Wafer adsorption device

Abstract

The utility model discloses a wafer adsorption device, which relates to the technical field of wafer fixation and comprises a fixing plate and a negative pressure vacuum pump. A connecting seat is fixed to the middle of the top face of the fixing plate, an adjusting rod is rotationally connected into the connecting seat, a motor is fixed to the left side face of the connecting seat, an output shaft of the motor is connected with the left side end of the adjusting rod, and the top end of the adjusting rod is connected with the middle of the bottom face of the mounting plate; the number of the negative pressure vacuum pumps is two, the two negative pressure vacuum pumps are arranged on the two sides of the top face of the fixing plate respectively, air inlet pipes of the negative pressure vacuum pumps are connected with air outlets of the air suction rings, and the air suction rings are installed on the bottom face of the fixing plate. A universal joint is matched to prevent the problem of air leakage caused by unstable fixation of the sucker, and a protective bracket is arranged to prevent the wafer from falling off and being damaged due to air leakage of the sucker.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer fixing, in particular to a wafer adsorption device. Background Technique

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. The domestic wafer production lines are mainly 8 inches and 12 inches. With the continuous development of semiconductor technology, the semiconductor feature size is getting smaller and smaller. Therefore, to ensure the use stability of silicon semiconductor circuits, wafers need to be precisely processed by equipment. A wafer adsorption device refers to a device that adsorbs and grabs wafers and moves them in processing equipment. Currently, most of the suction cup positions of the adsorption devices used are manually adjusted and fixed. In this way, it is inconvenient to automatically adjust according to the specifications of the wafers during use, and when the suction cup leaks air, it is easy to cause the wafer to fall and be damaged. For this reason, we propose a wafer adsorption device. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is to overcome the existing defects and provide a wafer adsorption device. An industrial camera is used to detect the specifications of the adsorbed wafers, so as to adjust the position of the suction cup in real time, and a universal joint is used to prevent the problem of air leakage caused by the suction cup not being firmly fixed. The provided protective bracket can prevent the wafer from falling and being damaged due to air leakage of the suction cup, and can effectively solve the problems in the background technique.

[0004] To achieve the above object, the utility model provides the following technical solution: A wafer adsorption device, including a fixing plate and a negative pressure vacuum pump;

[0005] Fixing plate: A connecting seat is fixed in the middle of the top surface. An adjusting rod is rotatably connected inside the connecting seat. A motor is fixed on the left side surface of the connecting seat. The output shaft of the motor is connected to the left end of the adjusting rod. The top end of the adjusting rod is connected to the middle of the bottom surface of the mounting plate. There are two negative pressure vacuum pumps, which are respectively arranged on both sides of the top surface of the fixing plate. The intake pipe of the negative pressure vacuum pump is connected to the outlet of the suction ring. The suction ring is installed on the bottom surface of the fixing plate. The intake pipe of the suction ring is connected to the outlet of the suction cup. An adjusting unit is arranged on the side surface of the fixing plate;

[0006] Wherein, it further includes a controller, the controller is arranged on the right side surface of the connecting seat. The input ends of the negative pressure vacuum pump and the motor are electrically connected to the output end of the controller. The input end of the controller is electrically connected to the output end of an external power supply.

[0007] Starting the negative pressure vacuum pump enables the four suction cups to adsorb and fix the surfaces of wafers of different specifications to prevent the wafers from falling during transportation, while the motor drives the mounting plate to rotate, making the adjustment of the fixing plate more flexible.

[0008] Furthermore, the adjustment unit includes a support frame, a placement groove, a linear motor, an electric push rod, and a universal joint. The support frame is installed on the side of the fixing plate. A placement groove is formed inside the support frame. A linear motor is fixed inside the placement groove. An electric push rod is provided on the bottom surface of the moving part seat of the linear motor. The bottom end of the electric push rod is connected to the top end of the universal joint. The bottom end of the universal joint is connected to the middle of the top surface of the suction cup. A protection unit is provided on the side of the support frame. The input ends of the linear motor and the electric push rod are electrically connected to the output end of the controller. Starting the linear motor can adjust the position of the suction cup according to the specifications of the wafer. The electric push rod drives the suction cup to press down and fit with the wafer, and the universal joint can automatically adjust according to the inclination of the wafer surface, thereby improving the adsorption effect.

[0009] Furthermore, the adjustment unit further includes an industrial camera and a placement rack. The placement rack is fixed in the middle of the bottom surface of the fixing plate. The industrial camera is snap-fitted inside the placement rack. The input end of the industrial camera is electrically connected to the output end of the controller. The industrial camera inside the placement rack can detect the specifications of the wafer in real time, thereby automatically adjusting the position of the suction cup to solve the problem of time-consuming and laborious manual adjustment.

[0010] Furthermore, the protection unit includes electric telescopic rods, support rods, and a protection bracket. There are four electric telescopic rods, and they are installed in pairs on the side of the support frame. Support rods are fixed to the outer ends of each pair of electric telescopic rods. The bottom end of the support rod is connected to the top surface of the protection bracket. The input end of the electric telescopic rod is electrically connected to the output end of the controller. Starting the electric telescopic rod drives the protection bracket to move to the bottom surface of the wafer to prevent the wafer from leaking air and falling during transportation, and it also plays a certain protective role.

[0011] Furthermore, the protection unit further includes a sponge pad and a rubber ring. The sponge pad is bonded to the top surface of the protection bracket. The rubber ring is fixed to the bottom surface of the suction cup. The sponge pad can solve the problem of wear when the wafer contacts the protection bracket, while the rubber ring can increase the sealing between the suction cup and the wafer surface.

[0012] Furthermore, it also includes lighting lamps. There are two lighting lamps, which are respectively fixed on the left and right side surfaces of the placement rack. The input ends of the lighting lamps are electrically connected to the output end of the controller. The lighting lamps can provide illumination to prevent the detection of wafer specifications from being affected by dim light.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: This wafer adsorption device has the following advantages:

[0014] 1. By starting the linear motor to adjust the position of the suction cup according to the specifications of the wafer, the electric push rod drives the suction cup to press down and fit with the wafer, and the universal joint can automatically adjust according to the inclination of the wafer surface, thereby improving the adsorption effect.

[0015] 2. The industrial camera inside the placement rack can detect the specifications of the wafer in real time, thereby automatically adjusting the position of the suction cup to solve the problem that manual adjustment is time-consuming and laborious. The negative pressure vacuum pump enables the four suction cups to adsorb and fix the surfaces of wafers with different specifications to prevent the wafers from falling during the conveying process.

[0016] 3. By starting the electric telescopic rod to drive the protective bracket to move to the bottom surface of the wafer, it can prevent the problem of air leakage and falling of the wafer during the conveying process, and at the same time play a certain protective role. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of the present utility model;

[0018] Figure 2 is a schematic structural diagram of the adjustment unit of the present utility model;

[0019] Figure 3 is a partial enlarged structural schematic diagram at position A of the present utility model.

[0020] In the figure: 1 fixing plate, 2 adjustment unit, 21 support frame, 22 placement groove, 23 linear motor, 24 electric push rod, 25 universal joint, 26 industrial camera, 27 placement rack, 3 protection unit, 31 electric telescopic rod, 32 support rod, 33 protection bracket, 34 sponge pad, 35 rubber ring, 4 negative pressure vacuum pump, 5 suction ring, 6 suction cup, 7 connection seat, 8 motor, 9 adjustment rod, 10 mounting plate, 11 lighting lamp, 12 controller. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-3 , this embodiment provides a technical solution: A wafer adsorption device includes a fixing plate 1 and a negative pressure vacuum pump 4;

[0023] Fixed plate 1: A connection seat 7 is fixed in the middle of the top surface. An adjusting rod 9 is rotatably connected inside the connection seat 7. A motor 8 is fixed on the left side surface of the connection seat 7. The output shaft of the motor 8 is connected to the left end of the adjusting rod 9. The top end of the adjusting rod 9 is connected to the middle of the bottom surface of the mounting plate 10. There are two negative pressure vacuum pumps 4, which are respectively arranged on both sides of the top surface of the fixed plate 1. The intake pipe of the negative pressure vacuum pump 4 is connected to the air outlet of the suction ring 5. The suction ring 5 is installed on the bottom surface of the fixed plate 1. The intake pipe of the suction ring 5 is connected to the air outlet of the suction cup 6. An adjusting unit 2 is arranged on the side surface of the fixed plate 1. The adjusting unit 2 includes a support frame 21, a placement groove 22, a linear motor 23, an electric push rod 24 and a universal joint 25. The support frame 21 is installed on the side surface of the fixed plate 1. A placement groove 22 is opened inside the support frame 21. A linear motor 23 is fixed inside the placement groove 22. An electric push rod 24 is arranged on the bottom surface of the moving seat of the linear motor 23. The bottom end of the electric push rod 24 is connected to the top end of the universal joint 25. The bottom end of the universal joint 25 is connected to the middle of the top surface of the suction cup 6. A protection unit 3 is arranged on the side surface of the support frame 21. The input ends of the linear motor 23 and the electric push rod 24 are electrically connected to the output end of the controller 12. Start the linear motor 23 to adjust the position of the suction cup 6 according to the specifications of the wafer. The electric push rod 24 drives the suction cup 6 to press down and fit with the wafer, and the universal joint 25 can automatically adjust according to the inclination of the wafer surface, so as to improve the adsorption effect. The adjusting unit 2 also includes an industrial camera 26 and a placement rack 27. The placement rack 27 is fixed in the middle of the bottom surface of the fixed plate 1. The industrial camera 26 is clamped inside the placement rack 27. The input end of the industrial camera 26 is electrically connected to the output end of the controller 12. The industrial camera 26 inside the placement rack 27 can detect the specifications of the wafer in real time, so as to automatically adjust the position of the suction cup 6 to solve the problem of time-consuming and laborious manual adjustment. The protection unit 3 includes electric telescopic rods 31, support rods 32 and a protection bracket 33. There are four electric telescopic rods 31, and they are installed in pairs on the side surface of the support frame 21. The outer ends of each group of electric telescopic rods 31 are fixed with support rods 32. The bottom end of the support rod 32 is connected to the top surface of the protection bracket 33. The input end of the electric telescopic rod 31 is electrically connected to the output end of the controller 12. Start the electric telescopic rod 31 to drive the protection bracket 33 to move to the bottom surface of the wafer to prevent air leakage and dropping during the wafer transportation process, and also play a certain protection role. The protection unit 3 also includes a sponge pad 34 and a rubber ring 35. The sponge pad 34 is bonded to the top surface of the protection bracket 33. The rubber ring 35 is fixed to the bottom surface of the suction cup 6. The sponge pad 34 can solve the problem of wear when the wafer contacts the protection bracket 33, and the rubber ring 35 can increase the sealing performance between the suction cup 6 and the wafer surface;

[0024] Among them, it further includes a controller 12 which is arranged on the right side surface of the connecting seat 7. The input ends of the negative pressure vacuum pump 4 and the motor 8 are electrically connected to the output end of the controller 12, and the input end of the controller 12 is electrically connected to the output end of an external power supply. Starting the negative pressure vacuum pump 4 enables the four suction cups 6 to adsorb and fix the surface of wafers of different specifications, preventing the wafers from falling during the conveying process. The motor 8 drives the mounting plate 10 to rotate, making the adjustment of the fixing plate more flexible. It further includes lighting lamps 11. There are two lighting lamps 11 which are respectively fixed on the left and right side surfaces of the placing rack 27. The input end of the lighting lamp 11 is electrically connected to the output end of the controller 12. The lighting lamp 11 can provide illumination to prevent the wafer specification detection from being affected by dim light.

[0025] The working principle of a wafer adsorption device provided by the present utility model is as follows: First, connect the mounting plate 10 to an external driving robotic arm. The industrial camera 26 inside the placing rack 27 can detect the specifications of the wafers in real time. Start the linear motor 23 to adjust the position of the suction cup 6 according to the specifications of the wafers. The electric push rod 24 drives the suction cup 6 to press down and fit with the wafer, and the universal joint 25 can automatically adjust according to the inclination of the wafer surface, thereby improving the adsorption effect and solving the problem of time-consuming and laborious manual adjustment. Start the electric telescopic rod 31 to drive the protective bracket 33 to move to the bottom surface of the wafer to prevent the wafer from leaking and falling during the conveying process, and at the same time play a certain protective role. The provided sponge pad 34 can solve the problem of wear when the wafer contacts the protective bracket 33, and the rubber ring 35 can increase the sealing between the suction cup 6 and the wafer surface.

[0026] It should be noted that in the above embodiments, the selected controller 13 is of model S7-200. The electric push rod 24 and the electric telescopic rod 31 can be freely configured according to the actual application scenario. It is recommended to select an electric telescopic rod of model IP42. The industrial camera 26 can select an industrial camera of model GX2500-C, and the negative pressure vacuum pump 4 can select a negative pressure pump of model KLVP3-SB12. The controller 13 controls the linear motor 23, the electric push rod 24, the electric telescopic rod 31, the industrial camera 26, the negative pressure vacuum pump 4, the motor 8 and the lighting lamp 11 to work by using the commonly used methods in the prior art.

[0027] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural or equivalent process transformation made by using the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present utility model.

Claims

1. A wafer adsorption device, characterized in that: It comprises a fixing plate (1) and a negative pressure vacuum pump (4); Fixed plate (1): A connecting seat (7) is fixed in the middle of the top surface, an adjusting rod (9) is rotatably connected inside the connecting seat (7), a motor (8) is fixed on the left side of the connecting seat (7), an output shaft of the motor (8) is connected to the left end of the adjusting rod (9), the top end of the adjusting rod (9) is connected to the middle of the bottom surface of the mounting plate (10), there are two negative pressure vacuum pumps (4) and they are respectively arranged on both sides of the top surface of the fixed plate (1), the air inlet pipe of the negative pressure vacuum pump (4) is connected to the air outlet of the suction ring (5), the suction ring (5) is installed on the bottom surface of the fixed plate (1), the air inlet pipe of the suction ring (5) is connected to the air outlet of the suction cup (6), and an adjusting unit (2) is arranged on the side of the fixed plate (1); It also includes a controller (12), which is arranged on the right side of the connecting seat (7), the input ends of the negative pressure vacuum pump (4) and the motor (8) are electrically connected to the output end of the controller (12), and the input end of the controller (12) is electrically connected to the output end of an external power supply.

2. The wafer adsorption device according to claim 1, characterized in that: The adjustment unit (2) comprises a support frame (21), a placement slot (22), a linear motor (23), an electric push rod (24) and a universal joint (25); the support frame (21) is mounted on the side of the fixed plate (1); a placement slot (22) is provided inside the support frame (21); a linear motor (23) is fixed inside the placement slot (22); an electric push rod (24) is provided on the bottom surface of the mover seat of the linear motor (23); the bottom end of the electric push rod (24) is connected to the top end of the universal joint (25); the bottom end of the universal joint (25) is connected to the middle of the top surface of the suction cup (6); a protection unit (3) is provided on the side of the support frame (21); the input ends of the linear motor (23) and the electric push rod (24) are electrically connected to the output end of the controller (12).

3. The wafer adsorption device according to claim 1, characterized in that: The adjustment unit (2) also includes an industrial camera (26) and a placement rack (27), wherein the placement rack (27) is fixed to the middle of the bottom surface of the fixed plate (1), the industrial camera (26) is clamped inside the placement rack (27), and the input end of the industrial camera (26) is electrically connected to the output end of the controller (12).

4. The wafer adsorption device according to claim 2, characterized in that: The protection unit (3) comprises an electric telescopic rod (31), a support rod (32) and a protection bracket (33). The electric telescopic rod (31) has four components and is mounted in groups of two on the side of the support frame (21). The outer end of each group of electric telescopic rods (31) is fixed with a support rod (32). The bottom end of the support rod (32) is connected to the top surface of the protection bracket (33). The input end of the electric telescopic rod (31) is electrically connected to the output end of the controller (12).

5. The wafer adsorption device according to claim 4, characterized in that: The protection unit (3) further comprises a sponge pad (34) and a rubber ring (35), wherein the sponge pad (34) is bonded to the top surface of the protection bracket (33), and the rubber ring (35) is fixed to the bottom surface of the suction cup (6).

6. The wafer adsorption device according to claim 3, characterized in that: It also includes lighting lamps (11), two of which are respectively fixed on the left and right sides of the placement rack (27), and the input end of the lighting lamps (11) is electrically connected to the output end of the controller (12).

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