Liquid crystal panel dry etching machine anti-reverse spraying structure

Abstract

The utility model relates to a liquid crystal panel dry etching machine reverse spraying prevention structure which comprises a cavity, an exhaust channel of a molecular pump is arranged at the corner of the cavity, a filter screen is arranged on the exhaust channel, the exhaust channel is fixedly connected with a baffle above the filter screen, and the baffle is provided with an air vent which is not right opposite to the upper portion of the filter screen. According to the anti-reverse-spraying structure of the liquid crystal panel dry etching machine, the baffle plate is fixedly connected above the filter screen, and the baffle plate is provided with the air vent which is not right opposite to the upper part of the filter screen, so that the situation that reverse gushing airflow is directly reversely sprayed to the substrate at the moment of APC closing is reduced, and etching residues after etching caused by the fact that microparticles fall on the substrate before etching are avoided; the product yield can be improved, and the maintenance frequency is reduced.

Description

Technical Field

[0001] The utility model relates to an anti-backspray structure of a dry etching machine for liquid crystal panels. Background Art

[0002] The dry etching machine for liquid crystal panels mainly uses the ion sputtering effect and chemical reaction in plasma to remove the film layer not shielded by photoresist, so as to leave the required graphic film layer on the glass substrate. The exhaust of the machine chamber is jointly completed by four TMPs (molecular pumps) distributed around the chamber. According to the chamber pressure required during the process, the pumping volume is controlled by the APC (automatic pressure regulator) above the TMP. The structure of a single TMP is as Figure 1 shown.

[0003] In the original machine design, there is no shielding structure above the exhaust channel of the molecular pump. Before the substrate just enters the chamber and is about to start the process, the opening degree of the APC (automatic pressure regulator) quickly opens and closes from 1000 to the opening degree value required to stabilize the chamber pressure. Due to the sudden change in pressure and the poor design, an anti-surge phenomenon occurs in the APC. The anti-surge gas blows off and carries some of the products attached to the cross filter, one-way filter and the inner wall of the exhaust channel and sprays back into the chamber together. The products fall on the unprocessed substrate, resulting in etching residues after the process and reducing the yield of the product. Summary of the Utility Model

[0004] In view of the deficiencies of the prior art, the technical problem to be solved by the utility model is to provide an anti-backspray structure of a dry etching machine for liquid crystal panels.

[0005] To solve the above technical problem, the technical solution of the utility model is: an anti-backspray structure of a dry etching machine for liquid crystal panels, including a chamber. An exhaust channel of a molecular pump is arranged at a corner of the chamber. A filter screen is arranged on the exhaust channel. A baffle is fixedly connected above the filter screen on the exhaust channel. An air vent not directly opposite to the upper part of the filter screen is arranged on the baffle.

[0006] Preferably, the air vents are distributed on the four peripheral edges of the baffle.

[0007] Preferably, the projection area of the air vent and the filter screen on the horizontal plane does not overlap.

[0008] Preferably, the horizontal projection area of the filter screen on the baffle is completely located in the shielding area of the baffle.

[0009] Preferably, the shapes of the air vents are all rectangular and penetrate through the edge of the baffle to form notches for ventilation.

[0010] Preferably, the baffle is made of stainless steel.

[0011] Compared with the prior art, the anti-backspray structure of the dry etching machine for liquid crystal panels of the present utility model has the following beneficial effects: By fixedly connecting a baffle above the filter screen and providing a ventilation port on the baffle that is not directly opposite to the upper part of the filter screen, the anti-surge air flow caused by the instant shutdown of the APC is reduced from directly backspraying onto the substrate, avoiding the etching residues after etching caused by the micro-particles falling on the substrate before etching, and can improve the product yield and reduce the maintenance frequency.

[0012] The following further elaborates on the present utility model in conjunction with the accompanying drawings and specific embodiments. Description of the Drawings

[0013] Figure 1 It is a schematic structural diagram of the prior art.

[0014] Figure 2 It is a schematic structural diagram of an embodiment of the present utility model.

[0015] Figure 3 It is a top view of the baffle of a single TMP. Specific Embodiments

[0016] The following further describes the present utility model in conjunction with the accompanying drawings and embodiments.

[0017] It should be noted that the following detailed description is exemplary and is intended to provide further illustration of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0018] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0019] As Figures 1 to 3 shown, this embodiment provides an anti-backspray structure for a dry etching machine of a liquid crystal panel. The exhaust of the machine chamber is jointly completed by four TMPs (molecular pumps 4) distributed around the chamber 1. According to the chamber pressure required during the process, the pumping rate is controlled by the APC (automatic pressure regulator 8) above the TMP. A cross filter screen and a single-line filter screen are provided on the exhaust channel 2 of the TMP.

[0020] This anti-backspray structure is mainly used to transform the problem of abnormal chamber and product caused by APC backflow in the dry etching machine, reduce the number of product abnormalities and extend the maintenance cycle. The technical solution includes a chamber, an exhaust channel of a molecular pump is arranged at the corner of the chamber, a filter screen 3 is arranged on the exhaust channel, a baffle 5 is fixedly connected above the filter screen on the exhaust channel, and a ventilation port 6 not directly facing the upper part of the filter screen is arranged on the baffle.

[0021] By adding a baffle above the exhaust of the molecular pump, the APC backflow gas will not directly backspray onto the unprocessed substrate, thereby reducing the number of product abnormalities, extending the maintenance cycle and increasing the yield rate of the product.

[0022] In the embodiment of the present invention, the ventilation ports are distributed on the four peripheral edges of the baffle.

[0023] In the embodiment of the present invention, the projection area of the ventilation port and the filter screen on the horizontal plane does not overlap.

[0024] In the embodiment of the present invention, the horizontal projection area of the filter screen on the baffle is completely located in the shielding area of the baffle.

[0025] In the embodiment of the present invention, the shapes of the ventilation ports are all rectangular, and penetrate through the edge of the baffle to form a notch for ventilation.

[0026] In the embodiment of the present invention, the baffle is made of stainless steel.

[0027] In the embodiment of the present invention, the principle of the anti-backspray structure of the liquid crystal panel dry etching machine is as follows: the anti-backspray structure of the liquid crystal panel dry etching machine fixedly connects a baffle above the filter screen, and a ventilation port not directly facing the upper part of the filter screen is arranged on the baffle, reducing the direct backspray of the backflow air flow caused by the instant shutdown of APC onto the substrate, and avoiding etching residues after etching caused by microparticles falling on the substrate before etching, which can improve the product yield rate and reduce the maintenance frequency.

[0028] The above is only a preferred embodiment of the present invention, and it is not a limitation to the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution content of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A liquid crystal panel dry etching machine back-spray prevention structure, comprising a chamber, a molecular pump exhaust channel is arranged at a corner of the chamber, a filter is arranged on the exhaust channel, and the characteristics are: The exhaust passage is fixedly connected with a baffle above the filter screen, and the baffle is provided with an air vent which is not directly opposite to the top of the filter screen.

2. The anti-reverse spray structure of the liquid crystal panel dry etching machine according to claim 1, characterized in that: The vents are distributed around the edges of the baffle.

3. The anti-reverse spray structure of the liquid crystal panel dry etching machine according to claim 1, characterized in that: The vent and the filter screen do not overlap in their projected areas on a horizontal plane.

4. The anti-reverse spray structure of the liquid crystal panel dry etching machine according to claim 1, characterized in that: The horizontal projection area of ​​the filter on the baffle is completely located in the shielding area of ​​the baffle.

5. The anti-reverse spray structure of the liquid crystal panel dry etching machine according to claim 1, characterized in that: The vents are all rectangular in shape and penetrate the edge of the baffle to form a gap for ventilation.

6. The anti-reverse spray structure of the liquid crystal panel dry etching machine according to claim 1, characterized in that: The baffle is made of stainless steel.

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