Two-phase immersed cooling system suitable for high-power chip

Abstract

The utility model discloses a two-phase immersed cooling system suitable for a high-power chip, and relates to the technical field of immersed cooling systems, the two-phase immersed cooling system comprises an outdoor heat radiation system, a sealing housing and a condensation assembly, the sealing housing is filled with dielectric liquid; the chip is connected with the flat micro heat pipe array or the VC vapor chamber and is completely immersed in the dielectric liquid; the condensation assembly is arranged in the sealing shell and located above the liquid level of the dielectric liquid. The water inlet end and the water outlet end of the condensation assembly penetrate through the sealing shell, extend outwards and are in circulating communication with an outdoor heat dissipation system. According to the utility model, by using the high thermal conductivity and temperature uniformity of the flat micro heat pipe array or the VC vapor chamber, the actual heat flux density of heat dissipation is indirectly reduced, the limit of the heat flux density of heat dissipation is improved, and the uniformity of the surface temperature of the chip is ensured. And meanwhile, natural cold energy can be utilized to dissipate heat for the chip to the maximum extent in cooperation with a condensation assembly and a corresponding outdoor heat dissipation system, the overall energy consumption of the data center is reduced, and then the PUE value is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of immersion cooling systems and relates to a two-phase immersion cooling system suitable for high-power chips. Background Art

[0002] In recent years, technologies such as 5G communications, cloud computing, artificial intelligence, and the Internet of Things have ushered in a phased development. The demand for data processing will grow exponentially, and the requirements for data computing, storage, transmission, and security energy will become higher and higher. Data centers will become the pillar industry of the information age. At the same time, the increase in the integration density and utilization rate of processor (CPU) chips in data centers is undoubtedly a trend in the future. High-density processor chips have better processing performance and smaller size, and their corresponding heat and heat flux density will be higher.

[0003] The traditional chip-level cooling forms mainly include air cooling, liquid cooling and heat pipe cooling. Air cooling mainly uses fans to achieve forced convection heat exchange between air and different forms of heat sinks, but with the continuous increase in the heat flux density of chip heat dissipation, this cooling method cannot achieve the expected cooling effect. Liquid cooling uses the higher heat transport capacity of liquid to take away heat through forced circulation, but the current liquid cooling technology pipeline design is relatively complex, prone to leakage and condensation, and is subject to certain restrictions in terms of the stability and reliability of server equipment operation. Compared with the traditional chip-level cooling method with limited heat dissipation capacity and complex structure, two-phase immersion liquid cooling undergoes phase change in the liquid during the cooling process, and uses its latent heat of evaporation to obtain better cooling effect, with greater heat dissipation potential, and has become a current research hotspot. However, the effect of immersion cooling depends to a large extent on the critical heat flux density in the boiling heat transfer process. The existence of critical heat flux density limits its heat flux density for heat dissipation. The critical heat flux density of conventional immersion cooling liquid is 20-30W / cm 2 , which is obviously not suitable for the heat dissipation requirements of current mainstream chips.

[0004] Therefore, there is an urgent need for a two-phase immersion cooling system suitable for high-power chips. Utility Model Content

[0005] In view of this, the utility model provides a two-phase immersion cooling system suitable for high-power chips to solve the problems raised in the above background technology, and specifically discloses the following contents:

[0006] A two-phase immersion cooling system applicable to high-power chips, comprising an outdoor heat dissipation system, a sealed housing, a heat conduction component, and a condensation component. The sealed housing is filled with a dielectric liquid. The heat conduction component adopts a flat micro heat pipe array or a VC heat sink. The chip is connected to the flat micro heat pipe array or the VC heat sink and is completely immersed in the dielectric liquid. The condensation component is arranged inside the sealed housing and is located above the liquid level of the dielectric liquid. The water inlet end and the water outlet end of the condensation component both penetrate through the sealed housing and extend outwards, and are in circular communication with the outdoor heat dissipation system.

[0007] Further, the surface area of the contact side of the flat micro heat pipe array or the contact side of the VC heat sink is 2 times or more of the surface area of the chip contact side.

[0008] Further, the condensation component includes a water inlet mixing box, a condensation section, and a water outlet mixing box that are connected in sequence. The condensation section includes a plurality of small-channel flat tubes arranged horizontally.

[0009] One end of the small-channel flat tube communicates with the inner cavity of the water inlet mixing box, and the other end communicates with the inner cavity of the water outlet mixing box.

[0010] The water inlet end of the water inlet mixing box and the water outlet end of the water outlet mixing box both penetrate through the sealed housing and extend outwards, and are in circular communication with the outdoor heat dissipation system.

[0011] Further, the flat micro heat pipe array has a flat shape, which is convenient for fitting the chip. When the chip is connected to the flat micro heat pipe array, both the chip and the flat micro heat pipe array are perpendicular to the bottom wall of the sealed housing.

[0012] Further, the inner wall of the flat micro heat pipe array is provided with capillary microgrooves for increasing the heat exchange area.

[0013] Further, the VC heat sink has a flat shape, which is convenient for fitting the chip. When the chip is connected to the VC heat sink, both the chip and the VC heat sink are parallel to the bottom wall of the sealed housing.

[0014] Further, the outdoor heat dissipation system includes a gas-liquid heat exchanger, a water pump, and a buffer water tank. The water outlet end of the condensation component, the buffer water tank, the water pump, the gas-liquid heat exchanger, and the water inlet end of the condensation component are connected in sequence through pipelines.

[0015] A fan that matches is also provided on one side of the gas-liquid heat exchanger.

[0016] Further, the outdoor heat dissipation system includes a cooling tower and a water pump. The water outlet end of the condensation component, the cooling tower, the water pump, and the water inlet end of the condensation component are connected in sequence through pipelines.

[0017] Further, the surface area of the contact side of the flat micro heat pipe array or the contact side of the VC heat sink plate is 2 times or more of the surface area of the chip contact side.

[0018] The beneficial effects of the present utility model are as follows:

[0019] The present utility model utilizes the high thermal conductivity and temperature uniformity of the flat micro heat pipe array or the VC heat sink plate to indirectly reduce the heat flux density of actual heat dissipation, improve the heat flux density limit of heat dissipation, and ensure the uniformity of the chip surface temperature. At the same time, in cooperation with the condensation component and the corresponding outdoor heat dissipation system, the natural cold energy can be maximally utilized to dissipate heat for the chip, reduce the overall energy consumption of the data center, and thus reduce the PUE value. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0021] Figure 1 It is a schematic structural diagram of the connection between the chip and the flat micro heat pipe array in the present utility model.

[0022] Figure 2 It is a schematic structural diagram of the connection between the chip and the VC heat sink plate in the present utility model.

[0023] Figure 3 It is a schematic structural diagram of the condensation component in the present utility model.

[0024] Figure 4 It is a schematic structural diagram of the chip and the flat micro heat pipe array located in the sealed housing in the present utility model.

[0025] Figure 5 It is a schematic structural diagram of the chip and the VC heat sink plate located in the sealed housing in the present utility model.

[0026] Figure 6 It is a schematic structural diagram of Embodiment 1.

[0027] Figure 7 It is a schematic structural diagram of Embodiment 2.

[0028] Figure 8 It is a schematic structural diagram of Embodiment 3.

[0029] Figure 9 It is a schematic structural diagram of Embodiment 4.

[0030] Among them, in the figure:

[0031] 1 - Chip; 2 - Flat micro heat pipe array; 3 - VC heat sink; 4 - Sealed housing; 5 - Condensation assembly; 51 - Inlet mixing box; 52 - Small channel flat tube; 53 - Outlet mixing box; 6 - Dielectric liquid; 7 - Dielectric liquid vapor; 8 - Gas-liquid heat exchanger; 9 - Fan; 10 - Water pump; 11 - Pipeline; 12 - Buffer water tank; 13 - Cooling tower. Detailed implementation mode

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] It should be noted that the terms "first", "second", etc. in the description and claims of this application and the above drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so as to describe the embodiments of this application here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or components does not necessarily limit to those clearly listed steps or components, but may include other steps or components not clearly listed or inherent to these processes, methods, products or devices.

[0034] In this application, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0035] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0036] In addition, the terms "installed", "set up", "equipped with", "connected", "linked", "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is internal communication between two devices, components or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] Refer to the appendix Figures 1-5 , the present utility model discloses a two-phase immersion cooling system applicable to high-power chips, including an outdoor heat dissipation system, a sealed housing 4, a heat conduction component, and a condensation component 5. A dielectric liquid 6 is contained in the sealed housing 4; the heat conduction component adopts a flat micro heat pipe array 2 or a VC heat sink 3; the chip 1 is connected to the flat micro heat pipe array 2 or the VC heat sink 3 and is completely immersed in the dielectric liquid 6; the condensation component 5 is arranged inside the sealed housing 4 and is located above the liquid level of the dielectric liquid 6; both the water inlet end and the water outlet end of the condensation component 5 penetrate through the sealed housing 4 and extend outwards, and are in circulating communication with the outdoor heat dissipation system.

[0038] In this embodiment, the heat generated by the chip 1 is transferred to the circulating liquid in the condensation component 5, and then the circulating liquid exchanges heat with the outdoor heat dissipation system, and the outdoor heat dissipation system uses natural cold energy to transfer the heat to the outdoor environment.

[0039] In this embodiment, the boiling point of the dielectric liquid 6 under normal pressure is 35°C - 65°C; preferably, the boiling point of the dielectric liquid 6 under normal pressure is 40°C - 60°C; therefore, free outdoor natural cold energy can be used for cooling for most of the year, which can effectively improve the cooling efficiency and reduce the refrigeration energy consumption.

[0040] The surface area of the contact side of the flat micro heat pipe array 2 or the contact side of the VC heat sink 3 is 2 times or more of the surface area of the contact side of the chip 1.

[0041] The condensation component 5 includes a water inlet mixing box 51, a condensation section, and a water outlet mixing box 53 that are connected in sequence. The condensation section includes a plurality of small-channel flat tubes 52 arranged horizontally;

[0042] One end of the small-channel flat tube 52 communicates with the inner cavity of the water inlet mixing box 51, and the other end communicates with the inner cavity of the water outlet mixing box 53;

[0043] Both the water inlet end of the water inlet mixing box 51 and the water outlet end of the water outlet mixing box 53 penetrate through the sealed housing 4 and extend outwards, and are in circulating communication with the outdoor heat dissipation system.

[0044] In this embodiment, the thin-channel flat tube 52 is flat and is formed by extruding aluminum alloy. It can be easily attached to the heat exchange surface, reducing the interfacial contact thermal resistance. Moreover, the partition walls between the thin-channel flat tubes 52 play a role in supporting and strengthening the structure, greatly increasing its pressure-bearing capacity. The structure in which the flat micro heat pipe array 2 or the VC heat sink 3 is integrated with the chip 1 is completely immersed in the dielectric liquid 6. The thin-channel flat tube 52 is used to condense the dielectric liquid vapor 7 generated when the dielectric liquid 6 boils, and the sealed housing 4 ensures that the dielectric liquid 6 does not leak.

[0045] In this embodiment, the inlet mixing box 51 and the outlet mixing box 53 are provided to ensure uniform water flow distribution.

[0046] The flat micro heat pipe array 2 has a flat shape, which is convenient for attaching to the chip 1. When the chip 1 is connected to the flat micro heat pipe array 2, both the chip 1 and the flat micro heat pipe array 2 are perpendicular to the bottom wall of the sealed housing 4.

[0047] The inner wall of the flat micro heat pipe array 2 is provided with capillary microgrooves for increasing the heat exchange area.

[0048] The VC heat sink 3 has a flat shape, which is convenient for attaching to the chip 1. When the chip 1 is connected to the VC heat sink 3, both the chip 1 and the VC heat sink 3 are parallel to the bottom wall of the sealed housing 4.

[0049] In this embodiment, the flat micro heat pipe array 2 or the VC heat sink 3 has strong thermal conductivity, good temperature uniformity, high heat dissipation efficiency, and a flat appearance, which is easy to attach to the surface of the chip 1 and is easy to be integrated with the chip 1. When applied to a two-phase immersion cooling system, its high thermal conductivity and high temperature uniformity can be used to indirectly reduce the actual heat flux density of heat dissipation, improve the heat flux density limit of heat dissipation, and ensure the uniformity of the temperature on the surface of the chip 1.

[0050] In this embodiment, the outdoor heat dissipation system includes an intelligent control system, which can real-time monitor the outdoor ambient temperature, the chip 1 temperature, the dielectric liquid 6 temperature, the temperature of the circulating liquid in the thin-channel flat tube 52, and the self-power consumption of the system, and automatically calculate the COP of the refrigeration system according to the monitored data.

[0051] In this embodiment, different circulating liquids can be selected according to different outdoor ambient temperatures.

[0052] In an optional embodiment, the outdoor heat dissipation system includes a gas-liquid heat exchanger 8, a water pump 10, and a buffer tank 12. The outlet end of the condensation component 5, the buffer tank 12, the water pump 10, the gas-liquid heat exchanger 8, and the inlet end of the condensation component 5 are sequentially connected through a pipeline 11;

[0053] A fan 9 that matches is also provided on one side of the gas-liquid heat exchanger 8.

[0054] In another alternative embodiment, the outdoor heat dissipation system includes a cooling tower 13 and a water pump 10. The water outlet end of the condensation assembly 5, the cooling tower 13, the water pump 10, and the water inlet end of the condensation assembly 5 are sequentially connected through a pipeline 11.

[0055] Embodiment 1

[0056] Refer to the appendix Figure 6 In this embodiment, the chip 1 is connected to the flat micro heat pipe array 2, and both the chip 1 and the flat micro heat pipe array 2 are perpendicular to the bottom wall of the sealed housing 4.

[0057] In this embodiment, the outdoor heat dissipation system includes a gas-liquid heat exchanger 8, a water pump 10, and a buffer water tank 12. The water outlet end of the condensation assembly 5, the buffer water tank 12, the water pump 10, the gas-liquid heat exchanger 8, and the water inlet end of the condensation assembly 5 are sequentially connected through a pipeline 11.

[0058] In this embodiment, the heat of the chip 1 is transferred to the dielectric liquid 6 through the structure integrated with the flat micro heat pipe array 2, so that the dielectric liquid 6 boils to generate dielectric liquid vapor 7, which condenses on the fine channel flat tube 52. The heat released during the condensation process is carried away by the circulating liquid flowing through the fine channel flat tube 52 and transferred to the gas-liquid heat exchanger 8. The gas-liquid heat exchanger 8 exchanges heat with the outdoor environment through a fan 9, and finally dissipates the heat to the outdoor environment.

[0059] Embodiment 2

[0060] Refer to the appendix Figure 7 In this embodiment, the chip 1 is connected to the flat micro heat pipe array 2, and both the chip 1 and the flat micro heat pipe array 2 are perpendicular to the bottom wall of the sealed housing 4.

[0061] In this embodiment, the outdoor heat dissipation system includes a cooling tower 13 and a water pump 10. The water outlet end of the condensation assembly 5, the cooling tower 13, the water pump 10, and the water inlet end of the condensation assembly 5 are sequentially connected through a pipeline 11.

[0062] In this embodiment, the heat of the chip 1 is transferred to the dielectric liquid 6 through the structure integrated with the flat micro heat pipe array 2, so that the dielectric liquid 6 boils to generate dielectric liquid vapor 7, which condenses on the fine channel flat tube 52. The heat released during the condensation process is carried away by the circulating liquid flowing through the fine channel flat tube 52 and transferred to the cooling tower 13, and finally the heat is dissipated to the outdoor environment.

[0063] Embodiment 3

[0064] Refer to the appendix Figure 8 In this embodiment, the chip 1 is connected to the VC heat sink 3, and both the chip 1 and the VC heat sink 3 are parallel to the bottom wall of the sealed housing 4.

[0065] In this embodiment, the outdoor heat dissipation system includes a gas-liquid heat exchanger 8, a water pump 10, and a buffer water tank 12. The water outlet end of the condensation assembly 5, the buffer water tank 12, the water pump 10, the gas-liquid heat exchanger 8, and the water inlet end of the condensation assembly 5 are sequentially connected through a pipeline 11.

[0066] In this embodiment, the heat of the chip 1 is transferred to the dielectric liquid 6 through the structure integrated with the VC heat spreader 3, so that the dielectric liquid 6 boils to generate dielectric liquid vapor 7, which condenses on the microchannel flat tube 52. The heat released during the condensation process is carried away by the circulating liquid flowing through the microchannel flat tube 52 and transferred to the gas-liquid heat exchanger 8. The gas-liquid heat exchanger 8 exchanges heat with the outdoor environment through a fan 9, and finally dissipates the heat to the outdoor environment.

[0067] Embodiment 4

[0068] Refer to the appendix Figure 9 In this embodiment, the chip 1 is connected to the VC heat spreader 3, and both the chip 1 and the VC heat spreader 3 are parallel to the bottom wall of the sealed housing 4.

[0069] In this embodiment, the outdoor heat dissipation system includes a cooling tower 13 and a water pump 10. The water outlet end of the condensation assembly 5, the cooling tower 13, the water pump 10, and the water inlet end of the condensation assembly 5 are sequentially connected through a pipeline 11.

[0070] In this embodiment, the heat of the chip 1 is transferred to the dielectric liquid 6 through the structure integrated with the VC heat spreader 3, so that the dielectric liquid 6 boils to generate dielectric liquid vapor 7, which condenses on the microchannel flat tube 52. The heat released during the condensation process is carried away by the circulating liquid flowing through the microchannel flat tube 52 and transferred to the cooling tower 13, and finally the heat is dissipated to the outdoor environment.

[0071] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A two-phase immersion cooling system suitable for high-power chips, characterized in that: The invention comprises an outdoor heat dissipation system, a sealed shell (4), a heat conduction component and a condensation component (5); the sealed shell (4) contains a dielectric liquid (6); the heat conduction component adopts a flat micro heat pipe array (2) or a VC heat spreader (3); a chip (1) is connected to the flat micro heat pipe array (2) or the VC heat spreader (3) and is completely immersed in the dielectric liquid (6); the condensation component (5) is arranged inside the sealed shell (4) and is located above the liquid surface of the dielectric liquid (6); the water inlet and the water outlet of the condensation component (5) both penetrate the sealed shell (4) and extend outwards, and are cyclically connected to the outdoor heat dissipation system.

2. A two-phase immersion cooling system suitable for high-power chips according to claim 1, characterized in that: The surface area of ​​the contact side of the flat micro heat pipe array (2) or the contact side of the VC heat spreader (3) is twice or more than the surface area of ​​the contact side of the chip (1).

3. A two-phase immersion cooling system suitable for high-power chips according to claim 1, characterized in that: The condensation assembly (5) comprises an inlet mixing box (51), a condensation section, and an outlet mixing box (53) which are connected in sequence, and the condensation section comprises a plurality of horizontally arranged thin channel flat tubes (52); One end of the thin channel flat tube (52) is connected to the inner cavity of the water inlet mixing flow box (51), and the other end is connected to the inner cavity of the water outlet mixing flow box (53); The water inlet end of the water inlet mixing box (51) and the water outlet end of the water outlet mixing box (53) both penetrate the sealed housing (4) to protrude outwards and are cyclically connected to the outdoor heat dissipation system.

4. A two-phase immersion cooling system suitable for high-power chips according to claim 1, characterized in that: The flat plate micro heat pipe array (2) has a flat appearance, which is convenient for fitting onto the chip (1); when the chip (1) is connected to the flat plate micro heat pipe array (2), the chip (1) and the flat plate micro heat pipe array (2) are both perpendicular to the bottom wall of the sealed housing (4).

5. A two-phase immersion cooling system suitable for high-power chips according to claim 4, characterized in that: The inner wall of the flat micro heat pipe array (2) is provided with capillary micro grooves for increasing the heat exchange area.

6. A two-phase immersion cooling system suitable for high-power chips according to claim 1, characterized in that: The VC heat spreader (3) is flat in shape, which is convenient for laminating the chip (1); when the chip (1) is connected to the VC heat spreader (3), the chip (1) and the VC heat spreader (3) are parallel to the bottom wall of the sealed housing (4).

7. A two-phase immersion cooling system suitable for high-power chips according to claim 1, characterized in that: The outdoor heat dissipation system comprises a gas-liquid heat exchanger (8), a water pump (10), and a buffer water tank (12); the water outlet of the condensing component (5), the buffer water tank (12), the water pump (10), the gas-liquid heat exchanger (8), and the water inlet of the condensing component (5) are connected in sequence via a pipe (11); A matching fan (9) is also provided on one side of the gas-liquid heat exchanger (8).

8. A two-phase immersion cooling system suitable for high-power chips according to claim 1, characterized in that: The outdoor heat dissipation system comprises a cooling tower (13) and a water pump (10); a water outlet of the condensing component (5), the cooling tower (13), the water pump (10) and a water inlet of the condensing component (5) are connected in sequence via a pipeline (11).

Images