IGBT module water cooling mechanism

Abstract

The utility model discloses an IGBT module water cooling mechanism which comprises a water cooling platform and a water cooling module, the water cooling module is fixed on the water cooling platform, the water cooling module comprises a water cooling station and supporting columns, the supporting columns are installed below four corners of the water cooling station, the tops of the supporting columns are connected with the water cooling station, and the bottoms of the supporting columns are connected with the water cooling platform. By optimizing the design of the water cooling station and the water cooling plate, efficient heat dissipation of the IGBT module is achieved, the performance and stability of the IGBT module are improved, meanwhile, the structure of the heat dissipation device is simplified, and installation and maintenance are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of mechanical automation, in particular to a water cooling mechanism for an IGBT module. Background Art

[0002] With the rapid development of power electronics technology, the IGBT (Insulated Gate Bipolar Transistor) module, as a core component for power conversion and control, has been widely used in power electronic devices. However, during the operation of the IGBT module, a large amount of heat is generated. If the heat cannot be dissipated in a timely and effective manner, it will lead to an increase in the module temperature, thereby affecting its performance and stability, and even may cause damage. Therefore, the heat dissipation problem of the IGBT module has become a technical problem that urgently needs to be solved in the field of power electronics.

[0003] The traditional heat dissipation methods for IGBT modules usually adopt air cooling or natural heat dissipation, but this method has limited effects in high-power and high-density power electronic devices and cannot meet the high requirements of the module for heat dissipation performance.

[0004] For this reason, the water cooling technology has gradually attracted people's attention. The water cooling technology takes away heat from the heat source through the circulating flow of liquid, and has the advantages of high heat dissipation efficiency, large heat dissipation capacity, low noise, etc., and is especially suitable for power electronic devices with high power density and compact structure.

[0005] However, the existing water cooling devices often have problems such as complex structure, inconvenient installation, uneven heat dissipation, etc., and cannot meet the high requirements of the IGBT module for heat dissipation performance. Therefore, it has important practical application value to develop a water cooling mechanism for IGBT modules with a simple structure, good heat dissipation effect and convenient installation.

[0006] Therefore, the utility model proposes a water cooling mechanism for an IGBT module to solve the above technical problems. Content of the Utility Model

[0007] The purpose of the utility model is to solve the above technical problems and provide a water cooling mechanism for an IGBT module. By optimizing the design of the water cooling station and the water cooling plate, the utility model realizes the efficient heat dissipation of the IGBT module, improves its performance and stability, and at the same time simplifies the structure of the heat dissipation device, facilitating installation and maintenance.

[0008] The technical solution adopted by the utility model to solve the above technical problems is: a water cooling mechanism for an IGBT module, including a water cooling platform and a water cooling module. The water cooling module is fixed on the water cooling platform. The water cooling module includes a water cooling station and support columns. The support columns are installed below the four corners of the water cooling station. The top of the support column is connected to the water cooling station, and the bottom of the support column is connected to the water cooling platform.

[0009] Preferably, the water cooling station comprises a plurality of water cooling racks which are arranged in a matrix and installed above the water cooling platform, and the bottom of each water cooling rack is connected and fixed by four supporting columns.

[0010] Preferably, the water cooling rack includes water cooling pipes and water cooling plates, the water cooling plates are connected by the water cooling pipes, no gaps are left between the left and right adjacent water cooling plates, and circulation gaps are left between the front and rear adjacent water cooling plates.

[0011] Preferably, the water cooling plate is provided with water cooling grooves, and the number of the water cooling grooves is at least 4.

[0012] Preferably, the water cooling pipe includes a water inlet pipe, a circulation pipe and a water outlet pipe, one end of the water inlet pipe is connected to the side of the water cooling plate, and the other end is connected to the water inlet, both ends of the circulation pipe are connected to the sides of two different water cooling plates, one end of the water outlet pipe is connected to the bottom of the water cooling plate, and the other end is connected to the water outlet.

[0013] Preferably, the water-cooling plate further comprises a water-cooling frame and a water-cooling circulation layer, the water-cooling trough is installed above the water-cooling frame, and the hollow portion formed by the installation of the water-cooling frame and the water-cooling trough is the water-cooling circulation layer.

[0014] Preferably, the middle portion of the water cooling tank is a hollow layer, and both sides of the hollow layer are heat conducting parts, which are in contact with both ends of the workpiece that needs water cooling for heat conduction.

[0015] The beneficial effects of the utility model are:

[0016] The utility model realizes efficient heat dissipation of IGBT modules by optimizing the design of water cooling stations and water cooling plates. The water cooling stations use water cooling racks arranged in a matrix, so that each module can obtain a uniform cooling effect, thereby effectively reducing the operating temperature of the module and improving its performance and stability;

[0017] The water cooling mechanism of the utility model has a simple structure and is easy to install. The water cooling station is fixed on the water cooling platform through the support column, which not only improves the stability of the mechanism, but also simplifies the installation steps and reduces the manufacturing cost. The water cooling plate includes a water cooling tank, a water cooling frame and a water cooling circulation layer, so that the cooling water can circulate therein and effectively take away the heat. At the same time, the heat conduction part of the water cooling tank contacts the two ends of the workpiece that needs water cooling for heat conduction, realizing the rapid transfer and dissipation of heat;

[0018] The water cooling mechanism of the utility model has the advantages of low noise and large heat dissipation, is suitable for power electronic devices with high power density and compact structure, and meets the high requirements of IGBT modules for heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a schematic structural diagram of the water-cooling module of the present utility model;

[0021] Figure 3 It is a schematic internal structure diagram of the water-cooling frame of the present utility model.

[0022] In the figure: 1. Water-cooling platform, 2. Water-cooling module, 21. Water-cooling station, 211. Water-cooling frame, 2111. Water-cooling pipe, 21111. Water inlet pipe, 21112. Circulation pipe, 21113. Water outlet pipe, 2112. Water-cooling plate, 21121. Water-cooling groove, 21122. Water-cooling frame, 21123. Water-cooling circulation layer, 21124. Hollow layer, 21125. Heat-conducting layer, 22. Support column. Specific implementation mode

[0023] The following further describes the present utility model in conjunction with the accompanying drawings and implementation modes.

[0024] As Figures 1 - 3 shown, a water-cooling mechanism for an IGBT module of the present utility model includes a water-cooling platform 1 and a water-cooling module 2. The water-cooling module 2 is fixed on the water-cooling platform 1. The water-cooling module 2 includes a water-cooling station 21 and support columns 22. The support columns 22 are installed below the four corners of the water-cooling station 21. The top of the support columns 22 is connected to the water-cooling station 21, and the bottom of the support columns 22 is connected to the water-cooling platform 1.

[0025] By adopting the above technical solution, through the structural design of the water-cooling station 21 and the support columns 22, the water-cooling module 2 can be stably fixed on the water-cooling platform 1, ensuring that the cooling water can circulate effectively, dissipating heat from the IGBT module efficiently, significantly reducing the working temperature of the IGBT module, and improving its performance and stability.

[0026] The water-cooling station 21 includes a number of water-cooling frames 211. The water-cooling frames 211 are arranged in a matrix above the water-cooling platform 1. The bottom of each water-cooling frame 211 is connected and fixed by four support columns 22.

[0027] By adopting the above technical solution, the water-cooling frames 211 are arranged in a matrix, enabling each IGBT module to be cooled evenly and efficiently, ensuring that heat is evenly distributed among the modules, avoiding local overheating, thereby improving the uniformity and effect of heat dissipation. The bottom of each water-cooling frame 211 is connected and fixed by four support columns 22, which not only increases the stability of the water-cooling frame but also reduces the impact on the water-cooling mechanism caused by external vibration or shock.

[0028] The water-cooling rack 211 includes water-cooling pipes 2111 and water-cooling plates 2112. The water-cooling plates 2112 are connected by the water-cooling pipes 2111. There is no gap between the adjacent water-cooling plates 2112 on the left and right, and there is a circulating gap between the adjacent water-cooling plates 2112 in the front and back.

[0029] By adopting the above technical solution, the water-cooling plates 2112 are closely arranged without gaps, enabling heat to be quickly transferred and diffused between the water-cooling plates, which helps improve the heat dissipation efficiency, reduce the possibility of heat accumulation in local areas, and thus ensure the stable operation of the IGBT module.

[0030] The water-cooling plate 2112 is provided with water-cooling grooves 21121, and the number of the water-cooling grooves 21121 is at least 4.

[0031] The water-cooling pipe 2111 includes a water inlet pipe 21111, a circulating pipe 21112, and a water outlet pipe 21113. One end of the water inlet pipe 21111 is connected to the side of the water-cooling plate 2112, and the other end is connected to the water inlet. Both ends of the circulating pipe 21112 are connected to the sides of two different water-cooling plates 2112. One end of the water outlet pipe 21113 is connected to the bottom of the water-cooling plate 2112, and the other end is connected to the water outlet.

[0032] By adopting the above technical solution, the water inlet pipe 21111 introduces cooling water into the water-cooling plate 2112. The circulating pipe 21112 ensures that the cooling water can flow smoothly between different water-cooling plates. The water outlet pipe 21113 discharges the heat-absorbed cooling water from the system, ensuring the continuous and efficient circulation of the cooling water, thereby realizing the effective heat dissipation of the IGBT module. By connecting different water-cooling plates 2112 with the circulating pipe 21112, the cooling water can flow evenly through each water-cooling plate, ensuring that each IGBT module can be evenly cooled, avoiding local overheating, and improving the uniformity of the heat dissipation effect.

[0033] The water-cooling plate 2112 further includes a water-cooling frame 21122 and a water-cooling circulation layer 21123. The water-cooling grooves 21121 are installed above the water-cooling frame 21122, and the hollow part formed by the installation of the water-cooling frame 21122 and the water-cooling grooves 21121 is the water-cooling circulation layer 21123.

[0034] By adopting the above technical solution, the cold grooves 21121 directly contact and fit the two ends of the IGBT module to be cooled, effectively transferring the heat generated by the module to the cooling water. The water-cooling circulation layer 21123 serves as a channel for the cooling water to flow, ensuring that the cooling water can fully contact and absorb this heat, thereby realizing efficient heat conduction and heat dissipation.

[0035] The middle part of the water-cooling groove 21121 is a hollow layer 21124, and both sides of the hollow layer 21124 are heat-conducting parts 21125, which are in contact with the two ends of the workpiece to be water-cooled for heat conduction.

[0036] By adopting the above technical solution, the heat conduction part 21125 is directly in contact with both ends of the workpiece that needs water cooling, and can quickly and effectively conduct the heat generated by the workpiece to the water cooling tank. The direct contact method reduces the resistance of heat transfer and improves the efficiency of heat transfer. The hollow layer 21124 provides a space for heat dissipation.

[0037] When the present utility model is specifically implemented, first, the staff places the IGBT module to be cooled on the robot operating table, and ensures that both the water cooling platform 1 and the water cooling module 2 are in normal working states. At the same time, check whether the water source supply of the water cooling system is sufficient, and ensure that the water inlet and outlet are unobstructed.

[0038] Then, the robot starts to work. It clamps and precisely places the IGBT module or other workpiece to be cooled in the water cooling tank 21121 of the water cooling station 21. At this time, both ends of the workpiece are in close contact with the heat conduction part 21125 of the water cooling tank 21121, ensuring that heat can be effectively transferred to the water cooling system.

[0039] Subsequently, the cooling water enters from the water inlet and flows into the water cooling plate 2112 through the water inlet pipe 21111. The cooling water flows inside the water cooling plate 2112 and exchanges heat with the heat conduction part 21125 of the workpiece through the hollow layer 21124 of the water cooling tank 21121. During this process, the heat of the workpiece is transferred to the cooling water, thereby achieving the cooling effect.

[0040] At the same time, the cooling water circulates between the water cooling plates 2112 through the circulation pipe 21112, ensuring that heat can be evenly distributed and effectively transferred to the entire water cooling system. The design of the circulation pipe 21112 enables the cooling water to flow between different water cooling plates 2112, thereby improving the heat dissipation efficiency of the entire water cooling system.

[0041] Finally, the cooling water that has undergone heat exchange flows out through the water outlet pipe 21113 and is discharged from the water outlet, completing a complete cooling cycle. At this time, the temperature of the cooled IGBT module or other workpiece has been reduced to the set range, and the robot picks it up and places it at the designated position, completing the entire cooling process.

[0042] During the entire working process, the water cooling module 2 is fixed by the water cooling station 21 and the support column 22, ensuring the stability and reliability of the cooling process. The design of the water cooling plate 2112 and the water cooling tank 21121 enables heat to be effectively transferred and dissipated, thereby achieving the rapid cooling of the IGBT module.

[0043] The various embodiments in the specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts between the various embodiments, reference can be made to each other.

[0044] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. An IGBT module water cooling mechanism, characterized in that: The invention comprises a water cooling platform (1) and a water cooling module (2), wherein the water cooling module (2) is fixed on the water cooling platform (1), and the water cooling module (2) comprises a water cooling station (21) and a support column (22), wherein the support column (22) is installed below the four corners of the water cooling station (21), the top of the support column (22) is connected to the water cooling station (21), and the bottom of the support column (22) is connected to the water cooling platform (1).

2. The IGBT module water cooling mechanism according to claim 1, characterized in that: The water cooling station (21) comprises a plurality of water cooling racks (211), which are arranged in a matrix and installed above the water cooling platform (1), and the bottom of each water cooling rack (211) is connected and fixed by four support columns (22).

3. The IGBT module water cooling mechanism according to claim 2, characterized in that: The water cooling rack (211) comprises a water cooling pipe (2111) and a water cooling plate (2112); the water cooling plates (2112) are connected via the water cooling pipe (2111); no gap is left between the left and right adjacent water cooling plates (2112); and a circulation gap is left between the front and rear adjacent water cooling plates (2112).

4. The IGBT module water cooling mechanism according to claim 3, characterized in that: The water cooling plate (2112) is provided with water cooling grooves (21121), and the number of the water cooling grooves (21121) is at least 4.

5. The IGBT module water cooling mechanism according to claim 3, characterized in that: The water cooling pipe (2111) comprises a water inlet pipe (21111), a circulation pipe (21112) and a water outlet pipe (21113); one end of the water inlet pipe (21111) is connected to the side of the water cooling plate (2112), and the other end is connected to the water inlet; both ends of the circulation pipe (21112) are connected to the sides of two different water cooling plates (2112); one end of the water outlet pipe (21113) is connected to the bottom of the water cooling plate (2112), and the other end is connected to the water outlet.

6. The IGBT module water cooling mechanism according to claim 3, characterized in that: The water-cooling plate (2112) further comprises a water-cooling frame (21122) and a water-cooling circulation layer (21123); the water-cooling groove (21121) is installed above the water-cooling frame (21122); and a hollow portion formed by the installation of the water-cooling frame (21122) and the water-cooling groove (21121) is the water-cooling circulation layer (21123).

7. The IGBT module water cooling mechanism according to claim 4, characterized in that: The middle part of the water cooling groove (21121) is a hollow layer (21124), and both sides of the hollow layer (21124) are heat conducting parts (21125), and the heat conducting parts (21125) are in contact with both ends of a workpiece that needs water cooling for heat conduction.

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