Jig

Abstract

The embodiment of the utility model relates to the technical field of semiconductor manufacturing, in particular to a jig. The jig comprises a substrate and a plurality of bearing plates. The bearing plates are mounted on the mounting base, the bearing plates are arranged in an array mode in the first direction and the second direction, each bearing plate comprises a top face and a plurality of side faces, the top faces are used for bearing chips, and the side faces comprise the first side face and the second side face which are oppositely arranged in the first direction and the third side face and the fourth side face which are oppositely arranged in the second direction; at least part of the second side face of one bearing plate is higher than the first side face of the other bearing plate between any two adjacent bearing plates in the first direction, and at least part of the fourth side face of one bearing plate is higher than the third side face of the other bearing plate between any two adjacent bearing plates in the second direction. Through the above structure, the phenomenon that the chip is easy to shake along with a chemical solution to cause chip superposition is reduced, the loss of the chip is reduced, and the chip is protected.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and particularly to a fixture. Background Art

[0002] Semiconductor debonding refers to the process of separating a semiconductor chip that has been bonded to a substrate device such as glass. In the chip manufacturing process, debonding is usually used for manufacturing, repairing, or restructuring chips, or for functional testing and analysis of chips. Common debonding methods include Thermal Debonding, Laser Debonding, and Chemical Debonding.

[0003] Among them, chemical debonding uses a specific chemical solution to dissolve or weaken the bonding material to separate the chip from the glass sheet. The chemical debonding process requires the use of two stacked trays. Among them, the upper tray is used to place the glass sheet and the chip, and the lower tray is used to pick up the debonded chip. Summary of the Utility Model

[0004] In the related art, the bottom of the lower tray is a flat surface for receiving the chips that fall off during debonding; when the chemical solution shakes due to the stirring device or the transportation tray, the chips may move accordingly and stack up, which may scratch the chips; in addition, when tools such as tweezers are needed to take out the chips, the chips stacked below may also be damaged due to the chip stacking.

[0005] The embodiments of the present application provide a fixture that can improve the current situation where chips are prone to stacking due to the shaking of the chemical solution.

[0006] Among them, the fixture includes: a mounting base and a plurality of carrier plates. The carrier plates are mounted on the mounting base, and the carrier plates are arranged in an array along a first direction and a second direction. The carrier plate includes a top surface and a plurality of side surfaces. The top surface is used to carry the chips. The plurality of side surfaces include a first side surface and a second side surface that are oppositely arranged along the first direction, and a third side surface and a fourth side surface that are oppositely arranged along the second direction. Between any two adjacent carrier plates along the first direction, at least a part of the second side surface of one carrier plate is higher than the first side surface of the other carrier plate. Between any two adjacent carrier plates along the second direction, at least a part of the fourth side surface of one carrier plate is higher than the third side surface of the other carrier plate.

[0007] Optionally, the mounting base includes a bottom plate and a limiting member provided at the edge of the bottom plate. The bottom plate and the limiting member together enclose a receiving space, and each carrier plate is mounted in the receiving space.

[0008] Optionally, the mounting base satisfies at least one of the following conditions: a) The limiting member has a first limiting wall facing the first side of the outermost bearing plate, and at least a part of the first limiting wall is higher than the first side; b) The limiting member has a second limiting wall facing the third side of the outermost bearing plate, and at least a part of the second limiting wall is higher than the third side.

[0009] Optionally, the limiting member is provided with a through communication groove, one end of the communication groove communicates with the receiving space, and the other end extends away from the receiving space.

[0010] Optionally, the bearing plate is rotatably mounted on the mounting base. The jig further includes an abutting member, and the abutting member is mounted on the mounting base and abuts against the bearing plate to make the bearing plate inclined relative to the bottom plate.

[0011] Optionally, the mounting base further includes a rotating shaft, the rotating shaft extends along a third direction and is mounted on the limiting wall. Wherein, the third direction is parallel to the bottom plate and intersects with the first direction and the second direction respectively.

[0012] Optionally, the bearing plate includes a first part and a second part. One end of the first side close to the third side, one end of the first side far from the third side, one end of the third side close to the first side, and one end of the third side far from the first side are located in the first part. One end of the second side close to the fourth side, one end of the second side far from the fourth side, one end of the fourth side close to the second side, and one end of the fourth side far from the second side are located in the second part. The first part is rotatably mounted on the mounting base, and the abutting member abuts against the second part to make the second part higher than the first part.

[0013] Optionally, the abutting member is a bolt, the bolt is threadedly connected to the bottom plate, and the screw rod of the bolt abuts against the bearing plate.

[0014] Optionally, the jig further includes a gasket, and the gasket is disposed between the bottom plate and the bolt.

[0015] Optionally, the inclination angle of the top surface relative to the bottom plate is a first inclination angle α, and the bearing plate satisfies: 5° ≤ α ≤ 15°

[0016] The beneficial effects of the embodiments of the present application are as follows: Different from the prior art, the embodiments of the present application provide a fixture, which includes a mounting base and a plurality of carrier plates. The carrier plates are mounted on the mounting base, and the carrier plates are arranged in an array along a first direction and a second direction. The carrier plate includes a top surface and a plurality of side surfaces. The top surface is used to carry chips. The plurality of side surfaces include a first side surface and a second side surface that are oppositely arranged along the first direction, and a third side surface and a fourth side surface that are oppositely arranged along the second direction. Between any two adjacent carrier plates along the first direction, at least a part of the second side surface of one carrier plate is higher than the first side surface of the other carrier plate. Between any two adjacent carrier plates along the second direction, at least a part of the fourth side surface of one carrier plate is higher than the third side surface of the other carrier plate.

[0017] Based on the above structure, when a chip falls onto the fixture and is carried on the top surface of a carrier plate, the second side surface of another adjacent carrier plate along the first direction is higher than the first side surface of this carrier plate, so the chip can be blocked; the fourth side surface of another adjacent carrier plate along the second direction is higher than the third side surface of this carrier plate, so the chip can be blocked; therefore, the fixture can reduce the phenomenon that chips are prone to shaking with the chemical solution and cause chip stacking, and reduce the risk of chip scratching. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. Obviously, the following described drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the drawings.

[0019] Figure 1 is a three-dimensional schematic diagram of the fixture and the chip provided by one embodiment of the present application;

[0020] Figure 2 is Figure 1 a schematic diagram of the partial decomposition of the fixture in

[0021] Figure 3 is a three-dimensional schematic diagram of the carrier plate and the abutting member provided by one embodiment of the present application.

[0022] The reference numerals are as follows:

[0023] Fixture 1000 Carrier board 200 Mounting base 100 Top surface 210 Bottom plate 110 Side surface 220 Limiting part 120 First side surface 221 First limiting wall 121 Second side surface 222 Second limiting wall 122 Third side surface 223 Communication groove 123 Fourth side surface 224 Receiving space 130 First part 230 Rotating shaft 140 Second part 240 First direction F1 Contact part 300 Second direction F2 Spacer 400 Third direction F3 Chip 2000 DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To facilitate the understanding of the present application, the present application will be described in more detail below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in this specification in the description of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0026] The chemical debonding process requires the use of two stacked trays. Among them, the upper tray is used to place glass wafers and chips, and the lower tray is used to pick up the debonded chips. In the related art, the bottom of the lower tray is a flat surface for receiving the chips that fall off during debonding; when the chemical solution shakes due to the agitation of the stirring device or due to the transportation of the tray, the chips may move accordingly and stack up, which may scratch the chips; in addition, when tools such as tweezers are needed to take out the chips, the chips stacked below may also be damaged due to the stacking of the chips.

[0027] Based on this, the present application provides a fixture to improve the current situation where chips stack up due to the shaking of the chemical solution in the related art, thereby reducing the risk of scratching the chips.

[0028] The present application provides a fixture 1000. Please refer to Figure 1, which shows a three-dimensional schematic diagram of the jig 1000 and the chip 2000 provided in one embodiment of the present application. The jig 1000 includes a mounting base 100 and a plurality of carrier plates 200. The carrier plates 200 are mounted on the mounting base 100, and the carrier plates 200 are arranged in an array along the first direction F1 and the second direction F2. The carrier plate 200 includes a top surface 210 and a plurality of side surfaces 220. The top surface 210 is used to carry the chip 2000. The plurality of side surfaces 220 include a first side surface 221 and a second side surface 222 that are oppositely arranged along the first direction F1, and a third side surface 223 and a fourth side surface 224 that are oppositely arranged along the second direction F2. Between any two adjacent carrier plates 200 along the first direction F1, at least a part of the second side surface 222 of one carrier plate 200 is higher than the first side surface 221 of the other carrier plate 200; between any two adjacent carrier plates 200 along the second direction F2, at least a part of the fourth side surface 224 of one carrier plate 200 is higher than the third side surface 223 of the other carrier plate 200.

[0029] It should be noted that the statement "the carrier plates are arranged in an array along the first direction and the second direction" in the present application means that a plurality of carrier plates 200 are arranged in sequence in the first direction F1 and the second direction F2, but does not limit the number of carrier plates 200 in the first direction F1 or the second direction F2; that is, the number of carrier plates in the array of two rows of carrier plates 200 spaced along the first direction F1 can be equal or unequal, and the number of carrier plates in the array of two rows of carrier plates 200 spaced along the second direction F2 can be equal or unequal, and can be specifically adjusted according to the shape of the mounting base 100. The "higher than" in the present application means that a certain structure is arranged beyond another structure; for example, at least a part of the second side surface 222 being higher than the first side surface 221 means that at least a part of the second side surface 222 is arranged beyond the first side surface 221, and the exceeding part protrudes relative to the top surface 210, so that there is a height difference between the second side surface 222 and the first side surface 221, thereby restricting the movement of the chip 2000 in the first direction F1; another example, at least a part of the fourth side surface 224 being higher than the third side surface 223 means that at least a part of the fourth side surface 224 is arranged beyond the third side surface 223, and the exceeding part protrudes relative to the top surface 210, so that there is a height difference between the third side surface 223 and the fourth side surface 224, thereby restricting the movement of the chip 2000 in the second direction F2.

[0030] The following will describe the specific structure of the jig 1000 in detail with reference to the accompanying drawings.

[0031] For the above-mentioned mounting base 100, please refer to Figure 1The mounting seat 100 is a mounting base for the carrier plate 200, and includes a bottom plate 110 and a stopper 120. The bottom plate 110 is a plate-shaped structure as a whole, and the first direction F1 and the second direction F2 are parallel to the bottom plate 110. The stopper 120 is arranged at the edge of the bottom plate 110, and it and the bottom plate 110 together form a receiving space 130; each of the above-mentioned carrier plates 200 is installed in the receiving space 130.

[0032] In this embodiment, the stopper 120 is further provided with a through communication groove 123. One end of the communication groove 123 is connected to the receiving space 130, and the other end extends away from the receiving space 130. By providing the communication groove 123, an escape space for a clamp can be provided, so that other clamps can clamp the glass sheet installed on the stopper 120. For example, in actual application, after the bonded glass sheet and the chip are debonded, the chip falls to the above-mentioned carrier plate 200, and the glass sheet can be taken away by the clamp.

[0033] For the above-mentioned carrier plate 200, please refer to Figure 2 , which shows a schematic diagram of a partial decomposition of the fixture 1000, and combined with Figure 1 The carrier plate 200 is also a plate-shaped structure, which is accommodated in the above-mentioned accommodation space 130 and is used to carry the chip 2000; multiple carrier plates 200 are arranged in an array along the first direction F1 and the second direction F2 in the accommodation space. The first direction F1 and the second direction F2 are respectively parallel to the above-mentioned bottom plate 110, and the first direction F1 intersects with the second direction F2; it should be noted that the first direction F1 and the second direction F2 described in the embodiment of the present application are both directions with directions, for example, the first direction F1 shown in the figure is the direction from the upper right corner of the figure to the lower left corner of the figure, and the second direction F2 shown in the figure is the direction from the upper left corner of the figure to the lower right corner of the figure.

[0034] The carrier plate 200 includes a top surface 210 and a plurality of side surfaces 220. The top surface 210 is the surface of the carrier plate 200 facing away from the bottom plate 110, and is used to carry the chip 2000. The side surfaces 220 are located at the side of the carrier plate 200, and are adjacent to the top surface 210. The plurality of side surfaces 220 include a first side surface 221 and a second side surface 222 that are opposite to each other along the first direction F1, and a third side surface 223 and a fourth side surface 224 that are opposite to each other along the second direction F2. The side of the top surface 210 close to the first side surface 221 is lower than the side of the top surface 210 close to the second side surface 222, and the side of the top surface 210 close to the third side surface 223 is lower than the side of the top surface 210 close to the fourth side surface 224. In this way, when the chip 2000 falls on the top surface 210, it will slide toward the first side surface 221 and the third side surface 223 due to gravity.

[0035] Further, between any two adjacent carrier plates 200 along the first direction F1, the second side surface 222 of one carrier plate 200 is at least partially higher than the first side surface 221 of the other carrier plate 200; between any two adjacent carrier plates 200 along the second direction F2, the fourth side surface 224 of one carrier plate 200 is at least partially higher than the third side surface 223 of the other carrier plate 200. In this way, when the chip 2000 on a certain carrier plate 200 slides toward the first side surface 221 and the third side surface 223, the second side surface 222 of the carrier plate 200 adjacent to the first side surface 221 will block the chip 2000, and the fourth side surface 224 of the carrier plate 200 adjacent to the third side surface 223 will block the chip 2000. When the chip 2000 is subjected to a force moving toward the second side surface 222 and / or the fourth side surface 224 due to the shaking of the chemical solution, the chip 2000 will move slightly in the direction of the second side surface 222 and / or the fourth side surface 224. At the same time, it will be restricted by gravity, so it will reset under the constraint of gravity after a short upward movement. Therefore, the stacking of the chips 2000 can be avoided. And if the chip 2000 is subjected to a force moving toward the first side surface 221 and / or the third side surface 223 due to the shaking of the chemical solution, the chip 2000 will be restricted by the second side surface 222 and / or the fourth side surface 224 of the adjacent carrier plate 200, so as to maintain the current position. Therefore, the stacking of the chips 2000 can be avoided. Therefore, the jig 1000 provided in the embodiment of the present application can improve the current situation where the chips are stacked due to the shaking of the chemical solution in the related art, and further reduce the risk of scratching the chips.

[0036] In this embodiment, the carrier plate 200 is rotatably mounted on the mounting base 100; correspondingly, the jig 1000 further includes an abutting member 300 for abutting against the carrier plate 200, so as to incline the carrier plate 200 relative to the bottom plate 100, that is, to make the carrier plate 200 form the inclined state where the first side surface 221 and the third side surface 223 are lower.

[0037] Specifically, the mounting base 100 further includes a rotating shaft 140, the rotating shaft 140 extends along the illustrated third direction F3 and is mounted on the limiting wall; the above-mentioned carrier plate 200 is sleeved on the rotating shaft 140, so as to realize the rotational connection with the mounting base 100. More specifically, please refer to Figure 2 and Figure 3 together, the carrier plate 200 includes a first part 230 and a second part 240, the first part 230 and the second part 240 are arranged in sequence along the direction perpendicular to the above-mentioned third direction F3, and the two are respectively Figure 2The upper left triangular area and the lower right triangular area of the carrier plate 200 shown. One end of the first side surface 221 close to the third side surface 223, one end of the first side surface 221 far from the third side surface 223, one end of the third side surface 223 close to the first side surface 221, and one end of the third side surface 223 far from the first side surface 221 are located in the first part 230, and the above four jointly define the first part 230; One end of the second side surface 222 close to the fourth side surface 224, one end of the second side surface 222 far from the fourth side surface 224, one end of the fourth side surface 224 close to the second side surface 222, and one end of the fourth side surface 224 far from the second side surface 222 are located in the second part 240, and the above four jointly define the second part 240. The first part 230 is rotatably mounted on the mounting seat 100, and the abutting member 300 abuts against the second part 240 so that the second part 240 is higher than the first part 230. The first part 230 is sleeved on the rotating shaft 140 to be rotatably connected to the rotating shaft 140; The second part 240 is inclined at a first inclination angle α relative to the first part 230 away from the bottom plate 110, and the second part 240 is higher than the rotating shaft 140 corresponding to the adjacent carrier plate 200 at this end, so as to avoid interference. Preferably, the above first inclination angle α satisfies: 5° ≤ α ≤ 15°, and more preferably, the first inclination angle α between the carrier plate 200 and the bottom plate 110 is 10°. It should be noted that the third direction F3 is parallel to the bottom plate 110 and intersects with the first direction F1 and the second direction F2 respectively; In this embodiment, the third direction F3 forms a 45-degree angle with the first direction F1, and the third direction F3 also forms a 45-degree angle with the second direction F2.

[0038] By arranging the rotating shaft 140 to extend along the above third direction F3, the adjacent first side surface 221 and the third side surface 223 of the carrier plate 200 can be lowered in height and are lower than the second side surface 222 and the fourth side surface 224 of the adjacent carrier plate 200, so that the chip 2000 can slide to the side where the first side surface 221 and the third side surface 223 are located under the action of gravity and be held by the adjacent carrier plate.

[0039] In this embodiment, a row of carrier plates 200 arranged along the third direction F3 are sleeved on the same rotating shaft 140, and the number of rotating shafts 140 is the same as the number of rows formed by the plurality of carrier plates 200 arranged along the third direction F3. This setting is beneficial to reducing the number of rotating shafts 140, facilitating the installation of each rotating shaft 140, and at the same time simplifying the overall structure of the mounting seat 100. As described above, the higher end of the carrier plate 200, that is, the second part 240 is higher than the rotating shaft 140 corresponding to the adjacent carrier plate 200 at this end, so as to avoid interference.

[0040] Next, an explanation will be made on the structure of the abutting member 300.

[0041] The abutting member 300 is installed on the mounting base 100 and abuts against the bearing plate 200 at the same time, so that the bearing plate 200 is inclined relative to the bottom plate 110. In this embodiment, the abutting member 300 is a bolt; the bolt is threadedly connected to the bottom plate 110, and the screw rod of the bolt abuts against the bearing plate 200. In this way, the inclination angle of the bearing plate 200 can be adjusted by adjusting the height of the stud extending into the above-mentioned receiving space 130. For example, in some embodiments, the jig 1000 further includes a gasket 400, and the gasket 400 is disposed between the bottom plate 110 and the head of the bolt; then, by changing the thickness of the gasket 400, the height of the stud extending into the above-mentioned receiving space 130 can be adjusted. Since the gasket 400 can be selected as a standard part, different heights of the abutting member 300 protruding relative to the bottom plate 110 can be adjusted by setting different numbers of gaskets 400.

[0042] It can be understood that even though this embodiment is described by taking the abutting member 300 as a bolt as an example, in other embodiments of the present application, the abutting member 300 can also be any other element that is installed on the mounting base 100 and can realize abutting against the bearing plate 200. For example, in other embodiments, the abutting member 300 can also be a boss structure fixed to the bottom plate 110, or a telescopic structure that can be telescopic relative to the bottom plate 110, etc., which will not be elaborated here one by one. In addition, in some other embodiments, the heights of the plurality of abutting members 300 protruding relative to the bottom plate 110 can also be unequal, so as to facilitate the regional loading of different types of chips 2000.

[0043] For the outermost bearing plate 200, the inner wall of the limiting member 130 can be configured to be adjacent to the outermost bearing plate 200, so as to form a restriction on the chip 2000 located on the bearing plate 200. For example, in this embodiment, the limiting member 120 has a first limiting wall 121 facing the first side surface 221 of the outermost bearing plate 200, and at least a part of the first limiting wall 121 is higher than the first side surface 221; the limiting member 120 has a second limiting wall 122 facing the third side surface 223 of the outermost bearing plate 200, and at least a part of the second limiting wall 122 is higher than the third side surface 223. The above-mentioned first limiting wall 121 is equivalent to the second side surface 222 of the bearing plate 200 in the middle position, and the second limiting wall 122 is equivalent to the fourth side surface 224 of the bearing plate 200 in the middle position, so that it can also form a constraint on the chip 2000 falling on the outermost bearing plate 200 and limit the movement of the chip 2000 in the first direction F1 and the second direction F2.

[0044] An embodiment of the present application provides a jig 1000, which includes a mounting base 100 and a plurality of carrier plates 200. The carrier plates 200 are arranged in an array along a first direction F1 and a second direction F2. The top surface 210 of the carrier plate 200 is used to carry the chip 2000. The plurality of side surfaces 220 of the carrier plate 200 include a first side surface 221 and a second side surface 222 that are oppositely arranged along the first direction F1, and a third side surface 223 and a fourth side surface 224 that are oppositely arranged along the second direction F2. Between any two adjacent carrier plates 200 along the first direction F1, at least a part of the second side surface 222 of one carrier plate 200 is higher than the first side surface 221 of the other carrier plate 200. Between any two adjacent carrier plates 200 along the second direction F2, at least a part of the fourth side surface 224 of one carrier plate 200 is higher than the third side surface 223 of the other carrier plate 200.

[0045] Based on the above structure, when the chip 2000 falls onto the jig 1000 and is carried on the top surface 210 of a carrier plate 200, the second side surface 222 of another adjacent carrier plate 200 along the first direction F1 is higher than the first side surface 221 of this carrier plate 200, so the chip 2000 can be blocked; the fourth side surface 224 of another adjacent carrier plate 200 along the second direction F2 is higher than the third side surface 223 of this carrier plate 200, so the chip 2000 can be blocked; therefore, the jig 100 can reduce the phenomenon that the chips 2000 are prone to shake with the chemical solution and cause the chips 2000 to be stacked, and reduce the risk of scratching the chips 2000.

[0046] It should be noted that the description and drawings of the present application give preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations to the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Moreover, the above technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as within the scope described in the specification of the present application; further, for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present application.

Claims

1. A fixture, characterized in that: include: Mounting seat; as well as A plurality of carrier plates, wherein the carrier plates are mounted on the mounting seat, and each of the carrier plates is arranged in an array along a first direction and a second direction, wherein the carrier plates include a top surface and a plurality of side surfaces, wherein the top surface is used to carry chips, and the plurality of side surfaces include a first side surface and a second side surface that are relatively arranged along the first direction, and a third side surface and a fourth side surface that are relatively arranged along the second direction, and between any two adjacent carrier plates along the first direction, at least a portion of the second side surface of one carrier plate is higher than the first side surface of the other carrier plate, and between any two adjacent carrier plates along the second direction, at least a portion of the fourth side surface of one carrier plate is higher than the third side surface of the other carrier plate.

2. The fixture according to claim 1, characterized in that: The mounting seat comprises a bottom plate and a limiting member arranged at the edge of the bottom plate. The bottom plate and the limiting member together enclose a receiving space, and each of the supporting plates is installed in the receiving space.

3. The fixture according to claim 2, characterized in that: The mounting seat satisfies at least one of the following conditions: a) the limiting member has a first limiting wall facing the first side surface of the outermost supporting plate, and at least a portion of the first limiting wall is arranged higher than the first side surface; b) The limiting member has a second limiting wall facing the third side surface of the outermost supporting plate, and at least a portion of the second limiting wall is arranged higher than the third side surface.

4. The fixture according to claim 2, characterized in that: The limiting member is provided with a through communication groove, one end of which is communicated with the receiving space, and the other end of which extends away from the receiving space.

5. The fixture according to claim 2, characterized in that: The bearing plate is rotatably mounted on the mounting seat; The fixture further includes a contact piece, which is mounted on the mounting seat and contacts the supporting plate so that the supporting plate is tilted relative to the bottom plate.

6. The fixture according to claim 5, characterized in that: The mounting seat further comprises a rotating shaft, the rotating shaft extends along the third direction and is mounted on the limiting member, and the bearing plate is sleeved on the rotating shaft; Wherein, the third direction is parallel to the bottom plate and intersects with the first direction and the second direction respectively.

7. The fixture according to claim 5, characterized in that: The carrying plate comprises a first portion and a second portion, wherein an end of the first side surface close to the third side surface, an end of the first side surface far from the third side surface, an end of the third side surface close to the first side surface, and an end of the third side surface far from the first side surface are located in the first portion, and an end of the second side surface close to the fourth side surface, an end of the second side surface far from the fourth side surface, an end of the fourth side surface close to the second side surface, and an end of the fourth side surface far from the second side surface are located in the second portion; The first part is rotatably mounted on the mounting seat, and the abutment member abuts against the second part, so that the second part is higher than the first part.

8. The fixture according to claim 5, characterized in that: The abutment member is a bolt, the bolt is threadedly connected to the bottom plate, and the screw rod of the bolt abuts against the bearing plate.

9. The fixture according to claim 8, characterized in that: The fixture further comprises a gasket, which is arranged between the base plate and the head of the bolt.

10. The fixture according to claim 7, characterized in that: The inclination angle of the top surface relative to the bottom plate is a first inclination angle α, and the bearing plate satisfies: 5°≤α≤15°.

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