Siphon radiator

Abstract

The utility model provides a siphon radiator which comprises a base plate, a cavity is formed in the base plate, a working medium is contained in the cavity, an installation area is formed on the first surface of the base plate, the installation area is used for being connected with an object to be cooled, and heat of the object to be cooled can enable the working medium to be changed into a gas state from a liquid state; the first end of the first pipeline is connected with the upper part of the substrate and is communicated with the cavity of the substrate; the condenser and the base plate are arranged in a spaced mode, the condenser is connected with the second end of the first pipeline so as to receive the gaseous working medium from the base plate and cool the working medium, the working medium can be changed into a liquid state from a gaseous state in the condenser, and the height of the condenser is larger than that of the base plate; the first end of the second pipeline is connected with the condenser, and the second end of the second pipeline is connected with the lower portion of the substrate so that the liquid working medium in the condenser can be input into the cavity of the substrate. The siphon radiator is high in heat exchange efficiency and low in cost.

Description

Technical Field

[0001] The utility model relates to the field of radiators, and particularly relates to a siphon radiator. Background Art

[0002] Existing radiators generally include air-cooled radiators and liquid-cooled radiators. The air-cooled radiator dissipates heat through fins, with low heat dissipation efficiency and unable to meet the demand for high-efficiency heat dissipation. The liquid-cooled radiator usually dissipates heat with coolant, which has a high cost and a risk of liquid leakage.

[0003] How to dissipate heat efficiently and reduce costs is a problem to be solved. Summary of the Utility Model

[0004] Aiming at the above problems of the prior art, the purpose of the utility model is to provide a siphon radiator with high heat exchange efficiency and low cost.

[0005] To solve the above problems, the utility model provides a siphon radiator, which includes:

[0006] A substrate, in which a chamber is formed, the chamber contains a working medium, the substrate has opposite first and second surfaces, an installation area is formed on the first surface of the substrate, the installation area is used to connect the object to be cooled, and the heat of the object to be cooled can cause the working medium to change from liquid to gas;

[0007] A first pipeline, the first end of the first pipeline is connected to the upper part of the substrate and communicates with the chamber of the substrate;

[0008] A condenser, which is arranged at an interval from the substrate, the condenser is connected to the second end of the first pipeline to receive the gaseous working medium from the substrate and cool the working medium, the working medium can change from gas to liquid in the condenser, and the height of the condenser is higher than the height of the substrate;

[0009] A second pipeline, the first end of the second pipeline is connected to the condenser, and its second end is connected to the lower part of the substrate to input the liquid working medium in the condenser into the chamber of the substrate.

[0010] Further, both the substrate and the condenser are vertically arranged, and the bottom end of the condenser is higher than the top end of the substrate.

[0011] Further, the condenser includes a plate-fin heat exchanger, and the plate-fin heat exchanger includes:

[0012] A first header pipe and a second header pipe, the first header pipe being located above the second header pipe, the condenser being connected to the second end of the first pipeline through the first header pipe and to the first end of the second pipeline through the second header pipe;

[0013] A plurality of flat pipes, the plurality of flat pipes being arranged vertically, with the top and bottom of each flat pipe being connected to the first header pipe and the second header pipe respectively to communicate the first header pipe and the second header pipe.

[0014] Further, the plate-fin heat exchanger further comprises:

[0015] A plurality of connecting pieces, the plurality of connecting pieces being respectively arranged in a plurality of gaps between the plurality of flat pipes one by one.

[0016] Further, the condenser comprises:

[0017] A fan, the fan being arranged at the front side or the rear side of the plate-fin heat exchanger.

[0018] Further, the condenser further comprises:

[0019] An air shroud, the air shroud covering one side of the plate-fin heat exchanger facing the fan, and air holes being formed in the air shroud, the fan covering the air holes to blow air or suck air into the air holes.

[0020] Further, the siphon radiator further comprises:

[0021] Two brackets, the two brackets being respectively located at the bottom end of the air shroud and being spaced apart along the length direction of the air shroud.

[0022] Further, the base plate comprises:

[0023] A first heat dissipation plate, the first heat dissipation plate being arranged vertically and comprising a first surface and a second surface arranged front and back, the installation area being formed on the first surface of the first heat dissipation plate, and a plurality of fins or pin fins being formed on the second surface thereof;

[0024] A second heat dissipation plate, the second heat dissipation plate being connected to the first heat dissipation plate, a groove being formed on one side surface of the second heat dissipation plate, the groove covering the fins or pin fins.

[0025] Further, the fins are formed as vertically arranged strip-shaped plates, and the plurality of strip-shaped plates are spaced apart along the length direction of the first heat dissipation plate.

[0026] Further, both the first pipeline and the second pipeline include a plurality of them, and the plurality of first pipelines and the plurality of second pipelines are all spaced apart along the length direction of the base plate.

[0027] Due to the above technical solution, the utility model has the following beneficial effects:

[0028] According to the siphon radiator of the present utility model, it includes a substrate, a first pipeline, a condenser and a second pipeline. During the operation of the object to be cooled, heat is generated and the temperature rises, which will transfer the temperature to the substrate. The working medium in the substrate changes from liquid to gas due to the temperature rise, and heat is absorbed during this process, thereby cooling the object to be cooled and enabling the normal operation of the object to be cooled. The gaseous working medium rises through the first pipeline to the condenser due to the action of pressure and buoyancy. The condenser cools the working medium, so that the working medium changes from gas to liquid. The height of the condenser is higher than that of the substrate, so that the liquid working medium in the condenser falls into the chamber of the substrate due to gravity. The liquid working medium falling into the chamber is heated by the object to be cooled again and becomes gaseous, and then flows into the condenser through the first pipeline. This process is repeated, thereby continuously and stably cooling the object to be cooled. The siphon radiator with this structure has high heat dissipation efficiency. This heat dissipation belongs to passive heat dissipation and does not require external power input, which can save energy. Compared with ordinary air-cooled radiators, it can improve the heat transfer efficiency, and compared with liquid-cooled radiators, it can save costs. Description of the Drawings

[0029] In order to more clearly illustrate the technical solution of the present utility model, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 is a structural diagram of a siphon radiator according to an embodiment of the present utility model;

[0031] Figure 2 is Figure 1 a structural diagram of the siphon radiator of the embodiment from another perspective;

[0032] Figure 3 is a structural diagram of a first heat dissipation plate according to an embodiment of the present utility model;

[0033] Figure 4 is a structural diagram of a second heat dissipation plate according to an embodiment of the present utility model;

[0034] Figure 5 is a structural diagram of a condenser according to an embodiment of the present utility model.

[0035] Reference Signs:

[0036] 100. Substrate; 110. First heat sink; 111. Fins; 120. Second heat sink; 121. Groove; 210. First pipeline; 220. Second pipeline; 310. Air hood; 320. Fan; 330. Condenser; 331. First header; 332. Flat tube; 333. Connecting piece; 334. Second header; 400. Bracket. Detailed implementation manners

[0037] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0039] Next, the siphon radiator of the embodiment of the present invention will be described.

[0040] As Figures 1 to 5 shown, the siphon radiator of the embodiment of the present invention includes a substrate 100, a first pipeline 210, a condenser 330, and a second pipeline 220.

[0041] First, the substrate 100 will be described. A chamber is formed in the substrate 100, and a working medium is accommodated in the chamber. The substrate 100 has a first surface and a second surface opposite to each other. An installation area is formed on the first surface of the substrate 100, and the installation area is used to connect the object to be cooled. The heat generated during the operation of the object to be cooled can cause the working medium to change from a liquid state to a gaseous state. Among them, the working medium capable of gas-liquid conversion is a known technology and will not be elaborated herein.

[0042] During the operation of the object to be cooled (such as a chip, a power device / module, etc.), heat is generated, and the heat is transferred to the working medium in the chamber. The working medium changes from a liquid state to a gaseous state, absorbing heat, so as to be able to cool the object to be cooled.

[0043] Next, the first pipeline 210 will be described. The first end of the first pipeline 210 is connected to the upper part of the substrate 100 and communicates with the chamber of the substrate 100.

[0044] The gaseous working medium can be transmitted through the first pipeline 210 and transferred from the first end of the first pipeline 210 to the second end of the first pipeline 210.

[0045] Then, the condenser 330 will be described. The condenser 330 is arranged at an interval from the substrate 100. The condenser 330 is connected to the second end of the first pipeline 210 to receive the gaseous working medium from the substrate 100 and cool the working medium. The working medium can change from gaseous state to liquid state in the condenser 330.

[0046] The gaseous working medium flows through the first end of the first pipeline 210 to the second end of the first pipeline 210, and then enters the condenser 330. The condenser 330 cools the working medium, so that the working medium changes from gaseous state to liquid state.

[0047] Finally, the second pipeline 220 will be described. The first end of the second pipeline 220 is connected to the condenser 330, and its second end is connected to the lower part of the substrate 100 to input the liquid working medium in the condenser 330 into the chamber of the substrate 100.

[0048] The height of the condenser 330 is higher than that of the substrate 100. Due to gravity, the liquid working medium will flow into the chamber of the substrate 100 through the second pipeline 220. Affected by the temperature of the object to be cooled, the liquid working medium in the chamber will become gas, and due to pressure and buoyancy, it will move upward, and then flow into the condenser 330 again through the first pipeline 210. The condenser 330 then changes the working medium from gaseous state to liquid state. This process repeats, so as to continuously and stably cool the object to be cooled.

[0049] The above siphon radiator includes a substrate 100, a first pipeline 210, a condenser 330, and a second pipeline 220. During the operation of the object to be cooled, heat is generated and the temperature rises, which will transfer the temperature to the substrate 100. The working medium in the substrate 100 changes from liquid to gas due to the temperature rise. This process absorbs heat, thereby cooling the object to be cooled and enabling the normal operation of the object to be cooled. The gaseous working medium rises to the condenser 330 through the first pipeline 210 due to the action of pressure and buoyancy. The condenser 330 cools the working medium, thereby converting the working medium from gas to liquid. The height of the condenser 330 is higher than that of the substrate 100, so that the liquid working medium in the condenser 330 falls into the chamber of the substrate 100 due to gravity. The liquid working medium falling into the chamber is heated by the object to be cooled again and becomes gas, and then flows into the condenser 330 through the first pipeline 210. This cycle continues, thereby continuously and stably cooling the object to be cooled. The siphon radiator with this structure has high heat dissipation efficiency. This heat dissipation belongs to passive heat dissipation and does not require external power input, which can save energy. Compared with ordinary air-cooled radiators, it can improve the heat transfer efficiency, and compared with liquid-cooled radiators, it can save costs.

[0050] In some embodiments of the present invention, both the substrate 100 and the condenser 330 are vertically arranged, and the bottom end of the condenser 330 is higher than the top end of the substrate 100.

[0051] As Figure 1 and Figure 2 shown, the bottom end of the condenser 330 is higher than the top end of the substrate 100, and both the condenser 330 and the substrate 100 are vertically arranged, so that the liquid working medium in the condenser 330 is more likely to fall into the chamber of the substrate 100, improving the fluidity of the working medium and increasing the heat transfer efficiency.

[0052] Further, the condenser 330 includes a plate-fin heat exchanger. The plate-fin heat exchanger includes a first header 331, a second header 334, and a plurality of flat tubes 332. The first header 331 is located above the second header 334. The condenser 330 is connected to the second end of the first pipeline 210 through the first header 331, and is connected to the first end of the second pipeline 220 through the second header 334. The plurality of flat tubes 332 are vertically arranged, and the top end and the bottom end of each flat tube 332 are respectively connected to the first header 331 and the second header 334 to communicate the first header 331 and the second header 334.

[0053] As Figure 1 and Figure 5As shown, the working medium in the substrate 100 flows into the first header 331 of the plate-fin heat exchanger of the condenser 330 through the first pipeline 210, then into the flat tubes 332 communicating with the first header 331, then from the flat tubes 332 into the second header 334, and finally from the second header 334 back into the substrate 100, thus realizing a circulating flow.

[0054] The plate-fin radiator has a relatively large heat exchange area, which can increase the heat exchange efficiency and improve the cooling efficiency of the working medium.

[0055] Furthermore, the plate-fin heat exchanger further includes multiple groups of connecting pieces 333. The multiple groups of connecting pieces 333 are respectively arranged in multiple gaps between multiple flat tubes 332 in a one-to-one correspondence.

[0056] As Figure 1 and Figure 5 shown, the connecting piece 333 is formed in a wavy shape, thereby further increasing the heat exchange area and improving the heat exchange efficiency.

[0057] Optionally, the condenser 330 includes a fan 320. The fan 320 is arranged on the front side or the rear side of the plate-fin heat exchanger.

[0058] Furthermore, the condenser 330 further includes a wind hood 310. The wind hood 310 covers one side of the plate-fin heat exchanger facing the fan 320, and wind holes are formed on the wind hood 310, and the fan 320 covers the wind holes to blow air or suck air into the wind holes.

[0059] As Figure 2 shown, two wind holes are provided on the wind hood 310, and two fans 320 are respectively arranged on the wind holes in a one-to-one correspondence, so as to blow air or suck air into the wind holes. Thus, the wind force of the fan 320 is concentrated on the plate-fin heat exchanger, improving the cooling effect of the air cooling on the plate-fin heat exchanger. Moreover, the pollution of the plate-fin heat exchanger can be reduced through the wind hood 310.

[0060] Furthermore, the siphon radiator further includes two brackets 400. The two brackets 400 are respectively located at the bottom end of the wind hood 310 and are spaced apart along the length direction of the wind hood 310, and the two sides of the two brackets 400 are respectively connected to the two ends of the substrate 100 in the length direction.

[0061] As Figure 1 and Figure 2 shown, the two brackets 400 support the wind hood 310, the wind hood 310 covers the plate-fin heat exchanger, and the two sides of the two brackets 400 are respectively connected to the two ends of the substrate 100 in the length direction, so that the structure of the siphon radiator can be stable.

[0062] In some embodiments of the present utility model, the substrate 100 includes a first heat dissipation plate 110 and a second heat dissipation plate 120. The first heat dissipation plate 110 is vertically arranged and includes a first surface and a second surface arranged front and back. An installation area is formed on the first surface of the first heat dissipation plate 110, and a plurality of fins 111 or pin fins are formed on its second surface. The second heat dissipation plate 120 is connected to the first heat dissipation plate 110, and a groove 121 is formed on the surface of one side of the second heat dissipation plate 120, and the groove 121 covers the fins 111 or pin fins.

[0063] As Figure 3 shown, an installation area for connecting the object to be cooled is formed on the first surface of the first heat dissipation plate 110. Fins 111 and pin fins are formed on the second surface of the first heat dissipation plate 110, so as to increase the contact area between the first heat dissipation plate 110 and the working medium, thereby improving the heat exchange efficiency.

[0064] As Figure 4 shown, the groove 121 on the surface of the second heat dissipation plate 120 and the first heat dissipation plate 110 are combined to form a chamber capable of accommodating the working medium. The fins 111 and pin fins are fully in contact with the working medium in the chamber.

[0065] Furthermore, the fins 111 are formed as vertically arranged strip-shaped plates, and a plurality of strip-shaped plates are arranged at intervals along the length direction of the first heat dissipation plate 110.

[0066] As Figure 3 shown, the strip-shaped plates form the fins 111, and a plurality of fins 111 are arranged at intervals along the length direction of the heat dissipation plate. The working medium flows into the top of the fins 111 from the bottom end of the fins 111.

[0067] In some embodiments of the present utility model, both the first pipeline 210 and the second pipeline 220 include a plurality of them, and the plurality of first pipelines 210 and the plurality of second pipelines 220 are both arranged at intervals along the length direction of the substrate 100.

[0068] As Figure 1 shown, there are 5 first pipelines 210 and 6 second pipelines 220. The plurality of first pipelines 210 and the plurality of second pipelines 220 can improve the heat exchange efficiency, so as to dissipate heat from a larger substrate 100, and through the substrate 100, more objects to be cooled can be dissipated.

[0069] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A siphon radiator, characterized in that: The siphon radiator comprises: A substrate, wherein a chamber is formed in the substrate, wherein the chamber contains a working medium, wherein the substrate has a first surface and a second surface opposite to each other, wherein a mounting area is formed on the first surface of the substrate, wherein the mounting area is used to connect an object to be cooled, wherein the heat of the object to be cooled can change the working medium from a liquid state to a gaseous state; a first pipeline, wherein a first end of the first pipeline is connected to an upper portion of the substrate and communicates with a chamber of the substrate; a condenser, the condenser being spaced apart from the substrate, the condenser being connected to the second end of the first pipeline to receive the gaseous working medium from the substrate and cool the working medium, the working medium being able to change from gaseous to liquid in the condenser, and the height of the condenser being higher than the height of the substrate; A second pipeline, wherein a first end of the second pipeline is connected to the condenser, and a second end of the second pipeline is connected to the lower part of the substrate, so as to input the liquid working medium in the condenser into the cavity of the substrate.

2. The siphon radiator according to claim 1, characterized in that: The base plate and the condenser are both arranged vertically, and the bottom end of the condenser is higher than the top end of the base plate.

3. The siphon radiator according to claim 2, characterized in that: The condenser comprises a plate-fin heat exchanger, and the plate-fin heat exchanger comprises: a first header and a second header, wherein the first header is located above the second header, the condenser is connected to the second end of the first pipeline through the first header, and is connected to the first end of the second pipeline through the second header; A plurality of flat tubes are vertically arranged, and a top end and a bottom end of each of the flat tubes are respectively connected to the first current collecting pipe and the second current collecting pipe to connect the first current collecting pipe and the second current collecting pipe.

4. The siphon radiator according to claim 3, characterized in that: The plate-fin heat exchanger also includes: A plurality of groups of connecting plates are respectively arranged in a plurality of gaps between the plurality of flat tubes in a one-to-one correspondence.

5. The siphon radiator according to claim 3, characterized in that: The condenser comprises: A fan is arranged on the front side or the rear side of the plate-fin heat exchanger.

6. The siphon radiator according to claim 5, characterized in that: The condenser also includes: The wind hood covers the side of the plate-fin heat exchanger facing the fan, and the wind hood is formed with wind holes, and the fan covers the wind holes to blow or suck air into the wind holes.

7. The siphon radiator according to claim 6, characterized in that: The siphon radiator also includes: Two brackets are respectively located at the bottom ends of the wind shield and are spaced apart along the length direction of the wind shield.

8. The siphon radiator according to claim 1, characterized in that: The substrate comprises: A first heat sink, which is vertically arranged and includes a first surface and a second surface arranged front and back, the first surface of the first heat sink being formed with the mounting area, and the second surface of the first heat sink being formed with a plurality of fins or pin fins; A second heat sink is connected to the first heat sink, and a groove is formed on a surface of one side of the second heat sink, wherein the groove covers the fin or pin fin.

9. The siphon radiator according to claim 8, characterized in that: The fins are formed as vertically arranged strip plates, and a plurality of the strip plates are arranged at intervals along the length direction of the first heat dissipation plate.

10. The siphon radiator according to claim 1, characterized in that: The first pipeline and the second pipeline each include a plurality of pipelines, and the plurality of the first pipelines and the plurality of the second pipelines are spaced apart and arranged along the length direction of the substrate.

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