Packaging structure based on HTCC substrate

Abstract

The utility model is suitable for the technical field of HTCC substrate packaging, and provides a packaging structure based on an HTCC substrate. The frame is fixedly mounted on the base; the hot air gun is arranged on the base; the rectangular groove is formed in the base; the clamping groove is formed in the inner wall of the rectangular groove; the tin planting net is arranged on the clamping groove; the positioning mechanism is arranged on the inner wall of the rectangular groove and is used for fixing a tin planting net; and the tin planting mechanism is mounted on the inner wall of the base and is used for carrying out tin planting operation. According to the packaging structure based on the HTCC substrate, tin planting operation can be efficiently completed, the tin planting net is convenient to replace, the packaging structure is suitable for BGA packaging of different types of electronic components, the positioning function on the HTCC substrate is achieved, operation is convenient, and practicability is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of HTCC substrate packaging, and particularly relates to a packaging structure based on an HTCC substrate. Background Technique

[0002] BGA packaging has good inter-board electromagnetic shielding characteristics and lower lead inductance, thus improving the high-frequency characteristics of the circuit. Therefore, it has been increasingly widely used in digital circuits and analog radio frequency circuits. The existing HTCC substrate packaging generally adopts BGA packaging.

[0003] However, the existing packaging structure based on HTCC substrates often requires manual tin planting operations by workers, which is time-consuming and laborious, and the work efficiency is relatively low. Summary of the Utility Model

[0004] The utility model provides a packaging structure based on an HTCC substrate, aiming to solve the problems of low tin planting efficiency and being time-consuming and laborious in the existing packaging structure based on HTCC substrates proposed in the above background technique.

[0005] To solve the above problems, the utility model is realized as follows. A packaging structure based on an HTCC substrate includes: a base; a frame fixedly installed on the base; a hot air gun arranged on the base; a rectangular groove opened on the base; a clamping groove opened on the inner wall of the rectangular groove; a tin planting mesh arranged on the clamping groove; a positioning mechanism arranged on the inner wall of the rectangular groove, and the positioning mechanism is used for fixing the tin planting mesh; a tin planting mechanism installed on the inner wall of the base, and the tin planting mechanism is used for performing tin planting operations; a displacement mechanism and an adsorption and fixation mechanism arranged on the frame, the displacement mechanism is used for controlling the horizontal, vertical and up-and-down movement of the adsorption and fixation mechanism, and the adsorption and fixation mechanism is used for adsorbing and fixing electronic components; a clamping and fixation mechanism installed on the base, and the clamping and fixation mechanism is used for clamping and fixing the HTCC substrate body.

[0006] Preferably, the positioning mechanism includes: a first electric cylinder fixedly installed on the inner wall of the rectangular groove; a positioning plate fixedly installed on the output rod of the first electric cylinder; a positioning groove opened on the positioning plate and adapted to the tin planting mesh.

[0007] Preferably, the tin planting mechanism includes: a second electric cylinder fixedly installed on the bottom inner wall of the base; a first electric slide rail fixedly installed on the output rod of the second electric cylinder; a tin box fixedly installed on the output block of the first electric slide rail; a third electric cylinder fixedly installed on the bottom inner wall of the tin box; a push block fixedly installed on the output rod of the third electric cylinder and slidably connected to the inner wall of the tin box; solder paste arranged inside the tin box.

[0008] Preferably, the displacement mechanism includes: a second electric slide rail fixedly installed on the inner wall of the top of the frame; a third electric slide rail fixedly installed on the output block of the second electric slide rail; and a fourth electric cylinder fixedly installed on the output block of the third electric slide rail.

[0009] Preferably, the adsorption and fixation mechanism includes: an adsorption seat fixedly installed on the output rod of the fourth electric cylinder; a groove opened at the bottom of the adsorption seat; a suction cup fixedly installed on the inner wall of the groove; a negative pressure pump fixedly installed on the adsorption seat; a negative pressure pipe arranged at the air inlet end of the negative pressure pump and communicated with the suction cup; a one-way valve arranged on the negative pressure pipe; a pressure relief pipe arranged on the negative pressure pipe and provided with a pressure relief valve; and electronic components arranged on the suction cup.

[0010] Preferably, two limiting grooves are opened on the top of the base, and two limiting plates are fixedly installed on the inner wall of the top of the base.

[0011] Preferably, the clamping and fixation mechanism includes: a biaxial motor fixedly installed on the inner wall of the top of the base; two screw rods respectively fixedly installed at both ends of the output shaft of the biaxial motor and respectively rotatably connected to the two limiting plates; a plurality of limiting rods fixedly installed on the side of the two limiting plates close to each other; two clamping plates respectively sleeved on the two screw rods in a threaded manner and slidably connected to the plurality of limiting rods, and the two clamping plates are respectively slidably connected to the inner walls of both sides of the two limiting grooves; two buffer pads respectively arranged on the side of the two clamping plates close to each other; and an HTCC substrate body arranged on the side of the two clamping plates close to each other.

[0012] Preferably, a controller is arranged on the frame, and a plurality of supporting feet are fixedly installed at the bottom of the base.

[0013] Compared with the related art, the packaging structure based on the HTCC substrate provided by the present utility model has the following

[0014] Beneficial effects:

[0015] Compared with the prior art, for the packaging structure based on the HTCC substrate provided by this solution, the base serves as the basic support platform for the entire packaging structure, carrying all other components and ensuring the stability and reliability of the entire packaging process. The frame is fixedly installed on the base, which not only provides additional structural strength but also serves as the installation basis for the displacement mechanism and the adsorption and fixation mechanism, enabling flexible operation of electronic components. The hot air gun is set on the base and is used to provide the necessary heat during the packaging process to help the solder paste melt and firmly connect the electronic components to the HTCC substrate, improving the packaging quality. The rectangular groove is used to accommodate and position the solder paste stencil, while the card slot further fixes the solder paste stencil to ensure its stability and accuracy during the solder paste printing process, preventing deviation and improving the solder paste printing accuracy. The solder paste stencil is used to carry and evenly distribute the solder paste. The positioning mechanism is used to position the solder paste stencil and is convenient for replacing solder paste stencils of different models. The solder paste printing mechanism is installed on the inner wall of the base and is specifically used to perform the solder paste printing operation. By precisely controlling the application of the solder paste, a high-quality connection between the electronic components and the HTCC substrate is achieved. The displacement mechanism is installed on the frame and can control the flexible movement of the adsorption and fixation mechanism in the horizontal, vertical, and up-and-down directions, enabling the adsorption and fixation mechanism to accurately adsorb and fix the electronic components, facilitating subsequent solder paste printing and packaging operations. This design improves the degree of automation, reduces manual intervention, and increases production efficiency. The clamping and fixation mechanism is installed on the base and is used to firmly clamp and fix the HTCC substrate body. This step is crucial for ensuring the stability and accuracy of the HTCC substrate during the entire packaging process, avoiding packaging defects caused by substrate movement or shaking.

[0016] In summary, the packaging structure based on the HTCC substrate proposed by the present invention integrates multiple functional modules such as a hot air gun, a solder paste printing mechanism, a displacement mechanism, an adsorption and fixation mechanism, and a clamping and fixation mechanism, realizing the efficient and precise packaging of the HTCC substrate and the electronic components thereon. This structure not only improves the packaging quality and production efficiency but also reduces the need for manual intervention, having significant technological progress and practical application value. Description of the Drawings

[0017] Figure 1 is the front sectional structural schematic diagram of a packaging structure based on the HTCC substrate provided by the present utility model;

[0018] Figure 2 is Figure 1 the three-dimensional assembly structural schematic diagram of the solder box and the solder paste in

[0019] Figure 3 is Figure 1 the three-dimensional assembly structural schematic diagram of the clamping plate and the buffer pad in

[0020] Figure 4 is Figure 1Schematic enlarged structure diagram of part A shown in [the figure];

[0021] Figure 5 is Figure 1 Schematic enlarged structure diagram of part B shown in [the figure];

[0022] Figure 6 is Figure 1 Schematic enlarged structure diagram of part C shown in [the figure];

[0023] Figure 7 is Figure 1 Schematic enlarged structure diagram of part D shown in [the figure].

[0024] Reference numerals: 1, base; 2, frame; 3, hot air gun; 4, rectangular groove; 5, clamping groove; 6, solder paste stencil; 7, first electric cylinder; 8, positioning plate; 9, positioning groove; 10, second electric cylinder; 11, first electric slide rail; 12, solder box; 13, third electric cylinder; 14, push block; 15, solder paste; 16, second electric slide rail; 17, third electric slide rail; 18, fourth electric cylinder; 19, adsorption seat; 20, groove; 21, suction cup; 22, negative pressure pump; 23, negative pressure pipe; 24, one-way valve; 25, pressure relief pipe; 26, pressure relief valve; 27, electronic component; 28, limiting groove; 29, limiting plate; 30, double-shaft motor; 31, screw; 32, limiting rod; 33, clamping plate; 34, HTCC substrate body. Detailed implementation manners

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and are not used to describe a specific order; the terms "inner", "outer", "left", "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0026] Reference to "embodiment" in this text means that the specific features, structures, or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] An embodiment of the present utility model provides a packaging structure based on an HTCC substrate, as Figure 1-7 shown. The packaging structure based on the HTCC substrate includes: a base 1; a frame 2 fixedly installed on the base 1; a hot air gun 3 disposed on the base 1; a rectangular groove 4 opened on the base 1; a card slot 5 opened on the inner wall of the rectangular groove 4; a solder paste stencil 6 disposed on the card slot 5; a positioning mechanism disposed on the inner wall of the rectangular groove 4, the positioning mechanism being used to fix the solder paste stencil 6; a solder paste dispensing mechanism installed on the inner wall of the base 1, the solder paste dispensing mechanism being used to perform solder paste dispensing operations; a displacement mechanism and an adsorption and fixation mechanism disposed on the frame 2, the displacement mechanism being used to control the lateral, longitudinal, and vertical movement of the adsorption and fixation mechanism, and the adsorption and fixation mechanism being used to adsorb and fix electronic components 27; a clamping and fixation mechanism installed on the base 1, the clamping and fixation mechanism being used to clamp and fix the HTCC substrate body 34.

[0028] In this embodiment, the base 1 serves as the basic support platform for the entire packaging structure, carrying all other components and ensuring the stability and reliability of the entire packaging process. The frame 2 is fixedly installed on the base, not only providing additional structural strength but also serving as the installation basis for the displacement mechanism and the adsorption and fixation mechanism, enabling flexible operation of the electronic components. The hot air gun 3 is arranged on the base and is used to provide the necessary heat during the packaging process to help the solder paste melt and firmly connect the electronic components to the HTCC substrate, improving the packaging quality. The rectangular groove 4 is used to accommodate and position the solder paste stencil 6, while the clamping groove 5 further fixes the solder paste stencil to ensure its stability and accuracy during the solder paste printing process, preventing deviation and improving the solder paste printing accuracy. The solder paste stencil 6 is used to carry and evenly distribute the solder paste. The positioning mechanism is used to position the solder paste stencil 6 and facilitate the replacement of solder paste stencils of different models. The solder paste printing mechanism is installed on the inner wall of the base and is specifically used to perform the solder paste printing operation. By precisely controlling the application of the solder paste, a high-quality connection between the electronic components and the HTCC substrate is achieved. The displacement mechanism is installed on the frame and can control the flexible movement of the adsorption and fixation mechanism in the horizontal, vertical, and up-and-down directions, enabling the adsorption and fixation mechanism to accurately adsorb and fix the electronic components, facilitating subsequent solder paste printing and packaging operations. This design improves the degree of automation, reduces manual intervention, and increases production efficiency. The clamping and fixation mechanism is installed on the base and is used to firmly clamp and fix the HTCC substrate body. This step is crucial for ensuring the stability and accuracy of the HTCC substrate during the entire packaging process, avoiding packaging defects caused by substrate movement or vibration.

[0029] In summary, the packaging structure based on the HTCC substrate proposed by the present invention integrates multiple functional modules such as a hot air gun, a solder paste printing mechanism, a displacement mechanism, an adsorption and fixation mechanism, and a clamping and fixation mechanism, realizing the efficient and precise packaging of the HTCC substrate and the electronic components thereon. This structure not only improves the packaging quality and production efficiency but also reduces the need for manual intervention, having significant technological progress and practical application value.

[0030] In a further preferred embodiment of the present utility model, the positioning mechanism includes: a first electric cylinder 7 fixedly installed on the inner wall of the rectangular groove 4; a positioning plate 8 fixedly installed on the output rod of the first electric cylinder 7; and a positioning groove 9 formed on the positioning plate 8 and adapted to the solder paste stencil 6.

[0031] In this embodiment, the first electric cylinder 7 can drive the positioning plate 8 to move horizontally. Through the horizontally moving positioning plate 8 and the positioning groove 9, the solder paste stencil 6 can be positioned and it is convenient to replace solder paste stencils of different models.

[0032] In a further preferred embodiment of the present utility model, the solder paste dispensing mechanism comprises: a second electric cylinder 10 fixedly installed on the inner wall of the bottom of the base 1; a first electric slide rail 11 fixedly installed on the output rod of the second electric cylinder 10; a solder paste box 12 fixedly installed on the output block of the first electric slide rail 11; a third electric cylinder 13 fixedly installed on the inner wall of the bottom of the solder paste box 12; a push block 14 fixedly installed on the output rod of the third electric cylinder 13 and slidably connected to the inner wall of the solder paste box 12; and solder paste 15 disposed inside the solder paste box 12.

[0033] In this embodiment, the second electric cylinder 10 can drive the solder paste box 12 to move up and down, the first electric slide rail 11 can drive the solder paste box 12 to move horizontally, and the third electric cylinder 13 can drive the push block 14 to move upward, so as to slowly push the solder paste 15 in the solder paste box 12 to the outside of the solder paste box 12. By making the top of the solder paste box 12 contact the solder paste stencil 6 and controlling the horizontal movement of the solder paste box 12, the solder paste 15 can be implanted on the electronic component 27 through the solder paste stencil 6.

[0034] In a further preferred embodiment of the present utility model, the displacement mechanism comprises: a second electric slide rail 16 fixedly installed on the inner wall of the top of the frame 2; a third electric slide rail 17 fixedly installed on the output block of the second electric slide rail 16; and a fourth electric cylinder 18 fixedly installed on the output block of the third electric slide rail 17.

[0035] In this embodiment, the second electric slide rail 16 can drive the electronic component 27 to move horizontally, the third electric slide rail 17 can drive the electronic component 27 to move longitudinally, and the fourth electric cylinder 18 can drive the electronic component 27 to move up and down.

[0036] In a further preferred embodiment of the present utility model, the adsorption and fixing mechanism comprises: an adsorption seat 19 fixedly installed on the output rod of the fourth electric cylinder 18; a groove 20 opened at the bottom of the adsorption seat 19; a suction cup 21 fixedly installed on the inner wall of the groove 20; a negative pressure pump 22 fixedly installed on the adsorption seat 19; a negative pressure pipe 23 disposed at the air inlet end of the negative pressure pump 22 and communicated with the suction cup 21; a one-way valve 24 disposed on the negative pressure pipe 23; a pressure relief pipe 25 disposed on the negative pressure pipe 23 and provided with a pressure relief valve 26; and an electronic component 27 disposed on the suction cup 21.

[0037] In this embodiment, when the negative pressure pump 22 operates, the air in the suction cup 21 can be pumped out, so that the electronic component 27 is adsorbed and fixed to the bottom of the suction cup 21. The air can enter the suction cup 21 through the pressure relief pipe 25 and the pressure relief valve 26, so that the suction cup 21 releases the adsorption and fixing state.

[0038] In a further preferred embodiment of the present utility model, two limiting grooves 28 are formed in the top of the base 1, and two limiting plates 29 are fixedly installed on the inner wall of the top of the base 1.

[0039] In this embodiment, the two clamping plates 33 can extend to the outside of the base 1 through the two limiting grooves 28, and the two screw rods 31 and the plurality of limiting rods 32 can be connected through the two limiting plates 29.

[0040] In a further preferred embodiment of the present utility model, the clamping and fixing mechanism includes: a double-shaft motor 30 fixedly installed on the inner wall of the top of the base 1; two screw rods 31 respectively fixedly installed at both ends of the output shaft of the double-shaft motor 30 and respectively rotatably connected to the two limiting plates 29; a plurality of limiting rods 32 fixedly installed on the side of the two limiting plates 29 close to each other; two clamping plates 33 respectively sleeved on the two screw rods 31 and slidably connected to the plurality of limiting rods 32, and the two clamping plates 33 are respectively slidably connected to the inner walls of both sides of the two limiting grooves 28; two buffer pads respectively arranged on the side of the two clamping plates 33 close to each other; and an HTCC substrate body 34 arranged on the side of the two clamping plates 33 close to each other.

[0041] In this embodiment, the double-shaft motor 30 drives the two screw rods 31 to rotate, and the rotation of the two screw rods 31 drives the two clamping plates 33 to approach each other to clamp and fix the HTCC substrate body 34. The two buffer pads can play a buffering role to prevent the HTCC substrate body 34 from being damaged.

[0042] In a further preferred embodiment of the present utility model, a controller is arranged on the frame 2, and a plurality of feet are fixedly installed at the bottom of the base 1.

[0043] In this embodiment, the structure can be operated and controlled through the controller, and the base 1 can be supported through the plurality of feet.

[0044] In summary, compared with the related technology, this structure can not only complete the tin planting operation more efficiently, but also facilitate the replacement of the tin planting mesh, is applicable to the BGA packaging of different types of electronic components, has a positioning function for the HTCC substrate, is relatively convenient to operate, and has strong practicability.

[0045] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways.

[0046] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the utility model. Obviously, the described embodiments are only partial embodiments of the present utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict and without creative efforts, combine, add, delete or make other adjustments to the features in the various embodiments of the present utility model according to the circumstances, so as to obtain different technical solutions that essentially do not depart from the concept of the present utility model, and these technical solutions also fall within the scope of protection of the present utility model.

Claims

1. A packaging structure based on a HTCC substrate, characterized in that: include: Base; A frame fixedly mounted on the base; A heat gun disposed on the base; A rectangular groove is provided on the base; A clamping groove is provided on the inner wall of the rectangular groove; A tin-planting mesh disposed on the card slot; A positioning mechanism disposed on the inner wall of the rectangular groove, the positioning mechanism being used to fix the tin-planting mesh; A tinning mechanism installed on the inner wall of the base, the tinning mechanism is used to perform tinning operation; A displacement mechanism and an adsorption and fixing mechanism are provided on the frame, wherein the displacement mechanism is used to control the lateral, longitudinal and up and down movement of the adsorption and fixing mechanism, and the adsorption and fixing mechanism is used to adsorb and fix electronic components; A clamping and fixing mechanism is installed on the base, and the clamping and fixing mechanism is used to clamp and fix the HTCC substrate body.

2. The packaging structure based on the HTCC substrate according to claim 1, characterized in that: The positioning mechanism comprises: A first electric cylinder fixedly mounted on the inner wall of the rectangular groove; A positioning plate fixedly mounted on the output rod of the first electric cylinder; A positioning groove is provided on the positioning plate and matched with the tin-planting net.

3. The packaging structure based on the HTCC substrate according to claim 1, characterized in that: The tin-planting mechanism comprises: A second electric cylinder fixedly mounted on the inner wall of the bottom of the base; A first electric slide rail fixedly mounted on the output rod of the second electric cylinder; A tin box fixedly mounted on the output block of the first electric slide; A third electric cylinder fixedly mounted on the inner wall of the bottom of the tin box; A push block fixedly mounted on the output rod of the third electric cylinder and slidably connected to the inner wall of the tin box; The solder paste is arranged inside the tin box.

4. The packaging structure based on the HTCC substrate according to claim 1, characterized in that: The displacement mechanism comprises: A second electric slide rail fixedly mounted on the inner wall of the top of the frame; A third electric slide rail fixedly mounted on the output block of the second electric slide rail; A fourth electric cylinder is fixedly mounted on the third electric slide rail output block.

5. The packaging structure based on the HTCC substrate according to claim 4, characterized in that: The adsorption and fixing mechanism comprises: An adsorption seat fixedly mounted on the output rod of the fourth electric cylinder; A groove is provided at the bottom of the adsorption seat; A suction cup fixedly mounted on the inner wall of the groove; A negative pressure pump fixedly mounted on the adsorption seat; A negative pressure pipe disposed at the air inlet end of the negative pressure pump and connected to the suction cup; A one-way valve disposed on the negative pressure pipe; A pressure relief pipe provided on the negative pressure pipe and having a pressure relief valve; The electronic components are arranged on the suction cup.

6. The packaging structure based on the HTCC substrate according to claim 1, characterized in that: The top of the base is provided with two limiting grooves, and the top inner wall of the base is fixedly mounted with two limiting plates.

7. The packaging structure based on the HTCC substrate according to claim 6, characterized in that: The clamping and fixing mechanism comprises: A dual-axis motor fixedly mounted on the inner wall of the top of the base; Two screws respectively fixedly mounted at both ends of the output shaft of the dual-axis motor and rotatably connected to the two limit plates; A plurality of limit rods fixedly mounted on the sides of the two limit plates close to each other; Two clamping plates are respectively threadedly sleeved on the two screw rods and slidably connected to the plurality of limit rods, and the two clamping plates are respectively slidably connected to the inner walls on both sides of the two limit grooves; Two buffer pads are respectively arranged on the sides of the two clamping plates close to each other; The HTCC substrate body is arranged on one side where the two clamping plates are close to each other.

8. The packaging structure based on the HTCC substrate according to claim 1, characterized in that: A controller is arranged on the frame, and a plurality of supporting legs are fixedly installed on the bottom of the base.

Images