Quartz boat

Abstract

The utility model relates to a quartz boat, which is used for clamping a silicon wafer, and comprises two support frames arranged oppositely; the bottom supporting structure is arranged between the two supporting frames; the two upper-layer clamping rods are arranged between the two supporting frames in parallel, and a plurality of first clamping grooves corresponding to each other are formed in the two upper-layer clamping rods at intervals in the extending direction of the two upper-layer clamping rods; and the bottom supporting structure is matched with the upper-layer clamping rod to clamp the silicon wafers, so that the extension lines of the central points of the adjacent silicon wafers which are sequentially clamped on the quartz boat are not parallel to the length direction of the clamping rod. By adopting the scheme, when the centers of the adjacent silicon wafers are staggered and water drops exist between the adjacent silicon wafers, the two silicon wafers are adhered by the water drops, the silicon wafers are easy to deform and are arched, the restoring force of the arched silicon wafers is arranged along the centers and is vertical to the silicon wafers, and the centers of the adjacent silicon wafers are staggered, so that the directions of the restoring force applied to the water drops are also staggered, and the liquid drops are not easy to balance; and the shape of the liquid drop is gradually reduced under the influence of gravity until the liquid drop is broken and drips.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer placement structures, and particularly relates to a quartz boat. Background Art

[0002] After the quartz boat places the wafers, it needs to be cleaned as a whole. After cleaning, the wafers are removed from the cleaning tank while remaining on the quartz boat and drained. When the existing quartz boat is drained, water droplets are easily clamped between the wafers, resulting in the problem that it is difficult for the water droplets between the wafers to drip off. Summary of the Utility Model

[0003] Based on this, a quartz boat for reducing water accumulation between wafers is provided to improve the problem that water is easily accumulated between wafers after cleaning when the existing quartz boat places the wafers.

[0004] The utility model provides a quartz boat for clamping wafers, and the quartz boat includes:

[0005] Two opposite support frames;

[0006] A bottom support structure arranged between the two support frames;

[0007] Two correspondingly arranged upper clamping rods, the two upper clamping rods are arranged in parallel between the two support frames, and a plurality of mutually corresponding first clamping grooves are arranged at intervals along the extending direction of the two upper clamping rods;

[0008] The bottom support structure and the upper clamping rods cooperate to clamp the wafers, so that the extension line of the central points of adjacent wafers sequentially clamped on the quartz boat is not parallel to the length direction of the clamping rods.

[0009] On the basis of the above technical solutions, the utility model can also be improved as follows.

[0010] In one embodiment, the depths of adjacent first clamping grooves on the same upper clamping rod are different.

[0011] In one embodiment, it further includes at least one middle clamping rod, and the middle clamping rod is located between the bottom support structure and the upper clamping rod and is used to support the wafers.

[0012] In one embodiment, at least one middle clamping rod is provided with second clamping grooves corresponding to the first clamping grooves, and the depths of adjacent second clamping grooves on the same middle clamping rod are different, and the second clamping grooves are used for the sides of the wafers to be inserted.

[0013] In one embodiment, the number of middle clamping rods is two and they are at the same horizontal height, and the two upper clamping rods are also at the same horizontal height.

[0014] In one embodiment, the bottom support structure is provided with third clamping grooves.

[0015] In one embodiment, the depths of adjacent third card slots are the same or different.

[0016] In one embodiment, third card slots are provided on the bottom support structure, the depths of adjacent third card slots are different, and the depths of adjacent first card slots on the same upper clamping bar are the same.

[0017] In one embodiment, the bottom support structure is two columnar structures arranged in parallel, and the support frame is detachably connected to the bottom support structure and the upper clamping bar by bolts.

[0018] In one embodiment, the opening direction of the first card slot is perpendicular to the length direction of the upper clamping bar, and the first card slots are parallel and equally spaced.

[0019] The beneficial effects of the present utility model are as follows: by cooperating the bottom support structure with the upper clamping bar to clamp the silicon wafers, the extension line of the center points of adjacent silicon wafers is not parallel to the length direction of the clamping bar, that is, the centers of adjacent silicon wafers are staggered; since the quartz boat is used to place the silicon wafers, when there are water droplets between adjacent silicon wafers after cleaning the silicon wafers, the two silicon wafers are adhered by the water droplets, and the silicon wafers are easily deformed and bow-shaped. The restoring force of the bow-shaped silicon wafer is arranged along the center and perpendicular to the silicon wafer. Since the centers of adjacent silicon wafers are staggered, the directions of the restoring forces received by the water droplets are also staggered, so that the water droplets are subjected to forces in different directions, and the water droplets are not easily balanced, and the shape of the water droplets gradually becomes smaller and breaks under the influence of gravity, thereby avoiding the accumulation of liquid between adjacent silicon wafers.

[0020] In addition, two upper clamping bars are provided, which can play a role in clamping the silicon wafers through the first card slots opened on the upper clamping bars. Through the setting of the bottom support structure, the bottom support structure plays a supporting role on the lower part of the silicon wafers; the support frame is used to fix the ends of the upper clamping bars, and at least two support frames are provided and are respectively located at both ends of the upper clamping bar. Description of the Drawings

[0021] Figure 1 It is a schematic structural diagram of a quartz boat for reducing water accumulation between silicon wafers in one embodiment;

[0022] Figure 2 For Figure 1 The detailed enlarged schematic diagram after the clamping bar is clamped with the silicon wafer in;

[0023] Figure 3 It is a comparison schematic diagram before and after improvement when clamping water droplets between silicon wafers.

[0024] In the drawings, the components represented by the reference numerals are as follows:

[0025] 10. Upper clamping bar; 11. First card slot;

[0026] 20. Support frame; 30. Silicon wafer; 40. Droplet;

[0027] 50. Bottom support structure; 60. Middle clamping rod. Detailed implementation manner

[0028] In order to make the purpose, technical solution and advantages of the present application clearer, the following further details the present application in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] This embodiment provides a quartz boat, as Figure 1 shown in Figure 2 and is used for clamping the silicon wafer 30. The quartz boat includes:

[0030] Two relatively arranged support frames 20;

[0031] A bottom support structure 50, which is arranged between the two support frames 20;

[0032] Two correspondingly arranged upper clamping rods 10. The two upper clamping rods 10 are arranged in parallel between the two support frames 20, and a plurality of mutually corresponding first card slots 11 are arranged at intervals along their extending directions on the two upper clamping rods 10;

[0033] The bottom support structure 50 and the upper clamping rod 10 cooperate to clamp the silicon wafer 30, so that the extension line of the center points of adjacent silicon wafers 30 sequentially clamped on the quartz boat is not parallel to the length direction of the clamping rod.

[0034] As Figure 3 shown, where the arrow direction is the restoring force of the silicon wafer 30 on the droplet 40, A is a schematic diagram of the structure where the droplet 40 is difficult to drip in the prior art. In the prior art, after the parallelly arranged silicon wafers 30 are cleaned, since the center connection line between adjacent silicon wafers 30 is perpendicular to the plane where the silicon wafers 30 are located, the directions of the restoring forces after the silicon wafers 30 are deformed are opposite, so that the directions of the forces exerted on the droplet 40 by the two silicon wafers 30 are opposite, making it difficult for the droplet 40 to drip; B is a schematic diagram of the silicon wafer 30 in this application being stressed and easy to drip. When in use, since the silicon wafers 30 are staggeredly arranged, the directions of the forces exerted on the droplet 40 by the silicon wafers 30 are also staggered.

[0035] The beneficial effects are as follows: By cooperating the bottom support structure 50 with the upper wafer clamping bar 10 to clamp and install the silicon wafer 30, the extension line of the center points of adjacent silicon wafers 30 is not parallel to the length direction of the wafer clamping bar, that is, the centers of adjacent silicon wafers 30 are staggered; Since the quartz boat is used to place the silicon wafer 30, when there are water droplets between adjacent silicon wafers 30 after cleaning the silicon wafer 30, the two silicon wafers 30 are adhered by the water droplets, and the silicon wafer 30 is easily deformed and arched. The restoring force of the arched silicon wafer 30 is set along the center and perpendicular to the silicon wafer 30. Since the centers of adjacent silicon wafers 30 are staggered, the directions of the restoring forces received by the water droplets are also staggered, so that the water droplets 40 are subjected to forces in different directions, and the water droplets 40 are not easily balanced, and the shape of the water droplets 40 gradually becomes smaller until it breaks under the influence of gravity, thus avoiding the accumulation of liquid between adjacent silicon wafers 30. Refer to Figure 3 In addition, two upper wafer clamping bars 10 are provided. The first clamping grooves 11 opened on the upper wafer clamping bars 10 can be used to clamp the silicon wafer 30. Through the setting of the bottom support structure 50, the bottom support structure 50 also supports the lower part of the silicon wafer 30; the support frame 20 is used to fix the ends of the upper wafer clamping bars 10, and at least two support frames 20 are provided and are respectively located at both ends of the upper wafer clamping bars 10.

[0036] In the embodiment, preferably, refer to Figure 1 and Figure 2 There are two upper wafer clamping bars 10. In specific application, through the combined action of the bottom support structure 50 and the upper wafer clamping bars 10, the bottom support structure 50 supports the bottom of the silicon wafer 30, the upper wafer clamping bars 10 support the sides of the silicon wafer 30, and the first clamping grooves 11 are clamped with the sides of the silicon wafer 30.

[0037] In some embodiments, refer to Figure 1 and Figure 2 The depths of adjacent first clamping grooves 11 on the same upper wafer clamping bar 10 are different. In this way, since the depths of adjacent clamping grooves on the same upper wafer clamping bar 10 are different, after the silicon wafer 30 is placed, the centers of adjacent silicon wafers 30 are staggered, and further the directions of the restoring forces received by the water droplets are also staggered, so that the water droplets are subjected to forces in different directions, and the shape of the water droplets gradually becomes smaller until it breaks under the influence of gravity, thus meeting the requirement of no water droplets remaining between the silicon wafers 30.

[0038] In the embodiment, on the premise that the depths of adjacent first clamping grooves 11 on the same upper wafer clamping bar 10 are different, the effect of staggering the centers of adjacent silicon wafers 30 can already be achieved. Therefore, the bottom support structure 50 may be provided with a third clamping groove or may not be provided with a third clamping groove.

[0039] In some embodiments, refer to Figure 1 and Figure 2, further comprising at least one middle clamping bar 60, which is located between the bottom support structure 50 and the upper clamping bar 10 and is used to support the silicon wafer 30. In this way, by providing the upper clamping bar 10 and the middle clamping bar 60 with different heights, the support structure on the side of the silicon wafer 30 is increased, and the stability of the silicon wafer 30 is improved.

[0040] In the embodiment, both the upper layer and the middle layer of the upper clamping bar 10 and the middle clamping bar 60 are within a range, and it is not limited that the heights of the upper clamping bars 10 are the same, nor is it limited that the heights of the middle clamping bars 60 are the same; however, it is limited that the upper clamping bar 10 is located above the middle clamping bar 60.

[0041] In some embodiments, referring to Figure 1 and Figure 2 , at least one middle clamping bar 60 is provided with a second card slot corresponding to the first card slot 11, and the depths of adjacent second card slots on the same middle clamping bar 60 are different, and the second card slot is used for the side of the silicon wafer 30 to be inserted. In this way, there are two layers of clamping bars, namely the upper clamping bar 10 and the middle clamping bar 60. On the basis that the first card slot 11 is provided on the upper clamping bar 10, the second card slot is also provided on the middle clamping bar 60, so that the silicon wafer 30 is simultaneously clamped with the first card slot 11 and the second card slot, improving the clamping stability of the silicon wafer 30.

[0042] Specifically, the second card slot can be provided on all the middle clamping bars 60, or on at least one middle clamping bar 60. Among them, it can be expected that the more the number of middle clamping bars 60 provided with the second card slot, the relatively more stable the structure of the silicon wafer 30 after clamping.

[0043] In some embodiments, referring to Figure 1 and Figure 2 , the number of middle clamping bars 60 is two and they are at the same horizontal height, and the horizontal heights of the two upper clamping bars 10 are also the same. In this way, by providing two middle clamping bars 60 and two upper clamping bars 10, and the horizontal heights of the two middle clamping bars 60 are the same, and the horizontal heights of the two upper clamping bars 10 are the same, while ensuring the stability of the silicon wafer 30, it is convenient for the installation and adjustment of the middle clamping bar 60 and the upper clamping bar 10.

[0044] In the embodiment, each middle clamping bar 60 is provided with a second card slot, so that each silicon wafer 30 is simultaneously clamped with two first card slots 11 and two second card slots. At the same time, the bottom support structure 50 only plays a supporting role for the silicon wafer 30 and does not have a card slot.

[0045] In some embodiments, the bottom support structure 50 is provided with a third card slot. In this way, by providing the third card slot, the bottom of the silicon wafer 30 can be clamped, thereby improving the stability of the silicon wafer 30.

[0046] Since it is defined in Embodiment 2 that the depths of adjacent first card slots 11 on the same upper clamping bar 10 are different, the position of the silicon wafer 30 can already be fixed through the first card slots 11 on the two upper clamping bars 10, and the centers of the silicon wafers 30 are arranged in a staggered manner; at this time, a third card slot is provided on the bottom support structure 50, which has the effect of increasing the clamping positions of the silicon wafer 30 and enhancing the stability of the silicon wafer 30.

[0047] In some embodiments, referring to Figure 1 and Figure 2 , the depths of adjacent third card slots are the same or different. In this way, when the depths of adjacent third card slots are the same, the centers of the silicon wafers 30 are arranged in a staggered manner through the first card slots 11 on the upper clamping bar 10, and the function of setting the third card slot is to improve the clamping stability of the silicon wafer 30; when the depths of adjacent third card slots are different, the other direction of adjacent silicon wafers 30 is also staggered, such as the adjacent silicon wafers 30 are staggered in the vertical direction, increasing the distance between the centers of adjacent silicon wafers 30, thus facilitating the falling of the droplets 40.

[0048] In some embodiments, the bottom support structure 50 is provided with third card slots, and the depths of adjacent third card slots are different, while the depths of adjacent first card slots 11 on the same upper clamping bar 10 are the same. In this way, when the depths of adjacent third card slots are different, the effect of staggering the centers of adjacent silicon wafers 30 is achieved through the third card slots; at the same time, the depths of adjacent first card slots 11 on the same upper clamping bar 10 are the same, enabling the sides of the silicon wafers 30 to be clamped and improving the stability of the structure of the silicon wafers 30.

[0049] In some embodiments, referring to Figure 1 , the bottom support structure 50 is two columnar structures arranged in parallel, and the support frame 20 is detachably connected to the bottom support structure 50 and the upper clamping bar 10 through bolts.

[0050] The beneficial effect of adopting the preferred solution in the above embodiments is that the upper clamping bar 10 and the bottom support structure 50 are detachably fixed to the support frame 20 through bolts, facilitating the installation and adjustment of the upper clamping bar 10 and the bottom support structure 50.

[0051] In the embodiment, the bolts extend from the back sides of the two support frames 20 and are threadedly connected to the ends of the support frame 20 and the upper clamping bar 10. Among them, the support frame 20 is preferably provided with a positioning groove matching the shape of the end of the upper clamping bar 10, thus facilitating the positioning and installation of the upper clamping bar 10.

[0052] In addition, the middle clamping bar 60 is also detachably fixed to the support frame 20 through bolts. The middle clamping bar 60 is arranged in parallel with the upper clamping bar 10.

[0053] After the silicon wafers 30 are installed, they are in a parallel and equidistant state, thus facilitating the insertion and removal of the silicon wafers 30.

[0054] In some embodiments, referring to Figure 1 and Figure 2 , the opening direction of the first card slot 11 is perpendicular to the length direction of the upper clamping bar 10, and the first card slots 11 are parallel and equidistantly arranged. In this way, after the silicon wafer 30 is placed on the quartz boat, the silicon wafer 30 is arranged perpendicular to the length direction of the quartz boat, and the first card slot 11 is opened perpendicular to the length direction of the upper clamping bar 10, thereby reducing the complexity of the overall structure and facilitating the installation of the structure.

[0055] Embodiment 1:

[0056] The quartz boat includes a bottom support structure 50 and two correspondingly arranged upper clamping bars 10. A plurality of mutually corresponding first card slots 11 are opened on each upper clamping bar 10. Among them, by making the depths of adjacent first card slots 11 on the same upper clamping bar 10 different, on the basis of "the extension line of the center points of adjacent silicon wafers 30 clamped on the quartz boat is not parallel to the length direction of the clamping bar", the technical effect that droplets between adjacent silicon wafers 30 are easy to fall is achieved. In this way, the staggered arrangement of adjacent silicon wafers 30 is realized through the first card slot 11.

[0057] On the basis of Embodiment 1, the quartz boat can also be provided with a middle clamping bar 60, so as to play a limiting role in the lateral direction of the silicon wafer. The quartz boat can also not be provided with the middle clamping bar 60. When the quartz boat is provided with the middle clamping bar 60: the second card slot can not be provided on the middle clamping bar 60, or the second card slot can be provided on the middle clamping bar 60. When the second card slot is provided on the middle clamping bar 60: the depths of adjacent second card slots are different, so that the second card slot and the first card slot 11 play a role in positioning the silicon wafer 30 in cooperation; the depths of adjacent second card slots are the same, and the second card slot only plays a role in laterally clamping the silicon wafer 30. Therefore, Embodiment 1 essentially includes four subdivision schemes of the middle clamping bar 60.

[0058] In addition, on the basis of the implementation of Scheme 1, the above technical effects can be achieved whether the third card slot is provided on the bottom support structure 50 or not. When the third card slot is opened on the bottom support structure 50, it is divided into two cases: when the depths of adjacent third card slots are the same, the third card slot plays a role in assisting to improve the clamping stability of the silicon wafer 30; when the depths of adjacent third card slots are different, the adjacent silicon wafers 30 are also staggered in another direction, such as the adjacent silicon wafers 30 are staggered in the vertical direction, increasing the distance between the centers of adjacent silicon wafers 30, so as to facilitate the falling of the droplets 40. Therefore, Embodiment 1 essentially includes three subdivision schemes of the bottom support structure 50.

[0059] Specifically, the number of the upper clamping bars 10 and the height between the upper clamping bars 10, the number of the middle clamping bars 60 and the height between the middle clamping bars 60 can be adjusted and selected according to specific conditions.

[0060] Example 2:

[0061] The quartz boat includes a bottom support structure 50 and two correspondingly arranged upper clamping rods 10. A plurality of mutually corresponding first card slots 11 are formed on each upper clamping rod 10. A third card slot is provided on the bottom support structure 50, and the depths of adjacent third card slots are different. The depths of adjacent first card slots 11 on the same upper clamping rod 10 are the same. On the basis of "the extension line of the center points of adjacent silicon wafers 30 clamped on the quartz boat is not parallel to the length direction of the clamping rod", the technical effect that the droplets between adjacent silicon wafers 30 are easy to fall is achieved. In this way, the staggered arrangement of adjacent silicon wafers 30 is realized through the third card slot.

[0062] For the setting and condition classification of the middle clamping rod 60 in Example 2, refer to the four sub-schemes of the middle clamping rod 60 listed in Example 1.

[0063] Example 3:

[0064] See Figure 1 , Example 3 is a specific example included in Example 1. The quartz boat includes a bottom support structure 50, two correspondingly arranged upper clamping rods 10 and two correspondingly arranged middle clamping rods 60. Among them, the horizontal heights between the two upper clamping rods 10 are the same, and the horizontal heights between the two middle clamping rods 60 are the same. A first card slot 11 is formed on each upper clamping rod 10, and a second card slot is formed on each middle clamping rod 60. The bottom support structure 50 includes two parallel columnar structures and no card slot is provided on the bottom support structure 50. Therefore, when the silicon wafer 30 is placed on the quartz boat, each silicon wafer 30 is clamped into two first card slots 11 and at the same time clamped into two second card slots, and the bottom support structure 50 supports the lower part of the silicon wafer 30.

[0065] Usage method: The quartz boat of this application has two support frames 20, four clamping rods, and a bottom support structure 50. Among them, the four clamping rods are divided into an upper clamping rod 10 and a middle clamping rod 60, with two clamping rods in each layer. The upper clamping rod 10 and the middle clamping rod 60 are both provided with clamping grooves and are arranged at equal horizontal intervals, so that each silicon wafer 30 is clamped and positioned with four clamping grooves. The bottom support structure 50 at the lower layer includes two columnar abutting rods. The horizontal distance between the two abutting rods is the smallest and is used to support the bottom of the silicon wafer 30. The first clamping groove 11 and the second clamping groove are arranged correspondingly. At the same time, the depths of adjacent first clamping grooves 11 on the same upper clamping rod 10 are different, and the depths of adjacent second clamping grooves on the same middle clamping rod 60 are different, so that the centers of adjacent silicon wafers 30 are staggered. When in use, place the silicon wafer 30 in the quartz boat, and then move the entire quartz boat into the cleaning tank for overall cleaning. After the cleaning is completed, move the quartz boat out of the cleaning tank as a whole for draining. Relying on the design of this application, the adjacent silicon wafers 30 are staggered, so that the force directions of the liquid drops 40 between the adjacent silicon wafers 30 do not coincide, so that it is convenient for the liquid drops 40 to gradually become smaller until they break under the influence of gravity, so that the liquid drops 40 fall off and reduce the retention of the liquid drops 40 between the silicon wafers 30.

[0066] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. The terms "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

Claims

1. A quartz boat for mounting silicon wafers (30), characterized in that: The quartz boat comprises: Two supporting frames (20) arranged opposite to each other; A bottom support structure (50) is arranged between the two support frames (20); Two correspondingly arranged upper clamping rods (10), the two upper clamping rods (10) being arranged in parallel between the two support frames (20), and the two upper clamping rods (10) being provided with a plurality of mutually corresponding first clamping grooves (11) spaced apart along their extension direction; The bottom support structure (50) cooperates with the upper clamping rod (10) to clamp the silicon wafer (30) so that the extension lines of the center points of adjacent silicon wafers (30) clamped in sequence on the quartz boat are not parallel to the length direction of the clamping rod.

2. The quartz boat according to claim 1, characterized in that: The depths of adjacent first clamping grooves (11) on the same upper clamping rod (10) are different.

3. The quartz boat according to claim 2, characterized in that: It also includes at least one middle-layer clamping rod (60), which is located between the bottom supporting structure (50) and the upper-layer clamping rod (10) and is used to support the silicon wafer (30).

4. The quartz boat according to claim 3, characterized in that: At least one of the middle-layer clamping bars (60) is provided with a second clamping slot corresponding to the first clamping slot (11); adjacent second clamping slots on the same middle-layer clamping bar (60) have different depths; the second clamping slot is used for clamping the side edge of the silicon wafer (30).

5. The quartz boat according to claim 4, characterized in that: The number of the middle layer clamping rods (60) is two and they are at the same level, and the level of the two upper layer clamping rods (10) is also the same.

6. The quartz boat according to any one of claims 2 to 5, characterized in that: The bottom supporting structure (50) is provided with a third slot.

7. The quartz boat according to claim 6, characterized in that: The depths of adjacent third card slots are the same or different.

8. The quartz boat according to claim 1, characterized in that: The bottom support structure (50) is provided with a third clamping groove, and the depths of adjacent third clamping grooves are different, while the depths of adjacent first clamping grooves (11) on the same upper clamping rod (10) are the same.

9. The quartz boat according to claim 1, characterized in that: The bottom support structure (50) is two columnar structures arranged in parallel, and the support frame (20) is detachably connected to the bottom support structure (50) and the upper clamping rod (10) by means of bolts.

10. The quartz boat according to claim 1, characterized in that: The opening direction of the first clamping grooves (11) is perpendicular to the length direction of the upper clamping rod (10), and the first clamping grooves (11) are parallel and arranged at equal intervals.

Images