Jig

Abstract

The embodiment of the utility model relates to the technical field of semiconductor manufacturing, in particular to a jig. The jig comprises a mounting base and a plurality of bearing discs. The bearing discs are installed on the installation base, the bearing discs are arranged in an array mode in the first direction and the second direction, the bearing discs are provided with top faces and side faces connected with the top faces, the top faces are used for bearing chips, and the side faces are arranged between any two adjacent bearing discs in the first direction. The part, close to the downstream bearing disc, of the side face of the upstream bearing disc meets the condition that at least part of the side, provided with the top face, of the downstream bearing disc is located between any two adjacent bearing discs in the second direction, the part, close to the downstream bearing disc, of the side face of the upstream bearing disc meets the condition that at least part of the side, provided with the top face, of the downstream bearing disc is located. Based on the above structure, the phenomenon that chips are easy to shake along with a chemical solution to cause chip stacking can be reduced, and the risk that the chips are scratched is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of chip manufacturing, and particularly to a jig. Background Art

[0002] Semiconductor debonding refers to the process of debonding and separating a semiconductor chip that has been bonded together with a substrate device such as glass. In the process of chip manufacturing, debonding is usually used for manufacturing, repairing, or restructuring chips, or for functional testing and analysis of chips. Common debonding methods include Thermal Debonding, Laser Debonding, and Chemical Debonding.

[0003] Among them, chemical debonding uses a specific chemical solution to dissolve or weaken the bonding material to separate the chip from the glass. The chemical debonding process requires the use of two stacked trays. Among them, the upper tray is used for the glass sheet and the chip, and the lower tray is used to pick up the debonded chip. Utility Model Content

[0004] In the related art, the bottom of the lower tray is a flat surface for receiving the chips that fall off during debonding; when the chemical solution shakes due to the stirring of the stirring device or due to the transportation tray, the chips may move accordingly and stack up, which may scratch the chips; in addition, when tools such as tweezers are needed to take out the chips, the chips stacked below may also be damaged due to the stacking of the chips.

[0005] The embodiments of the present application provide a jig that can improve the current situation where chips are prone to stacking due to the shaking of the chemical solution.

[0006] Among them, the jig includes a mounting base and a plurality of carrier plates. The carrier plates are mounted on the mounting base, and the carrier plates are arranged in an array along a first direction and a second direction. The carrier plate is provided with a top surface and a side surface connected to the top surface. The top surface is used to carry the chips. Between any two adjacent carrier plates along the first direction, a part of the side surface of the upstream carrier plate close to the downstream carrier plate satisfies: at least part of it is located on the side where the downstream carrier plate is provided with the top surface; between any two adjacent carrier plates along the second direction, a part of the side surface of the upstream carrier plate close to the downstream carrier plate satisfies: at least part of it is located on the side where the downstream carrier plate is provided with the top surface.

[0007] Optionally, the carrier plate is rotatably mounted on the mounting base. The fixture further includes an abutting member, which is mounted on the mounting base and abuts against the carrier plate, so that between any two adjacent carrier plates along the second direction, a part of the side surface of the upstream carrier plate close to the downstream carrier plate satisfies that at least a part of the side where the downstream carrier plate is provided with the top surface.

[0008] Optionally, the mounting base includes a base and a rotating shaft, the rotating shaft is mounted on the base and extends along the first direction. Each of the carrier plates in the same row along the first direction forms a carrier plate array, and each of the carrier plates in the same carrier plate array is mounted on the same rotating shaft, and one carrier plate array corresponds to one rotating shaft.

[0009] Optionally, along the first direction, the downstream part of the top surface is farther from the preset plane than the upstream part. Wherein, the preset plane is a plane parallel to the first direction and the second direction, and the preset plane is lower than the top surface.

[0010] Optionally, the bottom surface of the carrier plate is parallel to the first direction and the second direction.

[0011] Optionally, the side surface includes a plurality of connecting planes and connecting arc surfaces distributed around the top surface, and adjacent two connecting planes are connected by the connecting arc surface. Between any two adjacent carrier plates along the first direction, the connecting plane on the side of the upstream carrier plate close to the downstream carrier plate is the first limiting surface, and at least a part of the first limiting surface is located on the side where the downstream carrier plate is provided with the top surface. Between any two adjacent carrier plates along the second direction, the connecting plane on the side of the upstream carrier plate close to the downstream carrier plate is the second limiting surface, and at least a part of the second limiting surface is located on the side where the downstream carrier plate is provided with the top surface.

[0012] Optionally, the mounting base includes a base. The base includes a bottom plate and a limiting member, the limiting member is arranged at the edge of the bottom plate, and the bottom plate and the limiting member jointly enclose a receiving space, and each carrier plate is mounted in the receiving space.

[0013] Optionally, there is a first gap between any two adjacent carrier plates, and there is a second gap between the limiting member and the adjacent carrier plate.

[0014] Optionally, the limiting member has a limiting wall facing the outermost carrier plate, and at least a part of the limiting wall is higher than the side where the adjacent carrier plate is provided with the top surface.

[0015] Optionally, the limiting member is provided with a through-connecting groove, one end of the connecting groove communicates with the receiving space, and the other end extends away from the receiving space. The abutting member is a bolt, the bolt is threadedly connected to the bottom plate, and the screw rod of the bolt abuts against the bearing plate.

[0016] Based on the above structure, when the chip falls onto the fixture and is carried on the top surface of a bearing plate, along the first direction, the side surface of the bearing plate located upstream is higher than the top surface, so the movement of the chip can be reduced; along the second direction, the side surface of the bearing plate located upstream is higher than the top surface, so the movement of the chip can be reduced; therefore, the fixture can reduce the phenomenon that the chips are prone to shake with the chemical solution, resulting in chip stacking, and reduce the risk of chip scratching. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the drawings.

[0018] Figure 1 is a three-dimensional schematic diagram of a fixture and a chip provided by one embodiment of the present application;

[0019] Figure 2 is an exploded view of a fixture provided by one embodiment of the present application;

[0020] Figure 3 is a plan view of a fixture provided by one embodiment of the present application;

[0021] Figure 4 is provided by the present application Figure 3 A-side sectional view of;

[0022] Figure 5 is a partial three-dimensional schematic diagram of a fixture provided by one embodiment of the present application.

[0023] The reference numerals are as follows:

[0024]

[0025] Detailed Embodiments

[0026] To facilitate the understanding of the present application, the present application will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in this specification in the description of this application are only for the purpose of describing specific embodiments and are not used to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0028] The chemical debonding process requires the use of two stacked trays. Among them, the upper tray is used for glass wafers and chips, and the lower tray is used to pick up the debonded chips. In the related art, the bottom of the lower tray is a flat surface for receiving the chips that fall off during debonding; when the chemical solution shakes due to the stirring of the stirring device or due to the transportation of the tray, the chips may move accordingly and stack up, which may scratch the chips; in addition, when tools such as tweezers are needed to take out the chips, the chips stacked below may also be damaged due to the stacking of the chips.

[0029] Based on this, the present application provides a jig 1000 to improve the current situation where the chips 2000 are stacked due to the shaking of the chemical solution in the related art, thereby reducing the risk of scratching the chips 2000.

[0030] The present application provides a jig 1000. Please refer to Figures 1 to 4 which respectively show the three-dimensional schematic diagrams of the jig 1000 and the chip 2000 provided in one embodiment of the present application, the exploded view of the jig 1000 provided in one embodiment of the present application, the plan view of the jig 1000 provided in one embodiment of the present application, and the Figure 4A-side cross-sectional view. The fixture 1000 includes a mounting seat 100 and a plurality of carrier plates 200. The carrier plates 200 are mounted on the mounting seat 100, and each carrier plate 200 is arranged in an array along the first direction F1 and the second direction F2 shown in the figure. The carrier plate 200 is provided with a top surface 210 and a side surface 220 connected to the top surface 210, and the top surface 210 is used to carry the chip 2000; between any two adjacent carrier plates 200 along the first direction F1, the side surface 220 of an upstream carrier plate 200 satisfies the following conditions on the part close to a downstream carrier plate 200: at least a part of a downstream carrier plate 200 has a side of the top surface 210, and between any two adjacent carrier plates 200 along the second direction F2, the side surface 220 of an upstream carrier plate 200 is provided on the part close to a downstream carrier plate 200: at least a part of a downstream carrier plate 200 has a side of the top surface 210.

[0031] The specific structure of the fixture 1000 is described in detail below in conjunction with the accompanying drawings.

[0032] For Mount 100, see Figure 1 The mounting base 100 includes a base 110, which is a base for mounting a carrier plate, and includes a bottom plate 111 and a limiting member 112. The limiting member 112 is arranged at the edge of the bottom plate 111. The bottom plate 111 and the limiting member 112 together enclose a receiving space, and the above-mentioned carrier plates 200 are installed in the receiving space.

[0033] In some embodiments, the stopper 112 is provided with a through-connecting groove 1122, one end of which is connected to the receiving space, and the other end of which extends away from the receiving space. By providing the connecting groove 1122, a space for avoiding the clamp can be provided, so that other clamps can clamp the glass sheet installed on the stopper 112. For example, in practical applications, after the bonded glass sheet and the chip 2000 are debonded, the chip 2000 falls onto the above-mentioned carrier plate 200, and the glass sheet can be taken away by the clamp.

[0034] For the above-mentioned carrier plate 200, please continue to refer to Figure 1, the carrier plate 200 has a plate-like structure, which is received in the above-mentioned receiving space and is used to carry the chip 2000. A plurality of carrier plates 200 are arranged in an array in the receiving space along a first direction F1 and a second direction F2. Among them, the first direction F1 is a direction in which the carrier plates 200 are arranged in a one-dimensional array, and the second direction F2 is a direction in which the carrier plates are arranged in another one-dimensional array. The first direction F1 intersects the second direction F2, so that a plurality of carrier plates 200 are arranged in a two-dimensional array; in this embodiment, the first direction F1 is perpendicular to the second direction F2. It should be noted here that the phrase "each carrier plate 200 is arranged in an array along the first direction F1 and the second direction F2" in this application means that a plurality of carrier plates 200 are arranged in sequence in the first direction F1 and the second direction F2, but does not limit whether the number of carrier plates 200 in the first direction F1 or the second direction F2 is the same; that is, the number of carrier plates 200 in two adjacent rows of carrier plate arrays arranged in the first direction F1 can be equal or unequal, and the number of carrier plates 200 in two adjacent rows of carrier plate arrays arranged in the second direction F2 can be equal or unequal, and can be adjusted adaptively according to the shape of the mounting base 100.

[0035] In addition, it is worth mentioning that both the first direction F1 and the second direction F2 are directional directions, that is, both the first direction F1 and the second direction F2 are unidirectional directions; for example, please refer to Figure 1 , in the embodiment of this application, the first direction F1 is the direction from the upper right corner to the lower left corner in the figure, and the second direction F2 is the direction from the upper left corner to the lower right corner in the figure. The first direction F1 is perpendicular to the second direction F2.

[0036] For each carrier plate 200, it has a top surface 210 and a side surface connected to the top surface 210. Among them, the top surface 210 is used to carry the chip 2000. The side surface 220 is connected to the top surface 210, and the side surface 220 extends from the edge of the top surface 210 to the bottom plate of the base 110. Between any two adjacent carrier plates 200 along the first direction F1, a part of the side surface 220 of the upstream carrier plate 200 near the downstream carrier plate 200 satisfies: part or all of it is located on the side where the downstream carrier plate 200 has a top surface, so as to form a first limiting surface on this side. Since some carrier plates 200 are arranged in a one-dimensional array along the first direction F1, for a single carrier plate 200, the part of the top surface 210 of the carrier plate 200 located downstream in the first direction F1 will also be higher than the part located upstream; in other words, the part of the top surface 210 located downstream in the first direction F1 is farther from Figure 2is farther from the preset plane 400 shown. Among them, the preset plane 400 is a plane parallel to the first direction F1 and the second direction F2 and lower than the top surface 210; for example, the preset plane 400 may be the plane where the bottom plate 111 is located, or any plane lower than the top surface 210, that is, the preset plane 400 is a reference plane for representing the structure of the top surface 210, and is not necessarily a physical structure existing in the jig 1000. It should be noted that the "upstream" described in this application document means the position that is passed first in a certain direction; for example, "along the first direction, the first carrier plate located upstream and the second carrier plate located downstream" means that the direction indicated by the first direction passes through the first carrier plate first and then the second carrier plate, and the direction from the first carrier plate to the second carrier plate is the first direction.

[0037] Similarly, between any two adjacent carrier plates 200 along the second direction F2, the part of the side surface of the upstream carrier plate 200 close to the downstream carrier plate 200 satisfies that part or all of it is located on the side of the downstream carrier plate 200 where the top surface 210 is provided, so as to form a second limiting surface on this side. Since some carrier plates 200 are arranged in a one-dimensional array along the second direction F2, for a single carrier plate 200, the part of the top surface 210 of the carrier plate 200 located downstream along the second direction F2 will also be higher than the part located upstream; in other words, the part of the top surface 210 located downstream along the second direction F2 is farther from the preset plane 400 shown than the part located upstream.

[0038] In this embodiment, the side surface 220 includes a plurality of connecting planes 221 and connecting arc surfaces 222 distributed around the top surface 210, and adjacent connecting planes 221 are connected by connecting arc surfaces 222. Between any two adjacent carrier plates 200 along the first direction F1, the connecting plane on the side of the side surface 220 of the upstream carrier plate 200 close to the downstream carrier plate 200 is the first limiting surface, and the first limiting surface is at least partially located on the side of the downstream carrier plate 200 where the top surface 210 is provided. Similarly, between any two adjacent carrier plates 200 along the second direction F2, the connecting plane on the side of the side surface 220 of the upstream carrier plate 220 close to the downstream carrier plate 200 is the second limiting surface, and the second limiting surface is at least partially located on the side of the downstream carrier plate 200 where the top surface 210 is provided.

[0039] Based on the above structure, when the chip 2000 is carried on the carrier plate 200, it will be restricted by gravity and the above-mentioned first limiting surface and second limiting surface. When the chip 2000 is subjected to a force that causes it to move downstream along the carrier plate 200 in the first direction F1 and / or the second direction F2 due to the shaking of the chemical solution, the chip 2000 will move slightly in the above direction. At the same time, it will be restricted by gravity, so it will still reset under the restraint of gravity after a short upward movement. Therefore, the stacking of the chips 2000 can be avoided. And if the chip 2000 is subjected to a force that causes it to move upstream along the carrier plate 200 in the first direction F1 and / or the second direction F2 due to the shaking of the chemical solution, the chip 2000 will be restricted by the above-mentioned first limiting surface and / or the second limiting surface, so as to maintain its current position. Therefore, the stacking of the chips 2000 can be avoided. Therefore, the jig 1000 provided by the embodiment of the present application can improve the current situation where chips are stacked due to the shaking of chemical solutions in the related art, and further reduce the risk of scratching the chips.

[0040] Considering that the chips 2000 carried on the carrier plate 200 at the most upstream in the first direction F1 and the second direction F2 have the risk of slipping off the carrier plate 200, the present application further improves the jig 1000. Specifically, the limiting member 112 has a limiting wall 1121 facing the outermost carrier plate 200, and at least a part of the limiting wall 1121 is higher than the side of the adjacent carrier plate 200 provided with the top surface 210. It should be noted that there should not be too large a gap between the outermost carrier plate 200 and the above-mentioned limiting wall 1121 to prevent the chip 2000 from slipping through this gap; specifically, the carrier plate 2000 and the limiting wall 1121 can be in contact, or there can be a gap smaller than the width of the carrier plate 200 in the first direction F1 and the second direction F2. In this way, the limiting wall 1121 can play the same role as the above-mentioned first limiting surface and second limiting surface, preventing the chip 2000 from slipping off the carrier plate 200, or moving upstream in the first direction F1 and / or the second direction F2.

[0041] In some embodiments, please refer to Figure 3 , and in combination with other drawings, there is a first gap 500 between any two adjacent carrier plates 200, and there is a second gap 600 between the limiting member 112 and the adjacent carrier plate 200. By setting the first gap 500 and the second gap 600, the corners of the chips 2000 carried between the respective carrier plates 200 will not abut against the adjacent carrier plates 200, thereby protecting the corners of the chips 2000, reducing the wear of the chips 2000, and reducing the defective rate of the chips 2000.

[0042] Next, a supplementary description will be made on the way of installing the carrier plate 200 on the mounting seat 1000.

[0043] In this embodiment, the carrier plate 200 can be rotatably mounted on the mounting base 100; correspondingly, the jig 1000 further includes an abutting member 300 for abutting against the carrier plate 200, so as to tilt the carrier plate 200 relative to the bottom plate 111, that is, to make the carrier plate 200 form the above-mentioned lower inclined state.

[0044] Specifically, please refer to Figure 2 , the mounting base 100 further includes a rotating shaft 120. The rotating shaft 120 is mounted on the upper base 110 and extends along the first direction F1. The rotating shaft 120 is inserted into the limiting member 112 to facilitate the erection and fixation of the rotating shaft 120. The carrier plates 200 arranged in the same row along the first direction F1 form an array of carrier plates 200. The carrier plates 200 in the same array of carrier plates 200 are mounted on the same rotating shaft 120, and one array of carrier plates 200 corresponds to one rotating shaft 120. By configuring the rotating shaft 120 to extend along the above-mentioned first direction F1, the carrier plate 200 can be rotated around the rotating shaft 120 so that the part of the top surface 210 of the carrier plate 200 located downstream along the second direction F2 is higher than the part located upstream. At the same time, the top surface 210 can be set to gradually move away from the rotating shaft 120 along the first direction F1, so that the part of the top surface 210 located downstream along the first direction F1 is higher than that located upstream. As for the bottom surface of the carrier plate 200, it can be parallel to the first direction F1 and the second direction F2, so that the carrier plate 200 as a whole has a plate-like structure with a gradually changing height. In this way, the top surface 210 of the carrier plate 200 can be lower at the upstream position in the first direction F1 and the second direction F2 than at the downstream position, thereby achieving the above-mentioned effect. In addition, the arrangement of sleeving a row of carrier plates 200 arranged along the first direction F1 on the same rotating shaft 120 is beneficial to reducing the number of rotating shafts 120 and simplifying the overall structure of the mounting base 100. It should be noted that the higher end of the carrier plate 200 is higher than the rotating shaft 120 corresponding to the downstream carrier plate 200 adjacent to this end, so as to avoid interference.

[0045] It can be understood that even though the above embodiment is described by taking the carrier plates 200 in the same row along the first direction F1 corresponding to one rotating shaft 120 as an example, the present application is not limited thereto. In other embodiments of the present application, it can also be that one carrier plate 200 corresponds to one rotating shaft 120, or some carrier plates and rotating shafts 120 are in a one-to-one correspondence, and some carrier plates 200 and rotating shafts 120 are in a many-to-one state. In addition, in other embodiments, the carrier plate 200 can also be rotatably mounted on the mounting base 200 in other ways; for example, in some embodiments, the carrier plate 200 is provided with a rotating shaft, and the mounting base is provided with a matching mounting hole, and the carrier plate is rotatably mounted on the mounting base through the rotating shaft; or, in some other embodiments, the carrier plate can also be mounted on the mounting base through a hinge; the present application will not list them one by one here.

[0046] The abutting member 300 is installed on the mounting base 100 and abuts against the carrier plate 200 to support the carrier plate 200. Thus, between any two adjacent carrier plates 200 along the second direction F2, the portion of the side surface 220 of the upstream carrier plate 200 close to the downstream carrier plate 200 satisfies that at least part of it is located on the side where the downstream carrier plate 200 is provided with the top surface 210. In this application, the abutting member 300 is a bolt, and the bolt is threadedly connected to the bottom plate 111, and the screw rod of the bolt abuts against the carrier plate. In this way, the inclination angle of the carrier plate can be adjusted by adjusting the height of the stud extending into the above-mentioned accommodation space. For example, in some embodiments, the jig 1000 further includes a gasket, and the gasket is arranged between the bottom plate 111 and the head of the bolt; then, by changing the thickness of the gasket, the height of the stud extending into the above-mentioned accommodation space can be adjusted. Since the gasket can be selected as a standard part, different heights of the abutting member 300 protruding relative to the bottom plate 111 can be adjusted by setting different numbers of gaskets. It can be understood that even though this embodiment is described by taking the abutting member 300 as a bolt as an example, in other embodiments of this application, the abutting member 300 can also be any other element provided above that is installed on the mounting base 100 and can achieve abutting against the carrier plate.

[0047] Based on the above structure and the combination of the above one or more embodiments, when the chip 2000 falls onto the jig 1000 and is carried on the top surface 210 of a carrier plate 200, along the first direction F1, the side surface 220 of the upstream carrier plate 200 is higher than the top surface 210, so the movement of the chip 2000 can be reduced; along the second direction F2, the side surface 220 of the upstream carrier plate 200 is higher than the top surface 210, so the movement of the chip 2000 can be reduced. Therefore, the jig 1000 provided by this application can reduce the phenomenon that the chips 2000 are stacked due to the easy shaking of the chips 2000 with the chemical solution in the related art, and reduce the risk of scratching the chips 2000.

[0048] It should be noted that the description and drawings of this application give the preferred embodiments of this application. However, this application can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not additional limitations to the content of this application. The purpose of providing these embodiments is to make the understanding of the disclosed content of this application more thorough and comprehensive. Moreover, the above technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope described in the specification of this application; further, for those of ordinary skill in the art, improvements or changes can be made according to the above description, and all these improvements and changes should fall within the protection scope of the appended claims of this application.

Claims

1. A fixture, characterized in that: include: Mounting seat; as well as A plurality of carrier plates are provided, wherein the carrier plates are mounted on the mounting seat, and each of the carrier plates is arranged in an array along a first direction and a second direction, the carrier plates are provided with a top surface and a side surface connected to the top surface, and the top surface is used to carry a chip. Between any two adjacent carrier plates along the first direction, the side surface of an upstream carrier plate satisfies the condition that at least a part of the downstream carrier plate has a side of the top surface, and between any two adjacent carrier plates along the second direction, the side surface of an upstream carrier plate satisfies the condition that at least a part of the downstream carrier plate has a side of the top surface.

2. The fixture according to claim 1, characterized in that: The carrying plate is rotatably mounted on the mounting seat; The jig also includes an abutment member, which is installed on the mounting seat and abuts against the carrying plate, so that between any two adjacent carrying plates along the second direction, the side surface of an upstream carrying plate satisfies the portion close to a downstream carrying plate: at least a portion of the downstream carrying plate is provided with a side of the top surface.

3. The fixture according to claim 2, characterized in that: The mounting base includes a base and a rotating shaft, wherein the rotating shaft is mounted on the base and extends along the first direction; The carrier plates in the same row along the first direction form a carrier plate array. The carrier plates in the same carrier plate array are installed on the same rotating shaft. One carrier plate array corresponds to one rotating shaft.

4. The fixture according to claim 1, characterized in that: Along the first direction, a downstream portion of the top surface is farther from the preset plane than an upstream portion; The preset plane is a plane parallel to the first direction and the second direction, and the preset plane is lower than the top surface.

5. The fixture according to claim 1, characterized in that: The bottom surface of the carrying plate is parallel to the first direction and the second direction.

6. The fixture according to claim 1, characterized in that: The side surface includes a plurality of connection planes and connection arc surfaces distributed around the top surface, and two adjacent connection planes are connected by the connection arc surfaces; Between any two adjacent carrying plates along the first direction, the connection plane of the upstream carrying plate on the side close to the downstream carrying plate is a first limiting surface, and at least a part of the first limiting surface is located on the side of the downstream carrying plate provided with the top surface. Between any two adjacent carrying plates along the second direction, the connection plane of the upstream carrying plate on the side close to the downstream carrying plate is a second limiting surface, and at least a part of the second limiting surface is located on the side of the downstream carrying plate provided with the top surface.

7. The fixture according to claim 2, characterized in that: The mounting base includes a base; The base includes a bottom plate and a limiting member, wherein the limiting member is arranged at the edge of the bottom plate, and the bottom plate and the limiting member together enclose a receiving space, and each of the carrying plates is installed in the receiving space.

8. The fixture according to claim 7, characterized in that: There is a first gap between any two adjacent carrying plates, and there is a second gap between the limiting member and the adjacent carrying plates.

9. The fixture according to claim 7, characterized in that: The limiting member has a limiting wall facing the outermost supporting plate, and the limiting wall is at least partially higher than a side of an adjacent supporting plate provided with the top surface.

10. The fixture according to claim 7, characterized in that: The limiting member is provided with a through communication groove, one end of which is in communication with the receiving space, and the other end of which extends away from the receiving space; The abutment member is a bolt, the bolt is threadedly connected to the bottom plate, and the screw rod of the bolt abuts against the carrying plate.

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