Substrate assembly of flexible circuit board

Abstract

The utility model provides a substrate assembly of a flexible circuit board, which relates to the technical field of flexible circuit boards and comprises a flexible circuit board body, a connecting layer arranged on the flexible circuit board body, a first protective layer arranged on the flexible circuit board body, a base material layer arranged on the flexible circuit board body and a second protective layer arranged on the base material layer. The first buckle is fixed on the flexible circuit board body, the conductive copper foil can effectively provide an electromagnetic shielding effect so as to improve conductivity and signal transmission efficiency, the conductive copper foil is fixed between the polyimides so as to protect the conductive copper foil, and the acrylate adhesive can be firmly bonded with a battery pack, so that the flexible circuit board has good electrical insulation performance, and the service life of the flexible circuit board is prolonged. The flexible circuit board body is adhered and fixed on the battery pack through the acrylate adhesive, and the first buckle and the second buckle are clamped on the battery pack, so that the technical problem that the flexible circuit board body cannot be stably fixed on the battery pack is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible printed circuit boards, in particular to a substrate assembly of a flexible printed circuit board. Background Art

[0002] The substrate assembly of a flexible printed circuit board refers to the overall combination of a flexible printed circuit board (Flex PCB) and the components and connectors thereon. A flexible printed circuit board is a circuit board that can be bent and folded in three-dimensional space and is usually made of flexible polyester or polyamide-based materials. Such a substrate assembly is usually used in electronic devices that require high plasticity and customizability.

[0003] The existing patent (publication number: CN219627975U) proposes a flexible printed circuit board. The surface of the flexible circuit board in this solution is neat, and other components can be easily adhered thereto. Moreover, during the processing, since the surfaces of the circuit layer and the substrate layer are flush, when the protective layer is attached to the substrate layer, there are no gaps between the protective layer and the substrate layer, and between the protective layer and the circuit layer. Therefore, no void bubbles will be generated between the circuit layer and the protective layer, and it has a high thermal reliability level.

[0004] However, the existing flexible printed circuit board cannot be stably fixed on electronic components. The inability to be stably fixed will cause loosening of the circuit connection points, which will in turn affect the normal operation of the electronic components, resulting in inconsistent signal transmission, signal loss or interference. This is disadvantageous for application scenarios that process many signals or have special electrical performance requirements. If the flexible printed circuit board cannot work stably, it may require frequent maintenance or replacement, which will increase additional maintenance costs. Therefore, the utility model proposes a substrate assembly of a flexible printed circuit board to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the deficiencies existing in the prior art and propose a substrate assembly of a flexible printed circuit board.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme: A substrate assembly of a flexible printed circuit board, including a flexible printed circuit board body, a connection layer is arranged on the flexible printed circuit board body, a first protective layer is arranged on the flexible printed circuit board body, a substrate layer is arranged on the flexible printed circuit board body, a second protective layer is arranged on the substrate layer, a first buckle is fixed on the flexible printed circuit board body, and a second buckle is arranged on one side of the flexible printed circuit board body away from the first buckle.

[0007] As a preferred embodiment of a substrate assembly of a flexible printed circuit board, the connection layer is an acrylate-based adhesive material.

[0008] The beneficial effects of adopting the above further solution are as follows: Since the connection layer is an acrylate glue, acrylate adhesives can firmly bond to the battery pack, have good electrical insulation performance, and can encapsulate and protect electronic components.

[0009] As a preferred embodiment of the substrate assembly of a flexible printed circuit board, the base material layer is a conductive copper foil.

[0010] The beneficial effects of adopting the above further solution are as follows: Since the base material layer is a conductive copper foil, the conductive copper foil can effectively provide an electromagnetic shielding effect. When it is placed on the back surface of an electronic device and combined with a metal substrate, it can significantly reduce electromagnetic interference and static electricity accumulation to improve conductivity and signal transmission efficiency.

[0011] As a preferred embodiment of the substrate assembly of a flexible printed circuit board, both the first protective layer and the second protective layer are made of polyimide material.

[0012] The beneficial effects of adopting the above further solution are as follows: Since both the first protective layer and the second protective layer are made of polyimide, the polyimide can be thermosetting or thermoplastic, and can be cured or plasticized according to needs to adapt to different application scenarios. Moreover, polyimide has better bending resistance and heat resistance.

[0013] As a preferred embodiment of the substrate assembly of a flexible printed circuit board, the first protective layer and the second protective layer fix the base material layer between the first protective layer and the base material layer through an adhesive.

[0014] The beneficial effects of adopting the above further solution are as follows: Since the conductive copper foil is prone to oxidation during manufacturing and use, by providing the first protective layer and the second protective layer, oxygen and moisture can be isolated, and the conductive copper foil in the base material layer can be prevented from oxidation and corrosion.

[0015] As a preferred embodiment of the substrate assembly of a flexible printed circuit board, the first buckle and the second buckle are snapped into the card slots on the battery pack.

[0016] The beneficial effects of adopting the above further solution are as follows: Since the first buckle and the second buckle are snapped into the card slots on the battery pack, the flexible printed circuit board body can be limited on the battery pack.

[0017] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0018] The conductive copper foil can effectively provide an electromagnetic shielding effect to improve conductivity and signal transmission efficiency. The conductive copper foil is fixed between polyimides to protect the conductive copper foil. The acrylate adhesive can firmly bond to the battery pack and has good electrical insulation performance, enabling the acrylate adhesive to bond and fix the flexible printed circuit board body to the battery pack. The first buckle and the second buckle are snapped onto the battery pack, thus solving the technical problem that the flexible printed circuit board body cannot be stably fixed to the battery pack. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. is a schematic structural diagram of a substrate assembly of a flexible printed circuit board according to the present invention;

[0020] Figure 2 FIG. is a schematic bottom view of a substrate assembly of a flexible printed circuit board according to the present invention;

[0021] Figure 3 FIG. is a schematic structural diagram of a first buckle of a substrate assembly of a flexible printed circuit board according to the present invention;

[0022] Figure 4 FIG. is a cross-sectional view of a substrate assembly of a flexible printed circuit board according to the present invention.

[0023] REFERENCE NUMERALS

[0024] 1, flexible printed circuit board body; 2, connection layer; 3, first protective layer; 4, base material layer; 5, second protective layer; 6, first buckle; 7, second buckle. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0026] Such as Figure 1 - Figure 4As shown in the figure, this embodiment provides a technical solution: a substrate assembly of a flexible printed circuit board, including a flexible printed circuit board body 1, a connection layer 2 is provided on the flexible printed circuit board body 1, a first protective layer 3 is provided on the flexible printed circuit board body 1, a substrate layer 4 is provided on the flexible printed circuit board body 1, a second protective layer 5 is provided on the substrate layer 4, a first buckle 6 is fixed on the flexible printed circuit board body 1, and a second buckle 7 is provided on one side of the flexible printed circuit board body 1 away from the first buckle 6. The conductive copper foil can effectively provide an electromagnetic shielding effect to improve conductivity and signal transmission efficiency. The conductive copper foil is fixed between polyimides to protect the conductive copper foil. The acrylate adhesive can be firmly bonded to the battery pack and has good electrical insulation performance, so that the acrylate adhesive bonds and fixes the flexible printed circuit board body 1 on the battery pack. The first buckle 6 and the second buckle 7 are snapped onto the battery pack, which not only improves the electromagnetic compatibility and signal transmission efficiency of the device, but also simplifies the installation process and improves the production efficiency and performance of the entire system. The synergistic effect of the conductive copper foil, polyimide film, acrylate adhesive and buckle structure jointly solves the technical problem that the flexible printed circuit board body 1 cannot be stably fixed on the battery pack.

[0027] In the above solution, there are still problems of low conductivity and signal transmission efficiency, which cannot meet the requirements of complex data acquisition, such as Figure 4 As shown: The connection layer 2 is made of acrylate adhesive material. Since the connection layer 2 is acrylate adhesive, the acrylate adhesive can be firmly bonded to the battery pack and has good electrical insulation performance, and can encapsulate and protect electronic components. The substrate layer 4 is a conductive copper foil. Since the substrate layer 4 is a conductive copper foil, the conductive copper foil can effectively provide an electromagnetic shielding effect. When it is placed on the bottom surface of an electronic device and combined with a metal substrate, it can significantly reduce electromagnetic interference and static electricity accumulation to improve conductivity and signal transmission efficiency. The first protective layer 3 and the second protective layer 5 are both made of polyimide material. Since the first protective layer 3 and the second protective layer 5 are both made of polyimide, the polyimide can be thermosetting or thermoplastic, and can be cured or plasticized according to needs to adapt to different application scenarios. And polyimide has better bending resistance and heat resistance. The first protective layer 3 and the second protective layer 5 fix the substrate layer 4 between the first protective layer 3 and the substrate layer 4 through an adhesive. Since the conductive copper foil is prone to oxidation during manufacturing and use, through the provided first protective layer 3 and second protective layer 5, oxygen and moisture can be isolated to avoid oxidation and corrosion of the conductive copper foil in the substrate layer 4;

[0028] Such as Figure 1 - Figure 3 As shown, the first buckle 6 and the second buckle 7 are snapped into the slots on the battery pack. Since the first buckle 6 and the second buckle 7 are snapped into the slots on the battery pack, the flexible printed circuit board body 1 can be limited on the battery pack.

[0029] Working principle:

[0030] As Figures 1-4 shown, first of all, the conductive copper foil plays a key role in the flexible printed circuit board body 1. It not only provides excellent electrical conductivity but also functions as electromagnetic shielding, effectively improving the signal transmission efficiency. Fixing the conductive copper foil between polyimide films can protect the copper foil from the external environment, such as temperature and humidity changes, mechanical wear, etc., and extend its service life. Secondly, the acrylate adhesive plays an important role in fixing the flexible printed circuit board body 1 to the battery pack. This type of adhesive not only has excellent bonding strength to ensure long-term stability but also has good electrical insulation performance to avoid possible short-circuit problems. By using the acrylate adhesive, the flexible printed circuit board body 1 can be firmly bonded and fixed to the battery pack, ensuring a stable connection between electronic components. In addition, the design of the first buckle 6 and the second buckle 7 can further simplify the installation process, quickly and reliably fix the flexible printed circuit board body 1 mechanically, avoiding complex processes such as traditional welding, improving the production efficiency of the entire system. At the same time, the design of the first buckle 6 and the second buckle 7 allows for quick disassembly and maintenance when necessary, increasing the flexibility and maintainability of the system, and achieving progress in the design, performance, and reliability of electronic products. The combination of these materials not only optimizes the product structure, reduces the volume and weight, but also improves the electromagnetic compatibility, enabling the final product to work stably in a more complex and variable environment.

[0031] The above is only a preferred embodiment of the present invention, and it is not intended to limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A substrate assembly for a flexible circuit board, characterized in that: The invention comprises a flexible circuit board body (1), a connection layer (2) is arranged on the flexible circuit board body (1), a first protective layer (3) is arranged on the flexible circuit board body (1), a base material layer (4) is arranged on the flexible circuit board body (1), a second protective layer (5) is arranged on the base material layer (4), a first buckle (6) is fixed on the flexible circuit board body (1), and a second buckle (7) is arranged on a side of the flexible circuit board body (1) away from the first buckle (6).

2. The substrate assembly of a flexible circuit board according to claim 1, characterized in that: The connecting layer (2) is made of acrylic adhesive material.

3. The substrate assembly of a flexible circuit board according to claim 1, characterized in that: The substrate layer (4) is conductive copper foil.

4. The substrate assembly of a flexible circuit board according to claim 1, characterized in that: The first protective layer (3) and the second protective layer (5) are both made of polyimide materials.

5. The substrate assembly of a flexible circuit board according to claim 1, characterized in that: The first protective layer (3) and the second protective layer (5) fix the substrate layer (4) between the first protective layer (3) and the substrate layer (4) by means of an adhesive.

6. The substrate assembly of a flexible circuit board according to claim 1, characterized in that: The first buckle (6) and the second buckle (7) are buckled into the slots on the battery pack.

Images