Electronic package

Abstract

An electronic package includes: a carrier structure; the photoelectric module is arranged on the bearing structure and electrically connected with the bearing structure, and the photoelectric module comprises a photoelectric element and a first packaging layer used for wrapping the photoelectric element; the at least one first transceiving module comprises a first optical signal transmission unit; the first semiconductor element is arranged on the bearing structure and is electrically connected with the bearing structure; and the heat dissipation piece is connected to the first semiconductor element, and the first transceiving module is connected and fixed to the heat dissipation piece. Through the implementation of the invention, the number of optical fibers connected with the electronic packaging piece can be increased, so that the amount of data which can be transmitted and received by the electronic packaging piece in unit time can be greatly increased, and the data transmission and processing speed of the electronic packaging piece can be remarkably improved.

Description

Technical Field

[0001] This application relates to a semiconductor device, particularly an electronic package with a photon component. Background Art

[0002] After experiencing the evolution of generations such as personal computers, mobile communications, and artificial intelligence (AI), and due to the stimulation of changes in life and culture such as mobile Internet access, online shopping, video and audio streaming, and online games, etc., the modern communication technology's eagerness for communication bandwidth has become increasingly urgent. As a result, optical fibers have begun to largely replace copper cables.

[0003] In order to respond to the above trends and developments, the semiconductor industry has also developed various semiconductor components for optical fiber communication to connect with optical fibers and receive and transmit optical signals through optical fibers for the transmission of a large amount of data. However, due to the limitations of their packaging technology and structure, most of the existing semiconductor components for optical communication can only connect one optical fiber. Therefore, the transmission speed of existing optical fiber communication (i.e., the amount of data transmitted per unit time) has encountered a bottleneck and is gradually insufficient for use, let alone coping with the rapidly and significantly increasing data transmission requirements of future technologies and products.

[0004] Therefore, how to overcome the problems of the above-mentioned existing technologies has actually become an urgent issue to be solved currently. Utility Model Content

[0005] In view of the various deficiencies of the above-mentioned existing technologies, this application provides an electronic package, including: a carrier structure; an optoelectronic module, which is disposed on the carrier structure and electrically connected to the carrier structure, and the optoelectronic module includes an optoelectronic element and a first encapsulation layer for encapsulating the optoelectronic element; a first semiconductor element, which is disposed on the carrier structure and electrically connected to the carrier structure; a heat sink, which is connected to the first semiconductor element; and at least one first transceiver module, which includes a first optical signal transmission unit, is connected and fixed to the heat sink, and is fixedly connected to at least one first optical fiber to receive and transmit optical signals, wherein the first optical signal transmission unit is between the at least one first optical fiber and the optoelectronic element to transmit optical signals.

[0006] In the aforementioned electronic package, the at least one first transceiver module protrudes upward and is exposed outside the heat sink.

[0007] In the aforementioned electronic package, the optoelectronic element contains at least one first coupler, and the at least one first coupler corresponds to the first optical signal transmission unit.

[0008] The foregoing electronic package further includes at least one second transceiver module fixedly connected to the heat sink, the at least one second transceiver module is fixedly connected to at least one second optical fiber to receive and transmit optical signals, and the at least one second transceiver module includes a second optical signal transmission unit disposed between the at least one second optical fiber and the optoelectronic element to transmit optical signals.

[0009] In the foregoing electronic package, the optoelectronic element contains at least one first coupler, and the at least one first coupler corresponds to the first optical signal transmission unit and the second optical signal transmission unit.

[0010] In the foregoing electronic package, the optoelectronic element contains at least one first coupler and at least one second coupler, the at least one first coupler corresponds to the first optical signal transmission unit, and the at least one second coupler corresponds to the second optical signal transmission unit.

[0011] In the foregoing electronic package, the optoelectronic element is a Photonic Integrated Circuit (PIC for short).

[0012] In the foregoing electronic package, the first semiconductor element is an Electronic Integrated Circuit (EIC for short).

[0013] In the foregoing electronic package, the at least one first transceiver module includes a Fiber Array Unit (FAU for short).

[0014] In the foregoing electronic package, the first optical signal transmission unit includes a total reflection mirror.

[0015] In the foregoing electronic package, the optoelectronic module further includes a second semiconductor element.

[0016] In the foregoing electronic package, the second semiconductor element is an electronic integrated circuit.

[0017] In the foregoing electronic package, the second optical signal transmission unit includes a waveguide array.

[0018] In the foregoing electronic package, the at least one second transceiver module is fixedly connected to the bottom side of the top of the heat sink.

[0019] As can be seen from the above, the electronic package of the present application can significantly increase the amount of data that can be received and transmitted by the electronic package per unit time by providing a plurality of transceiver modules for receiving and transmitting optical signals, and each transceiver module can be connected to a plurality of optical fibers, thereby significantly improving the data transmission and processing speed of the electronic package. Description of the Drawings

[0020] Figure 1-1 It is a cross-sectional schematic diagram of an embodiment of the present application.

[0021] Figure 1-2 It is a cross-sectional schematic diagram of another embodiment of the present application.

[0022] Figure 2A It is a front view schematic diagram of the first transceiver module and the heat sink.

[0023] Figure 2B-1 It is a front view schematic diagram of the second transceiver module and the heat sink.

[0024] Figure 2B-2 It is a front view schematic diagram of a variation example of the second transceiver module and the heat sink.

[0025] Description of main component symbols

[0026] 1 Electronic package

[0027] 10 Carrier structure

[0028] 20 Optoelectronic module

[0029] 21 Optoelectronic element

[0030] 211 First coupler

[0031] 212 Second coupler

[0032] 22 First encapsulation layer

[0033] 23 Second semiconductor element

[0034] 30 First transceiver module

[0035] 31 First optical signal transmission unit

[0036] 311 Total reflection mirror

[0037] 312 Collimating mirror

[0038] 40 Second transceiver module

[0039] 41 Second optical signal transmission unit

[0040] 411 Waveguide array

[0041] 50 First semiconductor element

[0042] 60 Heat sink

[0043] 61 Tenon

[0044] 62 Opening

[0045] 63 Slide groove

[0046] 64 Thermal interface material

[0047] OF1 First optical fiber

[0048] OF2 Second optical fiber. Detailed implementation manners

[0049] The following uses specific specific embodiments to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0050] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limited conditions that the present application can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application. At the same time, the terms such as "upper", "first", "second", "third", "one", etc. cited in this specification are only for the convenience of clear narration, and are not used to limit the scope that the present application can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope that the present application can be implemented.

[0051] Figure 1-1 It is a cross-sectional schematic diagram of an embodiment of the electronic package 1 of the present application. As Figure 1-1 shown, this embodiment provides an electronic package 1, which includes: a carrier structure 10, an optoelectronic module 20, at least one first transceiver module 30, a first semiconductor element 50, and a heat sink 60.

[0052] The carrier structure 10 is a substrate, such as a silicon substrate, a glass substrate or a circuit board. One or more circuit layers (not shown in the figure), such as redistribution layers (RDL), are formed in the carrier structure 10, depending on the application requirements and / or design. This embodiment does not make any limitations in this regard.

[0053] The optoelectronic module 20 is disposed on the carrier structure 10 and electrically connected to the carrier structure 10. For example, when the carrier structure 10 contains one or more circuit layers as described above, the optoelectronic module 20 can be electrically connected to one or more of the circuit layers. The optoelectronic module 20 includes an optoelectronic element 21, and an optoelectronic element 21 is coated with a first encapsulation layer 22 to form an encapsulation module. The optoelectronic element 21 is, for example, a photonic integrated circuit (Photonic IC, abbreviated as PIC), and its function is to convert an optical signal into an electrical signal or convert an electrical signal into an optical signal.

[0054] The first transceiver module 30 includes a first optical signal transmission unit 31, and one or more first optical fibers OF1 are fixedly connected by structures such as guiding pins (not shown in the figure), and the first optical signal transmission unit 31 corresponds to the first optical fiber(s) OF1 to mutually transmit optical signals. When the first transceiver module 30 is connected to multiple first optical fibers OF1, a fiber array unit (abbreviated as FAU) may be included to be connected to the first optical fibers OF1.

[0055] The first optical signal transmission unit 31 may include a total reflection mirror, a waveguide tube, or a waveguide array, or any combination of these components, so as to transmit the optical signal received by the first transceiver module 30 from the first optical fiber OF1 to the optoelectronic element 21 in the optoelectronic module 20, and then convert the optical signal into an electronic signal through the optoelectronic element 21. In this embodiment, a total reflection mirror 311 is provided in the first optical signal transmission unit 31 as an example.

[0056] The first semiconductor element 50 is disposed on the carrier structure 10 and electrically connected to the carrier structure 10. The first semiconductor element 50 is, for example, an electronic integrated circuit (abbreviated as EIC), and its selection terminal depends on the function and / or circuit design requirements, without any special restrictions.

[0057] The heat sink 60 can be connected to the first semiconductor element 50 through a thermal interface material (abbreviated as TIM) layer 64, and the optoelectronic module 20 and the heat sink 60 can also be connected through a thermal interface material layer 64 to dissipate the heat generated by the first semiconductor element 50 and the optoelectronic module 20 during operation to the external environment. The heat sink 60 is fixed on the carrier structure 10, and the first transceiver module 30 is fixedly connected to the heat sink 60.

[0058] In this embodiment, the first transceiver module 30 is clamped above the heat sink 60 by a tenon 61 and protrudes upward and is exposed outside the heat sink 60. Of course, the first transceiver module 30 can also be fixed to the heat sink 60 by other types of fixing mechanisms or fixing methods, and this embodiment has no special restrictions on this.

[0059] The heat sink 60 is provided with an opening 62 for the optical signal to be transmitted between the total reflection mirror 311 and the optoelectronic element 21. In this embodiment, when the optical signal enters the first transceiver module 30 from the first optical fiber OF1, it first travels to the total reflection mirror 311 in the first optical signal transmission unit 31. After passing through the total reflection mirror 311, the optical signal is reflected by total internal reflection (TIR) from traveling along the horizontal direction to traveling vertically towards the optoelectronic element 21. A collimator 312 can also be provided between the total reflection mirror 311 and the optoelectronic element 21 to enable the optical signal to be correctly aligned and transmitted to the optoelectronic element 21. Then, the optoelectronic element 21 converts the received optical signal into an electrical signal, and then the converted electrical signal is transmitted to the first semiconductor element 50 through the electrical connection between the optoelectronic module 20 and the carrier structure 10 for subsequent processing. This is the process of receiving signals. Of course, the electrical signal generated by the first semiconductor element 50 can also be converted into an optical signal through the reverse path and process and then transmitted out by the optical fiber for signal transmission, which will not be elaborated here.

[0060] More specifically, the optoelectronic element 21 contains at least one first coupler 211. The first coupler 211 corresponds to the first optical signal transmission unit 31 and the first optical fiber OF1 fixedly connected thereto. When the optical signal passes through the total reflection mirror 311 and the collimator 312 in the first optical signal transmission unit 31 from the first optical fiber OF1, it enters and is received by the first coupler 211 of the optoelectronic element 21. Conversely, when sending a signal, after the electrical signal is converted into an optical signal in the optoelectronic element 21, the converted optical signal is emitted from the first coupler 211 and output along the aforementioned path but in the opposite direction through the collimator 312, the total reflection mirror 311 and the first optical fiber OF1.

[0061] The number of the first couplers 211 can be one or more. For example, when there is only one first transceiver module 30 and the first transceiver module 30 is only connected to one first optical fiber OF1, naturally only one first coupler 211 needs to be provided in the optoelectronic element 21. However, when a first transceiver module 30 is connected to multiple first optical fibers OF1, or as Figure 2A shown, when multiple first transceiver modules 30 are respectively connected to a first optical fiber OF1, only one first coupler 211 capable of receiving and transmitting the optical signals of all the first optical fibers OF1 can be provided in the optoelectronic element 21, or multiple first couplers 211 respectively receiving and transmitting the optical signals of different first optical fibers OF1 can be provided, both of which are adoptable configuration methods. Specifically, which method is to be used to configure the first coupler 211 depends on the design and / or functional requirements and there is no particularity.

[0062] In addition, the electronic package 1 provided in this embodiment may further include at least one second transceiver module 40. The second transceiver module 40 is also fixedly connected to the heat sink 60. In this embodiment, one side of the top of the heat sink 60 protrudes outward beyond the carrier structure 10, and the second transceiver module 40 is mechanically connected to the bottom side of the part of the top of the heat sink 60 that protrudes beyond the carrier structure 10, and can be fixed there through a structure such as a chute 63 as shown in Figure 2B-1 or Figure 2B-2 .

[0063] The second transceiver module 40 can also be fixedly connected to one or more second optical fibers OF2, and the second transceiver module 40 includes a second optical signal transmission unit 41. The second optical signal transmission unit 41 is between the one or more second optical fibers OF2 and the optoelectronic element 21 so that optical signals can be transmitted between the second optical fibers OF2 and the optoelectronic element 21, so that the optoelectronic element 21 can convert the optical signal into an electronic signal and then transmit it to the first semiconductor element 50, or convert the electronic signal from the first semiconductor element 50 into an optical signal and then transmit it to the second transceiver module 40 through the second optical signal transmission unit 41, and then emit it through the second optical fiber OF2.

[0064] The second optical signal transmission unit 41 can also include a total reflection mirror, a waveguide tube or a waveguide array 411 or any combination of these components. In this embodiment, the waveguide array 411 is taken as an example. As for the mechanism and process of the electronic package 1 transceiving signals through the optoelectronic module 20 and the second transceiver module 40, they are almost exactly the same as the principles, mechanisms and processes of transceiving signals through the optoelectronic module 20 and the first transceiver module 30, so they will not be repeated here.

[0065] In one embodiment, as shown in Figure 1-2 , at least one second coupler 212 can also be provided in the optoelectronic module 20. Similarly, the second coupler 212 can be arranged in such a way that one second coupler 212 corresponds to one second transceiver module 40, one second coupler 212 corresponds to multiple second transceiver modules 40, or multiple second couplers 212 correspond to multiple second transceiver modules 40 respectively (as shown in Figure 2B-2 ), etc., which will not be repeated here.

[0066] In addition, in some variant embodiments, the optoelectronic module 20 may further include a second semiconductor element 23. The second semiconductor element 23 may also be an electronic integrated circuit. Since the second semiconductor element 23 is also disposed within the optoelectronic module 20 and is relatively close to the optoelectronic element 21, it can process the electronic signals entering and leaving the optoelectronic element 21 more quickly. Alternatively, the second semiconductor element 23 may also be a memory element and is used for buffering the electronic signals entering and leaving the optoelectronic element 21. This embodiment has no limitations in this regard.

[0067] In summary, for the electronic package of the present application, by providing one or more first transceiver modules and / or one or more second transceiver modules on the heat sink, and each first transceiver module or second transceiver module can be connected to one or more optical fibers (including the first optical fiber and the second optical fiber), the amount of data that the electronic package can transmit and receive per unit time can be significantly increased, thereby significantly improving the data transmission and processing speed of the electronic package.

[0068] The above embodiments are used to exemplarily illustrate the principles and effects of the present application, rather than to limit the present application. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the rights protected by the present application shall be as set forth in the claims.

Claims

1. An electronic package, characterized in that: include: load-bearing structure; An optoelectronic module is disposed on the supporting structure and electrically connected to the supporting structure, and the optoelectronic module comprises an optoelectronic element and a first packaging layer for covering the optoelectronic element; A first semiconductor element is disposed on the supporting structure and electrically connected to the supporting structure; A heat sink connected to the first semiconductor element; as well as At least one first transceiver module includes a first optical signal transmission unit, which is connected and fixed on the heat sink and fixed with at least one first optical fiber to transmit and receive optical signals, wherein the first optical signal transmission unit is between the at least one first optical fiber and the optoelectronic element to transmit optical signals.

2. The electronic package according to claim 1, wherein: The at least one first transceiver module protrudes upward and is exposed outside the heat sink.

3. The electronic package according to claim 1, wherein: The photoelectric element contains at least one first coupler, and the at least one first coupler corresponds to the first optical signal transmission unit.

4. The electronic package according to claim 1, wherein: The electronic package also includes at least one second transceiver module connected and fixed to the heat sink, the at least one second transceiver module is fixedly connected to at least one second optical fiber to transmit and receive optical signals, and the at least one second transceiver module includes a second optical signal transmission unit between the at least one second optical fiber and the optoelectronic element to transmit optical signals.

5. The electronic package as claimed in claim 4, characterized in that The optoelectronic element contains at least one first coupler, and the at least one first coupler corresponds to the first optical signal transmission unit and the second optical signal transmission unit.

6. The electronic package as claimed in claim 4, characterized in that The photoelectric element contains at least one first coupler and at least one second coupler, wherein the at least one first coupler corresponds to the first optical signal transmission unit, and the at least one second coupler corresponds to the second optical signal transmission unit.

7. The electronic package as claimed in claim 4, characterized in that: The second optical signal transmission unit includes a waveguide array.

8. The electronic package as claimed in claim 4, characterized in that The at least one second transceiver module is fixedly connected to the bottom side of the top of the heat sink.

9. The electronic package according to claim 1, wherein: The optoelectronic component is a photonic integrated circuit.

10. The electronic package according to claim 1, wherein: The first semiconductor element is an electronic integrated circuit.

11. The electronic package according to claim 1, wherein: The at least one first transceiver module includes an optical fiber array unit.

12. The electronic package according to claim 1, wherein: The first optical signal transmission unit includes a total reflection mirror.

13. The electronic package according to claim 1, wherein: The optoelectronic module further comprises a second semiconductor element.

14. The electronic package according to claim 13, wherein: The second semiconductor element is an electronic integrated circuit.

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