Compact switching power supply

Abstract

The utility model relates to the technical field of switching power supplies, in particular to a compact switching power supply. The switching power supply comprises a ceramic circuit board, the lower end face of which is provided with a first wiring area; a second wiring area is arranged on the upper end face of the lower ceramic circuit board, and the lower ceramic circuit board and the upper ceramic circuit board are arranged in parallel up and down at intervals; the box dam is fixedly connected between the upper ceramic circuit board and the lower ceramic circuit board and surrounds the second wiring area; and the metal column is fixedly connected between the upper ceramic circuit board and the lower ceramic circuit board, is positioned between the second wiring area and the box dam, and is used for realizing electrical connection between the first wiring area and the second wiring area. According to the utility model, more compact and efficient circuit layout can be realized, and the requirement of miniaturization design can be satisfied.

Description

Technical Field

[0001] The present invention relates to switching power supply technology, and more specifically, to a compact switching power supply. Background Art

[0002] A switching power supply is a power supply device that converts an input power supply into a required output voltage and current. Compared with traditional linear power supplies, switching power supplies have advantages such as higher efficiency, smaller volume and weight, and a wider input voltage range. Therefore, as a prerequisite for electronic devices, switching power supplies account for a relatively large proportion in the whole machine equipment. However, in modern electronic devices, space is an extremely precious resource. With the development of miniaturization and light weight of existing whole machine systems, there are new technical requirements for the miniaturization of switching power supplies themselves.

[0003] Currently, the prior art usually designs a new circuit layout to reduce the occupied area of the switching power supply. For example, adopting dense wiring rules and a reasonable circuit board layout to reduce the wiring length and reduce the integration degree of the circuit board; selecting devices with smaller size and higher integration to reduce the volume and occupied area of the circuit. However, in the existing switching power supply circuit, the circuit wiring is still relatively long and the occupied area is still relatively large, thus affecting the development of the light weight of the whole machine system. Summary of the Utility Model

[0004] To solve the above technical problems that in the existing switching power supply circuit, the circuit wiring is still relatively long, the occupied area is still relatively large, and it affects the development of the light weight of the whole machine system, the present utility model proposes a compact switching power supply.

[0005] A compact switching power supply, comprising: an upper ceramic circuit board 3, with a first wiring area provided on its lower end face; a lower ceramic circuit board 5, with a second wiring area provided on its upper end face, and arranged in parallel and spaced apart up and down from the upper ceramic circuit board 3; a dam 4, fixedly connected between the upper ceramic circuit board 3 and the lower ceramic circuit board 5, and surrounding the second wiring area; a metal column 11, fixedly connected between the upper ceramic circuit board 3 and the lower ceramic circuit board 5, and located between the second wiring area and the dam 4, for realizing electrical connection between the first wiring area and the second wiring area.

[0006] In one embodiment, the dam 4 is a metal dam.

[0007] In one embodiment, the first wiring area is used to install a first electronic component, and the second wiring area is used to install a second electronic component.

[0008] In one embodiment, the first electronic component includes a first SMT device 2 and an isolation device 1.

[0009] In one embodiment, the second electronic component includes a second SMT device 10, a first integrated circuit chip 7, and a second integrated circuit chip 8. The first integrated circuit chip 7 is a bare chip, and the second integrated circuit chip 8 is a bare chip with a layer of metal coated on its back.

[0010] In one embodiment, the lower ceramic circuit board 5 is wire-bonded to the first integrated circuit chip 7 and the second integrated circuit chip 8 respectively through welding leads 9.

[0011] In one embodiment, the lower ceramic circuit board 5 is further configured with pads 6, and the pads 6 are QFN pads.

[0012] In one embodiment, the upper ceramic circuit board 3 is rectangular, the lower ceramic circuit board 5 is rectangular, the dam 4 is rectangular, and the metal posts 11 are provided in two rows, respectively located on the long sides of the rectangle of the lower ceramic circuit board 5.

[0013] In one embodiment, the dam 4 is fixedly connected between the upper ceramic circuit board 3 and the lower ceramic circuit board 5, including: the dam 4 is welded to the lower end surface of the upper ceramic circuit board 3, and the dam is welded to the upper end surface of the lower ceramic circuit board 5.

[0014] The beneficial effects of the present utility model are as follows:

[0015] The present utility model divides the circuit board of the switching power supply into an upper ceramic circuit board 3 and a lower ceramic circuit board 6 to reduce the planar size of the switching power supply, and the upper and lower ceramic circuit boards are electrically connected through metal posts (instead of connecting wires), thereby reducing the floor area of the switching power supply and reducing the length of the circuit. The present utility model can achieve a more compact and efficient circuit layout, which helps to meet the requirements of miniaturized design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By referring to the drawings and reading the detailed description below, the above and other objects, features, and advantages of the exemplary embodiments of the present utility model will become easily understandable. In the drawings, several embodiments of the present utility model are shown in an exemplary rather than restrictive manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 is a schematic structural diagram of a compact switching power supply according to an embodiment of the present invention.

[0018] REFERENCE NUMERALS:

[0019] 1. Isolation device; 2. First SMT device; 3. Upper ceramic circuit board; 4. Dam; 5. Lower ceramic circuit board; 6. Pad; 7. First integrated circuit chip; 8. Second integrated circuit chip; 9. Welding lead; 10. Second SMT device; 11. Metal post. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0021] Next, the specific implementation manners of the present utility model will be described in detail in conjunction with the accompanying drawings.

[0022] Figure 1 is a front view of a compact switching power supply according to an embodiment of the present invention.

[0023] As Figure 1 shown, a compact switching power supply includes: a ceramic circuit board 3, on the lower end surface of which a first wiring area is provided; a lower ceramic circuit board 5, on the upper end surface of which a second wiring area is provided, and which is arranged in parallel and spaced apart from the upper ceramic circuit board 3 up and down; a dam 4, fixedly connected between the upper ceramic circuit board 3 and the lower ceramic circuit board 5, and surrounding the second wiring area; a metal post 11, fixedly connected between the upper ceramic circuit board 3 and the lower ceramic circuit board 5, and located between the second wiring area and the dam 4, for realizing electrical connection between the first wiring area and the second wiring area. Among them, the substrate material of the upper ceramic circuit board 3 is ceramic, and it is configured with a feedback circuit. The substrate material of the lower ceramic circuit board 5 is ceramic, and it is configured with a power circuit.

[0024] In one embodiment, the dam 4 is a metal dam. Due to the good heat conduction performance of copper, the copper dam 4 can reduce the heat generated during the operation of the switching power supply, prevent the switching power supply from overheating, and thus improve the stability of the switching power supply. The copper dam 4 can also effectively reduce the influence of electromagnetic radiation in the external environment on the electrical components inside the switching power supply.

[0025] In one embodiment, the first wiring area is used to install the first electronic component, and the second wiring area is used to install the second electronic component.

[0026] In one embodiment, the first electronic component includes a first SMT device 2 and an isolation device 1. The isolation device 1 is an optocoupler. An SMT device refers to a device that mounts electrical components on the surface of a circuit board through surface mount technology (SMT). The first SMT device 2 includes a resistor and a capacitor.

[0027] In one embodiment, the second electronic component includes a second SMT device 10, a first integrated circuit chip 7, and a second integrated circuit chip 8. The first integrated circuit chip 7 is a bare chip, and the second integrated circuit chip 8 is a bare chip with a layer of metal coated on its back. This layer of metal can provide additional heat dissipation and increase the mechanical strength of the second integrated circuit chip 8. The second SMT device 10 includes a resistor and a capacitor.

[0028] In one embodiment, the lower ceramic circuit board 5 is wire-bonded to the first integrated circuit chip 7 and the second integrated circuit chip 8 respectively through welding leads 9. Wire bonding is a commonly used semiconductor packaging technology for connecting the metal leads inside the chip to the metal pads or pins on the packaging substrate to achieve the connection between the chip and the external circuit. In the embodiment of the present invention, after heating the welding lead 9 to the melting temperature by a hot press head, it is pressed onto the metal leads of the first integrated circuit chip 7 and the second integrated circuit chip to form a connection.

[0029] In one embodiment, the lower ceramic circuit board 5 is further configured with pads 6, and the pads 6 are QFN pads. The QFN pads are used for welding with the terminal circuit board to achieve the connection between the switching power supply and the terminal. The QFN pads are the pads of the QFN package. The QFN package is a surface mount package, and its pads are located at the bottom of the package without exposed pins. Therefore, special processes are required during welding.

[0030] In one embodiment, the upper ceramic circuit board 3 is rectangular, the lower ceramic circuit board 5 is rectangular, the dam 4 is rectangular, and the metal posts 11 are provided in two rows, respectively located on the long sides of the rectangle of the lower ceramic circuit board 5.

[0031] In one embodiment, the dam 4 is fixedly connected between the upper ceramic circuit board 3 and the lower ceramic circuit board 5, including: the dam 4 is welded to the lower end surface of the upper ceramic circuit board 3, and the dam is welded to the upper end surface of the lower ceramic circuit board 5.

[0032] In one embodiment, the packaging process flow of the switching power supply includes steps S1 - S4.

[0033] Step S1: Weld and clean the upper ceramic circuit board 3 and the first SMT device 2.

[0034] Step S2: Weld the first integrated chip to the lower ceramic circuit board 5, bond the second integrated chip to the lower ceramic circuit board 5, and wire-bond the lower ceramic circuit board 5 to the first integrated chip and the second integrated chip respectively through the welding lead 9. After the cleaning process and the baking process, check whether the process quality of this step meets the standards.

[0035] Step S3: Weld the second SIM device to the lower ceramic circuit board 5; weld the upper ceramic circuit board 3 and the lower ceramic circuit board 5 to the dam 4 respectively. After the cleaning process and the baking process, inspect whether the process quality of this step meets the standards.

[0036] Step S4: Conduct a functional test on the switching power supply. After passing the test, clean and bake the switching power supply.

[0037] The number of components in the embodiment is only for illustration and not the actual number of components in the example. The dimensions and shapes are drawn, and the relevant number of components can be combined arbitrarily for those in the relevant field to read and understand.

[0038] In the above description of this specification, unless otherwise clearly specified and limited, terms such as "fixed", "installed", "connected" or "coupled" should be understood in a broad sense. For example, for the term "connected", it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be the internal connection of two components or the interaction relationship between two components. Therefore, unless otherwise clearly limited in this specification, those skilled in the art can understand the specific meanings of the above terms in this utility model according to specific circumstances.

[0039] According to the above description of this specification, those skilled in the art can also understand the terms used as follows. For example, terms indicating orientation or positional relationships such as "upper", "lower", "front", "rear", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "center", "longitudinal", "transverse", "clockwise" or "counterclockwise" are based on the orientation or positional relationship shown in the drawings of this specification. It is only for the purpose of facilitating the description of the solution of this utility model and simplifying the description, rather than explicitly or implicitly indicating that the device or component involved must have the specific orientation, be constructed and operate in the specific orientation. Therefore, the above terms of orientation or positional relationship cannot be understood or interpreted as a limitation to the solution of this utility model.

[0040] In addition, terms such as "first" or "second" used in this specification to refer to numbers or ordinals are only for descriptive purposes and cannot be understood as explicitly or implicitly indicating relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this specification, the meaning of "a plurality" is at least two, such as two, three or more, etc., unless otherwise clearly and specifically limited.

[0041] Although this specification has shown and described several embodiments of the present utility model, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will think of many changes, alterations, and alternative ways without departing from the spirit and scope of the present utility model. It should be understood that various alternatives to the embodiments of the present utility model described herein may be employed in practicing the present utility model.

Claims

1. A compact switching power supply, characterized in that: include: An upper ceramic circuit board (3), a lower end surface of which is provided with a first wiring area; A lower ceramic circuit board (5), having an upper end surface provided with a second wiring area, and arranged vertically and parallelly with the upper ceramic circuit board (3) with a spacing therebetween; A dam (4) fixedly connected between the upper ceramic circuit board (3) and the lower ceramic circuit board (5), and surrounding the second wiring area; The metal column (11) is fixedly connected between the upper ceramic circuit board (3) and the lower ceramic circuit board (5), and is located between the second wiring area and the dam (4), and is used to realize the electrical connection between the first wiring area and the second wiring area.

2. A compact switching power supply according to claim 1, characterized in that: The dam (4) is a metal dam.

3. A compact switching power supply according to claim 1, characterized in that: The first wiring area is used to install a first electronic component, and the second wiring area is used to install a second electronic component.

4. A compact switching power supply according to claim 3, characterized in that: The first electronic component comprises a first SMT device (2) and an isolation device (1).

5. A compact switching power supply according to claim 3, characterized in that: The second electronic component comprises a second SMT device (10), a first integrated circuit chip (7) and a second integrated circuit chip (8); the first integrated circuit chip (7) is a bare chip, and the second integrated circuit chip (8) is a bare chip with a layer of metal coated on the back.

6. A compact switching power supply according to claim 5, characterized in that: The lower ceramic circuit board (5) is wire-bonded to the first integrated circuit chip (7) and the second integrated circuit chip (8) respectively through welding wires (9).

7. A compact switching power supply according to claim 1, characterized in that: The lower ceramic circuit board (5) is further provided with a soldering pad (6), and the soldering pad (6) is a QFN soldering pad.

8. A compact switching power supply according to claim 1, characterized in that: The upper ceramic circuit board (3) is rectangular, the lower ceramic circuit board (5) is rectangular, the dam (4) is rectangular, and the metal columns (11) are arranged in two rows, respectively located on the long sides of the rectangle of the lower ceramic circuit board (5).

9. A compact switching power supply according to claim 1, characterized in that: The dam (4) is fixedly connected between the upper ceramic circuit board (3) and the lower ceramic circuit board (5), comprising: the dam (4) is welded to the lower end surface of the upper ceramic circuit board (3), and the dam is welded to the upper end surface of the lower ceramic circuit board (5).

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