Novel circuit board with high heat dissipation performance

Abstract

The utility model discloses a novel high heat dissipation circuit board, and specifically relates to the technical field of circuit boards, the novel high heat dissipation circuit board comprises a supporting plate, the middle part of the supporting plate is provided with a dislocation port in a penetrating manner, the dislocation port is internally provided with a circuit board main body, the circuit board main body is clamped with the dislocation port, and the bottom of the circuit board main body is provided with a connecting plate. According to the utility model, through corresponding cooperative use of each structure, interference between the circuit board main body and the supporting plate is staggered through the dislocation port, installation of the circuit board main body and the connecting plate is facilitated, and meanwhile, the circuit board main body can be protected through the extension seat and the supporting plate, so that the circuit board main body is prevented from being damaged; and heat generated during operation of the circuit board main body can be transmitted through the silicone grease layer, conducted through the reinforcing aluminum plate and discharged through the conduction aluminum strip and the heat dissipation aluminum column, so that the heat dissipation efficiency and effect of the device during use are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically, the utility model relates to a new type of circuit board with high heat dissipation performance. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, printed circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin printed circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards can be called printed wiring boards or printed circuit boards. However, the heat dissipation performance of circuit boards themselves is poor, and heat dissipation needs to be assisted to optimize the heat dissipation performance of circuit boards.

[0003] Among them, through retrieval, it is found that the patent with the patent application number CN201920886299.3 discloses a new type of circuit board with high heat dissipation performance, including mounting holes, sub-assemblies, a circuit board main body, a heat dissipation mechanism, an interface row, aluminum foil, chips, and capacitors. The mounting holes penetrate through the four corner points of the circuit board main body. The bottom end of the sub-assembly is welded to the circuit board main body. The interface row is arranged at the top end of the circuit board main body. Both ends of the back surface of the aluminum foil are bonded to the circuit board main body, and the front surface of the circuit board main body is closely attached to the back surface of the aluminum foil. A heat dissipation mechanism is clamped above the aluminum foil. The bottom end of the chip is welded to the top end of the circuit board main body. The capacitors are fixedly installed on both sides of the chip. The heat dissipation mechanism includes a top port, a heat dissipation layer, an endothermic layer, a bottom port, clamping feet, copper sheets, heat dissipation ports, aluminum sheets, endothermic grooves, and endothermic ports;

[0004] When this structure is in use, by utilizing the heat absorption characteristics of the aluminum foil, the heat is transferred. The heat dissipation mechanism enhances heat dissipation in structure, that is, the heat absorbed by the aluminum foil is conducted upward into the aluminum sheet for processing, enters the endothermic groove through the endothermic port, and then is dissipated by the copper sheet. The heat dissipation ports on the copper sheet are conducive to improving the heat dissipation effect. However, when this structure is in use, it is not easy to protect the circuit board main body, resulting in easy damage to the circuit board main body. At the same time, it is not easy to release the heat during heat conduction, resulting in low heat dissipation efficiency. Summary of the Utility Model

[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a new type of circuit board with high heat dissipation performance, aiming to solve the problems proposed in the above background art.

[0006] The utility model is realized as follows. The utility model provides the following technical solution: A new type of circuit board with high heat dissipation performance, including a support plate, a dislocation port is penetrated and opened in the middle of the support plate, a circuit board main body is arranged in the dislocation port, and the circuit board main body is clamped with the dislocation port;

[0007] A connecting plate is arranged at the bottom of the circuit board body, the connecting plate is detachably connected to the circuit board body, a silicone grease layer is arranged between the connecting plate and the circuit board body, and an external plate is arranged at the bottom of the connecting plate.

[0008] It can be seen that in the above technical solution, the interference between the circuit board body and the support plate is staggered through the offset opening, which facilitates the installation of the circuit board body and the connecting plate. At the same time, the circuit board body can be protected through the extension seat and the support plate to avoid damage to the circuit board body.

[0009] Optionally, in a possible implementation, a mounting groove is provided on a side of the external plate facing the connecting plate, a limit frame is provided in the mounting groove, the limit frame is fixedly connected to the external plate, a conductive aluminum bar is provided in the middle of the limit frame, the cross-sectional shape of the conductive aluminum bar is set to be spiral, the conductive aluminum bar is detachably connected to the external plate, a plurality of heat dissipation aluminum columns are provided in the middle of the conductive aluminum bar, a limited position card cavity is formed between the limit frame and the mounting groove, a docking strip is provided in the limit card cavity, a reinforcing aluminum plate is provided on the top of the docking strip, the reinforcing aluminum plate is installed on the connecting plate, and a plurality of heat dissipation through holes are provided through the surface of the reinforcing aluminum plate;

[0010] It can be seen that in the above technical solution, the heat generated when the circuit board body is running can be transferred through the silicone grease layer, conducted through the reinforced aluminum plate, and released through the conductive aluminum strips and the heat dissipation aluminum columns, thereby improving the heat dissipation efficiency and effect of the device when in use. At the same time, through the setting of the limit card cavity and the docking strip, it is easy to install the external board on the side of the reinforced aluminum plate, and the heat dissipation through-holes facilitate the rapid transfer of hot and warm airflow to the conductive aluminum strips, thereby improving its heat dissipation efficiency.

[0011] Technical effects and advantages of the utility model:

[0012] Through the corresponding coordinated use of various structures, the overall design is simple and the structure is reasonable. The interference between the circuit board body and the support plate is staggered through the dislocation opening, which facilitates the installation of the circuit board body and the connecting plate. At the same time, the circuit board body can be protected through the extension seat and the support plate to avoid damage to the circuit board body.

[0013] And the heat generated when the circuit board body is running can be transferred through the silicone grease layer, conducted through the reinforced aluminum plate, and released through the conductive aluminum strips and heat dissipation aluminum columns, thereby improving the heat dissipation efficiency and effect of the device when in use;

[0014] Through the setting of the limiting card cavity and the docking strip, it is easy to install the external panel on the side of the reinforced aluminum plate, and the heat dissipation holes facilitate the rapid transfer of hot and warm airflow to the conductive aluminum strip, thereby improving its heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required for some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual dimensions of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0016] Figure 1 This is the front view of the overall structure of the present utility model.

[0017] Figure 2 This is the exploded view of the overall structure of the present utility model.

[0018] Figure 3 This is the cross-sectional view of the overall structure of the present utility model.

[0019] Figure 4 This is the three-dimensional view of the reinforcing aluminum plate, butt joint strip and outer release plate of the present utility model.

[0020] Figure 5 This is the three-dimensional view of the connecting plate, circuit board main body, support plate and extension base of the present utility model.

[0021] The reference numerals are: 1, support plate; 2, connecting plate; 3, misalignment opening; 4, circuit board main body; 5, outer release plate; 6, installation groove; 7, limiting frame; 8, conduction aluminum strip; 9, heat dissipation aluminum column; 10, limiting card cavity; 11, butt joint strip; 12, reinforcing aluminum plate; 13, heat dissipation through hole; 14, extension base; 15, installation hole. Detailed implementation manners

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0023] As shown in the attached Figures 1-5 In a new type of high heat dissipation circuit board, through the corresponding cooperation of each structure, the circuit board main body 4 can also be protected through the extension base 14 and the support plate 1 to avoid damage to the circuit board main body 4. And when the circuit board main body 4 is operating, the heat generated can be transferred through the silicone grease layer, conducted through the reinforcing aluminum plate 12, and at the same time, the heat is released through the conduction aluminum strip 8 and the heat dissipation aluminum column 9, improving the heat dissipation efficiency and effect of the device during use. And the specific structure of the components is as follows;

[0024] It comprises a support plate 1, a dislocation opening 3 is formed through the middle of the support plate 1, a circuit board body 4 is arranged in the dislocation opening 3, and the circuit board body 4 is clamped with the dislocation opening 3;

[0025] A connecting plate 2 is disposed at the bottom of the circuit board body 4 . The connecting plate 2 and the circuit board body 4 are detachably connected, and a silicone grease layer is disposed between the connecting plate 2 and the circuit board body 4 . An external plate 5 is disposed at the bottom of the connecting plate 2 .

[0026] A mounting groove 6 is provided on the side of the external plate 5 facing the connecting plate 2, and a limit frame 7 is provided in the mounting groove 6. The limit frame 7 is fixedly connected to the external plate 5, and a conductive aluminum bar 8 is provided in the middle of the limit frame 7. The cross-sectional shape of the conductive aluminum bar 8 is set to be spiral, and the conductive aluminum bar 8 is detachably connected to the external plate 5. A plurality of heat dissipation aluminum columns 9 are provided in the middle of the conductive aluminum bar 8. A limit card cavity 10 is formed between the limit frame 7 and the mounting groove 6, and a docking strip 11 is provided in the limit card cavity 10. A reinforcing aluminum plate 12 is provided on the top of the docking strip 11. The reinforcing aluminum plate 12 is installed on the connecting plate 2, and a plurality of heat dissipation through holes 13 are provided on the surface of the reinforcing aluminum plate 12. A plurality of extension seats 14 are provided on the outer side of the support plate 1, and each extension seat 14 is provided with a mounting hole 15.

[0027] According to the above structure, when in use, the staff installs the device at a designated position. When in use, the interference between the circuit board body 4 and the support plate 1 is staggered through the dislocation opening 3, which facilitates the installation of the circuit board body 4 and the connecting plate 2. At the same time, the circuit board body 4 can be protected through the extension seat 14 and the support plate 1 to prevent the circuit board body 4 from being damaged.

[0028] The heat generated when the circuit board body 4 is in operation can be transferred through the silicone grease layer, conducted through the reinforced aluminum plate 12, and released through the conductive aluminum strip 8 and the heat dissipation aluminum column 9, thereby improving the heat dissipation efficiency and effect of the device when in use;

[0029] At the same time, through the setting of the limiting cavity 10 and the docking strip 11, it is easy to install the external board 5 on the side of the reinforced aluminum plate 12, and the heat dissipation through hole 13 facilitates the rapid transfer of hot and warm air flow to the conductive aluminum strip 8, thereby improving its heat dissipation efficiency.

[0030] Different from the prior art, the present application discloses a new type of high heat dissipation circuit board, which can protect the circuit board body 4 through the extension seat 14 and the support plate 1 to prevent the circuit board body 4 from being damaged, and the heat generated when the circuit board body 4 is in operation can be transferred through the silicone grease layer, conducted through the reinforced aluminum plate 12, and at the same time dissipated through the conductive aluminum strip 8 and the heat dissipation aluminum column 9, thereby improving the heat dissipation efficiency and effect of the device when in use.

[0031] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A novel high heat dissipation circuit board, comprising a support plate (1), characterized in that: A dislocation opening (3) is provided through the middle of the support plate (1), a circuit board body (4) is arranged in the dislocation opening (3), and the circuit board body (4) is snap-connected with the dislocation opening (3); A connecting plate (2) is provided at the bottom of the circuit board body (4); the connecting plate (2) and the circuit board body (4) are detachably connected, and a silicone grease layer is provided between the connecting plate (2) and the circuit board body (4); and an external plate (5) is provided at the bottom of the connecting plate (2).

2. The novel high heat dissipation circuit board according to claim 1, characterized in that: A mounting groove (6) is provided on one side of the external plate (5) facing the connecting plate (2), and a limit frame (7) is provided in the mounting groove (6), and the limit frame (7) is fixedly connected to the external plate (5).

3. A novel high heat dissipation circuit board according to claim 2, characterized in that: A conductive aluminum bar (8) is arranged in the middle of the limiting frame (7), and the cross-sectional shape of the conductive aluminum bar (8) is arranged to be spiral.

4. The novel high heat dissipation circuit board according to claim 3 is characterized in that: The conductive aluminum strip (8) is detachably connected to the external plate (5), and a plurality of heat dissipating aluminum columns (9) are arranged in the middle of the conductive aluminum strip (8).

5. The novel high heat dissipation circuit board according to claim 2, characterized in that: A limiting card cavity (10) is formed between the limiting frame (7) and the installation groove (6), and a docking strip (11) is arranged in the limiting card cavity (10).

6. The novel high heat dissipation circuit board according to claim 5, characterized in that: A reinforcing aluminum plate (12) is provided on the top of the butt joint strip (11), and the reinforcing aluminum plate (12) is mounted on the connecting plate (2).

7. The novel high heat dissipation circuit board according to claim 6, characterized in that: A plurality of heat dissipation through holes (13) are formed through the surface of the reinforced aluminum plate (12).

8. The novel high heat dissipation circuit board according to claim 1, characterized in that: A plurality of extension seats (14) are arranged on the outer side of the support plate (1), and each of the extension seats (14) is provided with a mounting hole (15).

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