Wafer bearing jig based on wet etching process

Abstract

The utility model discloses a wafer bearing jig based on a wet etching process, which is applied to the field of semiconductor preparation and comprises a wafer bearing jig main body and a jig pressing rod, a first fixing groove and a second fixing groove are correspondingly formed in two opposite contour edges, in the preset direction, of the upper contour of the wafer bearing jig main body; the preset direction is an arrangement direction along a plurality of wafer bearing areas in the wafer bearing jig main body; one end of the jig pressing rod is hinged to the first fixing groove to form a rotating pair, an included angle exists between a rotating shaft of the rotating pair and the vertical direction, and the rotating shaft is perpendicular to the preset direction; the second fixing groove is used for being connected with a jig pressing rod in a clamped mode so as to fix the jig pressing rod. According to the second fixing groove connected with the jig pressing rod in the clamping mode, it is not needed to consider that the jig pressing rod moves in the groove in the preset direction, it is only needed to limit the jig pressing rod to be not separated from the groove, the jig pressing rod is convenient to disassemble and assemble, and by arranging the included angle between the rotating shaft of the rotating pair and the vertical direction, the feeding and discharging efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor preparation, and particularly relates to a wafer carrier fixture based on a wet etching process. Background Art

[0002] The wet etching process is a commonly used technology in semiconductor manufacturing. It is mainly used to form the required patterned structure on the wafer surface. Benefiting from the simple process and low cost of the wet etching process, the wet etching process is widely used in semiconductor preparation. When wet etching a wafer, generally, the wafer needs to be placed in a wafer carrier fixture, and the wafer carrier fixture is placed in the etching solution, and the etching solution is used to etch the wafer to form a patterned structure.

[0003] After the wafer is placed in the wafer carrier fixture, generally, the wafer carrier fixture is controlled to lift and swing. Therefore, a pressure rod needs to be fixed at the wafer placement opening to prevent the wafer from detaching. Currently, the wafer carrier fixture is provided with a slot for fixing the pressure rod. To prevent the pressure rod from detaching from the slot or moving in the slot, the pressure rod needs to be tightly connected to the slot. However, this also makes it difficult to separate the pressure rod from the slot when disassembling the pressure rod. Forcible disassembly is likely to cause the wafer in the fixture to break, and is also likely to damage the clamping structure between the slot and the pressure rod in the fixture.

[0004] Therefore, how to provide a convenient disassembly of the pressure rod and the slot in the fixture, ensure the stable connection between the pressure rod and the slot, and improve the service life of the fixture is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0005] In view of this, the purpose of the utility model is to provide a wafer carrier fixture based on a wet etching process, which solves the problem in the prior art that the pressure rod and the slot are tightly connected, resulting in difficult separation of the pressure rod from the slot when disassembling the pressure rod, and forcible disassembly is likely to cause the wafer in the fixture to break and damage the clamping structure between the slot and the pressure rod in the fixture.

[0006] To solve the above technical problems, the utility model provides a wafer carrier fixture based on a wet etching process, including:

[0007] A wafer carrier fixture main body and a fixture pressure rod;

[0008] On the upper contour of the wafer carrier fixture main body, on two opposite contour edges along a preset direction, a first fixing groove and a second fixing groove are correspondingly arranged; the preset direction is the arrangement direction of multiple wafer carrier areas in the wafer carrier fixture main body;

[0009] One end of the fixture pressure rod is hinged to the first fixing groove to form a rotating pair, and the rotating axis of the rotating pair forms an angle with the vertical direction and is perpendicular to the preset direction;

[0010] The second fixing groove is used for clamping with the jig pressing rod to fix the jig pressing rod.

[0011] Optionally, the rotation axis of the rotating pair is a rotation axis perpendicular to the preset direction in the horizontal direction.

[0012] Optionally, one end of the jig pressing rod is provided with a first through hole, and a second through hole corresponding to the first through hole is provided in the first fixing groove;

[0013] The jig pressing rod and the first fixing groove are hingedly connected by a pin inserted into the first through hole and the second through hole.

[0014] Optionally, the distance between the jig pressing rod and the highest point of the wafer placement area in the wafer carrier jig body is 8 mm to 10 mm.

[0015] Optionally, both the first fixing groove and the second fixing groove are detachably connected to the upper contour of the wafer carrier jig body.

[0016] Optionally, notches for the upper contour of the wafer carrier jig body to extend into are provided at the bottoms of the first fixing groove and the second fixing groove;

[0017] Both the first fixing groove and the second fixing groove are detachably connected to the upper contour of the wafer carrier jig body through the notches.

[0018] Optionally, both the first fixing groove and the second fixing groove are fixed to the upper contour of the wafer carrier jig body by bolts through the notches.

[0019] Optionally, chamfer structures are provided at the corners where the first fixing groove contacts the jig pressing rod and at the corners where the second fixing groove contacts the jig pressing rod.

[0020] Optionally, chamfer structures are provided at the upper surface corners of the first fixing groove and at the upper surface corners of the second fixing groove.

[0021] Optionally, the chamfer structures are all arc chamfer structures.

[0022] It can be seen that the wafer carrier fixture based on the wet etching process provided by the present utility model includes a wafer carrier fixture main body and a fixture pressing rod. On the upper contour of the wafer carrier fixture main body, a first fixing groove and a second fixing groove are correspondingly arranged on two opposite contour edges along a preset direction. The preset direction is the arrangement direction of multiple wafer carrier areas in the wafer carrier fixture main body. One end of the fixture pressing rod is hinged to the first fixing groove to form a rotating pair. The rotating axis of the rotating pair has an angle with the vertical direction and is perpendicular to the preset direction. The second fixing groove is used to be clamped with the fixture pressing rod to fix the fixture pressing rod. By correspondingly arranging the first fixing groove and the second fixing groove on the upper contour of the wafer carrier fixture main body, and being hinged and clamped with the fixture pressing rod respectively, the second fixing groove clamped with the fixture pressing rod does not need to consider the movement of the fixture pressing rod along the preset direction in the groove, and only needs to limit the fixture pressing rod from disengaging from the groove, thereby reducing the fastening degree of the clamping between the second fixing groove and the fixture pressing rod, facilitating the disassembly and assembly of the fixture pressing rod, reducing the chip breakage rate of the wafer. By setting the rotating axis of the rotating pair to have an angle with the vertical direction, when loading and unloading the fixture, there is a component of the fixture pressing rod moving away from the fixture in the vertical direction, improving the loading and unloading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0024] Figure 1 FIG. is a schematic structural diagram of a wafer carrier fixture based on the wet etching process provided by an embodiment of the present utility model;

[0025] Figure 2 FIG. is a schematic structural diagram of the first fixing groove and the second fixing groove in a wafer carrier fixture based on the wet etching process provided by an embodiment of the present utility model;

[0026] Figure 3 FIG. is a schematic structural diagram of another wafer carrier fixture based on the wet etching process provided by an embodiment of the present utility model;

[0027] Figure 4 FIG. is a schematic structural diagram of a fixing groove with a chamfer structure provided at the upper surface corner provided by an embodiment of the present utility model;

[0028] Figure 5 FIG. is a schematic structural diagram of yet another wafer carrier fixture based on the wet etching process provided by an embodiment of the present utility model;

[0029] Figures 1 to 5In the figure, the reference numerals are explained as follows:

[0030] 10 - Wafer carrier fixture body, 11 - First fixed groove, 12 - Second fixed groove, 20 - Fixture pressing rod, 13 - Chamfer structure, 30 - Plug, 40 - Notch, 50 - Bolt fixing hole. Detailed implementation manners

[0031] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0032] Embodiment 1:

[0033] Please refer to Figure 1 , Figure 1 , which is a schematic structural diagram of a wafer carrier fixture based on a wet etching process provided by an embodiment of the present utility model. The wafer carrier fixture based on the wet etching process may include:

[0034] A wafer carrier fixture body 10 and a fixture pressing rod 20;

[0035] On the upper contour of the wafer carrier fixture body 10, on two opposite contour edges along a preset direction, a first fixed groove 11 and a second fixed groove 12 are correspondingly provided; the preset direction is the arrangement direction of a plurality of wafer carrier areas in the wafer carrier fixture body 10;

[0036] One end of the fixture pressing rod 20 is hinged to the first fixed groove 11 to form a rotating pair, and the rotating axis of the rotating pair has an angle with the vertical direction and is perpendicular to the preset direction;

[0037] The second fixed groove 12 is used to be clamped with the fixture pressing rod 20 to fix the fixture pressing rod 20.

[0038] It should be noted that in this embodiment, the main body 10 of the wafer carrier fixture can refer to a conventional wafer carrier fixture, but the main body 10 of this wafer carrier fixture is not exactly the same as the existing wafer carrier fixture. The following mainly describes the differences between the wafer carrier fixture in this embodiment and the existing wafer carrier fixture, and the same parts are not emphasized in this specification. The main body 10 of the wafer carrier fixture and the fixture pressure bar 20 in this article form a wafer carrier fixture. The fixture pressure bar 20 is connected to the main body 10 of the wafer carrier fixture and is specifically arranged at the position of the main body 10 of the wafer carrier fixture for loading and unloading wafers. When the fixture pressure bar 20 is connected and fixed to the main body 10 of the wafer carrier fixture, the wafer is restricted within the wafer carrier fixture by the fixture pressure bar 20, and when the fixture pressure bar 20 is opened, the wafer can be placed and taken out through the exposed opening.

[0039] In this embodiment, the opening for the wafer carrier fixture to pick up and place the wafer is set upward as an example for illustration. It can be expected that changing the position of the wafer carrier fixture in this application in space does not affect the substantially disclosed content of this application, and the corresponding position descriptions can be adapted and changed accordingly. Since the opening for the wafer carrier fixture to pick up and place the wafer is set upward in this application, the fixture pressure bar 20 is arranged on the upper side of the main body 10 of the wafer carrier fixture. Therefore, on the upper contour of the main body 10 of the wafer carrier fixture in this application, the first fixed groove 11 and the second fixed groove 12 are correspondingly arranged on two opposite contour edges along the preset direction. Then, the two ends of the fixture pressure bar 20 are respectively fixed in the first fixed groove 11 and the second fixed groove 12. At this time, since the fixture pressure bar 20 is in the same direction as the wafer arrangement direction, it can prevent the wafer from leaking out of the wafer carrier fixture. In this embodiment, one end of the fixture pressure bar 20 is hingedly connected to the first fixed groove 11, and the other end is snap-connected to the second fixed groove 12. Since the fixture pressure bar 20 is hinged to the first fixed groove 11, the stability is significantly stronger than the snap-connection method. Therefore, there is no need to consider the fixture pressure bar 20 detaching from the first fixed groove 11, and naturally there is no need to tightly connect the fixture pressure bar 20 to the main body 10 of the wafer carrier fixture. Therefore, the connection tightness between the fixture pressure bar 20 and the second fixed groove 12 can be appropriately reduced, as long as it is ensured that the fixture pressure bar 20 does not detach from the second fixed groove 12 in the rotation direction. This reduces the difficulty of separating the fixture pressure bar 20 from the main body 10 of the wafer carrier fixture when picking up and placing the wafer. Furthermore, when there is a wafer placed in the main body 10 of the wafer carrier fixture, a relatively gentle way of separating the fixture pressure bar 20 from the main body 10 of the wafer carrier fixture can avoid damage and fragmentation of the wafer in the fixture, improving the yield of wafer preparation.

[0040] In addition, in the embodiment of the present utility model, one end of the jig pressing rod 20 is hinged to the first fixing groove 11 to form a rotating pair, and the rotation axis of the rotating pair is perpendicular to the preset direction and has an included angle with the vertical direction, that is, to prevent the jig pressing rod 20 from rotating horizontally in the current spatial position state of the wafer carrier jig. In this embodiment, when the jig pressing rod 20 is set to rotate around the rotation axis, there is a component away from the wafer carrier jig in the vertical direction, so that the jig pressing rod 20 does not need to rotate a large angle to expose the opening for picking and placing the wafer as when rotating horizontally, improving the efficiency of loading and unloading the wafer of the wafer carrier jig. It should be further noted that in this embodiment, the larger the included angle formed by the rotation axis of the rotating pair and the vertical direction, the more beneficial it is to improve the efficiency of loading and unloading the wafer of the wafer carrier jig, and the included angle formed by the rotation axis and the vertical direction is selected as the smaller included angle formed on the upper and lower sides. In this embodiment, the structural size of the wafer carrier jig body 10 located on the lower side can be reduced to facilitate the etching solution to wash the wafer surface.

[0041] Further, in order to ensure that the wafer carrier jig picks and places the wafer with the highest efficiency, the rotation axis of the above rotating pair can be a rotation axis perpendicular to the preset direction along the horizontal direction.

[0042] It should be noted that in this embodiment, by setting the rotation axis of the rotating pair to be a rotation axis along the horizontal direction and perpendicular to the preset direction, that is, the rotation plane of the jig pressing rod 20 is vertical, so that when the jig pressing rod 20 has the same rotation amount, it is farthest from the wafer carrier jig body 10 to the greatest extent, improving the efficiency of opening and closing the opening by rotating the jig pressing rod 20 in the wafer carrier jig.

[0043] Further, in order to ensure the hinged connection between the jig pressing rod 20 and the first fixing groove 11 while improving the simplicity of the hinged connection, reference can be made to Figure 2 , Figure 2 which is a schematic structural diagram of the first fixing groove 11 and the second fixing groove 12 in a wafer carrier jig based on a wet etching process provided by the embodiment of the present utility model. It can be set that one end of the above jig pressing rod 20 is provided with a first through hole, and a second through hole is correspondingly provided in the first fixing groove 11 for the first through hole;

[0044] The jig pressing rod 20 and the first fixing groove 11 are hinged by a pin 30 inserted into the first through hole and the second through hole.

[0045] It should be noted that in this embodiment, through holes are respectively formed in the jig pressing rod 20 and the first fixing groove 11, and the pin 30 is inserted into the through holes of the jig pressing rod 20 and the first fixing groove 11. At this time, the pin 30 is the rotating shaft of the rotating pair formed by the jig pressing rod 20 and the first fixing groove 11, and the pin 30 also restricts the jig pressing rod 20 in the first fixing groove 11, improving the stability of the connection between the jig pressing rod 20 and the wafer carrier jig main body 10 at one end where the rotating pair is formed, reducing the fastening requirement for the connection between the jig pressing rod 20 and the second fixing groove 12, and thus improving the convenience of separating and clamping the jig pressing rod 20 and the second fixing groove 12.

[0046] Furthermore, in order to reduce the risk of wafer fragmentation caused by the collision between the wafer and the jig pressing rod 20 when the wafer carrier jig is lifted and swung in the etching solution, the distance between the jig pressing rod 20 and the highest point of the wafer placement area in the wafer carrier jig main body 10 can be set to 8 mm to 10 mm.

[0047] It should be noted that the wafer placement area in the above-mentioned wafer carrier jig main body 10 is the area where the wafer is placed, and the highest point of this wafer placement area is the highest point of the wafer when the wafer is placed in the wafer carrier jig main body 10. When placing the wafer in a conventional wafer carrier jig, after the jig pressing rod 20 is fixed, the distance between the jig pressing rod 20 and the highest point of the wafer placement area in the wafer carrier jig main body 10 is generally 16 mm. And such a large gap results in a greater relative speed when the wafer collides with the jig pressing rod 20 when the same force is applied, and thus a greater momentum impact on the wafer, leading to the wafer being prone to fragmentation. In this application, based on simulation optimization, considering the etching effect of the etching solution flowing through the gap between the wafer and the jig pressing rod 20 and the problem of the wafer fragmentation rate in an overall manner, the distance between the jig pressing rod 20 and the highest point of the wafer placement area in the wafer carrier jig main body 10 is set to 8 mm to 10 mm, reducing the risk of wafer fragmentation caused by the collision between the jig pressing rod 20 and the wafer while ensuring the etching effect and improving the preparation efficiency.

[0048] Furthermore, in order to improve the flexibility of the installation position of the jig pressing rod 20, the above-mentioned first fixing groove 11 and the second fixing groove 12 can both be detachably connected to the upper contour of the wafer carrier jig main body 10.

[0049] It should be noted that in this embodiment, by setting that the first fixing groove 11 and the second fixing groove 12 are both detachably connected to the upper contour of the wafer carrier jig main body 10, the specific positions of the first fixing groove 11 and the second fixing groove 12 on the upper contour of the wafer carrier jig main body 10 can be flexibly adjusted, thereby realizing the flexibility of the installation position of the jig pressing rod 20.

[0050] Further, in order to ensure the stability of the detachable connection between the first fixing groove 11 and the second fixing groove 12 and the upper contour of the wafer carrier fixture body 10, notches 40 for receiving the upper contour of the wafer carrier fixture body 10 to extend into can be provided at the bottoms of the first fixing groove 11 and the second fixing groove 12; both the first fixing groove 11 and the second fixing groove 12 are detachably connected to the upper contour of the wafer carrier fixture body 10 through the notches 40.

[0051] It should be noted that in the structures for forming the first fixing groove 11 and the second fixing groove 12 in this embodiment, both include a bottom surface, and the bottom surface is provided with a notch 40 for receiving the upper contour of the wafer carrier fixture body 10 to extend into. When the first fixing groove 11 and the second fixing groove 12 are connected to the upper contour of the wafer carrier fixture body 10, the upper contour is partially extended into the notch 40 to improve the stability of the detachable connection.

[0052] Further, in order to improve the stability of the connection between the first fixing groove 11 and the second fixing groove 12 and the upper contour of the wafer carrier fixture body 10, it can be set that both the first fixing groove 11 and the second fixing groove 12 are fixed to the upper contour of the wafer carrier fixture body 10 through the notches 40 by bolts.

[0053] It should be noted that in this embodiment, bolt fixing holes 50 for installing bolts are correspondingly provided in the first fixing groove 11 and the second fixing groove 12, as Figure 2 shown in. Setting both the first fixing groove 11 and the second fixing groove 12 to be fixed to the upper contour of the wafer carrier fixture body 10 by bolts can further improve the stability of the connection. It should be further noted that in this embodiment, the bolts can be set to pass through the part of the upper contour of the wafer carrier fixture body 10 that extends into the first fixing groove 11 and the second fixing groove 12 to ensure the convenience of the connection.

[0054] Applying the wafer carrier fixture based on the wet etching process provided by the embodiments of the present invention, which includes a wafer carrier fixture main body 10 and a fixture pressure rod 20. On the upper contour of the wafer carrier fixture main body 10, corresponding first fixing grooves 11 and second fixing grooves 12 are provided on two opposite contour edges along a preset direction. The preset direction is the arrangement direction of multiple wafer carrier areas in the wafer carrier fixture main body 10. One end of the fixture pressure rod 20 is hinged to the first fixing groove 11 to form a rotating pair. The rotating axis of the rotating pair has an angle with the vertical direction and is perpendicular to the preset direction. The second fixing groove 12 is used to be clamped with the fixture pressure rod 20 to fix the fixture pressure rod 20. By providing the first fixing groove 11 and the second fixing groove 12 on the upper contour of the wafer carrier fixture main body 10 in the embodiments of the present invention, and corresponding to provide hinged connection and clamping connection with the fixture pressure rod 20. The second fixing groove 12 clamped with the fixture pressure rod 20 does not need to consider the movement of the fixture pressure rod 20 along the preset direction in the groove, and only needs to limit the fixture pressure rod 20 from disengaging from the groove, thereby reducing the fastening degree of the clamping connection between the second fixing groove 12 and the fixture pressure rod 20, facilitating the disassembly and assembly of the fixture pressure rod 20, reducing the chip breakage rate of the wafer. By setting the rotating axis of the rotating pair to have an angle with the vertical direction, when loading and unloading the fixture, the fixture pressure rod 20 has a component away from the fixture in the vertical direction, improving the loading and unloading efficiency.

[0055] In addition, in the embodiments of the present invention, by setting the rotating axis of the rotating pair to be along the horizontal direction and perpendicular to the preset direction, the efficiency of opening and closing the opening by rotating the fixture pressure rod 20 in the wafer carrier fixture is improved; by respectively opening through holes in the fixture pressure rod 20 and the first fixing groove 11, and using a pin 30 to insert into the through holes of the fixture pressure rod 20 and the first fixing groove 11, the stability of the connection between the fixture pressure rod 20 and the wafer carrier fixture main body 10 is improved, reducing the fastening requirement for the connection between the fixture pressure rod 20 and the second fixing groove 12, and thus improving the convenience of separating and clamping the fixture pressure rod 20 and the second fixing groove 12; setting the distance between the fixture pressure rod 20 and the highest point of the wafer placement area in the wafer carrier fixture main body 10 to be 8 mm to 10 mm, while ensuring the etching effect, reducing the risk of chip breakage caused by the collision between the fixture pressure rod 20 and the wafer, and improving the preparation efficiency; setting the first fixing groove 11 and the second fixing groove 12 to be detachably connected to the upper contour of the wafer carrier fixture main body 10, indirectly realizing the flexible adjustment of the installation position of the fixture pressure rod 20; corresponding parts of the upper contour of the wafer carrier fixture main body 10 are extended into the notches 40 of the first fixing groove 11 and the notches 40 of the second fixing groove 12 to improve the stability of the detachable connection; setting the first fixing groove 11 and the second fixing groove 12 to be fixed to the upper contour of the wafer carrier fixture main body 10 by bolts, which can further improve the stability of the connection.

[0056] Embodiment 2:

[0057] Please refer to Figure 3 , Figure 3 , which is a schematic structural diagram of another wafer carrier fixture based on the wet etching process provided by the embodiment of the present invention. The difference between this wafer carrier fixture based on the wet etching process and that of Embodiment 1 lies in that:

[0058] Chamfer structures 13 are provided at the corners where the first fixing groove 11 contacts the fixture pressing rod 20 and at the corners where the second fixing groove 12 contacts the fixture pressing rod 20.

[0059] It should be noted that in this embodiment, the corner where the first fixing groove 11 contacts the fixture pressing rod 20 is the corner formed between the surface where the first fixing groove 11 contacts the fixture pressing rod 20 and the adjacent surface. Similarly, the corner where the second fixing groove 12 contacts the fixture pressing rod 20 is the corner formed between the surface where the second fixing groove 12 contacts the fixture pressing rod 20 and the adjacent surface. By providing the chamfer structure 13 at the above-mentioned corners, it is possible to prevent etching liquid residues from forming on the contact surfaces between the first fixing groove 11 and the second fixing groove 12 and the fixture pressing rod 20, thereby avoiding the operator from being contaminated by the etching liquid when disassembling and assembling the fixture pressing rod 20. Further, it should be noted that since the fixture pressing rod 20 may not be in contact and fit with the first fixing groove 11 and the second fixing groove 12, there may be gaps. Therefore, in this embodiment, according to the actual situation, chamfer structures 13 should be provided at the corners formed between the surface of the first fixing groove 11 opposite to the fixture pressing rod 20 and the adjacent surface, and at the corners formed between the surface of the second fixing groove 12 opposite to the fixture pressing rod 20 and the adjacent surface. Further, in order to further prevent the operator from being contaminated by the etching liquid residues, chamfer structures 13 can also be provided at the two ends of the fixture pressing rod 20.

[0060] Furthermore, in order to further avoid the existence of etching liquid residues on the surface of the wafer carrier fixture, please refer to Figure 4 , Figure 4 , which is a schematic structural diagram of a fixing groove with a chamfer structure 13 provided at the upper surface corner provided by the embodiment of the present invention. Chamfer structures 13 can be provided at the upper surface corners of the above-mentioned first fixing groove 11 and the upper surface corners of the second fixing groove 12.

[0061] It should be noted that in this embodiment, the upper surface corners of the first fixing groove 11 and the upper surface corners of the second fixing groove 12 are the corners formed between the existing upper surface of the first fixing groove 11 and the adjacent surface. By providing chamfer structures 13 at the upper surface corners of the first fixing groove 11 and the upper surface corners of the second fixing groove 12 in this embodiment, it is possible to further avoid the existence of liquid residues in the wafer carrier fixture. In addition, in order to further reduce the etching liquid residues on the surface of the wafer carrier fixture main body, please refer toFigure 5 , Figure 5 A schematic diagram of the structure of another wafer support fixture based on a wet etching process provided by an embodiment of the utility model. In which, a chamfer structure 13 is also provided at the bottom corner of the lower support foot of the wafer support fixture body to further reduce the etching liquid residue on the wafer support fixture body.

[0062] Furthermore, in order to improve the effect of setting the chamfer to avoid etching liquid residue, the chamfer structures 13 can be set as arc-shaped chamfer structures.

[0063] It should be noted that, in the present embodiment, the chamfer structure 13 is configured as an arc-shaped chamfer structure, which can further avoid the appearance of angular corners and further avoid the etching liquid from remaining on the surface of the wafer supporting fixture.

[0064] The wafer carrier jig based on the wet etching process provided by the embodiment of the utility model can avoid the presence of etching liquid residue between the jig pressure rod 20 and the wafer carrier jig body 10 by setting chamfer structures 13 at the corners of the jig pressure rod 20 corresponding to the first fixed groove 11 and the corners of the jig pressure rod 20 corresponding to the second fixed groove 12, thereby avoiding the operator from being contaminated by the etching liquid when disassembling the jig pressure rod 20. In addition, the embodiment of the utility model can further avoid the presence of liquid residue in the wafer carrier jig by setting chamfer structures 13 at the corners of the upper surface of the first fixed groove 11 and the corners of the upper surface of the second fixed groove 12; by setting the chamfer structure 13 as an arc-shaped chamfer structure, it can further avoid the appearance of angular corners, thereby avoiding the etching liquid residue on the surface of the wafer carrier jig.

[0065] In an application scenario embodiment, the above-mentioned wafer carrying fixture based on the wet etching process may specifically include the following structure:

[0066] Wafer carrying fixture body and fixture pressure rod;

[0067] The upper contour of the wafer carrying fixture body is provided with a first fixing groove and a second fixing groove on two opposite contour edges along a preset direction; the preset direction is the arrangement direction of multiple wafer carrying areas in the wafer carrying fixture body;

[0068] A first through hole is provided at one end of the jig pressure rod, and a second through hole is provided in the first fixing groove corresponding to the first through hole; the jig pressure rod and the first fixing groove are hingedly connected by a pin inserted into the first through hole and the second through hole to form a rotating pair, and the rotating axis of the rotating pair is a rotating axis along the horizontal direction perpendicular to the preset direction;

[0069] The second fixing groove is used to engage with the jig pressure rod to fix the jig pressure rod; the distance between the jig pressure rod and the highest point of the wafer placement area in the wafer carrying jig body is 8 mm to 10 mm;

[0070] At the bottoms of the first fixing groove and the second fixing groove, there are both notches for the upper contour of the wafer carrier fixture body to extend into; both the first fixing groove and the second fixing groove are detachably connected to the upper contour of the wafer carrier fixture body by bolts through the notches.

[0071] The corners where the first fixing groove contacts the fixture pressing rod, the corners where the second fixing groove contacts the fixture pressing rod, the upper surface corners of the first fixing groove, and the upper surface corners of the second fixing groove are all provided with arc chamfer structures.

[0072] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0073] In addition, it should be noted that in this article, relationships such as the first and the second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant is intended to cover non-exclusive inclusion.

[0074] The above has introduced in detail a wafer carrier fixture based on the wet etching process provided by the present utility model. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the structure and core idea of the present utility model; at the same time, for those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present utility model.

Claims

1. A wafer carrying fixture based on a wet etching process, characterized in that: include: Wafer carrying fixture body and fixture pressure rod; The upper contour of the wafer carrying fixture body is provided with a first fixing groove and a second fixing groove on two opposite contour edges along a preset direction; the preset direction is the arrangement direction of multiple wafer carrying areas in the wafer carrying fixture body; One end of the jig pressure rod is hingedly connected to the first fixing groove to form a revolving pair, and the revolving axis of the revolving pair has an angle with the vertical direction and is perpendicular to the preset direction; The second fixing groove is used to engage with the jig pressure rod to fix the jig pressure rod.

2. The wafer carrying fixture based on wet etching process according to claim 1, characterized in that: The rotation axis of the rotation pair is a rotation axis along the horizontal direction and perpendicular to the preset direction.

3. The wafer carrying fixture based on wet etching process according to claim 1, characterized in that: A first through hole is provided at one end of the jig pressure rod, and a second through hole is provided in the first fixing groove corresponding to the first through hole; The jig pressure rod is hingedly connected to the first fixing groove via a latch inserted into the first through hole and the second through hole.

4. The wafer carrying fixture based on wet etching process according to claim 1, characterized in that: The distance between the jig pressure rod and the highest point of the wafer placement area in the wafer carrying jig body is 8 mm to 10 mm.

5. The wafer carrying fixture based on wet etching process according to claim 1, characterized in that: The first fixing groove and the second fixing groove are both detachably connected to the upper contour of the wafer carrying fixture body.

6. The wafer carrying fixture based on wet etching process according to claim 5, characterized in that: The bottoms of the first fixing groove and the second fixing groove are both provided with notches for accommodating the upper contour of the wafer carrying fixture body to extend therein; The first fixing groove and the second fixing groove are both detachably connected to the upper contour of the wafer carrying fixture body through the notch.

7. The wafer carrying fixture based on wet etching process according to claim 6, characterized in that: The first fixing groove and the second fixing groove are both fixed to the upper contour of the wafer carrying fixture body by bolts through the notch.

8. The wafer carrying fixture based on wet etching process according to any one of claims 1 to 7, characterized in that: A chamfered structure is provided at a corner where the first fixing groove contacts the jig pressure rod, and at a corner where the second fixing groove contacts the jig pressure rod.

9. The wafer carrying fixture based on wet etching process according to claim 8, characterized in that: A chamfered structure is provided at a corner of the upper surface of the first fixing groove and a corner of the upper surface of the second fixing groove.

10. The wafer carrying fixture based on wet etching process according to claim 9, characterized in that: The chamfered structures are all arc-shaped chamfered structures.

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