Energy storage device and radiator

Abstract

The utility model relates to an energy storage device and a radiator. The energy storage device comprises a radiator and a power module. The radiator comprises a heat conduction substrate, radiating fins and a heat exchange tube. The heat dissipation fins are connected to the heat conduction substrate. The heat exchange tube is connected to the heat conduction substrate. The heat conduction substrate separates the heat dissipation fins from the heat exchange tubes. The heat exchange tube comprises an evaporation section and a condensation end. The power module is connected to the heat conduction substrate. The heat exchange tube is arranged corresponding to the power module. The power module covers the evaporation section. The condensation end is located outside the power module. The orthographic projection of the evaporation section is located in the orthographic projection of the power module in the thickness direction of the heat conduction substrate. The orthographic projection of the condensation end is located outside the orthographic projection of the power module. The evaporation section is used for absorbing heat from the power module. The condensation end is used for releasing heat to the heat conduction substrate. According to the energy storage device provided by the embodiment of the invention, the working environment temperature of the power module is reduced, and the working reliability of the power module is improved.

Description

Technical Field

[0001] This application relates to the technical field of energy storage, and particularly to an energy storage device and a radiator. Background Art

[0002] A new power system with new energy as the main body is becoming an important choice for sustainable energy development. With the rapid development of new energy technologies, energy storage devices are being applied more and more widely. An energy storage device generally includes a power module and an electrical cabinet. Power conduction between the power module and the electrical cabinet is usually carried out through a power conduction component. The working reliability of the power module affects the working stability of the energy storage device. Therefore, how to improve the working reliability of the power module is one of the technical problems that those skilled in the art need to solve. Summary of the Utility Model

[0003] The embodiments of this application provide an energy storage device and a radiator, which are beneficial to reducing the working environmental temperature of the power module and improving the working reliability of the power module.

[0004] On the one hand, according to the embodiments of this application, an energy storage device is proposed, which includes a radiator and a power module.

[0005] The radiator includes a heat-conducting substrate, heat-dissipating fins, and a heat exchange tube. The heat-dissipating fins are connected to the heat-conducting substrate. The heat exchange tube is connected to the heat-conducting substrate. The heat-conducting substrate separates the heat-dissipating fins and the heat exchange tube. The heat exchange tube includes an evaporation section and a condensation end.

[0006] The power module is connected to the heat-conducting substrate. The heat exchange tube is arranged corresponding to the power module. The evaporation section is covered by the power module. The condensation end is located outside the power module. Along the thickness direction of the heat-conducting substrate, the orthographic projection of the evaporation section is located inside the orthographic projection of the power module. The orthographic projection of the condensation end is located outside the orthographic projection of the power module. The evaporation section is used to absorb heat from the power module. The condensation end is used to release heat to the heat-conducting substrate.

[0007] The energy storage device according to an embodiment of the present application includes a power module and a radiator. The radiator is connected to the power module. The heat generated when the power module operates can be diffused through the radiator, reducing the temperature of the working environment of the power module itself. The radiator includes a heat-conducting substrate, heat-dissipating fins, and a heat-exchanging tube. Both the heat-dissipating fins and the heat-exchanging tube are connected to the heat-conducting substrate. The evaporation section of the heat-exchanging tube can absorb heat from the power module, and the heat absorbed by the evaporation section of the heat-exchanging tube can be conducted to the condensation end, effectively reducing the possibility of heat accumulation at the power module. The condensation end of the heat-exchanging tube can release heat to conduct the heat to the heat-conducting substrate. The heat-conducting substrate then conducts the heat to the heat-dissipating fins. The radiator dissipates the heat to the external environment of the radiator through the heat-dissipating fins. The heat-exchanging tube in the radiator according to the embodiment of the present application has a relatively high heat-exchanging efficiency itself, and can dissipate heat in a region far from the power module through the condensation end. Therefore, it is beneficial to improve the heat-exchanging efficiency of the radiator, which is beneficial to reducing the working environment temperature of the power module and improving the working reliability of the power module.

[0008] In some realizable ways, the heat-conducting substrate is provided with a receiving groove. At least part of the heat-exchanging tube is located in the receiving groove.

[0009] During the assembly process of the heat-conducting substrate and the heat-exchanging tube, the receiving groove on the heat-conducting substrate can provide positioning for the heat-exchanging tube, so as to quickly and accurately place the heat-exchanging tube at a predetermined position, improving the assembly efficiency. After the heat-conducting substrate and the heat-exchanging tube are assembled, the receiving groove on the heat-conducting substrate can form a limiting constraint on the heat-exchanging tube, reducing the possibility of the heat-exchanging tube shifting in position due to external forces.

[0010] The arrangement that at least part of the heat-exchanging tube is located in the receiving groove is beneficial to increasing the contact area between the heat-exchanging tube and the heat-conducting substrate, thereby being beneficial to improving the heat-exchanging efficiency between the heat-exchanging tube and the heat-conducting substrate and enhancing the heat conduction performance between the heat-exchanging tube and the heat-conducting substrate.

[0011] In some realizable ways, the heat-exchanging tube is located in the receiving groove. The outer surface of the heat-exchanging tube facing the power module is a plane. The outer surface of the heat-exchanging tube is flush with the surface of the heat-conducting substrate.

[0012] Since the outer surface of the heat-exchanging tube faces the power module, the arrangement that the outer surface of the heat-exchanging tube facing the power module is a plane, on the one hand, is beneficial to increasing the heat-exchanging area between the heat-exchanging tube and the power module, thereby being beneficial to enhancing the heat-exchanging effect between the heat-exchanging tube and the power module; on the other hand, it is not easy to form an air gap that affects the heat-exchanging efficiency between the heat-exchanging tube and the power module, being beneficial to enhancing the heat-exchanging effect between the heat-exchanging tube and the power module; on the other hand, the heat-exchanging tube will not apply local concentrated stress to the power module, effectively reducing the possibility of structural deformation of the power module or the heat-exchanging tube due to the heat-exchanging tube applying local concentrated stress to the power module.

[0013] In some feasible ways, a thermally conductive adhesive layer is provided between the heat exchange tube and the wall surface of the receiving groove.

[0014] The thermally conductive adhesive layer connects the heat exchange tube and the thermally conductive substrate to effectively fix the heat exchange tube, which is beneficial to reducing the possibility of separation between the heat exchange tube and the thermally conductive substrate. The thermally conductive adhesive layer itself has good thermal conductivity. The thermally conductive adhesive layer can also effectively fill the gap between the heat exchange tube and the wall surface of the receiving groove, making it difficult to form an air gap that affects the heat exchange efficiency between the heat exchange tube and the wall surface of the receiving groove, which is beneficial to improving the heat exchange effect between the heat exchange tube and the thermally conductive substrate.

[0015] In some feasible ways, the heat exchange tube is welded to the thermally conductive substrate.

[0016] The heat exchange tube is welded to the thermally conductive substrate to effectively fix the heat exchange tube, which is beneficial to reducing the possibility of separation between the heat exchange tube and the thermally conductive substrate. The welding method of the heat exchange tube and the thermally conductive substrate makes it difficult to form an air gap that affects the heat exchange efficiency between the heat exchange tube and the thermally conductive substrate, which is beneficial to improving the heat exchange effect between the heat exchange tube and the thermally conductive substrate. Exemplarily, the brazing method is used to realize the welding of the heat exchange tube and the thermally conductive substrate. The welding temperature of the brazing method is relatively low, which has little influence on the structures of the heat exchange tube and the thermally conductive substrate, and is also beneficial to reducing the possibility of structural deformation of the heat exchange tube and the thermally conductive substrate.

[0017] In some feasible ways, an elastic thermally conductive layer is provided between the power module and at least part of the evaporation section.

[0018] After the power module is connected to the thermally conductive substrate, the power module and the evaporation section of the heat exchange tube can jointly squeeze the elastic thermally conductive layer to compress the elastic thermally conductive layer, so that the power module and the heat exchange tube can respectively closely adhere to the elastic thermally conductive layer. The elastic thermally conductive layer can effectively fill the gap between the heat exchange tube and the power module, making it difficult to form an air gap that affects the heat exchange efficiency between the heat exchange tube and the power module, which is beneficial to improving the heat exchange effect between the heat exchange tube and the power module.

[0019] In some feasible ways, the elastic thermally conductive layer is an adhesive layer.

[0020] The elastic thermally conductive layer connects the heat exchange tube and the power module to effectively fix the heat exchange tube and the power module, which is beneficial to reducing the possibility of separation between the heat exchange tube and the power module. In addition, before the power module is connected to the thermally conductive substrate, the elastic thermally conductive layer adheres to the power module to position the power module, reducing the operation difficulty of connecting the power module to the thermally conductive substrate subsequently.

[0021] In some feasible embodiments, the heat exchange tubes are strip-shaped structures. The number of power modules is more than two. The heat exchange tubes corresponding to a partial number of power modules extend along a first direction. The heat exchange tubes corresponding to the remaining number of power modules extend along a second direction. The first direction is perpendicular or intersects with the second direction. Or,

[0022] The heat exchange tubes are strip-shaped structures. The number of power modules is more than two. Heat exchange tubes are correspondingly provided for all the power modules. The extending directions of all the heat exchange tubes are the same.

[0023] When the overall board surface area of the heat conducting substrate is limited, by adjusting the extending directions of the respective heat exchange tubes, the board surface of the heat conducting substrate can be fully utilized, so that more heat exchange tubes can be arranged on the board surface of the heat conducting substrate and a relatively large distance can be maintained between the condensation end and the power module. Furthermore, when the board surface area of the heat conducting substrate is limited, the heat exchange efficiency between the heat exchange tubes and the power module can be effectively improved, and a relatively large distance is maintained between the condensation end and the power module, reducing the influence of the heat released by the condensation end on the power module.

[0024] In some feasible embodiments, the heat exchange tube includes a first tube section and a second tube section. At least one end of the opposite ends of the first tube section is connected to the second tube section. The first tube section and the second tube section intersect. The first tube section has an evaporation section. The second tube section has a condensation end.

[0025] When the overall board surface area of the heat conducting substrate is limited, by setting the extending directions of the first tube section and the second tube section to be different, the board surface of the heat conducting substrate can be fully utilized, so that a relatively large distance can be maintained between the condensation end and the power module when the board surface area of the heat conducting substrate is limited, reducing the influence of the heat released by the condensation end on the power module.

[0026] In some feasible embodiments, the power module includes a chip. The position of the chip corresponds to the position of the evaporation section.

[0027] In the power module, the heat generated by the chip is relatively large, so the chip is the main heat source in the power module. The arrangement mode that the evaporation section of the heat exchange tube faces the chip is conducive to the heat generated by the chip being conducted to the heat exchange tube in a timely and rapid manner, improving the heat exchange efficiency between the heat exchange tube and the power module.

[0028] On the other hand, according to an embodiment of the present application, a radiator is provided, which includes a heat conducting substrate, heat dissipation fins and heat exchange tubes.

[0029] The heat dissipation fins are connected to the heat conducting substrate. The heat exchange tubes are connected to the heat conducting substrate. The heat conducting substrate separates the heat dissipation fins and the heat exchange tubes. The heat exchange tube includes an evaporation section and a condensation end. The evaporation section is used for absorbing heat. The condensation end is used for releasing heat to the heat conducting substrate. Description of the Drawings

[0030] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0031] Figure 1 is a schematic partial structure diagram of an energy storage device according to an embodiment of the present application;

[0032] Figure 2 is a schematic exploded partial structure diagram of an energy storage device according to an embodiment of the present application;

[0033] Figure 3 is a schematic exploded partial structure diagram of an energy storage device according to an embodiment of the present application;

[0034] Figure 4 is a schematic sectional partial structure diagram of an energy storage device according to an embodiment of the present application;

[0035] Figure 5 is Figure 4 an enlarged schematic diagram at M in ;

[0036] Figure 6 is a schematic partial structure diagram of an energy storage device according to an embodiment of the present application;

[0037] Figure 7 is a schematic partial structure diagram of a housing according to an embodiment of the present application;

[0038] Figure 8 is a schematic partial structure diagram of an energy storage device according to an embodiment of the present application.

[0039] In the accompanying drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale.

[0040] Description of reference numerals:

[0041] 10. Radiator;

[0042] 11. Heat-conducting substrate; 11a. First surface; 11b. Second surface;

[0043] 111. Accommodating groove;

[0044] 12. Heat-dissipating fin;

[0045] 13. Heat-exchanging tube; 13a. Evaporation section; 13b. Condensing end; 13c. Outer surface;

[0046] 131. First pipe section; 132. Second pipe section;

[0047] 20. Power module;

[0048] 21. Chip;

[0049] 30. Heat-conducting adhesive layer;

[0050] 40. Elastic heat-conducting layer;

[0051] 50. Outer shell; 51. Accommodating space; 52. Air inlet; 53. Air outlet;

[0052] X. First direction;

[0053] Y. Second direction;

[0054] Z. Thickness direction; Detailed implementation manners

[0055] The following further describes in detail the implementation manners of the present application in conjunction with the accompanying drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principle of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

[0056] In the description of the present application, it should be noted that unless otherwise stated, the meaning of "a plurality of" is two or more; the orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0057] Referring to "embodiment" in the present application means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments.

[0058] The orientation terms appearing in the following description are all the directions shown in the drawings, and do not limit the specific structure of the present application. In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0059] In the related art, with the rapid development of new energy and the progress of power electronics technology, the power of energy storage devices is getting larger and larger. Currently, the volume of energy storage devices is required to be as small as possible, which is beneficial to improving the energy density of energy storage devices. The energy storage device includes a power module. For example, the power module can be an insulated gate bipolar transistor (IGBT) module. The power module generates a large amount of heat during operation. If the heat cannot be dissipated in time, it will cause the working temperature of the power module to be too high, affecting the working reliability of the power module. The too high temperature causes the performance of the power module to decline, and in severe cases, it will cause the damage of the power module.

[0060] The energy storage device according to an embodiment of the present application includes a radiator for dissipating heat from the power module. The radiator can absorb heat from the power module through a heat exchange tube. Then, the radiator can conduct the heat to a heat conducting substrate and heat dissipation fins through the heat exchange tube, and dissipate the heat through the heat conducting substrate and the heat dissipation fins. The radiator according to an embodiment of the present application has a relatively high heat exchange efficiency, which is beneficial to improving the heat dissipation effect, so that the working temperature of the power module remains stable, thereby ensuring the working reliability of the power module.

[0061] The energy storage device according to an embodiment of the present application can be used to achieve power output and energy storage functions. The energy storage device according to an embodiment of the present application can include an electrical cabinet. The electrical cabinet is a device for realizing electrical energy storage. The electrical cabinet usually includes a cabinet body. A battery is arranged in the cabinet body. The battery can realize the storage of electrical energy.

[0062] The energy storage device according to an embodiment of the present application can be but is not limited to being used as an energy storage cabinet or an energy storage station in new energy power systems such as wind energy, solar energy, and water energy. The energy storage device according to an embodiment of the present application includes a power module. The power module is a component for realizing power output. The power module includes but is not limited to thyristors and insulated gate bipolar transistor modules.

[0063] Figure 1 Schematically shows a partial structure of the energy storage device. Figure 2 Schematically shows a partial exploded structure of the energy storage device. Refer to Figure 1 and Figure 2 As shown, the energy storage device according to an embodiment of the present application includes a radiator 10 and a power module 20. The radiator 10 is used to dissipate heat from the power module 20, so that the heat generated when the power module 20 operates is dissipated in time, effectively avoiding the working environment temperature of the power module 20 from being too high.

[0064] The radiator 10 according to an embodiment of the present application includes a heat conducting substrate 11, heat dissipation fins 12, and a heat exchange tube 13. The heat dissipation fins 12 are connected to the heat conducting substrate 11. The heat exchange tube 13 is connected to the heat conducting substrate 11. The heat conducting substrate 11 separates the heat dissipation fins 12 and the heat exchange tube 13.

[0065] The heat-conducting substrate 11 is a plate-like structural member. The heat-conducting substrate 11 itself has good heat conduction performance. Exemplarily, the material of the heat-conducting substrate 11 can be, but is not limited to, copper or copper alloy. The heat-conducting substrate 11 can absorb heat and conduct the heat to the heat dissipation fins 12. Along the thickness direction Z of the heat-conducting substrate 11, the heat exchange tube 13 is disposed opposite to the heat dissipation fins 12. The heat exchange tube 13 can absorb heat and conduct the heat to the heat-conducting substrate 11. The heat-conducting substrate 11 conducts the heat to the heat dissipation fins 12. Exemplarily, see Figure 2 As shown, along the thickness direction Z of the heat-conducting substrate 11, the heat-conducting substrate 11 includes opposite first surface 11a and second surface 11b. Along the thickness direction Z of the heat-conducting substrate 11, the heat dissipation fins 12 protrude from the first surface 11a of the heat-conducting substrate 11. When observing the second surface 11b of the heat-conducting substrate 11, the heat exchange tube 13 can be seen.

[0066] The heat dissipation fins 12 itself have a relatively large surface area, so the heat dissipation fins 12 itself have good heat dissipation performance and heat exchange efficiency. Exemplarily, the number of the heat dissipation fins 12 can be multiple. The multiple heat dissipation fins 12 are arranged side by side. For example, the heat dissipation fins 12 can be flat sheet-like structures. The multiple heat dissipation fins 12 can be arranged parallel to each other. Exemplarily, the heat dissipation fins 12 can be arranged perpendicular to the heat-conducting substrate 11.

[0067] The heat exchange tube 13 includes an evaporation section 13a and a condensation end 13b. The evaporation section 13a and the condensation end 13b of the heat exchange tube 13 are spaced apart. The heat exchange tube 13 includes a cooling working fluid. The cooling working fluid is located inside the heat exchange tube 13. After the evaporation section 13a of the heat exchange tube 13 absorbs heat, the cooling working fluid at the evaporation section 13a is heated and evaporated, so as to be converted from a liquid state to a gaseous state. The gaseous cooling working fluid flows towards the condensation end 13b of the heat exchange tube 13. The cooling working fluid at the condensation end 13b is cooled and condensed, so as to be converted from a gaseous state to a liquid state. Therefore, the evaporation section 13a of the heat exchange tube 13 is used to absorb heat, while the condensation end 13b is used to release heat. The cooling working fluid condensed at the condensation end 13b can return to the evaporation section 13a and enter the next cycle. Exemplarily, a capillary structure is provided inside the heat exchange tube 13. The capillary structure includes, but is not limited to, copper foam. The cooling working fluid condensed at the condensation end 13b can return to the evaporation section 13a under the capillary action of the capillary structure. The inside of the heat exchange tube 13 can be a vacuum environment. The heat exchange tube 13 is a heat transfer device capable of phase change heat transfer formed by injecting a cooling working fluid into a vacuum cavity provided with a capillary structure inside. The heat exchange tube 13 itself has a relatively high heat exchange efficiency. The heat exchange tube 13 can conduct the heat at the heat source to a region far from the heat source for release, so as to be beneficial to cooling the heat source. For example, the heat source can be the power module 20.

[0068] The power module 20 is connected to the heat-conducting substrate 11. Exemplarily, the power module 20 is detachably connected to the heat-conducting substrate 11. For example, the power module 20 can be connected to the heat-conducting substrate 11 through fasteners such as screws. The heat exchange tube 13 is arranged corresponding to the power module 20. Along the thickness direction Z of the heat-conducting substrate 11, the heat exchange tube 13 is arranged facing the power module 20. The power module 20 is arranged to cover the evaporation section 13a of the heat exchange tube 13, that is, the evaporation section 13a of the heat exchange tube 13 can be located below the power module 20. When observing along the thickness direction Z of the heat-conducting substrate 11, the evaporation section 13a of the heat exchange tube 13 is blocked by the power module 20, so the evaporation section 13a of the heat exchange tube 13 cannot be observed.

[0069] The condensation end 13b of the heat exchange tube 13 is located outside the power module 20. There is a transition section between the condensation end 13b and the evaporation section 13a. The condensation end 13b of the heat exchange tube 13 is not blocked by the power module 20. When observing along the thickness direction Z of the heat-conducting substrate 11, the condensation end 13b of the heat exchange tube 13 can be observed. Along the thickness direction Z of the heat-conducting substrate 11, the orthographic projection of the evaporation section 13a is located inside the orthographic projection of the power module 20, while the orthographic projection of the condensation end 13b is located outside the orthographic projection of the power module 20. The evaporation section 13a of the heat exchange tube 13 is used to absorb heat from the power module 20. The condensation end 13b of the heat exchange tube 13 is used to release heat to the heat-conducting substrate 11.

[0070] The energy storage device according to the embodiment of the present application includes a power module 20 and a radiator 10. The radiator 10 is connected to the power module 20. The heat generated when the power module 20 works can be diffused through the radiator 10, reducing the temperature of the working environment of the power module 20 itself. The radiator 10 includes a heat-conducting substrate 11, heat dissipation fins 12, and a heat exchange tube 13. Both the heat dissipation fins 12 and the heat exchange tube 13 are connected to the heat-conducting substrate 11. The evaporation section 13a of the heat exchange tube 13 can absorb heat from the power module 20, and the heat absorbed by the evaporation section 13a of the heat exchange tube 13 can be conducted to the condensation end 13b, effectively reducing the possibility of heat accumulation at the power module 20. The condensation end 13b of the heat exchange tube 13 can release heat to conduct the heat to the heat-conducting substrate 11. The heat-conducting substrate 11 then conducts the heat to the heat dissipation fins 12. The radiator 10 dissipates the heat to the external environment of the radiator 10 through the heat dissipation fins 12. The heat exchange tube 13 in the radiator 10 of the embodiment of the present application has a relatively high heat exchange efficiency itself, and can dissipate heat in a region far from the power module 20 through the condensation end 13b. Therefore, it is beneficial to improve the heat exchange efficiency of the radiator 10, which is beneficial to reducing the working environment temperature of the power module 20 and improving the working reliability of the power module 20.

[0071] In some implementable ways, Figure 3 Schematically shows a partial exploded structure of the energy storage device. SeeFigure 2 and Figure 3 As shown in Figure 3 , the heat-conducting substrate 11 is provided with a receiving groove 111. The opening of the receiving groove 111 faces away from the heat-dissipating fins 12. Exemplarily, the opening of the receiving groove 111 may be located on the second surface 11b of the heat-conducting substrate 11. At least a part of the heat exchange tube 13 is located in the receiving groove 111.

[0072] During the assembly process of the heat-conducting substrate 11 and the heat exchange tube 13, the receiving groove 111 on the heat-conducting substrate 11 can provide positioning for the heat exchange tube 13, so as to facilitate quickly and accurately placing the heat exchange tube 13 at a predetermined position and improve the assembly efficiency. After the heat-conducting substrate 11 and the heat exchange tube 13 are assembled, the receiving groove 111 on the heat-conducting substrate 11 can form a limiting constraint on the heat exchange tube 13 to reduce the possibility of the heat exchange tube 13 shifting in position under the action of an external force.

[0073] The arrangement in which at least a part of the heat exchange tube 13 is located in the receiving groove 111 is beneficial to increasing the contact area between the heat exchange tube 13 and the heat-conducting substrate 11, thereby being beneficial to improving the heat exchange efficiency between the heat exchange tube 13 and the heat-conducting substrate 11 and being beneficial to enhancing the heat conduction performance between the heat exchange tube 13 and the heat-conducting substrate 11.

[0074] In some examples, a part of the heat exchange tube 13 is located in the receiving groove 111, and the other part protrudes out of the receiving groove 111, that is, it is located outside the receiving groove 111.

[0075] In other examples, the heat exchange tube 13 is entirely located in the receiving groove 111. The heat exchange tube 13 does not protrude out of the receiving groove 111.

[0076] In some examples, the receiving groove 111 is machined on the heat-conducting substrate 11 by means of machining such as milling to remove materials.

[0077] In some realizable ways, Figure 4 Schematically shows a partial cross-sectional structure of the energy storage device. Figure 5 is Figure 4 the enlarged view at M in Figure 3 、 Figure 4 and Figure 5As shown, the heat exchange tube 13 is located in the receiving groove 111 of the heat conducting substrate 11. The outer surface 13c of the heat exchange tube 13 facing the power module 20 is a flat surface. The outer surface 13c of the heat exchange tube 13 is flush with the surface of the heat conducting substrate 11. Along the thickness direction Z of the heat conducting substrate 11, the outer surface 13c of the heat exchange tube 13 can be flush with the opening of the receiving groove 111. Since the outer surface 13c of the heat exchange tube 13 faces the power module 20, the setting that the outer surface 13c of the heat exchange tube 13 facing the power module 20 is a flat surface, on the one hand, is conducive to increasing the heat exchange area between the heat exchange tube 13 and the power module 20, thereby being conducive to improving the heat exchange effect between the heat exchange tube 13 and the power module 20; on the other hand, it is not easy to form an air gap that affects the heat exchange efficiency between the heat exchange tube 13 and the power module 20, which is conducive to improving the heat exchange effect between the heat exchange tube 13 and the power module 20; on the other hand, the heat exchange tube 13 will not apply local concentrated stress to the power module 20, effectively reducing the possibility of structural deformation of the power module 20 or the heat exchange tube 13 caused by the heat exchange tube 13 applying local concentrated stress to the power module 20.

[0078] In some examples, the cross-section of the receiving groove 111 can be semi-circular. The outer contour of the cross-section of the heat exchange tube 13 can also be semi-circular. Exemplarily, the diameter of the heat exchange tube 13 can be 10 millimeters (mm) to 12 millimeters.

[0079] In some examples, refer to Figure 5 As shown, a heat conducting adhesive layer 30 can be provided between the heat exchange tube 13 and the wall surface of the receiving groove 111. The heat conducting adhesive layer 30 connects the heat exchange tube 13 and the heat conducting substrate 11 to effectively fix the heat exchange tube 13, which is conducive to reducing the possibility of separation between the heat exchange tube 13 and the heat conducting substrate 11. The heat conducting adhesive layer 30 itself has good heat conducting performance. The heat conducting adhesive layer 30 can also effectively fill the gap between the heat exchange tube 13 and the wall surface of the receiving groove 111, so that it is not easy to form an air gap that affects the heat exchange efficiency between the heat exchange tube 13 and the wall surface of the receiving groove 111, which is conducive to improving the heat exchange effect between the heat exchange tube 13 and the heat conducting substrate 11. Exemplarily, the heat conducting adhesive layer 30 can cover the entire wall surface of the receiving groove 111.

[0080] In some examples, the heat conducting adhesive layer 30 can be a heat conducting glue layer. When the heat exchange tube 13 and the heat conducting substrate 11 are assembled, heat conducting glue can be coated in the receiving groove 111 of the heat conducting substrate 11, and then the heat exchange tube 13 is placed into the receiving groove 111. The heat exchange tube 13 and the heat conducting substrate 11 can jointly extrude the heat conducting glue. After the heat conducting glue is cured, the heat conducting adhesive layer 30 is formed. Exemplarily, the heat conducting adhesive layer 30 can be an epoxy resin glue layer.

[0081] In some other examples, the heat exchange tube 13 is welded to the heat conducting substrate 11 to effectively fix the heat exchange tube 13, which is beneficial to reducing the possibility of separation between the heat exchange tube 13 and the heat conducting substrate 11. The welding method of the heat exchange tube 13 and the heat conducting substrate 11 makes it difficult to form an air gap that affects the heat exchange efficiency between the heat exchange tube 13 and the heat conducting substrate 11, which is beneficial to improving the heat exchange effect between the heat exchange tube 13 and the heat conducting substrate 11. Exemplarily, the brazing method is adopted to realize the welding of the heat exchange tube 13 and the heat conducting substrate 11. The welding temperature of the brazing method is relatively low, which has little influence on the structures of the heat exchange tube 13 and the heat conducting substrate 11, and is also beneficial to reducing the possibility of structural deformation of the heat exchange tube 13 and the heat conducting substrate 11. Exemplarily, the material of the heat conducting substrate 11 can be but is not limited to copper or copper alloy. The material of the heat exchange tube 13 can be but is not limited to copper or copper alloy.

[0082] In some realizable ways, referring to Figure 5 As shown, an elastic heat conducting layer 40 is provided between the power module 20 and at least part of the evaporation section 13a. The elastic heat conducting layer 40 itself has good heat conduction performance and compressible plastic performance. After the power module 20 is connected to the heat conducting substrate 11, the power module 20 and the evaporation section 13a of the heat exchange tube 13 can jointly squeeze the elastic heat conducting layer 40 to compress the elastic heat conducting layer 40, so that the power module 20 and the heat exchange tube 13 can be closely attached to the elastic heat conducting layer 40 respectively. The elastic heat conducting layer 40 can effectively fill the gap between the heat exchange tube 13 and the power module 20, making it difficult to form an air gap that affects the heat exchange efficiency between the heat exchange tube 13 and the power module 20, which is beneficial to improving the heat exchange effect between the heat exchange tube 13 and the power module 20.

[0083] In some examples, the material of the elastic heat conducting layer 40 can include thermal grease, silica gel or rubber.

[0084] In some examples, an elastic heat conducting layer 40 is provided between the power module 20 and part of the evaporation section 13a. Or, an elastic heat conducting layer 40 is provided between the power module 20 and the entire evaporation section 13a.

[0085] In some examples, the elastic heat conducting layer 40 can be an adhesive layer. The elastic heat conducting layer 40 connects the heat exchange tube 13 and the power module 20 to effectively fix the heat exchange tube 13 and the power module 20, which is beneficial to reducing the possibility of separation between the heat exchange tube 13 and the power module 20. In addition, before the power module 20 is connected to the heat conducting substrate 11, the elastic heat conducting layer 40 bonds the power module 20 to position the power module 20, reducing the operation difficulty of subsequent connection between the power module 20 and the heat conducting substrate 11. Exemplarily, the elastic heat conducting layer 40 can be silicone glue.

[0086] In some realizable ways, referring to Figure 3As shown, the heat exchange tube 13 can be in a strip structure. The number of power modules 20 is more than two. The more than two power modules 20 are arranged at intervals. The heat exchange tubes 13 corresponding to a part of the power modules 20 extend along the first direction X, while the heat exchange tubes 13 corresponding to the remaining power modules 20 extend along the second direction Y. The first direction X is perpendicular to the second direction Y.

[0087] In some examples, the heat conducting substrate 11 can be in a rectangular structure. The first direction X is the same as the width direction of the heat conducting substrate 11. The second direction Y is the same as the length direction of the heat conducting substrate 11.

[0088] In some examples, the length of the heat exchange tube 13 extending along the first direction X is greater than the length of the heat exchange tube 13 extending along the second direction Y.

[0089] In some examples, the heat conducting substrate 11 can be in a rectangular structure. Along the length direction of the heat conducting substrate 11, a plurality of heat dissipation fins 12 are arranged side by side. Exemplarily, the first direction X is perpendicular to the thickness direction of the heat dissipation fins 12. The second direction Y is the same as the thickness direction of the heat dissipation fins 12.

[0090] Exemplarily, the length of the heat conducting substrate 11 is 600 millimeters to 700 millimeters. The width of the heat conducting substrate 11 is 400 millimeters to 450 millimeters. Along the thickness direction Z of the heat conducting substrate 11, the height of the heat dissipation fins 12 is 80 millimeters to 100 millimeters. The thickness of the heat dissipation fins 12 is 1 millimeter to 1.5 millimeters.

[0091] In some realizable ways, the heat exchange tube 13 can be in a strip structure. The number of power modules 20 is more than two. The more than two power modules 20 are arranged at intervals. The heat exchange tubes 13 corresponding to a part of the power modules 20 extend along the first direction X, while the heat exchange tubes 13 corresponding to the remaining power modules 20 extend along the second direction Y. The first direction X intersects with the second direction Y. There is an included angle between the first direction X and the second direction Y. Exemplarily, the included angle between the first direction X and the second direction Y is an acute angle greater than 0° and less than 90°.

[0092] In some examples, the more than two power modules 20 can be divided into two groups. The number of power modules 20 in one group can be the same as or different from the number of power modules 20 in the other group. The heat exchange tubes 13 corresponding to the power modules 20 in one group extend along the first direction X. The heat exchange tubes 13 corresponding to the power modules 20 in the other group extend along the second direction Y.

[0093] In some implementable ways, the heat exchange tube 13 is in a strip structure. The number of power modules 20 is more than two. The more than two power modules 20 are arranged at intervals. Heat exchange tubes 13 are correspondingly arranged for all the power modules 20. The extending directions of all the heat exchange tubes 13 are the same. Any two heat exchange tubes 13 are arranged parallel to each other. In some examples, the heat exchange tubes 13 correspondingly arranged for all the power modules 20 may extend along the first direction X. Alternatively, the heat exchange tubes 13 correspondingly arranged for all the power modules 20 may extend along the second direction Y.

[0094] The larger the distance between the condensation end 13b of the heat exchange tube 13 and the power module 20, the smaller the influence of the heat released by the condensation end 13b on the power module 20, and the more conducive to the heat dissipation of the power module 20. When the overall board surface area of the heat conducting substrate 11 is limited, the board surface of the heat conducting substrate 11 can be fully utilized by adjusting the extending directions of the respective heat exchange tubes 13, so as to arrange more heat exchange tubes 13 on the board surface of the heat conducting substrate 11 and keep a relatively large distance between the condensation end 13b and the power module 20. Furthermore, when the board surface area of the heat conducting substrate 11 is limited, the heat exchange efficiency between the heat exchange tube 13 and the power module 20 can be effectively improved, and a relatively large distance is kept between the condensation end 13b and the power module 20, reducing the influence of the heat released by the condensation end 13b on the power module 20.

[0095] In some implementable ways, Figure 6 Schematically shows a partial structure of the energy storage device. Refer to Figure 6 As shown, the heat exchange tube 13 includes a first tube section 131 and a second tube section 132. The first tube section 131 has opposite ends. At least one of the opposite ends of the first tube section 131 is connected to the second tube section 132. The first tube section 131 and the second tube section 132 intersect. The first tube section 131 has an evaporation section 13a. The second tube section 132 has a condensation end 13b.

[0096] The larger the distance between the condensation end 13b of the heat exchange tube 13 and the power module 20, the smaller the influence of the heat released by the condensation end 13b on the power module 20, and the more conducive to the heat dissipation of the power module 20. When the overall board surface area of the heat conducting substrate 11 is limited, the board surface of the heat conducting substrate 11 can be fully utilized by setting the extending directions of the first tube section 131 and the second tube section 132 to be different, so as to keep a relatively large distance between the condensation end 13b and the power module 20 when the board surface area of the heat conducting substrate 11 is limited, reducing the influence of the heat released by the condensation end 13b on the power module 20.

[0097] In some examples, both the first pipe segment 131 and the second pipe segment 132 are straight pipes. Both opposite ends of the first pipe segment 131 are connected to the second pipe segment 132. Exemplarily, the first pipe segment 131 may extend along the first direction X, while the second pipe segment 132 may extend along the second direction Y. Exemplarily, the first pipe segment 131 may extend along the second direction Y, while the second pipe segment 132 may extend along the first direction X.

[0098] In some realizable ways, the number of heat exchange pipes 13 corresponding to one power module 20 is more than two. For one power module 20, more than two heat exchange pipes 13 can dissipate heat from one power module 20 simultaneously, effectively improving the heat exchange efficiency.

[0099] In some realizable ways, referring to Figure 6 As shown, the power module 20 includes a chip 21. The position of the chip 21 corresponds to the position of the evaporation section 13a. Along the thickness direction Z of the heat conduction substrate 11, the evaporation section 13a of the heat exchange pipe 13 can be disposed below the chip 21. In the power module 20, the chip 21 generates relatively more heat, so the chip 21 is the main heat source in the power module 20. The arrangement of the evaporation section 13a of the heat exchange pipe 13 facing the chip 21 is conducive to the heat generated by the chip 21 being conducted to the heat exchange pipe 13 in a timely and rapid manner, improving the heat exchange efficiency between the heat exchange pipe 13 and the power module 20.

[0100] In some examples, one power module 20 includes more than two chips 21. One chip 21 can be arranged corresponding to one heat exchange pipe 13. Or, one chip 21 can be arranged corresponding to two heat exchange pipes 13.

[0101] In some examples, the power module 20 can be an insulated gate bipolar transistor module. The chip 21 of the power module 20 can include a drive chip.

[0102] In some realizable ways, Figure 7 Schematically shows a partial structure of the housing. Figure 8 Schematically shows a partial structure of the energy storage device. Referring to Figure 7 and Figure 8As shown, the radiator 10 further includes a housing 50. The housing 50 includes a receiving space 51, an air inlet 52, and an air outlet 53. Both the air inlet 52 and the air outlet 53 are in communication with the receiving space 51. The heat-conducting substrate 11 is connected to the housing 50, and the heat-dissipating fins 12 are located in the receiving space 51 of the housing 50. The heat-dissipating fins 12 are located between the air inlet 52 and the air outlet 53. Air with a relatively low temperature can flow into the housing 50 from the air inlet 52. Then, the air with a relatively low temperature exchanges heat with the heat-dissipating fins 12 to form air with a relatively high temperature. The air with a relatively high temperature can flow out of the housing 50 from the air outlet 53. Therefore, the radiator 10 of the embodiment of the present application can achieve heat dissipation by means of air cooling to reduce the temperature of the radiator 10 itself.

[0103] Although the present application has been described with reference to the preferred embodiments, various modifications can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. An energy storage device, characterized in that: include: A radiator, comprising a heat-conducting substrate, heat-dissipating fins and a heat-exchange tube, wherein the heat-dissipating fins are connected to the heat-conducting substrate, the heat-exchange tubes are connected to the heat-conducting substrate, the heat-conducting substrate separates the heat-dissipating fins and the heat-exchange tubes, and the heat-exchange tubes comprise an evaporation section and a condensation end; A power module is connected to the heat-conducting substrate, the heat exchange tube is arranged corresponding to the power module, the power module covers the evaporation section, the condensation end is located outside the power module, along the thickness direction of the heat-conducting substrate, the orthographic projection of the evaporation section is located inside the orthographic projection of the power module, and the orthographic projection of the condensation end is located outside the orthographic projection of the power module, the evaporation section is used to absorb heat from the power module, and the condensation end is used to release heat to the heat-conducting substrate.

2. The energy storage device according to claim 1, characterized in that: The heat-conducting substrate is provided with a receiving groove, and at least part of the heat exchange tube is located in the receiving groove.

3. The energy storage device according to claim 2, characterized in that: The heat exchange tube is located in the containing groove, the outer surface of the heat exchange tube facing the power module is a plane, and the outer surface of the heat exchange tube is flush with the surface of the heat conductive substrate.

4. The energy storage device according to claim 2, characterized in that: A heat-conducting adhesive layer is provided between the heat exchange tube and the wall surface of the containing tank; or the heat exchange tube is welded to the heat-conducting substrate.

5. The energy storage device according to claim 1, characterized in that: An elastic heat-conducting layer is arranged between the power module and at least a portion of the evaporation section.

6. The energy storage device according to claim 5, characterized in that: The elastic heat-conductive layer is an adhesive layer.

7. The energy storage device according to any one of claims 1 to 6, characterized in that: The heat exchange tube is a strip structure, the number of the power modules is more than two, the heat exchange tubes corresponding to a part of the power modules extend along a first direction, and the heat exchange tubes corresponding to the remaining power modules extend along a second direction, and the first direction is perpendicular to or intersects the second direction; or, The heat exchange tube is a strip structure, the number of the power modules is more than two, all the power modules are correspondingly provided with the heat exchange tube, and the extension direction of all the heat exchange tubes is the same.

8. The energy storage device according to any one of claims 1 to 6, characterized in that: The heat exchange tube includes a first tube section and a second tube section, at least one of the two opposite ends of the first tube section is connected to the second tube section, the first tube section and the second tube section intersect, the first tube section has the evaporation section, and the second tube section has the condensation end.

9. The energy storage device according to any one of claims 1 to 6, characterized in that: The power module includes a chip, and the position of the chip corresponds to the position of the evaporation section.

10. A radiator, characterized in that: include: Thermally conductive substrate; A heat dissipation fin connected to the heat conductive substrate; A heat exchange tube is connected to the heat conductive substrate, the heat conductive substrate separates the heat dissipation fins and the heat exchange tube, the heat exchange tube includes an evaporation section and a condensation end, the evaporation section is used to absorb heat, and the condensation end is used to release heat to the heat conductive substrate.

Images