primer layer 21 and the second primer layer 22 between the flexible substrate 10 and the silicone layer 30, the bonding force between the flexible substrate 10 and the silicone layer 30 is enhanced, and the stability of the semiconductor package structure 100 is improved.

[0039] Before forming the silicone layer 30 on the flexible substrate 10 in the embodiment of the present application, the first primer layer 21 and the second primer layer 22 are first formed on the surface of the flexible substrate 10 as adhesive layers. The first primer layer 21 and the second primer layer 22 have good bonding forces for both the flexible substrate 10 and the silicone layer 30, thereby tightly bonding the silicone layer 30 to the flexible substrate 10. Figure 5 A top view of a tensile test on the structure of the present application using the first primer layer 21 and the second primer layer 22 is shown. When performing the tensile test, even if the silicone layer 30 has been broken from the neck 302 with lower tolerance, the silicone layer 30 adhered to the first primer layer 21 and the second primer layer 22 still remains tightly bonded to the flexible substrate 10.

[0040] Continue to refer to Figure 2, in some embodiments, the flexible substrate 10 includes terminals 16, and the projections of the terminals 16 in the vertical direction do not overlap with those of the first primer layer 21 and the second primer layer 22. In some embodiments, the semiconductor packaging structure 100 further includes: an electronic component 40 disposed on the flexible substrate 10 and electrically connected to the terminals 16. In some embodiments, the electronic component 40 is a processing element or a passive device for processing the received physiological signals or supporting the operation of the processing element. In some embodiments, the silicone layer 30 covers the electronic component 40. In some embodiments, the semiconductor packaging structure 100 further includes: leads 50, and the electronic component 40 is electrically connected to the terminals 16 through the leads 50. In some embodiments, the silicone layer 30 covers the leads 50. In some embodiments, the electronic component 40 is disposed in the component placement area 14.

[0041] Figure 6 illustrates an embodiment different from Figure 2 , in some embodiments, the electronic component 40 is disposed on the terminals 16 and is directly electrically connected to the terminals 16. Figure 6 The A region of the illustrated embodiment is the same as that of Figure 2 the illustrated embodiment.

[0042] In some embodiments, the semiconductor package includes a plurality of electronic components 40, and a part of the silicone layer 30 is filled between the electronic components 40.

[0043] See Figure 4 , in some embodiments, the projections of the first primer layer 21 and the second primer layer 22 in the vertical direction overlap.

[0044] In some embodiments, the sides of the first primer layer 21 and the second primer layer 22 are flush.

[0045] In some embodiments, the outermost side of the silicone layer 30 is flush with the sides of the flexible substrate 10, the first primer layer 21, and the second primer layer 22.

[0046] In some embodiments, the first primer layer 21 and the second primer layer 22 are conductive materials.

[0047] In some embodiments, the silicone layer 30 is a conductive material, such as conductive silicone, liquid silicone rubber (LSR). In some embodiments, the silicone layer 30 is light-transmitting silicone.

[0048] In some embodiments, metal particles are dispersed in the first primer layer 21, the second primer layer 22, and the silicone layer 30 for transmitting physiological signals. In some embodiments, the first primer layer 21 and the second primer layer 22 are silver pastes.

[0049] In some embodiments, the materials of the first primer layer 21 and the second primer layer 22 are different.

[0050] In some embodiments, the contents of the first primer layer 21 and the second primer layer 22 are the same but the contents are different. For example, the substrates of the first primer layer 21 and the second primer layer 22 are silica gel and the type is a two-component resin. The solid content in the first primer layer 21 is 8.5% and the viscosity is 50 CPS to 100 CPS, and the solid content in the second primer layer 22 is 20% and the viscosity is 100 CPS to 250 CPS.

[0051] In some embodiments, the flexible substrate 10 is a flexible printed circuit board (FPC).

[0052] Embodiments of the present application further provide a semiconductor package structure 100, including: a flexible substrate 10; an electronic component 40 disposed on the flexible substrate 10 and electrically connected to the flexible substrate 10; a first primer layer 21 disposed on the flexible substrate 10, the first primer layer 21 being disposed around the electronic component 40 and spaced apart from the electronic component 40; a second primer layer 22 disposed on the first primer layer 21; and a silica gel layer 30 covering the flexible substrate 10, the electronic component 40, and the second primer layer 22. In some embodiments, the flexible substrate 10 includes terminals 16, and the electronic component 40 is disposed on the terminals 16. In some embodiments, the electronic component 40 is directly electrically connected to the terminals 16 or electrically connected to the terminals 16 through leads 50. In some embodiments, partial sides of the first primer layer 21 and the second primer layer 22 are in contact with the silica gel layer 30.

[0053] Embodiments of the present application use the first primer layer 21 and the second primer layer 22 as adhesion layers to enhance the bonding force between the flexible substrate 10 and the silica gel layer 30. Embodiments of the present application can be used in wearable devices and involve technologies such as system in a package (SIP), integrated processes, spraying, and flexible packages.

[0054] The present application selects a two-component primer layer. First, the first primer layer 21 is coated on the surface of the flexible substrate 10. The function of the first primer layer 21 is to bond the flexible substrate 10 and the second primer layer 22. After baking and curing, the second primer layer 22 is coated. The second primer layer 22 is used to bond various silica gel layers 30 used in the product. By means of such a two-component primer layer, it has good bonding force with both the flexible substrate 10 and the silica gel layer 30, and firmly adheres the flexible substrate 10 and the silica gel layer 30 together.

[0055] The formation process of the semiconductor package 100 according to the embodiment of the present application includes: coating a first primer layer 21 on the surface of the flexible substrate 10 by means of spraying, dispensing or printing; baking (Curing) the first primer layer 21 for curing; coating a second primer layer 22 on the surface of the first primer layer 21 by means of spraying, dispensing or printing; baking (Curing) the second primer layer 22 for curing, wherein the first primer layer 21 and the second primer layer 22 avoid the terminals 16 on the flexible substrate 10; bonding an electronic component 40 (such as a semiconductor chip or die) to the flexible substrate 10, and the electronic component 40 is directly electrically connected to the flexible substrate 10 or electrically connected to the flexible substrate 10 through a lead 50; coating a silicone layer 30 on the second primer layer 22 and covering the electronic component 40 by means of dispensing or injection molding, etc.

[0056] The formation process of the semiconductor package 100 according to the embodiment of the present application may also be: bonding an electronic component 40 (such as a semiconductor chip or die) to the flexible substrate 10, and the electronic component 40 is directly electrically connected to the flexible substrate 10 or electrically connected to the flexible substrate 10 through a lead 50; coating a first primer layer 21 on the surface of the flexible substrate 10 by means of spraying, dispensing or printing; baking (Curing) the first primer layer 21 for curing; coating a second primer layer 22 on the surface of the first primer layer 21 by means of spraying, dispensing or printing; baking (Curing) the second primer layer 22 for curing, wherein the first primer layer 21 and the second primer layer 22 are separated from the terminals 16 and the electronic component 40; coating a silicone layer 30 on the second primer layer 22 and covering the electronic component 40 by means of dispensing or injection molding, etc.

[0057] In the embodiment of the present application, the physiological signal enters the second primer layer 22, the first primer layer 21 and the flexible substrate 10 from the silicone layer 30, and then reaches the terminal 16 through the circuit in the flexible substrate 10 and is connected to the electronic component 40. Through the configuration of each component in the embodiment of the present application, the physiological signal in the signal receiving area 12 is transmitted to the electronic component 40 for processing through the silicone layer 30, the second primer layer 22, the first primer layer 21 and the flexible substrate 10.

[0058] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A semiconductor packaging structure, characterized in that: include: A flexible substrate, including a signal receiving area and a component placement area; A first primer layer is disposed on the signal receiving area of ​​the flexible substrate; a second primer layer, disposed on the first primer layer; The silicone layer is coated on the flexible substrate and the second primer layer.

2. The semiconductor package structure according to claim 1, wherein: The flexible substrate includes a terminal, and projections of the terminal, the first primer layer, and the second primer layer in a vertical direction do not overlap.

3. The semiconductor package structure according to claim 2, characterized in that: Also includes: The electronic component is disposed on the flexible substrate and is electrically connected to the terminal.

4. The semiconductor package structure according to claim 3, characterized in that: The silica gel layer covers the electronic component.

5. The semiconductor package structure according to claim 3, characterized in that: Also includes: A lead wire is used to electrically connect the electronic component to the terminal.

6. The semiconductor package structure according to claim 3, characterized in that: The electronic component is disposed on the terminal and is directly electrically connected to the terminal.

7. The semiconductor package structure according to claim 1, wherein: The projections of the first primer layer and the second primer layer in a vertical direction overlap.

8. The semiconductor package structure according to claim 7, characterized in that: The sides of the first primer layer and the second primer layer are flush.

9. The semiconductor package structure according to claim 1, wherein: The first primer layer and the second primer layer are conductive materials.

10. The semiconductor package structure according to claim 1, wherein: The silica gel layer is a conductive material.

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