Heat dissipation circuit board

Abstract

The utility model provides a heat dissipation circuit board comprising a circuit board body, the circuit board body is provided with a plurality of strip-shaped heat conduction grooves in a penetrating manner, the inner side wall of each strip-shaped heat conduction groove is covered with an insulating heat conduction layer, the opening side of the upper end of each heat conduction groove is provided with a heat conduction upper cover, and the opening side of the lower end of each heat conduction groove is provided with a heat conduction lower cover. A plurality of air holes are uniformly formed in the positions, close to the openings of the heat conduction grooves, of the heat conduction upper cover and the heat conduction lower cover; a thermal grease layer is printed on the bottom surface of the circuit board body; the heat conduction upper cover and the heat conduction lower cover extend into the strip-shaped heat conduction groove and are in contact with the insulation heat conduction layer in an attached mode. On the basis of ensuring the hardness of the circuit board, the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a heat dissipation circuit board. Background Art

[0002] The Chinese application publication number is CN113382532A, and the application publication date is September 10, 2021. It specifically relates to a circuit board, including: a substrate, the substrate includes at least two core boards stacked from top to bottom, a first semi-cured sheet is stacked between two adjacent core boards, and the upper surface of the substrate is provided with a receiving groove; a heat-conducting block, the heat-conducting block is arranged in the receiving groove, and the upper surface of the heat-conducting block is higher than the upper surface of the substrate. The present invention also provides a method for manufacturing a circuit board. The circuit board and manufacturing method of the present invention can effectively conduct heat to the circuit board by arranging the heat-conducting block in the receiving groove. At the same time, the upper surface of the heat-conducting block is higher than the upper surface of the substrate, which can solve the problem of glue overflow during the pressing of the heat-conducting block and improve the quality of the circuit board. The defects of the prior art are: the heat-conducting block is filled in the receiving groove, and the heat dissipation performance is mainly achieved by the physical properties of the heat-conducting block itself, and the heat dissipation efficiency is low, which needs to be improved urgently. Utility Model Content

[0003] Based on this, the purpose of the present invention is to provide a heat dissipation circuit board, which improves the heat dissipation efficiency while ensuring the hardness of the circuit board.

[0004] The utility model provides a heat dissipation circuit board, comprising a circuit board body, wherein the circuit board body is penetrated by a plurality of strip-shaped heat-conducting grooves, the inner side wall of each of the strip-shaped heat-conducting grooves is covered with an insulating heat-conducting layer, a heat-conducting upper cover is arranged on the upper opening side of the heat-conducting groove, a heat-conducting lower cover is arranged on the lower opening side of the heat-conducting groove, and a plurality of air holes are evenly distributed on the heat-conducting upper cover and the heat-conducting lower cover at positions close to the openings of the heat-conducting grooves; a heat-dissipating paste layer is printed on the bottom surface of the circuit board body; the heat-conducting upper cover and the heat-conducting lower cover both extend into the interior of the strip-shaped heat-conducting grooves and are in contact with the insulating heat-conducting layer.

[0005] Preferably, the heat-conducting upper cover is configured as a ceramic block upper cover; and the heat-conducting lower cover is configured as a ceramic block lower cover.

[0006] Preferably, the circuit board body comprises, from top to bottom, a first green oil layer, a first circuit layer, a first core board, a semi-cured sheet layer, a second core board, a second circuit layer, and a second green oil layer, and a thermal paste layer is printed on a side of the second green oil layer away from the second circuit layer.

[0007] Preferably, the thickness of the first core plate and the second core plate are both set to 35 um.

[0008] Preferably, the thickness of the prepreg layer is set to 120 um.

[0009] The beneficial effects of the present utility model are as follows: The inner side walls of the strip-shaped heat-conducting grooves are all covered with insulating heat-conducting layers. The insulating heat-conducting layers are used to dissipate heat from the internal circuit layer. Heat forms a space in contact with air in the strip-shaped heat-conducting grooves, thereby improving the heat dissipation efficiency. By providing a heat-conducting upper cover and a heat-conducting lower cover, it is ensured that the circuit board after grooving can maintain good strength, and heat can be dissipated outward through the ventilation holes; combined with the printing of a heat-conducting paste layer on the bottom surface of the circuit board body, the overall heat dissipation efficiency of the circuit board is further improved. Description of the Drawings

[0010] Figure 1 is a sectional view of the present utility model.

[0011] The reference numerals are: the first green solder mask layer 10, the first circuit layer 17, the first core board 11, the prepreg layer 12, the second core board 13, the second circuit layer 14, the second green solder mask layer 16, the heat-conducting paste layer 15, the heat-conducting groove 19, the heat-conducting upper cover 18, the ventilation hole 20, the heat-conducting lower cover 21, and the insulating heat-conducting layer 22. Detailed Description of the Embodiments

[0012] To further understand the features, technical means, and the specific purposes and functions achieved by the present utility model, the present utility model will be described in further detail below in conjunction with the detailed description of the embodiments and the drawings.

[0013] In the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0014] Please refer to Figure 1 As shown, the present utility model provides a heat-dissipating circuit board, including a circuit board body. The circuit board body is provided with a plurality of strip-shaped heat-conducting grooves 19 penetrating through it. The inner side walls of each strip-shaped heat-conducting groove 19 are all covered with an insulating heat-conducting layer 22. A heat-conducting upper cover 18 is provided on the upper opening side of the heat-conducting groove 19, and a heat-conducting lower cover 21 is provided on the lower opening side of the heat-conducting groove 19. A plurality of ventilation holes 20 are evenly distributed at the positions where the heat-conducting upper cover 18 and the heat-conducting lower cover 21 approach the openings of the heat-conducting grooves 19; a heat-conducting paste layer 15 is printed on the bottom surface of the circuit board body; both the heat-conducting upper cover 18 and the heat-conducting lower cover 21 extend into the interior of the strip-shaped heat-conducting grooves 19 and are in contact with the insulating heat-conducting layer 22. The heat-conducting upper cover 18 is set as a ceramic block upper cover; the heat-conducting lower cover 21 is set as a ceramic block lower cover.

[0015] The circuit board body sequentially includes a first solder mask layer 10, a first circuit layer 17, a first core board 11, a prepreg layer 12, a second core board 13, a second circuit layer 14, and a second solder mask layer 16 from top to bottom. A heat dissipation paste layer 15 is printed on one side of the second solder mask layer 16 away from the second circuit layer 14. The thicknesses of the first core board 11 and the second core board 13 are both set to 35 um. The thickness of the prepreg layer 12 is set to 120 um.

[0016] In this embodiment, the inner sidewalls of the strip-shaped heat dissipation grooves are all covered with an insulating heat dissipation layer, and the internal circuit layer is dissipated by the insulating heat dissipation layer. Heat forms a space in contact with the air in the strip-shaped heat dissipation grooves, thereby improving the heat dissipation efficiency. By providing a heat conducting upper cover and a heat conducting lower cover, it is ensured that the circuit board after grooving can maintain good strength, and heat can be dissipated outward through the ventilation holes. Moreover, the heat conducting upper cover 18 and the heat conducting lower cover 21 are both set as covers made of ceramic blocks, which can assist in heat dissipation; combined with the heat dissipation paste layer printed on the bottom surface of the circuit board body, the overall heat dissipation efficiency of the circuit board is further improved.

[0017] The above-described embodiments only represent one implementation mode of the present utility model, and its description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model should be subject to the appended claims.

Claims

1. A heat dissipation circuit board, comprising a circuit board body, characterized in that: The circuit board body is provided with a plurality of strip-shaped heat-conducting grooves (19), the inner side walls of each of the strip-shaped heat-conducting grooves (19) are covered with an insulating heat-conducting layer (22), a heat-conducting upper cover (18) is provided on the upper opening side of the heat-conducting groove (19), and a heat-conducting lower cover (21) is provided on the lower opening side of the heat-conducting groove (19), and a plurality of air holes (20) are evenly distributed on the heat-conducting upper cover (18) and the heat-conducting lower cover (21) at positions close to the openings of the heat-conducting grooves (19); a heat-dissipating paste layer (15) is printed on the bottom surface of the circuit board body; the heat-conducting upper cover (18) and the heat-conducting lower cover (21) both extend into the interior of the strip-shaped heat-conducting groove (19) and are in contact with the insulating heat-conducting layer (22).

2. A heat dissipation circuit board according to claim 1, characterized in that: The heat-conducting upper cover (18) is configured as a ceramic block upper cover; and the heat-conducting lower cover (21) is configured as a ceramic block lower cover.

3. The heat dissipation circuit board according to claim 1, characterized in that: The circuit board body comprises, from top to bottom, a first green oil layer (10), a first circuit layer (17), a first core board (11), a prepreg layer (12), a second core board (13), a second circuit layer (14), and a second green oil layer (16); a heat dissipation paste layer (15) is printed on a side of the second green oil layer (16) away from the second circuit layer (14).

4. A heat dissipation circuit board according to claim 3, characterized in that: The thickness of the first core plate (11) and the second core plate (13) are both set to 35 um.

5. The heat dissipation circuit board according to claim 3, characterized in that: The thickness of the prepreg layer (12) is set to 120 um.

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