Magnetron sputtering equipment for measuring and calibrating thickness of thin film in real time

Abstract

The utility model discloses magnetron sputtering equipment for measuring and calibrating the thickness of a film in real time, which comprises a mechanical arm, a push-pull baffle, a sample table, a target baffle, a target and a white light interferometer lens, the white light interferometer lens is mounted at the stretching and folding ends of the mechanical arm, and the push-pull baffle is connected with the sample table. According to the utility model, the white light interference device is additionally arranged, so that vacuum breaking sampling of an equipment process chamber is avoided, steps can be manufactured in a sample sputtering process through the push-pull baffle on the sample table, the working procedure of manufacturing the sample steps by photoetching and developing the sample and the vacuum breaking operation are saved, and the white light interferometer adopts a non-contact measurement mode, so that the measurement accuracy is improved. The position of the lens of the white light interferometer can be changed through the mechanical arm, a test step can be found, the sample is prevented from being directly contacted and damaged, the sample is always in a vacuum state and is prevented from being polluted, and the efficiency of coating process research and development and process retest is obviously improved.

Description

Technical Field

[0001] The utility model relates to the technical field of superconducting quantum computing, in particular to a magnetron sputtering device for real-time measurement and calibration of film thickness. Background Technique

[0002] In vacuum coating, magnetron sputtering equipment is widely used in the semiconductor chip manufacturing industry due to its low sputtering temperature and high deposition rate. However, during the use of magnetron equipment, the deposition rate is affected by factors such as the type and pressure of the working gas, the type of target material and the area of the "sputtering etching area", the target surface temperature and the target surface magnetic field strength, the distance between the target source and the substrate, etc., and is also affected by the output current and voltage on the target surface.

[0003] However, the current magnetron sputtering equipment can only measure the sample deposition rate and the thickness of the film after manufacturing steps through photolithography and development before and after sample growth, and then using corresponding characterization equipment (such as a step profiler, AFM) for characterization and testing. However, after long-term use, the test rate of the equipment will deviate from the actual rate, resulting in data deviation, and it is necessary to remanufacture steps for testing. The whole process seriously wastes time and financial resources, and greatly affects the progress of laboratory process research and development. Content of the Utility Model

[0004] The purpose of the utility model is to provide a magnetron sputtering device for real-time measurement and calibration of film thickness, so as to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical scheme:

[0006] A magnetron sputtering device for real-time measurement and calibration of film thickness, comprising: a robotic arm, a push-pull baffle, a sample stage, a target baffle, a target, and a white light interferometer lens. The white light interferometer lens is installed at the extension and folding ends of the robotic arm, and the push-pull baffle is connected to the sample stage.

[0007] As a further scheme of the utility model: a target baffle is installed on the target.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] By adding a white light interference device, the utility model avoids breaking the vacuum in the process chamber of the equipment for sampling. Through the push-pull baffle on the sample stage, steps can be manufactured during the sample sputtering process, saving the processes of sample photolithography and development for manufacturing sample steps, as well as the operation of breaking the vacuum. The white light interferometer adopts a non-contact measurement mode, and the position of the white light interferometer lens can be changed through the robotic arm to find the tested steps, avoiding direct contact and damaging the sample itself. Moreover, the sample is always in a vacuum state, ensuring that the sample is not contaminated, and significantly improving the efficiency of coating process research and development and process re-measurement. Description of the Drawings

[0010] Figure 1 It is a schematic structural diagram of a magnetron sputtering device for real-time measurement and calibration of thin film thickness.

[0011] Figure 2 It is a schematic working principle diagram of a magnetron sputtering device for real-time measurement and calibration of thin film thickness.

[0012] In the figure: 1 - robotic arm, 2 - push-pull baffle, 3 - sample stage, 4 - target baffle, 5 - target, 6 - white light interferometer lens. Detailed Embodiments

[0013] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0014] Embodiment 1

[0015] Please refer to Figure 1-2 , a magnetron sputtering device for real-time measurement and calibration of thin film thickness, comprising: a robotic arm 1, a push-pull baffle 2, a sample stage 3, a target baffle 4, a target 5, and a white light interferometer lens 6, characterized in that a white light interferometer lens 6 is installed at the extending and folding ends of the robotic arm 1, and the push-pull baffle 2 is connected to the sample stage 3.

[0016] Preferably, a target baffle 4 is installed on the target 5.

[0017] It should be specifically noted that: the robotic arm 1 can be used for extension and folding; the connection between the push-pull baffle 2 and the sample stage 3 can create a step for measurement during the sputtering process; the sample stage 3 can be used to place the sample; the white light interferometer lens 6 can be used in conjunction with the robotic arm 1 and move to the position of the step for testing.

[0018] Working principle: During the sample sputtering process, the sample is placed on the sample stage 3 at this time, the target baffle 4 is opened, and the push-pull baffle 2 is closed. A step is created at the edge through the mask of the push-pull baffle 2. When it is necessary to measure the sputtering rate and thickness, the target baffle 4 is closed, the push-pull baffle 2 is opened, and the white light interferometer lens 6 automatically focuses on the sample surface step under the drive of the robotic arm 1 for measurement. By irradiating the sample with light in a wide wavelength band emitted by the light source and measuring using the magnitude of the interference light, the accurate height of the step of the target sample can be calculated.

[0019] It should be particularly noted that: when the magnetron sputtering equipment is combined with a white light interferometer, the sputtering rate can be measured in real time through the steps manufactured by the push-pull baffle 2. The non-contact measurement mode is adopted to better protect the sample. All steps are carried out under vacuum, reducing the time of breaking vacuum, which can significantly improve the efficiency of coating process research and process remeasurement.

[0020] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model.

[0021] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A magnetron sputtering device for real-time measurement and calibration of film thickness, comprising: A mechanical arm (1), a push-pull baffle (2), a sample stage (3), a target baffle (4), a target (5) and a white light interferometer lens (6), characterized in that the white light interferometer lens (6) is installed at the extended and folded ends of the mechanical arm (1), and the push-pull baffle (2) is connected to the sample stage (3).

2. The magnetron sputtering device for real-time measurement and calibration of film thickness according to claim 1, characterized in that: A target baffle (4) is installed on the target (5).

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