Grinding disc and chemical mechanical polishing equipment

Abstract

The utility model discloses a grinding disc and chemical mechanical polishing equipment, and relates to the technical field of polishing. The grinding disc comprises a grinding disc body, a grinding part and a pollution discharge part are arranged on the grinding disc body, the grinding part is used for making contact with a wafer in an attached mode so as to grind the wafer, and the distance between the side, away from the grinding disc body, of the pollution discharge part and the grinding disc body is smaller than the distance between the side, away from the grinding disc body, of the grinding part and the grinding disc body. The pollution discharge part is used for guiding particulate matter generated between the grinding disc body and the wafer to the edge of the grinding disc body and discharging the particulate matter through the edge of the grinding disc body. According to the grinding disc and the chemical mechanical polishing equipment, the problem that particles generated between the grinding disc and the surface of a wafer easily cause scratches on the surface of the wafer and even subfissure of the wafer during grinding treatment in the prior art can be solved, so that the yield of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing, and more specifically, to a grinding disc and a chemical mechanical polishing device. Background Art

[0002] With the rapid development of the semiconductor industry, during the wafer packaging process, chemical mechanical polishing (CMP for short) of the wafer is required. By using chemical agents and abrasive grains on the grinding disc, the wafer surface is rotated to achieve the purpose of planarizing the wafer surface.

[0003] When the grinding disc grinds in a pressing and rotating manner, particles will inevitably be generated between the grinding disc and the wafer surface. These particles are the abrasive grains from the slurry or the materials removed from the wafer surface during grinding, which are likely to cause scratches on the wafer surface and even cause hidden cracks in the wafer in severe cases. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a grinding disc and a chemical mechanical polishing device, which can solve the problem that the particles generated between the grinding disc and the wafer surface during grinding in the prior art are likely to cause scratches on the wafer surface and even hidden cracks in the wafer, thereby improving the yield of the wafer.

[0005] The embodiments of the utility model are implemented as follows:

[0006] In a first aspect of an embodiment of the utility model, a grinding disc is provided, which includes a grinding disc body. A grinding part and a sewage discharge part are arranged on the grinding disc body. The grinding part is used to be in contact with the wafer to grind the wafer. The distance between one side of the sewage discharge part away from the grinding disc body and the grinding disc body is less than the distance between one side of the grinding part away from the grinding disc body and the grinding disc body. The sewage discharge part is used to guide the particles generated between the grinding disc body and the wafer to the edge of the grinding disc body and discharge them through the edge of the grinding disc body. This grinding disc can solve the problem that the particles generated between the grinding disc and the wafer surface during grinding in the prior art are likely to cause scratches on the wafer surface and even hidden cracks in the wafer, thereby improving the yield of the wafer.

[0007] Optionally, the number of the grinding part and the sewage discharge part is at least one. When the number of the grinding part and the sewage discharge part is multiple, the multiple grinding parts are arranged at intervals, and the sewage discharge part is located between two adjacent grinding parts.

[0008] Optionally, the multiple grinding parts are arranged radially with the center of the grinding disc body as the center of the circle, and the distance between two adjacent grinding parts is equal.

[0009] Optionally, the orthographic projection shape of the grinding part on the grinding disk body is a trapezoid, the upper base of the trapezoid is located on the side far from the center of the grinding disk body, and the lower base of the trapezoid is located on the side close to the center of the grinding disk body.

[0010] Optionally, the sewage discharge part includes a sewage discharge cutter bar, and the opposite ends of the sewage discharge cutter bar are respectively connected to two adjacent grinding parts, so that the sewage discharge cutter bar and two adjacent grinding parts form a sewage discharge space for restricting the movement of the particulate matter.

[0011] Optionally, the orthographic projection shape of the sewage discharge part on the grinding disk body is a T shape, the opposite ends of the cross bar of the T shape are respectively connected to two adjacent grinding parts, and the longitudinal bar of the T shape extends towards the edge of the grinding disk body.

[0012] Optionally, a sewage discharge groove is further formed in the sewage discharge part, and the orthographic projection shape of the sewage discharge groove on the grinding disk body is a linear shape or a T shape.

[0013] Optionally, a connecting shaft hole is arranged at the center of the grinding disk body, and the connecting shaft hole is used for being fixedly installed on a grinding rod.

[0014] Optionally, along the axial direction of the grinding disk body, the grinding parts and the sewage discharge parts are arranged on both opposite sides of the grinding disk body.

[0015] In the second aspect of the embodiments of the present invention, a chemical mechanical polishing device is provided, including the above-mentioned grinding disk. This grinding disk can solve the problem that particulate matter generated between the grinding disk and the surface of the wafer during grinding treatment in the prior art easily causes scratches on the surface of the wafer or even causes hidden cracks in the wafer, thereby improving the yield of the wafer.

[0016] The beneficial effects of the embodiments of the present invention include:

[0017] The polishing pad includes a polishing pad body, on which a polishing portion and a sewage discharging portion are provided. The polishing portion is used to be in contact with the surface of the wafer in a fitting manner, so as to polish the surface of the wafer through the polishing portion. The distance between one side of the sewage discharging portion far away from the polishing pad body and the polishing pad body is less than the distance between one side of the polishing portion far away from the polishing pad body and the polishing pad body, that is, the sewage discharging portion does not directly contact the wafer. The sewage discharging portion is used to guide the particulate matters generated between the polishing pad body and the wafer to the edge of the polishing pad body and discharge them through the edge of the polishing pad body. Compared with the polishing pads disclosed in the prior art, when the wafer surface is polished by pressing and rotating, particulate matters will be generated between the polishing pad and the wafer surface, and these particulate matters are likely to cause scratches on the wafer surface or even cause the wafer to have hidden cracks. The polishing pad provided in this application not only has a convex polishing portion on the surface of the polishing pad body to polish the wafer surface through the polishing portion, but also has a convex sewage discharging portion on the surface of the polishing pad body to guide the particulate matters generated between the polishing pad body and the wafer to the edge of the polishing pad body through the sewage discharging portion, and then finally discharge them to the outside of the polishing pad body and the wafer through the edge of the polishing pad body, avoiding the wafer surface being scratched by particulate matters and even causing the wafer to have hidden cracks in severe cases, thereby improving the yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 FIG. 1 is one of the schematic structural diagrams of the polishing pad provided by the embodiment of the present invention;

[0020] Figure 2 FIG. 2 is another schematic structural diagram of the polishing pad provided by the embodiment of the present invention;

[0021] Figure 3 FIG. 3 is still another schematic structural diagram of the polishing pad provided by the embodiment of the present invention.

[0022] Reference numerals: 100 - polishing pad; 10 - polishing pad body; 11 - polishing portion; 111 - upper bottom; 112 - lower bottom; 12 - sewage discharging portion; 121 - cross bar; 122 - longitudinal bar; 123 - sewage discharging groove; 13 - connecting shaft hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. The components of the embodiments of the present utility model described and illustrated herein generally may be arranged and designed in a variety of different configurations.

[0024] Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the scope of protection of the present utility model.

[0025] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0026] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is customarily placed during use. It is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0027] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0028] In the description of the present utility model, it should also be noted that unless otherwise clearly defined and limited, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the connection inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model may be understood according to specific circumstances.

[0029] Please refer toFigures 1 to 3 , an embodiment of the present application provides a chemical mechanical polishing device, including a polishing pad 100 for polishing the surface of a wafer through the polishing pad 100. In addition, the chemical mechanical polishing device may further include a polishing pad, a polishing rod, a driving device, a liquid adding device, etc. During the actual assembly process, the polishing pad 100 and the polishing pad are respectively arranged on opposite sides of the wafer. The polishing pad 100 is fixedly installed on the polishing rod to drive the polishing pad 100 to rotate through the polishing rod. The polishing pad is fixedly installed on the driving device to drive the polishing pad to rotate through the driving device. The liquid adding device is arranged above the polishing pad.

[0030] During the actual use process, on the one hand, the chemical agent can be dropped on the surface of the polishing pad through the liquid adding device, so that the chemical agent reacts with the material on the surface of the wafer, making it easier to remove the material that needs to be removed on the surface of the wafer; on the other hand, by driving the polishing rod to rotate, the polishing pad 100 can be driven to rotate. At the same time, by driving the driving device to work, the polishing pad can be driven to rotate. In this way, the surface of the wafer can be chemically polished by the chemical agent, and at the same time, the mechanical polishing of the surfaces on opposite sides of the wafer can be carried out through the joint cooperation of the polishing pad and the polishing pad 100.

[0031] Regarding the specific structures of the above-mentioned polishing pad, polishing rod, driving device and liquid adding device, those skilled in the art should be able to make reasonable selections and designs with reference to the prior art, and no specific limitations are made here. The main improvement point of the present application is to provide a polishing pad 100. By making a special structural design on the surface of the polishing pad 100, the particulate matter generated between the polishing pad body 10 and the wafer can be guided to the edge of the polishing pad body 10 and discharged through the edge of the polishing pad body 10. In this way, the polishing pad 100 can solve the problem that the particulate matter generated between the polishing pad 100 and the wafer surface during the polishing process in the prior art easily causes scratches on the wafer surface or even causes the wafer to have a hidden crack, thereby improving the yield of the wafer.

[0032] Specifically, as Figures 1 to 3 shown, the polishing pad 100 provided by the present application includes a polishing pad body 10. A polishing part 11 and a sewage discharging part 12 are arranged on the polishing pad body 10. The polishing part 11 is used for being in contact with the surface of the wafer to polish the surface of the wafer through the polishing part 11. The distance between the side of the sewage discharging part 12 away from the polishing pad body 10 and the polishing pad body 10 is less than the distance between the side of the polishing part 11 away from the polishing pad body 10 and the polishing pad body 10, that is, the sewage discharging part 12 is not in direct contact with the wafer. The sewage discharging part 12 is used for guiding the particulate matter generated between the polishing pad body 10 and the wafer to the edge of the polishing pad body 10 and discharging it through the edge of the polishing pad body 10.

[0033] It should be noted that as Figures 1 to 3As shown in the figure, the polishing pad 100 includes a polishing pad body 10, which serves as the material basis for the structural design. For example, in this embodiment, the polishing pad body 10 has a disc-shaped structure so that the profile of the polishing pad body 10 is similar to that of the wafer. Of course, in other embodiments, the polishing pad body 10 can also be in a square structure, a diamond structure, etc. Those skilled in the art should be able to make reasonable selections and designs according to the actual situation, and no specific limitations are made here. A polishing portion 11 is convexly provided on the surface of the polishing pad body 10. Among them, the polishing portion 11 is used to be in fitting contact with the surface of the wafer, so that under the pressing and rotating action of the polishing rod, the surface of the wafer is polished by the polishing portion 11.

[0034] On this basis, a sewage discharge portion 12 is also convexly provided on the surface of the polishing pad body 10. Moreover, the distance between the side of the sewage discharge portion 12 away from the polishing pad body 10 and the polishing pad body 10 is less than the distance between the side of the polishing portion 11 away from the polishing pad body 10 and the polishing pad body 10. In other words, along the axial direction of the polishing pad body 10, the actual height of the sewage discharge portion 12 protruding from the polishing pad body 10 is less than the actual height of the polishing portion 11 protruding from the polishing pad body 10. Therefore, when the polishing portion 11 is in fitting contact with the surface of the wafer, there is still a certain gap between the sewage discharge portion 12 and the surface of the wafer. This gap is the difference between the distance between the side of the sewage discharge portion 12 away from the polishing pad body 10 and the polishing pad body 10 and the distance between the side of the polishing portion 11 away from the polishing pad body 10 and the polishing pad body 10. In this way, it can be ensured that the sewage discharge portion 12 does not directly contact the surface of the wafer, and thus will not affect the polishing of the wafer through the sewage discharge portion 12. Instead, the sewage discharge portion 12 guides the particles generated between the polishing pad body 10 and the wafer to the edge of the polishing pad body 10, and then is finally discharged through the edge of the polishing pad body 10.

[0035] Compared with the polishing pads disclosed in the prior art, when the wafer surface is polished by pressing and rotating, particles will be generated between the polishing pad and the wafer surface, and these particles are likely to cause scratches on the wafer surface or even cause the wafer to have hidden cracks. The polishing pad 100 provided in this application not only has a polishing portion 11 convexly provided on the surface of the polishing pad body 10 to polish the wafer surface through the polishing portion 11, but also has a sewage discharge portion 12 convexly provided on the surface of the polishing pad body 10 to guide the particles generated between the polishing pad body 10 and the wafer to the edge of the polishing pad body 10 through the sewage discharge portion 12, and then is finally discharged outside the polishing pad body 10 and the wafer, avoiding the phenomenon that the wafer surface is scratched by particles and even causing the wafer to have hidden cracks in severe cases, thereby improving the yield of the wafer.

[0036] Optionally, as Figure 1 and Figure 2As shown, the number of grinding parts 11 and sewage discharge parts 12 is at least one. When the number of grinding parts 11 and sewage discharge parts 12 is multiple, the multiple grinding parts 11 are arranged at intervals to fully grind each position on the surface of the wafer, and the sewage discharge part 12 is located between two adjacent grinding parts 11 to guide the particulate matter generated by grinding between the grinding part 11 and the wafer surface to the edge of the grinding disc body 10 and discharge it.

[0037] Optionally, as Figure 1 and Figure 2 shown, the multiple grinding parts 11 are arranged radially around the center of the grinding disc body 10, and the distance between two adjacent grinding parts 11 is equal, so as to ensure that each position on the surface of the wafer can be fully ground by the multiple grinding parts 11, thus avoiding the surface of the wafer being uneven and smooth.

[0038] Optionally, as Figure 1 and Figure 2 shown, the orthographic projection shape of the grinding part 11 on the grinding disc body 10 is a trapezoid. The upper base 111 of the trapezoid is located on the side away from the center of the grinding disc body 10, and the lower base 112 of the trapezoid is located on the side close to the center of the grinding disc body 10. As is well known, the upper base 111 of the trapezoid refers to the shorter one of the two parallel sides of the trapezoid, while the lower base 112 of the trapezoid refers to the longer one of the two parallel sides of the trapezoid. Placing the upper base 111 of the trapezoid on the side away from the center of the grinding disc body 10 and the lower base 112 of the trapezoid on the side close to the center of the grinding disc body 10 is to ensure that the distance between the lower bases 112 of two adjacent trapezoids is small enough on the side close to the center of the grinding disc body 10, so as to ensure the full grinding of the grinding part 11 on the wafer surface, while on the side away from the center of the grinding disc body 10, the distance between the upper bases 111 of two adjacent trapezoids is large enough to facilitate the timely discharge of the grinding liquid and particulate matter.

[0039] Optionally, as Figure 1 and Figure 2 shown, the sewage discharge part 12 includes a sewage discharge knife guard. The opposite ends of the sewage discharge knife guard are respectively connected to two adjacent grinding parts 11, so that the sewage discharge knife guard and two adjacent grinding parts 11 form a sewage discharge space for restricting the movement of particulate matter, so that the particulate matter moves to the edge of the grinding disc body 10 and is discharged through the edge of the grinding disc body 10 under the blocking and guiding effects of the side walls of the sewage discharge space.

[0040] Optionally, as Figure 1 and Figure 2As shown, the orthographic projection shape of the sewage discharge part 12 on the grinding disc body 10 is T-shaped. The opposite ends of the horizontal bar 121 of the T-shape are respectively connected to two adjacent grinding parts 11, and the vertical bar 122 of the T-shape extends towards the edge of the grinding disc body 10. In this way, the sewage discharge space formed between the sewage discharge knife block and two adjacent grinding parts 11 can be divided into two sub-spaces along the vertical bar 122 of the T-shape. Thus, it can not only ensure that the particulate matter will not cross the sewage discharge knife block and enter other spaces on the side close to the center of the grinding disc body 10, but also, under the guiding action of the vertical bar 122 of the T-shape, guide the particulate matter to the outer edge of the grinding disc body 10 for discharge.

[0041] Of course, the orthographic projection shape of the sewage discharge part 12 on the grinding disc body 10 being T-shaped is only an optional embodiment provided by this application and does not play a restrictive role. In other embodiments, the orthographic projection shape of the sewage discharge part 12 on the grinding disc body 10 can also be Y-shaped, M-shaped or other shapes. Those skilled in the art should be able to make reasonable selections and designs according to the actual situation, and no specific limitations are made here.

[0042] Optionally, as Figure 1 and Figure 2 shown, a sewage discharge groove 123 is also provided on the sewage discharge part 12. The orthographic projection shape of the sewage discharge groove 123 on the grinding disc body 10 is linear or T-shaped. When the shape of the sewage discharge groove 123 is linear, the sewage discharge groove 123 can be provided only on the vertical bar 122 of the T-shape. When the shape of the sewage discharge groove 123 is T-shaped, the sewage discharge groove 123 can be provided on the horizontal bar 121 and the vertical bar 122 of the T-shape, so that the shape of the sewage discharge groove 123 matches the shape of the sewage discharge part 12.

[0043] Optionally, as Figure 1 and Figure 2 shown, a connecting shaft hole 13 is provided at the center of the grinding disc body 10. The connecting shaft hole 13 is used to be fixedly installed on the grinding rod. Exemplarily, in this embodiment, the orthographic projection shape of the connecting shaft hole 13 on the grinding disc body 10 is circular, so that the shape of the connecting shaft hole 13 matches the shape of the grinding rod. Of course, in other embodiments, the shape of the connecting shaft hole 13 can also be square, diamond-shaped, etc. Those skilled in the art should be able to make reasonable selections and designs according to the actual situation, and no specific limitations are made here, as long as the grinding disc body 10 can be assembled on the grinding rod through the connecting shaft hole 13.

[0044] Optionally, as Figure 3As shown in the figure, along the axial direction of the polishing disk body 10, polishing parts 11 and sewage discharging parts 12 are arranged on both opposite sides of the polishing disk body 10. In this way, when the polishing part 11 on one side of the polishing disk body 10 is severely worn after being used for a period of time, the polishing disk body 10 can be turned over to the other side, and the wafer can be polished by using the polishing part 11 on the other side of the polishing disk body 10, thereby improving the utilization rate of the polishing disk 100.

[0045] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0046] In addition, it should be noted that, in the above specific embodiments, the various specific technical features described can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.

Claims

1. A grinding disc, characterized in that: The invention comprises a grinding disc body, on which a grinding part and a waste discharge part are arranged, wherein the grinding part is used for coming into contact with a wafer to grind the wafer, and a distance between a side of the waste discharge part away from the grinding disc body and the grinding disc body is smaller than a distance between a side of the grinding part away from the grinding disc body and the grinding disc body, and the waste discharge part is used for guiding particles generated between the grinding disc body and the wafer to the edge of the grinding disc body and discharging them through the edge of the grinding disc body.

2. The grinding disc according to claim 1, characterized in that The number of the grinding part and the sewage discharge part is at least one. When the number of the grinding part and the sewage discharge part is plural, the plural grinding parts are arranged at intervals, and the sewage discharge part is located between two adjacent grinding parts.

3. The grinding disc according to claim 2, characterized in that The plurality of grinding parts are arranged radially with the center of the grinding disc body as the center, and the distance between two adjacent grinding parts is equal.

4. The grinding disc according to claim 3, characterized in that The orthographic projection shape of the grinding portion on the grinding disc body is a trapezoid, the upper base of the trapezoid is located on a side away from the center of the grinding disc body, and the lower base of the trapezoid is located on a side close to the center of the grinding disc body.

5. The grinding disc according to claim 1, characterized in that The sewage discharge part includes a sewage discharge baffle, and the opposite ends of the sewage discharge baffle are respectively connected to two adjacent grinding parts, so that the sewage discharge baffle and the two adjacent grinding parts form a sewage discharge space for limiting the movement of the particles.

6. The grinding disc according to claim 5, characterized in that The orthographic projection of the sewage discharge portion on the grinding disc body is T-shaped, the opposite ends of the T-shaped cross bar are respectively connected to two adjacent grinding portions, and the T-shaped longitudinal bar extends toward the edge of the grinding disc body.

7. The grinding disc according to claim 6, characterized in that The sewage discharge portion is also provided with a sewage discharge groove, and the orthographic projection shape of the sewage discharge groove on the grinding disc body is linear or T-shaped.

8. The grinding disc according to claim 1, characterized in that A connecting shaft hole is arranged at the center of the grinding disc body, and the connecting shaft hole is used for being installed and fixed on the grinding rod.

9. The grinding disc according to claim 1, characterized in that Along the axial direction of the grinding disc body, the grinding part and the sewage discharge part are arranged on opposite sides of the grinding disc body.

10. A chemical mechanical polishing device, characterized in that: It comprises the grinding disc as claimed in any one of claims 1 to 9.

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