Large wafer detection fixing tool convenient to clean

Abstract

The utility model relates to a convenient-to-clean fixing tool for large wafer detection, which belongs to the technical field of fixing tools and comprises a detection bottom plate, fixing sheets are fixedly welded at four corners of the detection bottom plate, fixing threaded holes are formed in the upper surfaces of the fixing sheets, and wafers to be detected are uniformly arranged on the upper surface of the detection bottom plate. A cleaning frame is arranged above the detection bottom plate, clamping assemblies used for fixing wafers to be detected are evenly arranged on the upper surface of the detection bottom plate, clamping grooves are evenly formed in the upper surface of the detection bottom plate, the inserted ends of the wafers to be detected are arranged in the clamping grooves in an inserted mode, and the clamping assemblies are located on the two sides of the clamping grooves. A driving assembly used for lifting the cleaning frame is arranged on the inner wall of the thin wall of one side of the detection bottom plate, and cleaning brushes are evenly arranged on the surface of one side of the cleaning frame. And meanwhile, the purpose of cleaning the two side surfaces of a plurality of to-be-detected wafers with different thicknesses can be achieved through the driving assembly.

Description

Technical Field

[0001] The utility model relates to a fixing tool for detecting large wafers, which is convenient for cleaning, and belongs to the technical field of fixing tools. Background Technique

[0002] The wafer is one of the most important raw materials of LED, which is the light-emitting component of LED and the most core part of LED. The quality of the wafer will directly determine the performance of LED. The wafer is composed of compound semiconductor materials of III and V groups. When packaging LED, the incoming wafers are neatly arranged on the wafer film. However, when detecting the wafers, a fixing tool is needed to clamp and fix the wafers.

[0003] When the existing fixing tool for wafer detection detects wafers, the fixing effect on multiple wafers to be detected with different thicknesses is poor. When dust accumulates on the surface of the wafers to be detected, the existing device is not convenient for cleaning multiple wafers to be detected.

[0004] In view of this, the present utility model is particularly proposed. Content of the Utility Model

[0005] The purpose of the present utility model is to provide a fixing tool for detecting large wafers, which is convenient for cleaning, and can fix multiple wafers to be detected with different thicknesses when cleaning the wafers to be detected, and can achieve the effect of efficiently cleaning multiple large wafers.

[0006] The present utility model realizes the above purpose through the following technical solutions. A fixing tool for detecting large wafers, which is convenient for cleaning, includes a detection bottom plate. The upper surface of the detection bottom plate is evenly provided with wafers to be detected. A cleaning frame is arranged above the detection bottom plate. The upper surface of the detection bottom plate is evenly provided with clamping components for fixing the wafers to be detected. One side thin-wall inner wall of the detection bottom plate is provided with a driving component for lifting the cleaning frame. The side surface of the cleaning frame is evenly provided with cleaning brushes.

[0007] Preferably, in order to facilitate the fixation of the detection bottom plate, fixing pieces are fixedly welded at the four corner positions of the detection bottom plate, and fixing threaded holes are opened on the upper surfaces of the fixing pieces.

[0008] Preferably, in order to place the wafers to be detected with different thicknesses, clamping grooves are evenly opened on the upper surface of the detection bottom plate. One end of the wafer to be detected is inserted into the clamping groove, and the clamping components are located on both sides of the clamping groove.

[0009] Preferably, in order to fixedly clamp the wafers to be inspected with different thicknesses, the clamping assembly includes a clamping rubber plate. The clamping rubber plates are symmetrically and adhesively arranged on both sides of one end of the wafer to be inspected. Spring grooves are formed on both inner walls of the clamping groove. Spring telescopic rods are evenly arranged in the spring grooves, and one end of each spring telescopic rod is fixedly connected to one side surface of the clamping rubber plate.

[0010] Preferably, in order to provide a rotational driving force to the active lead screw through the driving motor, a driving cavity is formed in the thin wall of one side surface of the detection base plate. The driving assembly includes a driving motor. The driving motor is embedded and installed on the inner bottom wall of one end of the driving cavity. The output end of the driving motor is fixedly installed with an active lead screw. One end of the outer surface of the active lead screw is fixedly welded with an active sprocket, and a synchronous chain is meshed on the outer surface of the active sprocket.

[0011] Preferably, in order to transmit the synchronous rotational force between the active lead screw and the passive lead screw through the synchronous chain, a passive lead screw is rotatably installed on the inner bottom wall of the other end of the driving cavity. One end of the outer surface of the passive lead screw is fixedly welded with a passive sprocket, and the outer surface of the passive sprocket is meshed with the synchronous chain.

[0012] Preferably, in order to lift the cleaning frame through the active lead screw and the passive lead screw, lifting threaded holes are formed on the surfaces of the bottom edges of both ends of the cleaning frame. One end of each of the active lead screw and the passive lead screw penetrates through the outer surface of one side of the detection base plate, and one end of each of the active lead screw and the passive lead screw is meshed with the lifting threaded holes at both ends of the cleaning frame respectively.

[0013] Preferably, in order to fix the cleaning brush, docking holes are evenly formed on one side surface of the cleaning frame. Fixed frames are fixedly installed on one side surface of the cleaning frame on both sides of the docking holes, and one end of each cleaning brush is tightly inserted into the fixed frame.

[0014] The beneficial effects of the present utility model are as follows: The device can facilitate the staff to fixedly clamp the wafers to be inspected with different thicknesses, and at the same time, through the driving assembly, the purpose of cleaning the two side surfaces of multiple wafers to be inspected with different thicknesses can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present utility model.

[0016] Figure 2 It is a schematic diagram of the position of the driving assembly of the present utility model.

[0017] Figure 3 It is a schematic diagram of the structure of the clamping assembly of the present utility model.

[0018] Figure 4 This is a schematic structural diagram of the driving component of the present utility model.

[0019] Figure 5 is Figure 2 an enlarged view of the structure at A in

[0020] In the figure: 1, detection base plate; 2, wafer to be detected; 3, cleaning frame; 4, clamping component; 401, clamping rubber plate; 402, spring telescopic rod; 5, driving component; 501, driving motor; 502, active lead screw; 503, active sprocket; 504, synchronous chain; 505, passive lead screw; 506, passive sprocket; 6, cleaning brush; 7, fixing piece; 8, fixing frame. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-5 As shown, a fixing tool for detecting large wafers that is convenient for cleaning includes a detection base plate 1. The upper surface of the detection base plate 1 is evenly provided with wafers 2 to be detected. Above the detection base plate 1 is provided a cleaning frame 3. The upper surface of the detection base plate 1 is evenly provided with a clamping component 4 for fixing the wafers 2 to be detected. One side thin wall inner wall of the detection base plate 1 is provided with a driving component 5 for lifting the cleaning frame 3. One side surface of the cleaning frame 3 is evenly provided with cleaning brushes 6.

[0023] As Figure 3 shown, fixing pieces 7 are fixedly welded at the four corner positions of the detection base plate 1. The upper surface of the fixing piece 7 is provided with fixing threaded holes. The upper surface of the detection base plate 1 is evenly provided with clamping grooves. One end of the wafer 2 to be detected is inserted and arranged in the clamping grooves. The clamping component 4 is located on both sides of the clamping grooves. The clamping component 4 includes a clamping rubber plate 401. The clamping rubber plates 401 are symmetrically and adhesively arranged on both sides of one end of the wafer 2 to be detected. Spring grooves are provided on both inner walls of the clamping grooves. Spring telescopic rods 402 are evenly arranged in the spring grooves. One end of the spring telescopic rod 402 is fixedly connected to one side surface of the clamping rubber plate 401, so as to facilitate the staff to complete the fixing of the detection base plate 1. The spring elasticity of the spring telescopic rods 402 in the clamping component 4 is used to achieve the effect of clamping and fixing wafers of different thicknesses in the clamping grooves.

[0024] As Figure 4 and Figure 5As shown in the figure, a drive cavity is provided in the thin wall on one side surface of the detection base plate 1. The drive assembly 5 includes a drive motor 501, which is embedded and installed on the inner bottom wall at one end of the drive cavity. The output end of the drive motor 501 is fixedly installed with a driving lead screw 502. One end of the driving lead screw 502 is fixedly welded with a driving sprocket 503. A synchronous chain 504 is meshed on the outer surface of the driving sprocket 503. A driven lead screw 505 is rotatably installed on the inner bottom wall at the other end of the drive cavity. One end of the driven lead screw 505 is fixedly welded with a driven sprocket 506. The outer surface of the driven sprocket 506 is meshed with the synchronous chain 504. Lifting threaded holes are provided on the surface of the bottom edges at both ends of the cleaning frame 3. One end of the driving lead screw 502 and the driven lead screw 505 both penetrate through the outer surface of one side of the detection base plate 1, and one end of the driving lead screw 502 and the driven lead screw 505 are respectively meshed with the lifting threaded holes at both ends of the cleaning frame 3. Docking holes are evenly provided on one side surface of the cleaning frame 3. Fixed frames 8 are fixedly installed on one side surface of the cleaning frame 3 on both sides of the docking holes. One end of each cleaning brush 6 is tightly inserted into the fixed frame 8, so as to drive the driving lead screw 502 to rotate through the drive motor 501, and to realize the parallel lifting of the cleaning frame 3 through the driving lead screw 502, the driven lead screw 505 and the synchronous chain 504, and then to clean wafers 2 to be detected with different thicknesses by the cleaning brushes 6 uniformly arranged below the cleaning frame 3.

[0025] When the utility model is in use, the staff fixes the device through the fixing pieces 7 arranged at the four corners of the detection base plate 1. At this time, the staff inserts a plurality of wafers 2 to be detected into the clamping grooves arranged on the upper surface of the detection base plate 1, and then the staff turns on the power supply of the drive motor 501. At this time, the drive motor 501 provides driving force for the rotation of the driving lead screw 502. The driving lead screw 502 rotates to drive the driving sprocket 503 to rotate. The driving sprocket 503 drives the synchronous chain 504 to rotate. The synchronous chain 504 drives the driven lead screw 505 to rotate. At this time, the driving lead screw 502 and the driven lead screw 505 rotate in the same direction and at the same speed. Then the cleaning frame 3 moves downward. At this time, the cleaning frame 3 drives the cleaning brushes 6 to move downward, and the two side surfaces of the wafers 2 to be detected are efficiently cleaned by the cleaning brushes 6. The device can fix wafers 2 to be detected with different thicknesses, and at the same time, it is also convenient to clean the two side surfaces of the wafers 2 to be detected.

[0026] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0027] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A fixture for testing large wafers that is easy to clean, comprising a testing base plate (1), the upper surface of which is evenly provided with wafers to be tested (2), and a cleaning rack (3) arranged above the testing base plate (1), characterized in that: The upper surface of the detection base plate (1) is evenly provided with clamping components (4) for fixing the wafer (2) to be detected, a driving component (5) for lifting and lowering the cleaning frame (3) is provided on a thin inner wall of one side of the detection base plate (1), and a cleaning brush (6) is evenly provided on the surface of one side of the cleaning frame (3).

2. The easy-to-clean fixture for large wafer inspection according to claim 1, characterized in that: The four corners of the detection base plate (1) are all fixedly welded with fixing plates (7), and the upper surface of the fixing plates (7) is provided with fixing threaded holes.

3. The easy-to-clean fixture for large wafer inspection according to claim 1, characterized in that: The upper surface of the detection base plate (1) is evenly provided with clamping grooves, one end of the wafer to be detected (2) is inserted into the clamping groove, and the clamping components (4) are located on both sides of the clamping groove.

4. The easy-to-clean fixture for large wafer inspection according to claim 3, characterized in that: The clamping assembly (4) comprises a clamping rubber plate (401), wherein the clamping rubber plate (401) is symmetrically arranged on both sides of one end of the wafer to be inspected (2), and the inner walls on both sides of the clamping groove are provided with spring grooves, and spring telescopic rods (402) are evenly arranged in the spring grooves, and one end of the spring telescopic rod (402) is fixedly connected to a surface of one side of the clamping rubber plate (401).

5. The easy-to-clean fixture for large wafer inspection according to claim 1, characterized in that: A driving cavity is provided in a thin wall on one side surface of the detection base plate (1); the driving assembly (5) comprises a driving motor (501), the driving motor (501) is mounted on an inner bottom wall at one end of the driving cavity, an active lead screw (502) is fixedly mounted on the output end of the driving motor (501), a driving sprocket (503) is fixedly welded on the outer surface of one end of the active lead screw (502), and a synchronous chain (504) is meshedly provided on the outer surface of the active sprocket (503).

6. The easy-to-clean fixture for large wafer inspection according to claim 5, characterized in that: A passive lead screw (505) is rotatably mounted on the inner bottom wall at the other end of the driving cavity, and a passive sprocket (506) is fixedly welded to the outer surface of one end of the passive lead screw (505), and the outer surface of the passive sprocket (506) is meshed with the synchronous chain (504).

7. The easy-to-clean fixture for large wafer inspection according to claim 6, characterized in that: The bottom side wall surfaces at both ends of the cleaning frame (3) are provided with lifting threaded holes, one end of the active lead screw (502) and one end of the passive lead screw (505) pass through the outer surface of one side of the detection base plate (1), and one end of the active lead screw (502) and one end of the passive lead screw (505) are respectively meshed with the lifting threaded holes at both ends of the cleaning frame (3).

8. The easy-to-clean fixture for large wafer inspection according to claim 1, characterized in that: The outer surface of one side of the cleaning frame (3) is evenly provided with docking holes, and a fixing frame (8) is fixedly mounted on the surface of one side of the cleaning frame (3) located on both sides of the docking holes, and one end of the cleaning brush (6) is tightly inserted into the fixing frame (8).

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