External interface temperature protection circuit board and structure

Abstract

The utility model relates to a plug-in interface temperature protection circuit board and structure. The plug-in interface temperature protection circuit board comprises a substrate, a power supply unit, an interface unit and a PTC temperature protection unit, the power supply unit is used for accessing a power supply, the interface unit is used for connecting external equipment, and the PTC temperature protection unit can change resistance along with temperature change; the substrate is provided with a connecting circuit used for connecting the power supply unit, the interface unit and the PTC temperature protection unit in series, and the PTC temperature protection unit is connected between the power supply unit and the interface unit in series. When the temperature of the substrate is abnormal due to environment temperature or short circuit, the temperature is coupled to the PTC temperature protection unit through conduction of substrate materials, media, air and the like, when the temperature exceeds the rated temperature, the impedance is increased, the current is reduced, and damage caused by abnormal work of a load host or external function equipment due to high temperature influence is prevented; and when the temperature returns to normal, the PTC impedance also returns to normal magnitude, so that the work of the host is not influenced, and the host and external equipment can normally supply power, charge or communicate.

Description

Technical Field

[0001] The present application relates to the temperature protection technology of external interfaces, and specifically to a temperature protection circuit board and structure for external interfaces. Background Art

[0002] External devices are plug-and-play devices. When an external device is connected to a host at the interface, during power connection such as charging and power supply, the interface contacts the charging PIN through metal contacts for charging or power supply communication. If there is foreign matter contact between the exposed contacts, when docking with the external device for charging, high voltage flows to low voltage through the conductive medium, causing short circuit between the positive and negative poles. The device and the host will generate high temperature, and the power demand at the load end exceeds the output power of the host, thereby causing damage to the host and the device.

[0003] For example, for the charging PIN on the mobile phone side, if there is a short circuit between two points by a metal medium on the periphery, high temperature will be generated during charging, damaging the host and the charging device; or power supply and voltage communication are in contact through multiple small contacts. Since the pins are relatively close, if a metal medium gets in, it is very easy to cause a short circuit and voltage backflow, resulting in abnormal operation or damage of the device.

[0004] When other metals get mixed in between the PINs or metal pins at the interface, causing a short circuit, voltage backflow, increased current, and increased temperature, which will cause abnormal operation or damage of the device. Summary of the Utility Model

[0005] The present application provides a temperature protection circuit board and structure for external interfaces to prevent abnormal operation and damage of the load host or external functional device caused by high temperature.

[0006] According to one aspect of the present application, in one embodiment, a temperature protection circuit board for an external interface is provided, including a substrate, and a power supply unit, an interface unit, and a PTC temperature protection unit arranged on the substrate;

[0007] The power supply unit is used to connect to a power source, the interface unit is used to connect to an external device, and the PTC temperature protection unit can change its resistance with temperature change; there is a connection circuit on the substrate for connecting the power supply unit, the interface unit, and the PTC temperature protection unit in series, and the PTC temperature protection unit is connected in series between the power supply unit and the interface unit.

[0008] In another embodiment, two groups of PTC temperature protection units are provided and are respectively connected in series on the positive and negative lines of the connection circuit.

[0009] In another embodiment, the PTC temperature protection unit is arranged close to the interface unit to sense the temperature at the interface unit.

[0010] In another embodiment, the PTC temperature protection unit includes a PTC thermistor.

[0011] In another embodiment, the PTC thermistor is soldered on the substrate and connected to a connection circuit.

[0012] In another embodiment, the power supply unit includes a plurality of pins connected to the connection circuit. The pins are set as power input terminals and are used to connect to an external power supply.

[0013] In another embodiment, a USB interface is provided at the pins for docking with an external power supply.

[0014] In another embodiment, the interface unit includes two charging contacts connected to the connection circuit. The charging contacts are set as external connection terminals for connecting to an external device.

[0015] In another embodiment, a Pogo pin is provided at the charging contacts. One end of the Pogo pin is set on the substrate and connected to the connection circuit, and the other end is used to dock with an external device.

[0016] According to another aspect of the present application, in one embodiment, an external interface temperature protection structure is provided, including the above-mentioned external interface temperature protection circuit board.

[0017] Based on the external interface temperature protection circuit board and structure of the above embodiments, a PTC temperature protection unit is connected in series on the connection circuit between the power supply unit and the interface unit. When the substrate temperature becomes abnormal due to the ambient temperature or a short circuit, the temperature will be conducted and coupled to the PTC temperature protection unit through the substrate material, medium, air, etc. When the temperature exceeds the set temperature of the PTC temperature protection unit, according to the characteristic that the higher the PTC temperature, the greater the impedance, the resistance of the connection circuit is increased, thereby linearly reducing the passing current, preventing the load host or the external function device from being damaged due to abnormal operation caused by high temperature, and realizing temperature protection; when the temperature returns to normal, according to the PTC characteristic, the normal PTC impedance size can be restored, so as not to affect the normal operation of the host itself, and the host and the external device can be normally powered, charged or communicated. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the external interface temperature protection circuit board;

[0019] Figure 2 It is a schematic diagram of the principle of external interface temperature protection in one embodiment;

[0020] Figure 3 It is a schematic diagram of the front structure of the external interface temperature protection circuit board in another embodiment;

[0021] Figure 4 is Figure 3 Schematic side view of the external interface temperature protection circuit board;

[0022] Figure 5 is Figure 3 Schematic back view of the external interface temperature protection circuit board.

[0023] Reference numerals: 1, substrate; 2, power supply unit; 21, pin; 22, USB interface; 3, interface unit; 31, Pogo pin; 32, pad; 4, PTC temperature protection unit; 41, PTC thermistor. Detailed implementation manners

[0024] The present application will be further described in detail below in conjunction with the accompanying drawings through specific implementation manners. Similar elements in different implementation manners adopt related similar element numbers. In the following implementation manners, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, which is to avoid the core part of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and the general technical knowledge in the art.

[0025] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various implementation manners, and the operation steps involved in each embodiment can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the specification and the drawings are only for clearly describing a certain embodiment, and do not mean to be the necessary composition and / or order.

[0026] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. The "connection" and "coupling" mentioned in the present application, unless otherwise specified, both include direct and indirect connections (couplings).

[0027] The external device is a plug-and-play device. When the external device is connected to the host at the interface, during operations similar to charging and power supply connection, the interface contacts the charging PIN through metal contacts for charging or power supply communication. If there is foreign matter contact between the exposed contacts, when docking with the external device for charging, high voltage flows to low voltage through the conductive medium, causing a short circuit between the positive and negative poles, and the device and the host will generate high temperature, and the power demand at the load end exceeds the output power of the host, thereby causing damage to the host and the device end.

[0028] For example, for the charging PIN on the mobile phone side, if there is a short circuit between two points due to a metal medium on the periphery, high temperature will be generated during charging, damaging the host and the charging device; or power supply and voltage communication are in contact through multiple small contacts. Since the pins are relatively close, if a metal medium gets in, it is very easy to cause a short circuit and voltage backflow, resulting in abnormal operation or damage to the device. When other metals get mixed in between the PINs or metal pins at the interface, causing a short circuit, voltage backflow occurs, the current increases, and the temperature rises, thus triggering abnormal operation or damage to the device.

[0029] The present application provides an external interface temperature protection circuit board and structure, which can reduce the current passing through the circuit when the operating temperature and ambient temperature are too high, so as to prevent abnormal operation and damage of the load host or the external function device caused by high temperature.

[0030] According to one aspect of the present application, please refer to Figure 1 、 Figure 2 and Figure 3 In an embodiment, an external interface temperature protection circuit board is provided, including a substrate 1, a power supply unit 2, an interface unit 3, and a PTC temperature protection unit 4 arranged on the substrate 1; the power supply unit 2, the interface unit 3, and the PTC temperature protection unit 4 are arranged in series. The power supply unit 2 is used to connect to the power supply, the interface unit 3 is used to connect to the external device, and the PTC temperature protection unit 4 can change its resistance with temperature; there is a connection circuit on the substrate 1 for connecting the power supply unit 2, the interface unit 3, and the PTC temperature protection unit 4 in series, and the PTC temperature protection unit 4 is connected in series between the power supply unit 2 and the interface unit 3.

[0031] In the embodiment of the present application, the PTC temperature protection unit 4 is connected in series on the connection circuit between the power supply unit 2 and the interface unit 3. When the ambient temperature or a short circuit causes the temperature of the substrate 1 to be abnormal, the temperature will be conducted and coupled to the PTC temperature protection unit 4 through the material, medium, air, etc. of the substrate 1. When the temperature exceeds the set temperature of the PTC temperature protection unit 4, according to the characteristic that the higher the PTC temperature, the greater the impedance, the resistance of the connection circuit is increased, thereby linearly reducing the passing current, preventing abnormal operation and damage of the load host or the external function device caused by high temperature, and realizing temperature protection; when the temperature returns to normal, according to the PTC characteristic, the normal PTC impedance size can be restored, so as not to affect the operation of the host itself, and the host and the external device are normally powered, charged, or communicated.

[0032] Please refer to Figure 2 and Figure 3, Further, two sets of PTC temperature protection units 4 are provided and are respectively connected in series on the positive and negative lines of the connection circuit. When the substrate 1 temperature becomes abnormal due to the ambient temperature or a short circuit, the PTC temperature protection unit 4 exerts its own characteristics to increase the impedance and reduce the current. The two sets of PTC temperature protection units 4 are respectively connected in series on the positive and negative lines of the connection circuit, which can make the current change of the positive and negative poles of the power supply more stable and balanced.

[0033] Please refer to Figure 3 , The interface unit 3 is within the sensing range of the corresponding PTC temperature protection unit 4 to conduct its own heat to the PTC temperature protection unit 4; the two can be in direct contact or can be indirectly contacted through corresponding heat dissipation devices, such as pads 32 or exposed copper, etc.; this is not limited here either, as long as the distance between the two is relatively close and heat conduction can be achieved. In the embodiment of the present application, the PTC temperature protection unit 4 is arranged close to the interface unit 3 to sense the temperature at the interface unit 3, which is equivalent to being close to the position where the temperature is abnormal, and the temperature is conducted and coupled to the PTC temperature protection unit 4 through the substrate 1 material, medium, air, etc., facilitating the rapid sensing of the substrate 1 temperature and the ambient temperature, so that the PTC temperature protection unit 4 can respond quickly and reduce current cooling and heat dissipation.

[0034] Please refer to Figure 2 and Figure 3 , Further, in the embodiment of the present application, the PTC temperature protection unit 4 uses a PTC thermistor 41. The PTC thermistor 41 is a typical semiconductor resistor with temperature sensitivity. When the temperature exceeds a certain value, its resistance value increases with the increase of temperature. The substrate 1 uses the copper foil commonly used in printed circuit boards. Corresponding circuits are etched on the substrate 1 and are covered and protected by a coverlay protective film. The coverlay protective film has an opening exposing the gold surface of the connection circuit at the installation position of the corresponding PTC thermistor 41. The PTC thermistor 41 is welded to the corresponding position of the substrate 1, so that the PTC thermistor 41 is electrically connected to the connection circuit and is connected in series with the power supply unit 2 and the interface unit 3.

[0035] Under normal conditions, a large current passes through the PTC thermistor 41, and the PTC thermistor 41 will limit the current in the connection circuit within the rated current; when the ambient temperature or the external conduction temperature reaches the PTC thermistor 41 temperature exceeding the rated value, the PTC thermistor 41 will linearly increase the impedance and reduce the current passing through the PTC thermistor 41. It is convenient to use and can be restored. To a certain extent, the power supply end can be disconnected linearly according to the temperature, and the PTC thermistor 41 will play a role in circuit protection.

[0036] Please refer to Figure 3, Further, the power supply unit 2 includes a plurality of pins 21 connected to the connection circuit. The pins 21 are set as power input terminals and are used to connect to an external power supply; a USB interface 22 is provided at the pins 21. The USB interface 22 surrounds the pins 21, so as to dock with the corresponding USB interface 22 of the external power supply to achieve power input.

[0037] Please refer to Figure 3 , Figure 4 and Figure 5 , Further, the interface unit 3 includes two charging contacts connected to the connection circuit. The two charging contacts are respectively arranged at the positive and negative poles of the connection circuit and are used as external connection ends to connect to an external device; specifically, a Pogo pin 31 (spring pin) is provided at the charging contact. The Pogo pin 31 is a spring-type probe formed by riveting and pre-pressing three basic components, namely a needle shaft, a spring, and a needle tube, through a precision instrument. It has a precision spring structure inside. A thimble pad 32 is arranged at the lower needle tube base of the Pogo pin 31 and is welded to the substrate 1, so that the Pogo pin 31 is electrically connected to the connection circuit. One end of the needle shaft is used to dock and contact the corresponding contact of the external device, thereby realizing charging.

[0038] According to another aspect of the present application, in an embodiment, an external interface temperature protection structure is provided, which includes the above-mentioned external interface temperature protection circuit board, and further includes a housing for supporting and installing the external interface temperature protection circuit board. The housing has a slot for power input. The corresponding USB interface 22 of the external interface temperature protection circuit board is arranged at the slot position for connecting to an external power supply; the housing also has an opening for two Pogo pins 31 to protrude, facilitating the corresponding contact of the external device to contact the Pogo pins 31 for charging or signal transmission.

[0039] The above uses specific examples to elaborate on the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the technical field to which the present invention belongs, according to the idea of the present invention, several simple deductions, deformations or replacements can also be made.

Claims

1. A plug-in interface temperature protection circuit board, characterized in that: It comprises a substrate (1), and a power supply unit (2), an interface unit (3) and a PTC temperature protection unit (4) arranged on the substrate (1); The power supply unit (2) is used to connect to a power source, the interface unit (3) is used to connect to an external device, and the PTC temperature protection unit (4) can change resistance as the temperature changes; the substrate (1) has a connection circuit for connecting the power supply unit (2), the interface unit (3) and the PTC temperature protection unit (4) in series, and the PTC temperature protection unit (4) is connected in series between the power supply unit (2) and the interface unit (3).

2. The external interface temperature protection circuit board according to claim 1, characterized in that: The PTC temperature protection units (4) are provided in two groups and are respectively connected in series to the positive and negative pole lines of the connection circuit.

3. The external interface temperature protection circuit board according to claim 1, characterized in that: The PTC temperature protection unit (4) is arranged close to the interface unit (3) to sense the temperature at the interface unit (3).

4. The external interface temperature protection circuit board according to any one of claims 1 to 3, characterized in that: The PTC temperature protection unit (4) comprises a PTC thermistor (41).

5. The external interface temperature protection circuit board according to claim 4, characterized in that: The PTC thermistor (41) is welded on the substrate (1) and connected to a connecting circuit.

6. The external interface temperature protection circuit board according to claim 1, characterized in that: The power supply unit (2) comprises a plurality of pins (21) connected to the connection circuit, wherein the pins (21) are arranged as power input terminals and are used for external power supply.

7. The external interface temperature protection circuit board according to claim 6, characterized in that: The pin (21) is provided with a USB interface (22) for connecting to an external power source.

8. The external interface temperature protection circuit board according to claim 1, characterized in that: The interface unit (3) comprises two charging contacts connected to the connection circuit, and the charging contacts are arranged as external connection terminals for connecting to external devices.

9. The external interface temperature protection circuit board according to claim 8, characterized in that: A Pogo pin (31) is provided at the charging contact point, one end of the Pogo pin (31) is provided on the substrate (1) and is connected to the connection circuit, and the other end is used for docking with an external device.

10. An external interface temperature protection structure, characterized in that: It comprises the external interface temperature protection circuit board as described in any one of claims 1 to 9.

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