Millimeter wave radar and automobile

Abstract

The utility model relates to the technical field of millimeter-wave radars, in particular to a millimeter-wave radar and an automobile, according to the millimeter-wave radar provided by the utility model, a shielding cover and a PCB (Printed Circuit Board) are in pre-pressed contact through the elasticity of an elastic pad, an EMC (Electro Magnetic Compatibility) shielding effect can be well achieved, and after an upper cover and an installation bottom shell are welded, the shielding cover can be prevented from being damaged. The elasticity of the elastic pad can be conducted to the upper cover through the shielding case and the PCB, and the tolerance of laser welding can be absorbed, so that parts in a product have retention force and are attached more tightly, and the anti-interference capability of the millimeter wave radar is enhanced; and on the other hand, the heat on the PCB is dissipated through the first heat conduction structure, the shielding cover, the second heat conduction structure and the installation bottom shell in sequence, the heat generated by the PCB can be well dissipated, and therefore the heat dissipation capacity of the millimeter wave radar is improved, and the service life of the millimeter wave radar is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of millimeter-wave radar, in particular to a millimeter-wave radar and an automobile. Background Art

[0002] Vehicle-mounted millimeter-wave radar has become an indispensable part of the Advanced Driving Assistance System (ADAS for short). With the continuous development of autonomous driving technology, millimeter-wave radar will have huge market demand.

[0003] Devices such as automobiles itself include indispensable electronic devices such as audio and display screens. These electronic devices will cause electromagnetic interference to the millimeter-wave radar, affecting the electromagnetic compatibility (EMC for short) characteristics of the millimeter-wave radar; when the millimeter-wave radar is working, the temperature of some components will rise. If heat dissipation cannot be carried out in time, the high temperature will reduce the service life and effect of the millimeter-wave radar. Therefore, the heat dissipation function of the millimeter-wave radar also needs to be considered.

[0004] On the one hand, in order to improve the anti-interference ability, a shielding cover is added in the prior art. However, there will be a situation where the shielding cover and the PCB board are not tightly fitted during encapsulation, thus affecting the overall anti-interference ability of the millimeter-wave radar; on the other hand, the existing heat dissipation paths have unsatisfactory effects.

[0005] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in this technical field. Content of the Utility Model

[0006] The technical problem to be solved by the utility model is how to improve the anti-interference ability and heat dissipation ability of the millimeter-wave radar.

[0007] The utility model adopts the following technical solutions:

[0008] In the first aspect, a millimeter-wave radar is provided, which includes a sealed housing composed of an upper cover 1 and an installation bottom shell 2, and a printed circuit board (PCB for short) board 3, a shielding cover 4 and an elastic pad 5 arranged in sequence inside the sealed housing;

[0009] The shielding cover 4 is arranged between the second surface of the PCB board 3 and the installation bottom shell 2, and the elastic pad 5 is arranged between the shielding cover 4 and the installation bottom shell 2 to provide sufficient pressure for the shielding cover 4 and the PCB board 3, the upper cover 1 and the installation bottom shell 2 respectively;

[0010] The first surface of the PCB board 3 is disposed adjacent to the upper cover 1, and a first heat conduction structure 6 is provided between the second surface of the PCB board 3 and the shielding cover 4. A second heat conduction structure 7 is further provided between the shielding cover 4 and the mounting bottom case 2 for dissipating the heat energy generated by the PCB board 3 to the mounting bottom case 2.

[0011] Preferably, a first positioning structure is provided on the mounting bottom case 2, a second positioning structure is provided on the shielding cover 4, and a third positioning structure is provided on the PCB board 3;

[0012] After the first positioning structure is coupled with the elastic pad 5, it is then coupled with the second positioning structure and the third positioning structure in sequence. After coupling, the elastic pad 5 is in a compressed state.

[0013] Preferably, the first positioning structure is a positioning post 20, and the second positioning structure and the third positioning structure are positioning holes; a circular through hole is provided in the middle area of the elastic pad 5 to facilitate automatic nesting on the positioning post 20.

[0014] Preferably, the elastic pads 5 are respectively disposed at the four corners of the mounting bottom case 2.

[0015] Preferably, the first heat conduction structure 6 and the second heat conduction structure 7 are heat conduction gaskets, heat conduction structures formed by heat conduction glue, or heat conduction structures formed by heat caulking agent.

[0016] Preferably, the area of the second heat conduction structure 7 is larger than the area of the first heat conduction structure 6; at least part of the projection of the first heat conduction structure 6 on the mounting bottom case 2 overlaps with the projection of the second heat conduction structure 7 on the mounting bottom case 2.

[0017] Preferably, the mounting bottom case 2 includes a mounting bottom surface 21 and a stepped surface 22. The area of the stepped surface 22 is larger than the area of the mounting bottom surface 21, and the area of the mounting bottom surface 21 is larger than the area of the PCB board 3.

[0018] Preferably, the shielding cover 4 includes an inner cavity 41 that is recessed toward the mounting bottom case 2 and heat dissipation blocks that extend upward from the bottom surface of the inner cavity 41. The first heat conduction structure 6 is provided between the heat generating components on the PCB board 3 and the heat dissipation blocks.

[0019] Preferably, a welding groove 10 is provided at the edge of the upper cover 1. At least one support rib 11 that deviates from the welding groove 10 is provided on one side wall of the welding groove 10; the support rib 11 is in contact with the PCB board 3; the welding groove 10 is used to accommodate the molten plastic to prevent the plastic from overflowing.

[0020] In a second aspect, a vehicle is provided, which includes a millimeter-wave radar, a vehicle body, and a control device as described in the first aspect; the control device is integrated in the vehicle body, the millimeter-wave radar is disposed on the vehicle body, and one end of a connector 23 on the millimeter-wave radar is connected to the control device.

[0021] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0022] Due to the elasticity of the elastic pad 5 of the millimeter-wave radar proposed by the present utility model, the shielding cover 4 is in pre-pressed contact with the PCB board 3, which can well play the role of EMC shielding. After the upper cover 1 and the mounting bottom case 2 are welded, the elasticity of the elastic pad 5 can be conducted to the upper cover 1 through the shielding cover 4 and the PCB board 3, which can absorb the tolerance of laser welding, enable the parts inside the product to have a holding force, fit more closely, and enhance the anti-interference ability of the millimeter-wave radar; on the other hand, the heat on the PCB board is dissipated through the first heat-conducting structure 6, the shielding cover 4, the second heat-conducting structure 7, and the mounting bottom case in sequence, and the heat generated by the PCB board can be well dissipated, thereby increasing the heat dissipation ability and service life of the millimeter-wave radar. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is a schematic structural diagram of a millimeter-wave radar provided by an embodiment of the present utility model;

[0025] Figure 2 It is another schematic structural diagram of a millimeter-wave radar provided by an embodiment of the present utility model;

[0026] Figure 3 It is a schematic positioning diagram of a millimeter-wave radar provided by an embodiment of the present utility model;

[0027] Figure 4 It is a schematic diagram of the internal structure of the mounting bottom case of a millimeter-wave radar provided by an embodiment of the present utility model;

[0028] Figure 5 It is a schematic diagram of the bottom structure of the mounting bottom case of a millimeter-wave radar provided by an embodiment of the present utility model;

[0029] Figure 6It is a schematic structural diagram of a shielding cover of a millimeter-wave radar provided by an embodiment of the present invention;

[0030] Figure 7 It is a schematic installation structure diagram of a heat-conducting structure of a millimeter-wave radar provided by an embodiment of the present invention;

[0031] Figure 8 It is a schematic structural diagram of a connector of a millimeter-wave radar provided by an embodiment of the present invention;

[0032] Figure 9 It is a schematic structural diagram of an upper cover of a millimeter-wave radar provided by an embodiment of the present invention;

[0033] Figure 10 It is a schematic installation structure diagram of a millimeter-wave radar provided by an embodiment of the present invention.

[0034] In all the drawings, the same reference numerals denote the same structure, where:

[0035] Upper cover 1, welding groove 10, support rib 11, wave-emitting surface 12, mounting bottom case 2, positioning post 20, mounting bottom surface 21, ventilation hole 210, waterproof breathable film 211, step surface 22, connector 23, mounting hole 24, mounting lug 25, welding rib 26, PCB board 3, first positioning hole 30, shielding cover 4, second positioning hole 40, inner cavity 41, first heat sink 42, second heat sink 43, through hole 44, elastic pad 5, first heat-conducting structure 6, second heat-conducting structure 7. Detailed implementation manners

[0036] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0037] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted in an open - inclusive sense, that is, "including, but not limited to". In the description of the specification, terms such as "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" are intended to indicate that specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above - mentioned terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above - mentioned terms due to reasons such as the order and position of appearance, it is not limited that they can be carried by one embodiment or example in a combined manner.

[0038] In the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, for example, in the description, for the same type of nouns, the method of adding "A" and "B" at the end is used to describe them as two independent individuals. In this case, the features defined with "A" and "B" are only used for the purpose of distinguishing similar individuals and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0039] When describing some embodiments, expressions such as "coupled", "coupled to", and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components have direct physical contact or electrical contact with each other. Another example is that when describing some embodiments, the term "coupled" may be used to indicate that two or more components have direct physical contact or electrical contact. However, the term "connected" or "coupled" may also mean that two or more components do not have direct contact with each other but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the content of the present utility model.

[0040] In addition, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0041] Embodiment 1:

[0042] The shielding cover on the existing millimeter-wave radar is generally fixed by screws during installation, which not only brings problems such as complex assembly and repair processes and high product costs. At the same time, after being fixed by screws, the gaps generated by screw fixation will affect the EMC effect of the product. On the other hand, while ensuring the EMC effect, the heat dissipation effect also needs to be considered. Therefore, in this embodiment, a millimeter-wave radar is provided, such as Figure 1 shown, which includes a sealed housing composed of an upper cover 1 and an installation bottom shell 2, a PCB board 3, a shielding cover 4, and an elastic pad 5 sequentially arranged inside the sealed housing; the shielding cover 4 is arranged between the second surface of the PCB board 3 and the installation bottom shell 2, and the elastic pad 5 is arranged between the shielding cover 4 and the installation bottom shell 2 to provide sufficient pressure for the shielding cover 4 and the PCB board 3, the upper cover 1, and the installation bottom shell 2 respectively; the first surface of the PCB board 3 is adjacent to the upper cover 1, and a first heat conduction structure 6 is arranged between the second surface of the PCB board 3 and the shielding cover 4, and a second heat conduction structure 7 is also arranged between the shielding cover 4 and the installation bottom shell 2 to spread the heat energy generated by the PCB board 3 to the installation bottom shell 2.

[0043] Among them, the PCB board 3 is arranged on the shielding cover 4, and the upper cover 1 is arranged on the PCB board 3.

[0044] In this embodiment, referring to Figure 2 and Figure 3 , the PCB board 3 can be rectangular. To facilitate installation and enhance the stability of the PCB board 3, a first positioning structure is arranged on the installation bottom shell 2, a second positioning structure is arranged on the shielding cover 4, and a third positioning structure is arranged on the PCB board 3; after the first positioning structure is coupled with the elastic pad 5, it is then sequentially coupled with the second positioning structure and the third positioning structure. After coupling, the elastic pad 5 is in a compressed state. In one embodiment, the first positioning structure is a positioning post 20, and the second positioning structure and the third positioning structure are positioning holes; the middle area of the elastic pad 5 has a circular through hole to facilitate automatic nesting on the positioning post 20. In other embodiments, the first positioning structure, the second positioning structure, and the third positioning structure can also be in other forms, which will not be elaborated in this embodiment.

[0045] Specifically, the second positioning structure is the first positioning hole 30, and the third positioning structure is the second positioning hole 40. Four first positioning holes 30 are provided on the PCB board 3, which are respectively arranged at the four corners of the PCB board 3. At the same time, four second positioning holes 40 are respectively provided at the corresponding four corners of the shielding cover 4, and four positioning posts 20 are provided on the mounting bottom case 2. For the convenience of installation and space saving, the elastic pads 5 are respectively arranged at the four corners of the mounting bottom case 2. The elastic pads 5 can be circular rings, and the size of the elastic pads 5 is larger than the aperture diameters of the first positioning holes 30 and the second positioning holes 40. The material of the elastic pads 5 can be rubber. During installation, an automated device can be used to make the elastic pads 5 automatically fall onto the positioning posts 20, avoiding complicated manual operations and facilitating mass production.

[0046] In this embodiment, the welding method between the upper cover 1 and the mounting bottom case 2 can be laser welding. During welding, the elastic pads 5 are in a compressed state, so that the PCB board 3 and the shielding cover 4, as well as between the PCB board 3 and the upper cover, are closely attached. At this time, the upper cover 1 is welded to the mounting bottom case 2 through laser welding technology. During welding, corresponding tolerances will be generated. After welding is completed, during the process of the elastic pads 5 recovering their deformation, the upper cover 1, the PCB board 3, the shielding cover 4, and the mounting bottom case 2 can be attached to each other more closely, which is more beneficial to the EMC effect of the product. Next, other structures on the millimeter-wave radar will be described.

[0047] In one embodiment, as Figure 4 shown, the mounting bottom case 2 includes a mounting bottom surface 21 and a stepped surface 22. The area of the stepped surface 22 is larger than the area of the mounting bottom surface 21, and the area of the mounting bottom surface 21 is larger than the area of the PCB board 3. Among them, the positioning posts 20 are vertically arranged at the four corners of the mounting bottom surface 21.

[0048] Among them, according to the above design, after the millimeter-wave radar is installed, a certain dimension is reserved between the welding ribs 26 on the stepped surface 22 and the horizontal Field of View (FOV) on the PCB board 3 to achieve the maximum FOV effect of the millimeter-wave radar and avoid the distance between the welding ribs 26 and the PCB board 3 being too close, resulting in the electromagnetic waves emitted by the antenna on the PCB board 3 passing through the welding ribs 26, thereby affecting the performance of the millimeter-wave radar.

[0049] In one embodiment, in the inner cavity of the millimeter-wave radar (i.e., the sealed housing composed of the upper cover 1 and the mounting bottom case 2), since the heating elements on the PCB board 3 generate heat during operation, the heat will cause the air pressure in the sealed housing to be too high. The too high air pressure may affect the waterproof effect in the sealed housing, and the too high air pressure may also cause the upper cover 1 to bulge, thus affecting the performance of the millimeter-wave radar. Therefore, the inner cavity of the millimeter-wave radar should have both waterproof and breathable functions. As Figure 5 shown, a ventilation hole 210 is further provided on the mounting bottom surface 21, and a waterproof breathable film 211 is provided in the ventilation hole 210.

[0050] Among them, the working principle of the waterproof breathable film 211 can be divided into two parts:

[0051] 1. Breathing function: There are a large number of micropores inside the waterproof breathable film 211. The diameter and number of the micropores can be made according to actual needs. When the internal gas pressure is higher than the external gas pressure, the gas will penetrate into the air through the micropores, thus realizing the breathing function.

[0052] 2. Waterproof function: The micropores inside the waterproof breathable film 211 will not allow moisture to enter its internal space, because moisture has a certain surface tension on the surface of the micropores. When the diameter of the micropores is small, moisture cannot enter from the outside, thus realizing the waterproof function.

[0053] In one embodiment, the heating elements on the PCB board 3 generate heat during operation, and it is difficult for the heat to dissipate in a closed environment. The first heat conduction structure 6 and the second heat conduction structure 7 are heat conduction gaskets, heat conduction structures formed by heat conduction glue, or heat conduction structures formed by heat filling agent. The area of the second heat conduction structure 7 is larger than the area of the first heat conduction structure 6; the projection of the first heat conduction structure 6 on the mounting bottom case 2 and the projection of the second heat conduction structure 7 on the mounting bottom case 2 at least partially overlap.

[0054] The shielding cover 4 includes an inner cavity body 41 recessed towards the mounting bottom case 2 and heat dissipation blocks extending upward from the bottom surface of the inner cavity body 41. The first heat conduction structure 6 is arranged between the heating devices on the PCB board 3 and the heat dissipation blocks.

[0055] Among them, referring to Figure 6 , the heat dissipation blocks include a first heat dissipation block 42 and a second heat dissipation block 43. The first heat dissipation block 42 and the second heat dissipation block 43 are both arranged on the bottom surface of the inner cavity body 41; the positions of the first heat dissipation block 42 and the second heat dissipation block 43 match the positions of the corresponding heating devices on the PCB board 3. For further heat dissipation, as Figure 7As shown, the shielding cover 4 and the mounting bottom case 2 can be made of aluminum alloy. Heat on the heating element is conducted to the first heat sink 42 and the second heat sink 43 through the first heat conduction structure 6. Then, the first heat sink 42 and the second heat sink 43 conduct the heat to the mounting bottom case 2 through the second heat conduction structure 7 between the bottom surface of the shielding cover 4 and the mounting bottom surface 21. Finally, the mounting bottom case 2 dissipates the heat to the outside. Aluminum alloy has excellent thermal conductivity, which can improve the efficiency and service life of the heating elements on the PCB board 3 and maintain the stability of the millimeter-wave radar.

[0056] In one embodiment, to facilitate connecting the millimeter-wave radar to the corresponding control device, in one embodiment, as Figure 8 shown, a connector 23 is provided on the side surface of the mounting bottom case 2, and a through hole 44 is also provided on the shielding cover 4; one end of the connector 23 is used to connect to the control device, and the other end of the connector 23 passes through the through hole 44 to connect to the corresponding interface on the PCB board 3.

[0057] The PCB board 3 is provided with a radar module and a data processing module. The data processing module is connected to the radar module, and the data processing module is also connected to the connector 23 on the mounting bottom case 2 through the corresponding interface on the PCB board 3; the data processing module is used to process the radar information collected by the radar module and transmit the processed radar information to the control device through the connector 23.

[0058] Among them, the connector 23 is of the plug type. One end of the connector 23 is provided with pins for connecting to the corresponding wire harness plug to connect to the control device; the other end of the connector 23 is of the pin type, and the pins pass through the through hole 44 and are welded in the welding holes 12 on the PCB board 3 to receive the radar information transmitted from the PCB board 3 and transmit the corresponding radar information to the control device. The acquisition, transmission, and processing of radar information and the like are all prior arts and will not be described in detail in this embodiment.

[0059] Since the distance between the PCB board 3 and the upper cover 1 will affect the working effect of the radar module on the PCB board 3. A too close distance will affect the FOV effect of the radar module, and a too far distance will affect the penetration effect of the electromagnetic waves emitted by the radar module. For the welding effect of the upper cover 1 and without affecting the operation of the PCB board 3, in one embodiment, as Figure 9As shown, a welding groove 10 is provided at the edge of the upper cover 1, and at least one support rib 11 facing away from the welding groove 10 is provided on one side wall of the welding groove 10; the support rib 11 is attached to the PCB board 3; the welding groove 10 is used to accommodate the molten plastic to prevent the plastic from overflowing.

[0060] The upper cover 1 further includes a wave output surface 12, the wave output surface 12 is parallel to the PCB board 3, and the wave output surface 12 is used to transmit the electromagnetic wave signals emitted by the radar module on the PCB board 3.

[0061] Among them, the welding groove 10 is provided at the edge of the contact surface of the upper cover 1 with the PCB board 3 and is arranged in a circle. The welding groove 10 is used to align with the welding ribs 26 on the mounting bottom shell 2 for laser welding; a support rib 11 is provided at a preset distance on each of the four sides of the welding groove 10, and the preset distance is determined according to the actual situation and is not specifically limited in this embodiment. When processing the upper cover 1, by designing the height of the support rib 11, it can be matched according to the penetration effect and FOV effect of the electromagnetic waves of different radar modules, so that while not affecting the welding effect, the PCB board 3 can work in a normal state. The setting of the welding groove 10 can ensure that when laser welding is performed, the molten plastic is in direct contact with the welding groove 10. On the one hand, it increases the contact area between the two, and on the other hand, it can effectively prevent the overflow of the molten plastic. Regarding the laser welding technology, not too much description is made in this embodiment.

[0062] For the convenience of the installation and fixation of the millimeter-wave radar, in one embodiment, as Figure 10 shown, at least one mounting hole 24 is provided on the outer bottom surface of the mounting bottom shell 2, and a mounting lug 25 is further provided on the outer side surface of the mounting bottom shell 2. The millimeter-wave radar is mounted on the corresponding device through the mounting hole 24 and / or the mounting lug 25.

[0063] Among them, in this embodiment, there are two mounting methods for the millimeter-wave radar. The first method is that four mounting holes 24 are provided on the outer bottom surface of the mounting bottom shell 2, which can be used to install self-tapping screws to mount the millimeter-wave radar on the corresponding device; the second method is that two symmetrical mounting lugs 25 are integrally formed on both side surfaces of the mounting bottom shell 2, and the millimeter-wave radar is mounted on the corresponding device through the two mounting lugs 25. For the stability of the installation, the two methods can be used simultaneously, or either method can be selected for installation. More specifically, the corresponding installation method is determined according to the actual situation and the installation environment.

[0064] The millimeter-wave radar proposed by the present utility model makes the shielding cover 4 and the PCB board 3 in pre-pressure contact through the elasticity of the elastic pad 5, which can play a good EMC shielding role. After the upper cover 1 and the mounting bottom case 2 are welded, the elasticity of the elastic pad 5 can be conducted to the upper cover 1 through the shielding cover 4 and the PCB board 3, which can absorb the tolerance of laser welding, make the parts in the product have a holding force, fit more closely, and enhance the anti-interference ability of the millimeter-wave radar; on the other hand, the heat on the PCB board is dissipated through the first heat-conducting structure 6, the shielding cover 4, the second heat-conducting structure 7 and the mounting bottom case in sequence, and the heat generated by the PCB board can be dissipated well, thereby increasing the heat dissipation ability and service life of the millimeter-wave radar.

[0065] Embodiment 2:

[0066] A millimeter-wave radar was proposed in Embodiment 1. In this embodiment, a vehicle will be proposed, including the millimeter-wave radar, vehicle body and control device as described in Embodiment 1; the control device is integrated in the vehicle body, the millimeter-wave radar is arranged on the vehicle body, and one end of the connector 23 (as Figure 8 shown) on the millimeter-wave radar is connected to the control device.

[0067] For the specific structure of the millimeter-wave radar, refer to Embodiment 1 and no further description will be made in this embodiment.

[0068] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A millimeter wave radar, characterized in that: It comprises a sealed housing composed of an upper cover (1) and a mounting bottom shell (2), and a PCB board (3), a shielding cover (4) and an elastic pad (5) which are sequentially arranged inside the sealed housing; The shielding cover (4) is arranged between the second surface of the PCB board (3) and the mounting bottom shell (2), and the elastic pad (5) is arranged between the shielding cover (4) and the mounting bottom shell (2) so as to provide sufficient pressure for the shielding cover (4) and the PCB board (3), the upper cover (1) and the mounting bottom shell (2) respectively; The first surface of the PCB board (3) is arranged adjacent to the upper cover (1), and a first heat-conducting structure (6) is arranged between the second surface of the PCB board (3) and the shielding cover (4), and a second heat-conducting structure (7) is also arranged between the shielding cover (4) and the mounting bottom shell (2) for dissipating heat energy generated by the PCB board (3) to the mounting bottom shell (2).

2. The millimeter wave radar according to claim 1, characterized in that: The mounting base shell (2) is provided with a first positioning structure, the shielding cover (4) is provided with a second positioning structure, and the PCB board (3) is provided with a third positioning structure; After the first positioning structure is coupled with the elastic pad (5), it is coupled with the second positioning structure and the third positioning structure in sequence, wherein the elastic pad (5) is in a compressed state after the coupling is completed.

3. The millimeter wave radar according to claim 2, characterized in that: The first positioning structure is a positioning column (20), and the second positioning structure and the third positioning structure are positioning holes; the middle area of ​​the elastic pad (5) has a circular through hole so as to be automatically nested on the positioning column (20).

4. The millimeter wave radar according to any one of claims 1 to 3, characterized in that: The elastic pads (5) are respectively arranged at the four corners of the mounting bottom shell (2).

5. The millimeter wave radar according to any one of claims 1 to 3, characterized in that: The first heat-conducting structure (6) and the second heat-conducting structure (7) are heat-conducting gaskets, heat-conducting structures formed by heat-conducting glue, or heat-conducting structures formed by thermal fillers.

6. The millimeter wave radar according to any one of claims 1 to 3, characterized in that: The area of ​​the second heat-conducting structure (7) is greater than the area of ​​the first heat-conducting structure (6); and the projection of the first heat-conducting structure (6) on the mounting base shell (2) and the projection of the second heat-conducting structure (7) on the mounting base shell (2) at least partially overlap.

7. The millimeter wave radar according to any one of claims 1 to 3, characterized in that: The mounting bottom shell (2) comprises a mounting bottom surface (21) and a stepped surface (22); the area of ​​the stepped surface (22) is larger than the area of ​​the mounting bottom surface (21); and the area of ​​the mounting bottom surface (21) is larger than the area of ​​the PCB board (3).

8. The millimeter wave radar according to any one of claims 1 to 3, characterized in that: The shielding cover (4) comprises an inner cavity (41) recessed in the direction of the mounting base shell (2) and a heat sink extending upward from the bottom surface of the inner cavity (41), and the first heat conducting structure (6) is arranged between the heating device on the PCB board (3) and the heat sink.

9. The millimeter wave radar according to any one of claims 1 to 3, characterized in that: The edge of the upper cover (1) is provided with a welding groove (10), and one of the side walls of the welding groove (10) is provided with at least one supporting rib (11) facing away from the welding groove (10); the supporting rib (11) is in contact with the PCB board (3); the welding groove (10) is used to contain plastic in a molten state to prevent the plastic from overflowing.

10. An automobile, characterized in that: It comprises a millimeter-wave radar, a vehicle body and a control device as described in any one of claims 1 to 9; the control device is integrated in the vehicle body, the millimeter-wave radar is arranged on the vehicle body, and one end of the connector (23) on the millimeter-wave radar is connected to the control device.

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