SOP frame structure for motor driving module

Abstract

The utility model provides an SOP frame structure used for a motor driving module, and relates to the semiconductor device field, a frame unit comprises a first metal frame, a second metal frame and a third metal frame which are arranged in sequence, one side edge of the first metal frame extends towards the direction of the second metal frame to form an extension edge strip, and the other side edge of the first metal frame extends towards the direction of the third metal frame. The first metal frame is provided with an extension edging, the second metal frame is provided with an abdicating gap corresponding to the extension edging, the first metal frame and the extension edging are respectively led out towards the same side of the frame unit to form two direct connection pins, the third metal frame is led out towards the side of the frame unit to form two direct connection pins, and the second metal frame is led out towards the other side of the frame unit to form two direct connection pins; the first metal frame and the third metal frame are respectively provided with a first base island used for placing a power chip, and the second metal frame is provided with a second base island used for placing a master control IC chip. According to the utility model, the boundary dimension of the motor driving module based on the frame structure can be reduced, and miniaturization of a product is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a SOP frame structure for a motor drive module. Background Art

[0002] With the continuous development of electronic products, the output of electronic products is getting higher and higher, the product models are diversified, and the competition is becoming increasingly fierce. The requirements for high density, high strength, high heat dissipation, and low cost of product packaging are also getting higher and higher. In addition, the power of electronic products is getting higher and higher, while the size is constantly decreasing, which puts higher and higher requirements on the size and heat dissipation of components.

[0003] For example, in the motor drive products of high-speed hair dryers, some products use two built-in power MOSFETs, high-voltage gate drive circuits HVIC and a bootstrap diode, such as the CS5764SCO half-bridge IPM module, which simplifies the peripheral circuits and reduces the space occupied on the PCB board. However, the dimensions of such products can generally be 9.9*7.5mm. For some miniaturized products with small PCB space, their dimensions still limit the application range of the products.

[0004] Therefore, how to integrate high power, strong heat dissipation and small size technology in a limited space has become a trend that the industry is paying more attention to. Utility Model Content

[0005] In view of the above problems existing in the prior art, the utility model provides a SOP frame structure for a motor drive module with a smaller packaging size, which is more conducive to the miniaturization of the product.

[0006] The utility model solves the above-mentioned technical problem with the following technical solution: A SOP frame structure for a motor drive module, characterized in that it comprises a plurality of frame units arranged in an array, wherein the frame unit comprises a first metal frame, a second metal frame, and a third metal frame arranged in sequence, one side of the first metal frame extends toward the second metal frame to form an extended side strip, and the second metal frame is provided with a clearance gap corresponding to the extended side strip, the first metal frame and the extended side strip are respectively led out to the same side of the frame unit to form two direct-connection pins, the third metal frame is led out to the side of the frame unit to form two direct-connection pins, and the second metal frame is led out to the other side of the frame unit to form two direct-connection pins;

[0007] The first metal frame and the third metal frame are respectively provided with a first base island for placing a power chip, and the second metal frame is provided with a second base island for placing a main control IC chip.

[0008] In one embodiment of the present utility model, the first base island is a sunken base island, which is used to protrude from the plastic package body in the plastic encapsulated product. Preferably, lock rubber steps are provided on the bottom surfaces of both first base islands.

[0009] In another embodiment of the present utility model, the inner ends of two directly connected pins led out by the first metal frame and the extended edge strip are connected to each other to form a one-piece structure, and the inner ends of two directly connected pins led out by the third metal frame are connected to each other to form a one-piece structure.

[0010] Furthermore, the frame unit further includes a plurality of independent pins that are independent of the first metal frame, the second metal frame, and the third metal frame. The independent pins and the directly connected pins together form a 14-pin position of the frame unit.

[0011] Even further, a safe creepage distance is maintained between the directly connected pin led out by the first metal frame and the adjacent independent pin.

[0012] Even further, a safe creepage distance is maintained between the directly connected pin led out by the extended edge strip and the directly connected pin led out by the third metal frame.

[0013] The beneficial effects of the present utility model are as follows: By changing the frame structure, the present utility model provides a frame unit including a first metal frame, a second metal frame, and a third metal frame arranged in sequence. The shapes of the metal frames cooperate with each other and are respectively used to place two power chips and a main control IC chip. This can reduce the external dimensions of the motor drive module based on this frame structure, making it more conducive to the miniaturization of the product, and can also achieve the sharing of the same type of injection mold, improving efficiency and saving the development costs of the frame and the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of a single frame unit according to Embodiment 1 of the present utility model;

[0015] Figure 2 is a schematic structural diagram of an application case according to Embodiment 1 of the present utility model;

[0016] Figure 3 is a schematic structural diagram of a single frame unit according to Embodiment 2 of the present utility model;

[0017] Figure 4 is a schematic structural diagram of an application case according to Embodiment 2 of the present utility model;

[0018] In the figure: 1. Pin 1, 2. Pin 2, 3. Pin 3, 4. Pin 4, 5. Pin 5, 6. Pin 6, 7. Pin 7, 8. Pin 8, 9. Pin 9, 10. Pin 10, 11. Pin 11, 12. Pin 12, 13. Pin 13, 14. Pin 14, 100. First metal frame, 101. Extended edge strip, 110. First base island, 111. Glue locking step, 200. Second metal frame, 210. Second base island, 300. Third metal frame, 400. Power chip, 500. Main control IC chip, 600. Plastic package. DETAILED DESCRIPTION

[0019] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0020] Example 1

[0021] like Figure 1 As shown, the SOP frame structure for the motor drive module of the present embodiment includes a plurality of frame units arranged in an array, wherein the frame unit includes a first metal frame 100, a second metal frame 200, and a third metal frame 300 arranged in sequence, one side of the first metal frame 100 extends toward the second metal frame 200 to form an extended side strip 101, and the second metal frame 200 is provided with a clearance gap 201 corresponding to the extended side strip 101, the first metal frame 100 and the extended side strip 101 are respectively led to the same side of the frame unit to form two direct-connected pins, i.e., pin two 2 and pin four 4 shown in the figure, the third metal frame 300 is led to the side of the frame unit to form two direct-connected pins, i.e., pin five 5 and pin six 6 shown in the figure, and the second metal frame 200 is led to the other side of the frame unit to form two direct-connected pins, i.e., pin ten 10 and pin eleven 11 shown in the figure;

[0022] The first metal frame 100 and the third metal frame 300 are respectively provided with a first base island 110 for placing the power chip 400 , and the second metal frame 200 is provided with a second base island 210 for placing the main control IC chip 500 .

[0023] In this embodiment, the two first base islands 110 are both sunken base islands, and this structure makes them protrude from the plastic packaging body in the plastic packaging product to increase heat dissipation. The bottom surfaces of the two first base islands 110 are both provided with glue locking steps 111 to strengthen the connection between the base islands and the plastic packaging material and enhance its stability.

[0024] The frame unit further includes a plurality of independent pins that are independent of the first metal frame 100, the second metal frame 200, and the third metal frame 300, namely, pin 1 and pin 3 on the same side as pin 2 in the figure, and pin 7, pin 8, pin 9, pin 12, pin 13, and pin 14 on the same side as pin 10 in the figure. The eight independent pins and the six direct connection pins together form the 14-pin positions of the frame unit. Among them, a safety creepage distance is maintained between pin 1 and pin 2, and a safety creepage distance is maintained between pin 4 and pin 5.

[0025] One application case of the above frame structure, the motor drive module, is shown in Figure 2 As shown, it includes a plastic package 600 and the above three metal frames, two power chips, and a main control IC chip encapsulated in the plastic package 600. Among them, the power chips use MOS devices. The two power chips are respectively placed on the base islands on the first metal frame and the third metal frame, and the bottom surfaces of the first metal frame 100 and the third metal frame 300 are exposed from the plastic package 600, and the stability and reliability of their exposed parts are enhanced through the potting step 111. The main control IC chip is placed on the second metal frame. The connection of the power chips and the main control IC chip in the plastic package is shown in Figure 2 As shown, each pin is led out of the plastic package, making the plastic package in an SOP14 package. Based on the SOP frame structure of this solution, the external dimensions of the motor drive module are 9.9 * 3.9 mm, which greatly reduces the external dimensions of the motor drive module and its occupied area on the PCB board compared with the prior art, and is more conducive to the miniaturization of the product.

[0026] Embodiment 2

[0027] The structure of this embodiment is basically the same as that of Embodiment 1. The difference is that the two first base islands 110 are of a planar base island structure. After potting, the first base island does not protrude from the plastic package, and the inner ends of pin 2 and pin 4 are connected to form a one-piece structure, and the inner ends of pin 5 and pin 6 are connected to form a one-piece structure to increase the heat dissipation.

Claims

1. A SOP framework structure for a motor drive module, characterized in that: The invention comprises a plurality of frame units arranged in an array, wherein the frame unit comprises a first metal frame, a second metal frame, and a third metal frame arranged in sequence, wherein one side of the first metal frame extends toward the second metal frame to form an extended side strip, and the second metal frame is provided with a clearance gap corresponding to the extended side strip, wherein the first metal frame and the extended side strip are respectively led out to the same side of the frame unit to form two direct connection pins, the third metal frame is led out to the side of the frame unit to form two direct connection pins, and the second metal frame is led out to the other side of the frame unit to form two direct connection pins; The first metal frame and the third metal frame are respectively provided with a first base island for placing a power chip, and the second metal frame is provided with a second base island for placing a main control IC chip.

2. The SOP frame structure of the motor drive module according to claim 1, characterized in that: The first base island is a sunken base island, which is used to protrude from the plastic packaging body in the plastic packaging product.

3. The SOP frame structure of the motor drive module according to claim 2, characterized in that: The bottom surfaces of the two first base islands are both provided with glue locking steps.

4. The SOP framework structure of the motor drive module according to claim 1, characterized in that: The inner ends of the two direct-connection pins led out from the first metal frame and the extended side strip are connected to each other to form a one-piece structure, and the inner ends of the two direct-connection pins led out from the third metal frame are connected to each other to form a one-piece structure.

5. The SOP frame structure of the motor drive module according to claim 1, 2 or 4, characterized in that: The frame unit also includes a plurality of independent pins that are independent of the first metal frame, the second metal frame, and the third metal frame. The independent pins and the direct connection pins together constitute 14 pins of the frame unit.

6. The SOP frame structure of the motor drive module according to claim 1, characterized in that: A safe creepage distance is maintained between the direct connection pins led out from the first metal frame and the independent pins arranged adjacent to the direct connection pins.

7. The SOP frame structure of the motor drive module according to claim 1, characterized in that: A safe creepage distance is maintained between the direct connection pins led out from the extended edge bar and the direct connection pins led out from the third metal frame.

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