Cooling fin for silicon carbide module

Abstract

The utility model discloses a radiating fin for a silicon carbide module, which belongs to the technical field of silicon carbide modules and comprises a patch, the quantity of radiating fins on different heat conducting plates is different, the proper heat conducting plates can be selected to be replaced according to the heating conditions of different silicon carbide modules, and the radiating fins can be replaced by pulling a pull block, a pull rod and an inserting block to move the inserting block out of an inserting groove and then rotating a rotating block. The number of the cooling fins is directly proportional to the heat dissipation effect, the cooling fins are bent, under the condition that the heights occupied by the cooling fins are the same, the surface area of the cooling fins can be increased by adopting the bending mode, the heat dissipation effect of the cooling fins for the silicon carbide module is improved, and the service life of the cooling fins is prolonged. And through the connecting pieces, the impact resistance of the cooling fin for the silicon carbide module can be effectively improved, the cooling fin is prevented from being damaged to affect the cooling effect, the service life is prolonged, and the practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon carbide modules, in particular to a heat sink for a silicon carbide module. Background Art

[0002] Silicon carbide modules, based on the new semiconductor material silicon carbide (SiC), have been widely used in many fields such as power electronics, automotive electronics, optoelectronics, and communications due to their excellent properties such as high electron energy gap, high thermal stability, high breakdown field strength, and high electron saturation drift velocity.

[0003] When a silicon carbide module is in use, a large amount of heat will be generated, and a heat sink needs to be used for heat dissipation. However, at present, the traditional heat sink for a silicon carbide module cannot adjust the number of heat dissipation fins according to the heat generation intensity of the silicon carbide module, resulting in poor adaptability and universality; moreover, the size of the surface area of the heat sink is also an important factor determining the heat dissipation effect of the heat sink; at the same time, the existing heat sink for a silicon carbide module is relatively easy to be damaged, greatly reducing the service life of the heat sink. Therefore, the utility model provides a heat sink for a silicon carbide module. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a heat sink for a silicon carbide module is proposed.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: including a patch, a heat conduction plate is placed above the patch, a plurality of heat sinks are fixedly connected to the top surface of the heat conduction plate, a connecting piece is fixedly connected to the heat sink, U-shaped grooves are opened on the top surface of the heat conduction plate and between two heat sinks, fixing blocks are fixedly connected to both sides of the top surface of the patch, an adjusting groove two is opened on one side of the fixing block close to the heat conduction plate, a clamping block is slidably connected in the adjusting groove two, clamping grooves are opened on both sides of the heat conduction plate, one ends of the two clamping blocks are respectively clamped in the two clamping grooves, threaded grooves are opened on one sides of the two clamping blocks away from the clamping grooves, threaded rods are threadedly connected in the threaded grooves, one ends of the two threaded rods penetrate through the fixing block and extend to the outside of the fixing block and are fixedly connected with a rotating block, an adjusting groove one is opened on one side of the rotating block close to the fixing block, an inserting block is slidably connected in the adjusting groove one, one end of the inserting block extends outside the adjusting groove one and is inserted into the fixing block, a pull rod is fixedly connected to one end of the inserting block away from the fixing block, one end of the pull rod away from the inserting block penetrates through the outside of the rotating block and is fixedly connected with a pulling block, a spring is sleeved on the adjusting groove one, and two ends of the spring are respectively fixedly connected with the inserting block and the inner surface of the adjusting groove one.

[0006] As a further description of the above technical solution:

[0007] A plurality of through holes are opened on the heat sink.

[0008] As a further description of the above technical solution:

[0009] The heat sink includes at least two bends.

[0010] As a further description of the above technical solution:

[0011] Both ends of the connecting piece are fixedly connected to one side of two adjacent heat sinks respectively.

[0012] As a further description of the above technical solution:

[0013] Sliders are fixedly connected to both the upper and lower surfaces of the clamping block, chutes are opened on the inner surfaces of both the upper and lower sides of the adjustment groove two, and the sliders are slidably connected to the chutes.

[0014] As a further description of the above technical solution:

[0015] The external thread of the threaded rod is adapted to the internal thread of the thread groove.

[0016] As a further description of the above technical solution:

[0017] A plurality of slots are circumferentially opened on the side of the fixed block away from the heat conducting plate around the threaded rod, and one end of the inserting block is inserted into one of the slots.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, the number of heat sinks on different heat conducting plates is different, and a suitable heat conducting plate can be selected for replacement according to the heat generation situation of different silicon carbide modules. By pulling the pulling block, the pull rod and the inserting block, the inserting block is moved out of the slot, and then the rotating block is rotated to move the clamping block out of the clamping slot, and then the replacement can be carried out. The number of heat sinks is proportional to the heat dissipation effect.

[0020] 2. In the utility model, the heat sink is bent. Under the condition that the height occupied by the heat sink is the same, the bending method can increase the surface area of the heat sink and improve the heat dissipation effect of the heat sink for the silicon carbide module.

[0021] 3. In the utility model, the connecting piece can effectively improve the impact resistance of the heat sink for the silicon carbide module, prevent the heat sink from being damaged and affecting the heat dissipation effect, and improve the service life and practicability. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the overall structure of a heat sink for a silicon carbide module proposed by the utility model;

[0023] Figure 2 It is a side view of a heat sink for a silicon carbide module proposed by the utility model;

[0024] Figure 3 Schematic cross-sectional view of the fixing block of a heat sink for a silicon carbide module proposed by the present utility model.

[0025] Legend:

[0026] 1. Patch; 2. Heat conducting plate; 3. Heat sink; 4. Connecting piece; 5. U-shaped groove; 6. Through hole; 7. Card slot; 8. Card block; 9. Thread groove; 10. Fixing block; 11. Threaded rod; 12. Chute; 13. Slide block; 14. Slot; 15. Insert block; 16. Adjustment groove 1; 17. Spring; 18. Pull rod; 19. Pull block; 20. Adjustment groove 2; 21. Rotating block. Specific implementation manner

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Referring to Figures 1 - 3 , an embodiment provided by the present utility model includes a patch 1. A heat conducting plate 2 is placed above the patch 1. A plurality of heat sinks 3 are fixedly connected to the top surface of the heat conducting plate 2. A connecting piece 4 is fixedly connected to the heat sink 3. U-shaped grooves 5 are opened on the top surface of the heat conducting plate 2 and between two heat sinks 3. Fixing blocks 10 are fixedly connected to both sides of the top surface of the patch 1. An adjustment groove 20 is opened on one side of the fixing block 10 close to the heat conducting plate 2. A card block 8 is slidably connected in the adjustment groove 20. Card slots 7 are opened on both sides of the heat conducting plate 2. One ends of the two card blocks 8 are respectively clamped in the two card slots 7. Thread grooves 9 are opened on the sides of the two card blocks 8 away from the card slots 7. Threaded rods 11 are threadedly connected in the thread grooves 9. One ends of the two threaded rods 11 penetrate through the fixing block 10 and extend to the outside of the fixing block 10 and are fixedly connected to rotating blocks 21. An adjustment groove 16 is opened on one side of the rotating block 21 close to the fixing block 10. An insert block 15 is slidably connected in the adjustment groove 16. One end of the insert block 15 extends out of the adjustment groove 16 and is inserted into the fixing block 10. A pull rod 18 is fixedly connected to the end of the insert block 15 away from the fixing block 10. The end of the pull rod 18 away from the insert block 15 penetrates through the outside of the rotating block 21 and is fixedly connected to a pull block 19. A spring 17 is sleeved on the adjustment groove 16. Two ends of the spring 17 are respectively fixedly connected to the insert block 15 and the inner surface of the adjustment groove 16. After the heat sink 3 is bent, in the case where the heights occupied by the heat sinks 3 are the same, the surface area of the heat sink 3 can be increased by using the bending method, and the heat dissipation effect of the heat sink 3 for the silicon carbide module can be improved.

[0029] The heat sink 3 is provided with a plurality of through holes 6. The heat sink 3 includes at least two bends. Both ends of the connecting piece 4 are fixedly connected to one side of two adjacent heat sinks 3 respectively. Through the connecting piece 4, the impact resistance of the heat sink 3 for the silicon carbide module can be effectively improved, preventing the heat sink 3 from being damaged and affecting the heat dissipation effect, thereby improving the service life and practicability. Sliders 13 are fixedly connected to both the upper and lower surfaces of the clamping block 8. Sliding grooves 12 are provided on the inner surfaces of the upper and lower sides of the adjusting groove 20. The sliders 13 are slidably connected to the sliding grooves 12. The external thread of the threaded rod 11 is adapted to the internal thread of the threaded groove 9. A plurality of insertion slots 14 are circumferentially formed around the threaded rod 11 on the side of the fixed block 10 away from the heat conducting plate 2. One end of the insertion block 15 is inserted into one of the insertion slots 14. The angle of each bend on each heat sink 3 is less than 45 degrees.

[0030] Working principle: The number of heat sinks 3 on different heat conducting plates 2 is different. According to the heat generation conditions of different silicon carbide modules, a suitable heat conducting plate 2 can be selected for replacement. By pulling the pull block 19, the pull block 19 pulls the pull rod 18 and the insertion block 15, so that the insertion block 15 is removed from the insertion slot 14. Then, rotate the rotating block 21, and the rotating block 21 drives the threaded rod 11 to rotate, causing the clamping block 8 to move. When the clamping block 8 is removed from the clamping groove 7, replacement can be carried out, increasing or decreasing the number of heat sinks 3. The number of heat sinks 3 is proportional to the heat dissipation effect. The temperature generated during the operation of the silicon carbide module is absorbed and conducted to the heat conducting plate 2 through the patch 1 and volatilized through the heat sink 3. After the heat sink 3 is bent, in the case of the same height occupied by the heat sink 3, the bending method can increase the surface area of the heat sink 3 and improve the heat dissipation effect of the heat sink for the silicon carbide module. Through the connecting piece 4, the impact resistance of the heat sink 3 for the silicon carbide module can be effectively improved, preventing the heat sink 3 from being damaged and affecting the heat dissipation effect, thereby improving the service life and practicability.

[0031] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat sink for a silicon carbide module, comprising a patch (1), characterized in that: A heat conducting plate (2) is placed above the patch (1), a plurality of heat sinks (3) are fixedly connected to the top surface of the heat conducting plate (2), a connecting plate (4) is fixedly connected to the heat sink (3), a U-shaped groove (5) is provided on the top surface of the heat conducting plate (2) and between two heat sinks (3), a fixing block (10) is fixedly connected to both sides of the top surface of the patch (1), a second adjustment groove (20) is provided on the side of the fixing block (10) close to the heat conducting plate (2), a clamping block (8) is slidably connected in the second adjustment groove (20), a clamping groove (7) is provided on both sides of the heat conducting plate (2), one end of the two clamping blocks (8) are respectively clamped in the two clamping grooves (7), a threaded groove (9) is provided on the side of the two clamping blocks (8) away from the clamping groove (7), and a threaded rod (1) is threadedly connected in the threaded groove (9) 1), one end of each of the two threaded rods (11) passes through the fixed block (10) and extends to the outside of the fixed block (10) and is fixedly connected to a rotating block (21); an adjusting groove (16) is provided on a side of the rotating block (21) close to the fixed block (10); an insert block (15) is slidably connected in the adjusting groove (16); one end of the insert block (15) extends to the outside of the adjusting groove (16) and is inserted in the fixed block (10); one end of the insert block (15) away from the fixed block (10) is fixedly connected to a pull rod (18); one end of the pull rod (18) away from the insert block (15) passes through the outside of the rotating block (21) and is fixedly connected to a pull block (19); a spring (17) is sleeved on the adjusting groove (16); two ends of the spring (17) are respectively fixedly connected to the insert block (15) and the inner surface of the adjusting groove (16).

2. The heat sink for silicon carbide module according to claim 1, characterized in that: The heat sink (3) is provided with a plurality of through holes (6).

3. The heat sink for silicon carbide module according to claim 1, characterized in that: The heat sink (3) comprises at least two bends.

4. The heat sink for silicon carbide module according to claim 1, characterized in that: Both ends of the connecting sheet (4) are respectively fixedly connected to one side of two adjacent heat sinks (3).

5. The heat sink for silicon carbide module according to claim 1, characterized in that: The upper and lower surfaces of the clamping block (8) are fixedly connected with sliding blocks (13), the upper and lower inner surfaces of the second adjustment slot (20) are provided with sliding grooves (12), and the sliding blocks (13) are slidably connected with the sliding grooves (12).

6. The heat sink for silicon carbide module according to claim 1, characterized in that: The external thread of the threaded rod (11) is matched with the internal thread of the threaded groove (9).

7. The heat sink for silicon carbide module according to claim 1, characterized in that: A plurality of slots (14) are provided in a circumferential direction around the threaded rod (11) on a side of the fixing block (10) away from the heat conducting plate (2), and one end of the insert block (15) is inserted into one of the slots (14).

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