Novel dye liquid crystal glass packaging structure

Abstract

The utility model relates to the technical field of dye liquid crystal glass packaging, in particular to a novel dye liquid crystal glass packaging structure which comprises liquid crystal glass, a glass face is arranged on the surface of the front end face of the liquid crystal glass, a section layer is arranged in the liquid crystal glass, and blocking layer base materials are arranged on the left side and the right side in the section layer. A blocking layer is attached to one side of each of the two blocking layer base materials, a buffer layer is attached to one side of each of the two blocking layers, a first transparent conductive layer is attached between the two buffer layers, a dye liquid crystal layer is attached to one side of the first transparent conductive layer, and a second transparent conductive layer is attached to one side of the dye liquid crystal layer; the dye liquid crystal panel can be bent and is suitable for a curved surface environment, and the overall thickness is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal glass packaging, in particular to a novel dye liquid crystal glass packaging structure. Background Art

[0002] Currently, for dye liquid crystal dimming panels, the production method is as follows: a transparent conductive layer is deposited on the upper surface of a glass substrate, and then a dye liquid crystal component is fabricated (including liquid crystal and dichroic dye molecules uniformly mixed with the liquid crystal). Then, the glass with the deposited transparent conductive layer is used for encapsulation, as Figure 3 shown;

[0003] Therefore, aiming at the difficulties that the above dye liquid crystal panel cannot be bent and cannot be applied in a curved surface environment, which has certain limitations, and its overall thickness is relatively thick, affecting the encapsulation efficiency, a dye liquid crystal panel can be designed to be bendable, suitable for a curved surface environment, and the overall thickness is reduced. Content of the Utility Model

[0004] In order to overcome the difficulties that the dye liquid crystal panel cannot be bent and cannot be applied in a curved surface environment, which has certain limitations, and its overall thickness is relatively thick, affecting the encapsulation efficiency.

[0005] The technical solution of the utility model is: a novel dye liquid crystal glass packaging structure, including a liquid crystal glass. A glass surface is arranged on the front surface of the liquid crystal glass. A cross-sectional layer is arranged inside the liquid crystal glass. Barrier layer substrates are arranged on the left and right sides inside the cross-sectional layer. Barrier layers are attached to one side of the two barrier layer substrates. Buffer layers are attached to one side of the two barrier layers. A first transparent conductive layer is disposed between the two buffer layers in a fitting manner. A dye liquid crystal layer is attached and connected to one side of the first transparent conductive layer. A second transparent conductive layer is attached and connected to one side of the dye liquid crystal layer.

[0006] Preferably, a buffer plate is arranged inside the buffer layer. The buffer plate is made of rubber material to improve its buffering effect.

[0007] As a preference, a plurality of buffer pads are arranged between the buffer plate and the buffer layer in a uniformly arranged manner. A plurality of buffer rubber bumps are arranged on the upper surface of the buffer layer in a uniformly arranged manner to strengthen the buffering effect of the buffer layer and improve the protection function.

[0008] As a preference, the buffer layer is an integrated structure of silicon nitride and silicon oxide materials, and physical vapor deposition is used for the deposition of the buffer layer.

[0009] As a preference, the first transparent conductive layer and the second transparent conductive layer are integrated structures of indium tin oxide or indium zinc oxide materials, and physical vapor deposition is used for the deposition of the transparent conductive layer.

[0010] Preferably, polyimide films are coated on the surfaces above the first transparent conductive layer and the second transparent conductive layer. Polyimide has high toughness and strong tensile strength.

[0011] Advantages of the present utility model:

[0012] 1. First, the barrier layer substrate is heat-treated until the shrinkage rates in the TD and MD directions are both less than 0.5%. Then, hydroxylation treatment is carried out on one surface of the barrier layer substrate. Next, it enters the ALD deposition equipment chamber. In a vacuum environment, an inert gas is used to introduce a metal oxide precursor into the chamber, which reacts with pure water introduced by the inert gas to alternately form a metal oxide film on the surface of the barrier layer substrate, forming a highly dense barrier layer.

[0013] 2. On the surface of the barrier layer, a buffer layer is deposited by physical vapor deposition. The buffer layer is usually a laminated combination of silicon nitride and silicon oxide. Then, on the surface of the buffer layer, the first transparent conductive layer and the second transparent conductive layer are deposited by physical vapor deposition. The first transparent conductive layer and the second transparent conductive layer are usually made of materials such as indium tin oxide and indium zinc oxide. Then, a polyimide film is coated above the first transparent conductive layer and the second transparent conductive layer. This polyimide has high toughness and strong tensile strength and is suitable for a curved surface environment. Finally, the barrier film is used to form a liquid crystal cell, and the periphery is sealed with frame glue, and the liquid crystal that has been added with dye and uniformly mixed with the liquid crystal is filled into the liquid crystal cell. Description of the drawings

[0014] Figure 1 Shows a three-dimensional structure schematic diagram of the liquid crystal glass of the present utility model;

[0015] Figure 2 Shows a schematic diagram of the internal material structure of the cross-section of the liquid crystal glass of the present utility model;

[0016] Figure 3 Shows a schematic diagram of the internal material structure of the cross-section of the liquid crystal glass of the present utility model;

[0017] Figure 4 Shows the Figure 3 Partial enlarged structure schematic diagram at cross-section A of the present utility model.

[0018] Description of reference numerals: 1. Liquid crystal glass; 2. Cross-section layer; 3. Glass surface; 4. First transparent conductive layer; 5. Dye liquid crystal layer; 6. Second transparent conductive layer; 7. Barrier layer substrate; 8. Barrier layer; 9. Buffer layer; 10. Buffer rubber bump; 11. Buffer plate; 12. Buffer pad. Detailed implementation manners

[0019] The present utility model will be further described below with reference to the drawings and embodiments.

[0020] Please refer to ( Figures 1-4 ), the present utility model provides an embodiment: a novel dye liquid crystal glass encapsulation structure, which includes a liquid crystal glass 1. A glass surface 3 is provided on the front surface of the liquid crystal glass 1. A cross-sectional layer 2 is provided inside the liquid crystal glass 1. Barrier layer substrates 7 are provided on both the left and right sides inside the cross-sectional layer 2. A barrier layer 8 is adhered to one side of each of the two barrier layer substrates 7. A buffer layer 9 is adhered to one side of each of the two barrier layers 8. A first transparent conductive layer 4 is adhesively provided between the two buffer layers 9. A dye liquid crystal layer 5 is adhesively connected to one side of the first transparent conductive layer 4. A second transparent conductive layer 6 is adhesively connected to one side of the dye liquid crystal layer 5.

[0021] Please refer to ( Figures 3-4 ). In this embodiment, a buffer plate 11 is provided inside the buffer layer 9. The buffer plate 11 is made of rubber. A plurality of buffer pads 12 arranged evenly are provided between the buffer plate 11 and the buffer layer 9. A plurality of buffer rubber bumps 10 arranged evenly are provided on the upper surface of the buffer layer 9. The barrier layer substrate 7 is first heat-treated until the shrinkage rates in the TD and MD directions are both less than 0.5%. Then, hydroxylation treatment is performed on one side surface of the barrier layer substrate 7. Then, it enters the ALD deposition equipment cavity. In a vacuum environment, a metal oxide precursor is brought into the cavity by an inert gas and reacts with pure water brought in by the inert gas to alternately form a metal oxide film on the surface of the barrier layer substrate 7, forming a highly dense barrier layer 8.

[0022] Please refer to ( Figures 2-3 ). In this embodiment, the buffer layer 9 is an integrated structure of silicon nitride and silicon oxide materials. The first transparent conductive layer 4 and the second transparent conductive layer 6 are integrated structures of indium tin oxide or indium zinc oxide materials. Polyimide films are coated on the upper surfaces of the first transparent conductive layer 4 and the second transparent conductive layer 6. On the surface of the barrier layer 8, the buffer layer 9 is deposited by physical vapor deposition. The buffer layer 9 is usually a laminated combination of silicon nitride and silicon oxide. Then, on the surface of the buffer layer 9, the first transparent conductive layer 4 and the second transparent conductive layer 6 are deposited by physical vapor deposition. The first transparent conductive layer 4 and the second transparent conductive layer 6 are usually made of materials such as indium tin oxide and indium zinc oxide. Then, a polyimide film is coated on the upper sides of the first transparent conductive layer 4 and the second transparent conductive layer 6. The polyimide has high toughness and strong tensile strength and is suitable for a curved surface environment.

[0023] When working, the barrier layer substrate 7 is first heat-treated until the shrinkage rates in the TD and MD directions are both less than 0.5%. Then, hydroxylation treatment is carried out on one surface of the barrier layer substrate 7. Next, it enters the ALD deposition equipment cavity. In a vacuum environment, an inert gas is used to introduce a metal oxide precursor into the cavity, which reacts with pure water introduced by the inert gas to alternately form a metal oxide thin film on the surface of the barrier layer substrate 7, forming a highly dense barrier layer 8. On the surface of the barrier layer 8, a buffer layer 9 is deposited by physical vapor deposition. The buffer layer 9 is usually a laminated combination of silicon nitride and silicon oxide. Then, on the surface of the buffer layer 9, a first transparent conductive layer 4 and a second transparent conductive layer 6 are deposited by physical vapor deposition. The first transparent conductive layer 4 and the second transparent conductive layer 6 are usually made of materials such as indium tin oxide and indium zinc oxide. Then, a polyimide film is coated on the first transparent conductive layer 4 and the second transparent conductive layer 6. The polyimide has high toughness and strong tensile strength and is suitable for a curved surface environment. Finally, the barrier film is used to form a liquid crystal cell, and the periphery is sealed with a frame adhesive, and the liquid crystal that has been added with a dye and uniformly mixed with the liquid crystal is filled into the liquid crystal cell.

[0024] Through the above steps, on the surface of the barrier layer, a buffer layer is deposited by physical vapor deposition. The buffer layer is usually a laminated combination of silicon nitride and silicon oxide. Then, on the surface of the buffer layer, a first transparent conductive layer and a second transparent conductive layer are deposited by physical vapor deposition. The first transparent conductive layer and the second transparent conductive layer are usually made of materials such as indium tin oxide and indium zinc oxide. Then, a polyimide film is coated on the first transparent conductive layer and the second transparent conductive layer. The polyimide has high toughness and strong tensile strength and is suitable for a curved surface environment to solve the problems that the dye liquid crystal panel cannot be bent and cannot be applied in a curved surface environment, which has certain limitations, and its overall thickness is relatively thick, affecting the packaging efficiency.

Claims

1. A novel dye liquid crystal glass packaging structure, comprising a liquid crystal glass (1), characterized in that: A glass surface (3) is provided on the surface of the front end face of the liquid crystal glass (1), a cross-section layer (2) is provided inside the liquid crystal glass (1), barrier layer substrates (7) are provided on both left and right sides inside the cross-section layer (2), barrier layers (8) are laminated to one side of the two barrier layer substrates (7), buffer layers (9) are laminated to one side of the two barrier layers (8), a first transparent conductive layer (4) is laminated between the two buffer layers (9), a dye liquid crystal layer (5) is laminated to one side of the first transparent conductive layer (4), and a second transparent conductive layer (6) is laminated to one side of the dye liquid crystal layer (5).

2. A novel dye liquid crystal glass packaging structure according to claim 1, characterized in that: A buffer plate (11) is arranged inside the buffer layer (9), and the buffer plate (11) is made of rubber material.

3. A novel dye liquid crystal glass packaging structure according to claim 2, characterized in that: A plurality of evenly arranged buffer pads (12) are arranged between the buffer plate (11) and the buffer layer (9), and a plurality of evenly arranged buffer rubber convex blocks (10) are arranged on the upper end surface of the buffer layer (9).

4. A novel dye liquid crystal glass packaging structure according to claim 1, characterized in that: The buffer layer (9) is an integrated structure of silicon nitride and silicon oxide materials.

5. The novel dye liquid crystal glass packaging structure according to claim 1 is characterized in that: The first transparent conductive layer (4) and the second transparent conductive layer (6) are an integrated structure of indium tin oxide or indium zinc oxide.

6. The novel dye liquid crystal glass packaging structure according to claim 1 is characterized in that: The surfaces above the first transparent conductive layer (4) and the second transparent conductive layer (6) are both coated with a polyimide film.

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