Dual-frequency common-caliber antenna structure and antenna array

Abstract

The utility model provides a dual-frequency common-aperture antenna structure and an antenna array, and relates to the technical field of microwave communication. Through the combination of the high-frequency side-fire structure and the low-frequency end-fire structure, the problem of high and low-frequency crosstalk is effectively solved, a filtering branch knot or a filter does not need to be additionally arranged, and it is ensured that the corresponding common-caliber antenna structure has the broadband characteristic and high radiation efficiency; meanwhile, the low-frequency end-fire structure is slotted on the high-frequency side-fire structure adopting a multilayer circuit board lamination design, so that the low-frequency end-fire structure can realize an accurate alignment effect and an efficient assembly welding effect on the high-frequency side-fire structure based on a slot position; the assembling efficiency, the product qualification rate, the antenna integration degree and the product reliability of the common-caliber antenna structure are further improved.

Description

Technical Field

[0001] The present application relates to the field of microwave communication technology, and in particular to a dual-frequency co-aperture antenna structure and an antenna array. Background Art

[0002] With the continuous development of science and technology, microwave communication technology is increasingly widely used in various industries. People have put forward higher requirements on the signal receiving and transmitting performance and hardware size of antennas. It is usually necessary to use the means of integrated receiving / transmitting antennas and co-aperture of multi-band antenna units to achieve the effect of miniaturization and lightness of antenna systems. For multi-band co-aperture antennas that achieve miniaturization, the physical limitation of the close spacing of low-frequency antenna units and high-frequency antenna units often leads to signal coupling between low-frequency antenna units and high-frequency antenna units, resulting in poor isolation between different frequencies, distorted radiation patterns, and narrowed operating frequency bandwidth in the corresponding multi-band co-aperture antennas. It is usually necessary to add filtering branches or filters to reduce high- and low-frequency crosstalk, but the thickness or size will be increased to make the antenna structure more complicated. At the same time, the conventional multi-band co-aperture antennas usually use end-fire three-dimensional structures with large cross-section heights to realize their functions. The overall antenna assembly is difficult, there are many welding points, and a slight deviation in the structural alignment will lead to poor electrical performance or even short circuit or open circuit. The overall integration is poor, and it is difficult to process and integrate into a reliable antenna array structure. Utility Model Content

[0003] In view of this, the purpose of the present application is to provide a dual-frequency co-aperture antenna structure and antenna array, which can effectively solve the high- and low-frequency crosstalk problem through the combination of a high-frequency side-fire structure and a low-frequency end-fire structure, without the need to add additional filtering branches or filters, to ensure that the corresponding co-aperture antenna structure has wide-band characteristics and high radiation efficiency. At the same time, by slotting the low-frequency end-fire structure on the high-frequency side-fire structure that adopts a multi-layer circuit board stacking design, the low-frequency end-fire structure can achieve precise alignment and efficient assembly and welding effects based on the slot position on the high-frequency side-fire structure, so as to further improve the assembly efficiency, product qualification rate, antenna integration and product reliability of the co-aperture antenna structure, and ensure that the corresponding co-aperture antenna structure is easy to integrate into an antenna array with reliable performance.

[0004] In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0005] In a first aspect, the present application provides a dual-frequency co-aperture antenna structure, the antenna structure comprising a low-frequency antenna board, and a high-frequency radiation layer and an antenna feeding layer stacked on each other, wherein a half-wave dipole is etched on the low-frequency antenna board;

[0006] A plurality of first parasitic patches are arranged at intervals on the side of the high-frequency radiation layer away from the antenna feeding layer. A plurality of high-frequency radiation patches are arranged at intervals inside the high-frequency radiation layer. Each of the first parasitic patches corresponds to one of the high-frequency radiation patches separately. The patch projection areas of each of the first parasitic patches and the corresponding high-frequency radiation patches on the antenna feeding layer at least partially overlap.

[0007] The antenna feeding layer is provided with a low-frequency feeding structure and a plurality of high-frequency feeding structures. The high-frequency radiation layer is provided with an antenna board slot at the interval area between the plurality of first parasitic patches, and the antenna board slot partially exposes the antenna feeding layer. The low-frequency antenna board is inserted into the antenna board slot and welded to the antenna feeding layer. Each of the high-frequency feeding structures corresponds to one of the high-frequency radiation patches separately. The high-frequency feeding structure is used to feed the corresponding high-frequency radiation patch, and the low-frequency feeding structure is used to feed the half-wave dipole.

[0008] In an alternative embodiment, the high-frequency radiation layer includes a first dielectric layer and a second dielectric layer stacked on each other, where the second dielectric layer is between the first dielectric layer and the antenna feeding layer.

[0009] A plurality of the first parasitic patches are arranged at intervals on the side of the first dielectric layer away from the second dielectric layer.

[0010] A plurality of the high-frequency radiation patches are arranged at intervals on the side of the second dielectric layer close to the first dielectric layer. The patch projection area of each of the first parasitic patches on the second dielectric layer and the corresponding high-frequency radiation patch at least partially overlap.

[0011] In an alternative embodiment, each of the high-frequency feeding structures includes a feeding strip line and a first connector for connecting a signal transceiver device. The antenna feeding layer includes a third dielectric layer and a fourth dielectric layer stacked on each other, where the third dielectric layer is between the high-frequency radiation layer and the fourth dielectric layer.

[0012] A radiation floor is provided on the side of the third dielectric layer away from the fourth dielectric layer. The third dielectric layer is provided with a plurality of first connection through holes, and each of the first connection through holes penetrates the radiation floor and the third dielectric layer.

[0013] A plurality of feeding strip lines are disposed on a side surface of the fourth dielectric layer close to the third dielectric layer, a metal floor is disposed on a side surface of the fourth dielectric layer far from the third dielectric layer, and a plurality of first connectors are mounted on a side surface of the metal floor far from the fourth dielectric layer. One end of each of the feeding strip lines is electrically connected to one of the high-frequency radiation patches through a feeding wire via one of the first connection through holes, and the other end of each of the feeding strip lines is electrically connected to one of the first connectors.

[0014] In an alternative embodiment, the low-frequency feeding structure includes a second connector for connecting a signal transceiver device;

[0015] A second connection through hole is formed in a partial area of the third dielectric layer exposed by the antenna board slot. The second connection through hole penetrates through the third dielectric layer and the radiation floor at the same time, and the half-wave dipole is welded to the radiation floor.

[0016] The fourth dielectric layer is provided with a third connection through hole whose projection position overlaps with that of the second connection through hole. The third connection through hole penetrates through the fourth dielectric layer and the metal floor at the same time.

[0017] The second connector is mounted on a side surface of the metal floor far from the fourth dielectric layer, and is electrically connected to the half-wave dipole through a feeding wire via the third connection through hole and the second connection through hole.

[0018] In an alternative embodiment, the low-frequency antenna board includes an antenna board body and a feeding connecting member;

[0019] The half-wave dipole is etched on a side surface of one board body of the antenna board body, and the feeding connecting member is disposed on a side surface of the other board body of the antenna board body. A metal through hole is formed in the antenna board body, and the metal through hole connects the feeding connecting member and the half-wave dipole. The feeding connecting member is electrically connected to the low-frequency feeding structure, and the half-wave dipole is welded to the radiation floor included in the antenna feeding layer.

[0020] In an alternative embodiment, the low-frequency antenna board further includes a plurality of second parasitic patches;

[0021] The plurality of second parasitic patches are arranged on the side surface of the antenna board body where the half-wave dipole is etched at intervals. The extending direction of the patch of each of the second parasitic patches is parallel to the extending direction of the oscillator arm of the half-wave dipole.

[0022] In an alternative embodiment, the low-frequency antenna board further includes a plurality of third parasitic patches;

[0023] A plurality of the third parasitic patches are arranged on the side surface of the antenna board body where the feeding connector is provided, with intervals therebetween, and the patch projection area of each of the third parasitic patches on the antenna board body coincides with one of the second parasitic patches.

[0024] In an alternative embodiment, the low-frequency antenna board further includes two antenna isolators;

[0025] Both of the two antenna isolators are arranged on the side surface of the antenna board body where the half-wave dipole is etched, and are connected to the half-wave dipole. Both of the two antenna isolators are welded to the radiation floor included in the antenna feeding layer, for improving the co-frequency isolation degrees of the half-wave dipole and the plurality of high-frequency radiation patches respectively.

[0026] In an alternative embodiment, the antenna feeding layer is respectively provided with a plurality of signal shielding holes around the low-frequency feeding structure and the plurality of high-frequency feeding structures.

[0027] In a second aspect, the present application provides an antenna array, which includes a plurality of dual-frequency common-aperture antenna structures as described in any one of the foregoing embodiments and distributed in an array, wherein the extending directions of the dipole arms of the half-wave dipoles included in the plurality of dual-frequency common-aperture antenna structures are parallel to each other.

[0028] In this case, the beneficial effects of the embodiments of the present application may include the following:

[0029] In this application, a high-frequency radiation layer and an antenna feeding layer are stacked, and a plurality of first parasitic patches are arranged at intervals on the side of the high-frequency radiation layer away from the antenna feeding layer. A plurality of high-frequency radiation patches are deployed at intervals inside the high-frequency radiation layer, so that the patch projection areas of each first parasitic patch and a high-frequency radiation patch on the antenna feeding layer at least partially overlap. A low-frequency feeding structure and a plurality of high-frequency feeding structures are deployed on the antenna feeding layer. Each high-frequency feeding structure feeds the corresponding high-frequency radiation patch separately. An antenna board slot for partially exposing the antenna feeding layer is opened at the interval area between the plurality of first parasitic patches of the high-frequency radiation layer, so that the low-frequency antenna board can be inserted into the antenna board slot and welded to the antenna feeding layer. The low-frequency feeding structure feeds the half-wave dipole etched on the low-frequency antenna board. Thus, through the combination of the high-frequency side-radiation structure and the low-frequency end-fire structure, the problem of high-low frequency crosstalk can be effectively solved without additionally increasing filtering stubs or filters, ensuring that the corresponding co-aperture antenna structure has broadband characteristics and high radiation efficiency. At the same time, by opening slots for the low-frequency end-fire structure on the high-frequency side-radiation structure using a multi-layer circuit board stack design, the low-frequency end-fire structure can achieve accurate alignment and efficient assembly and welding effects based on the slot positions on the high-frequency side-radiation structure, so as to further improve the assembly efficiency, product qualification rate, antenna integration degree and product reliability of the co-aperture antenna structure, and ensure that the corresponding co-aperture antenna structure is easy to be integrated into a reliable antenna array.

[0030] In order to make the above objects, features and advantages of the present application more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, detailed descriptions are as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0032] Figure 1 Assembly schematic diagram of the dual-frequency co-aperture antenna structure provided by the embodiment of the present application;

[0033] Figure 2 Expansion schematic diagram of the dual-frequency co-aperture antenna structure provided by the embodiment of the present application;

[0034] Figure 3 For Figure 2 Expansion schematic diagram of the high-frequency radiation layer and the antenna feeding layer in

[0035] Figure 4 For Figure 2 One of the structural schematic diagrams of the low-frequency antenna board in

[0036] Figure 5 The second schematic structural diagram of the low-frequency antenna board in Figure 2 ;

[0037] Figure 6 The third schematic structural diagram of the low-frequency antenna board in Figure 2 ;

[0038] Figure 7 The fourth schematic structural diagram of the low-frequency antenna board in Figure 2 ;

[0039] Figure 8 The assembly schematic diagram of the antenna array provided by the embodiment of the present application.

[0040] Icon: 10 - Dual-frequency common-aperture antenna structure; 11 - Low-frequency antenna board; 12 - High-frequency radiation layer; 13 - Antenna feeding layer; 111 - Half-wave dipole; 112 - Antenna board body; 113 - Feeding connection part; 114 - Metal via hole; 115 - Second parasitic patch; 116 - Third parasitic patch; 117 - Antenna isolator; 121 - First parasitic patch; 122 - High-frequency radiation patch; 123 - First dielectric layer; 124 - Second dielectric layer; 131 - Low-frequency feeding structure; 132 - High-frequency feeding structure; 133 - Third dielectric layer; 134 - Fourth dielectric layer; 135 - Radiation floor; 136 - Metal floor; 137 - First connection via hole; 138 - Second connection via hole; 139 - Third connection via hole; 141 - Feeding strip line; 142 - First connector; 143 - Second connector; 15 - Antenna board slot; 20 - Antenna array. Detailed implementation manners

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0042] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but is merely representative of the selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0043] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0044] In the description of the present application, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use, or the positions or positional relationships commonly understood by those skilled in the art, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0045] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0047] Please refer to Figure 1 and Figure 2 ,in Figure 1 is an assembly diagram of a dual-frequency co-aperture antenna structure 10 provided in an embodiment of the present application, Figure 2 : is an expanded schematic diagram of the dual-frequency co-aperture antenna structure 10 provided in the embodiment of the present application. In the embodiment of the present application, the dual-frequency co-aperture antenna structure 10 can effectively solve the high-low frequency crosstalk problem through the combination of the high-frequency side-firing structure and the low-frequency end-firing structure, without the need to add additional filtering branches or filters, so that the dual-frequency co-aperture antenna structure 10 has wide-band characteristics, high radiation efficiency and good frequency isolation. At the same time, by slotting the low-frequency end-firing structure on the high-frequency side-firing structure using a multi-layer circuit board stacking design, the low-frequency end-firing structure can achieve precise alignment and efficient assembly and welding effects based on the slot position on the high-frequency side-firing structure, so as to further improve the assembly efficiency, product qualification rate, antenna integration and product reliability of the dual-frequency co-aperture antenna structure 10, and ensure that the dual-frequency co-aperture antenna structure 10 is easy to integrate into a reliable antenna array.

[0048] In an embodiment of the present application, the dual - frequency common - aperture antenna structure 10 may include a low - frequency antenna board 11, and a high - frequency radiation layer 12 and an antenna feeding layer 13 that are stacked on top of each other. A half - wave dipole 111 is etched on the low - frequency antenna board 11.

[0049] In an embodiment of the present application, a plurality of first parasitic patches 121 are spaced apart on the side of the high - frequency radiation layer 12 away from the antenna feeding layer 13. At the same time, a plurality of high - frequency radiation patches 122 are deployed at intervals inside the high - frequency radiation layer 12. Among them, the total number of patches of the high - frequency radiation patches 122 in the high - frequency radiation layer 12 is the same as the total number of patches of the first parasitic patches 121. Each of the first parasitic patches 121 corresponds to one of the high - frequency radiation patches 122 alone. The patch projection areas of each of the first parasitic patches 121 and the corresponding high - frequency radiation patch 122 on the antenna feeding layer 13 at least partially overlap, so as to ensure that each high - frequency radiation patch 122 can be signal - coupled with the first parasitic patch 121 with at least partial projection overlap when receiving or transmitting high - frequency signals, and receive or transmit high - frequency signals based on the corresponding first parasitic patch 121. In this embodiment, each of the first parasitic patches 121 is used to play a role in shrinking the beam width, increasing the antenna gain, and expanding the antenna bandwidth for the high - frequency radiation patch 122; the patch shape of the first parasitic patch 121 can be, but is not limited to, rectangular, strip - shaped, circular, etc.

[0050] In an implementation manner of this embodiment, the total number of patches of the first parasitic patches 121 included in the dual - frequency common - aperture antenna structure 10 is 4. The 4 first parasitic patches 121 are spaced apart from each other and are distributed in a cross shape on the side of the high - frequency radiation layer 12 away from the antenna feeding layer 13.

[0051] In an embodiment of the present application, a low - frequency feeding structure 131 and a plurality of high - frequency feeding structures 132 are deployed on the antenna feeding layer 13. An antenna board slot 15 is opened in the interval area between the plurality of first parasitic patches 121 of the high - frequency radiation layer 12. The antenna board slot 15 is used for plugging and unplugging the installation of the low - frequency antenna board 11, and the antenna board slot 15 exposes the low - frequency feeding structure 131 in the antenna feeding layer 13 (that is, the antenna board slot 15 partially exposes the antenna feeding layer 13). Each of the high - frequency feeding structures 132 corresponds to one of the high - frequency radiation patches 122 alone and is used to feed the corresponding high - frequency radiation patch 122; the low - frequency antenna board 11 can be inserted into the antenna board slot 15 and welded to the antenna feeding layer 13, and the low - frequency feeding structure 131 is used to feed the half - wave dipole 111 on the low - frequency antenna board 11.

[0052] At this time, the dual-band common-aperture antenna structure 10 provided by the present application can be regarded as obtained by the common aperture of a low-frequency antenna unit and multiple high-frequency antenna units. The low-frequency antenna unit is essentially a low-frequency end-fire structure composed of the low-frequency antenna board 11 and the low-frequency feeding structure 131. Each high-frequency antenna unit is a high-frequency side-fire structure using a multi-layer circuit board stacking design, which is composed of a first parasitic patch 121, a high-frequency radiation patch 122, and a high-frequency feeding structure 132. Among them, the implementation structures of the low-frequency antenna unit and the high-frequency antenna unit in the dual-band common-aperture antenna structure 10 are different from each other, so as to reduce the common-mode resonance interference between the high-frequency and low-frequency antenna units, effectively solve the problem of high-frequency and low-frequency crosstalk, and there is no need to additionally add filtering stubs or filters, thereby ensuring that the dual-band common-aperture antenna structure 10 has broadband characteristics, high radiation efficiency, and good cross-frequency isolation; at the same time, the antenna board slot 15 in the dual-band common-aperture antenna structure 10 can ensure the accurate alignment effect and efficient assembly and welding effect of the low-frequency antenna unit on the multi-layer circuit board where the high-frequency antenna unit is located, so as to effectively reduce the assembly difficulty of the dual-band common-aperture antenna structure 10, and effectively improve the assembly efficiency, product qualification rate, antenna integration, and product reliability of the dual-band common-aperture antenna structure 10, ensuring that the corresponding dual-band common-aperture antenna structure 10 is easy to be integrated into a reliable antenna array.

[0053] Among them, the upper limit value of the operating frequency band of the above-mentioned low-frequency antenna unit is lower than the lower limit value of the operating frequency band of each high-frequency antenna unit. In an implementation manner of this embodiment, the operating frequency band of the half-wave dipole 111 in the dual-band common-aperture antenna structure 10 is the Ku band (i.e., 14 GHz to 18 GHz), and the operating frequency band of each high-frequency radiation patch 122 in the dual-band common-aperture antenna structure 10 is the Ka band (i.e., 32 GHz to 36 GHz).

[0054] It can be understood that a plurality of alignment card slots located within the coverage range of the slot body of the antenna board slot 15 can be opened on the antenna feeding layer 13, and a plurality of card slot fixing feet can be installed on the side surface of the low-frequency antenna board 11 that is in direct contact with the antenna feeding layer 13, so that the low-frequency antenna board 11 can be stably assembled on the antenna feeding layer 13 by inserting the card slot fixing feet into the corresponding matching alignment card slots, thereby further improving the alignment accuracy and assembly and welding efficiency of the low-frequency antenna board 11 on the antenna feeding layer 13, where each alignment card slot corresponds to a card slot fixing foot separately. For example, Figure 2Two alignment slots are formed on the shown antenna feeding layer 13. Both of the two alignment slots are within the coverage range of the slot body of the antenna board slot 15 and are respectively located on two opposite sides of the antenna feeding layer 13. At this time, two slot fixing feet are also installed on the side of the low-frequency antenna board 11 that needs to be in direct contact with the antenna feeding layer 13. The distance between the two slot fixing feet is the same as the distance between the two alignment slots, so as to ensure that each slot fixing foot can be inserted into the corresponding matching alignment slot separately.

[0055] Optionally, please refer to Figure 3 , Figure 3 is Figure 2 the developed schematic diagram of the high-frequency radiation layer 12 and the antenna feeding layer 13 in Figure 3 (not shown). In the embodiment of the present application, the high-frequency radiation layer 12 may include a first dielectric layer 123 and a second dielectric layer 124 that are stacked on each other. The antenna feeding layer 13 may include a third dielectric layer 133 and a fourth dielectric layer 134 that are stacked on each other. Wherein the second dielectric layer 124 is between the first dielectric layer 123 and the third dielectric layer 133 included in the antenna feeding layer 13; the first dielectric layer 123, the second dielectric layer 124, the third dielectric layer 133, and the fourth dielectric layer 134 are all made of microwave dielectric substrate materials; an epoxy prepreg ( Figure 3 (not shown) may be provided between two adjacent dielectric layers among the first dielectric layer 123, the second dielectric layer 124, the third dielectric layer 133, and the fourth dielectric layer 134, so as to use the corresponding epoxy prepreg as the bonding material of the inner conductive pattern of the multi-layer circuit board and the interlayer insulation layer of the multi-layer circuit board.

[0056] In this embodiment, a plurality of the first parasitic patches 121 are arranged at intervals on the side of the first dielectric layer 123 away from the second dielectric layer 124, and a plurality of the high-frequency radiation patches 122 are arranged at intervals on the side of the second dielectric layer 124 close to the first dielectric layer 123. Wherein the patch projection area of each first parasitic patch 121 on the second dielectric layer 124 at least partially overlaps with the corresponding high-frequency radiation patch 122.

[0057] In the embodiment of the present application, the feeding methods of the low-frequency feeding structure 131 and the high-frequency feeding structure 132 are different from each other, so as to reduce the common-mode interference of the low-frequency antenna unit and the plurality of high-frequency antenna units during feeding respectively, and avoid the resonance phenomenon of the low-frequency antenna unit and the plurality of high-frequency antenna units. Among them, the feeding method of the low-frequency feeding structure 131 may be a coaxial cable feeding method, and the feeding method of the high-frequency feeding structure 132 may be a microstrip line feeding method.

[0058] Optionally, in this embodiment, each of the high-frequency feeding structures 132 may include a feeding strip line 141 and a first connector 142 for connecting a signal transceiver device.

[0059] Wherein, a radiation floor 135 is provided on a side of the third dielectric layer 133 away from the fourth dielectric layer 134. The third dielectric layer 133 and the second dielectric layer 124 are laminated with the radiation floor 135 interposed therebetween, and the radiation floor 135 is made of a metal material. The third dielectric layer 133 is provided with a plurality of first connection through holes 137, and each of the first connection through holes 137 penetrates through the radiation floor 135 and the third dielectric layer 133 simultaneously. Each first connection through hole 137 corresponds to a high-frequency feeding structure 132 individually.

[0060] A plurality of feeding strip lines 141 are provided on a side of the fourth dielectric layer 134 close to the third dielectric layer 133. A metal floor 136 is provided on a side of the fourth dielectric layer 134 away from the third dielectric layer 133, and the metal floor 136 is made of a metal material; a plurality of first connectors 142 are installed on a side of the metal floor 136 away from the fourth dielectric layer 134. One end of each of the feeding strip lines 141 is electrically connected to a high-frequency radiation patch 122 through a feeding wire via one of the first connection through holes 137, and the other end of each of the feeding strip lines 141 is electrically connected to one of the first connectors 142, so as to realize the strip-line feeding function of the corresponding high-frequency feeding structure 132. Wherein, each of the feeding strip lines 141 feeds the corresponding high-frequency radiation patch 122 through the radiation floor 135 by means of electrical signal coupling. The electrical signal coupling method may be, but is not limited to, a slot coupling method, a probe coupling method, etc.

[0061] Optionally, in this embodiment, each of the low-frequency feeding structures 131 may include a second connector 143 for connecting a signal transceiver device.

[0062] Wherein, a second connection through hole 138 is provided in a partial area of the third dielectric layer 133 exposed by the antenna board slot 15, and the second connection through hole 138 penetrates through the third dielectric layer 133 and the radiation floor 135 simultaneously; when the low-frequency antenna board 11 is welded to the antenna feeding layer 13, the half-wave dipole 111 on the low-frequency antenna board 11 is directly welded to the partial area of the radiation floor 135 exposed by the antenna board slot 15.

[0063] The fourth dielectric layer 134 is provided with a third connection via hole 139 whose projection position overlaps with the second connection via hole 138, wherein the third connection via hole 139 penetrates through both the fourth dielectric layer 134 and the metal floor 136. The second connector 143 is installed on the side of the metal floor 136 away from the fourth dielectric layer 134, and is electrically connected to the half-wave dipole 111 through a feeder line via the third connection via hole 139 and the second connection via hole 138, so as to realize the coaxial feeding function of the low-frequency feeding structure 131.

[0064] Thus, in the present application, by configuring the feeding mode of the low-frequency feeding structure 131 as a coaxial feeding mode and configuring the feeding mode of each high-frequency feeding structure 132 as a stripline feeding mode, the high-frequency and low-frequency feeding functions are ingeniously realized by making use of the limited space, and at the same time, the common-mode interference during feeding of the low-frequency antenna unit and the multiple high-frequency antenna units is effectively reduced synchronously, and the resonance phenomenon of the low-frequency antenna unit and the multiple high-frequency antenna units is avoided. At the same time, in the present application, by sharing the same radiation floor 135 for the low-frequency antenna unit and the multiple high-frequency antenna units, the number of stacked layers of the antenna feeding layer 13 is reduced to a certain extent, which has positive effects on both the antenna processing cost and the antenna processing difficulty, so as to ensure that the corresponding antenna structure is easier to be processed and formed, and the profile height of the corresponding antenna structure is reduced.

[0065] Optionally, in the embodiment of the present application, the antenna feeding layer 13 is respectively provided with a plurality of signal shielding holes ( Figure 1 、 Figure 2 and Figure 3 all not shown) around the low-frequency feeding structure 131 and the multiple high-frequency feeding structures 132, so that the low-frequency feeding structure 131 and the multiple high-frequency feeding structures 132 can avoid signal mutual coupling phenomena (for example, the low-frequency signal processed by the low-frequency antenna unit is coupled to the high-frequency antenna unit, or the high-frequency signal processed by the high-frequency antenna unit is coupled to the low-frequency antenna unit) through the numerous signal shielding holes provided on the antenna feeding layer 13, improve the cross-frequency isolation degree between the high-frequency and low-frequency antenna units, and at the same time effectively suppress the formation of surface waves on the dielectric and reduce the dielectric loss.

[0066] In an implementation manner of this embodiment, each signal shielding hole penetrates through the radiation floor 135, the third dielectric layer 133, the fourth dielectric layer 134 and the metal floor 136 at the same time, and the hole wall of each signal shielding hole is covered with a metal material, so that each signal shielding hole can form an antenna shielding hole with a grounding function through the covered metal material, and improve the communication stability performance of the low-frequency antenna unit and the high-frequency antenna unit respectively.

[0067] Optionally, please refer toFigure 4 , Figure 4 is Figure 2 one of the schematic structural diagrams of the low-frequency antenna board 11 in Figure 4 The low-frequency antenna board 11 shown in

[0068] may include an antenna board body 112 and a feeding connector 113, wherein the antenna board body 112 is a double-sided circuit board.

[0069] Optionally, please refer to Figure 5 , Figure 5 is Figure 2 one of the schematic structural diagrams of the low-frequency antenna board 11 in Figure 4 Compared with the low-frequency antenna board 11 shown in Figure 5 the low-frequency antenna board 11 shown in

[0070] may further include a plurality of second parasitic patches 115.

[0071] Optionally, Figure 5The shown low-frequency antenna board 11 may further include a plurality of third parasitic patches 116. The plurality of third parasitic patches 116 are arranged at intervals on the side surface of the antenna board body 112 where the feeding connector 113 is provided. The patch projection area of each third parasitic patch 116 on the antenna board body 112 coincides with one of the second parasitic patches 115, so as to ensure that the paired third parasitic patches 116 and second parasitic patches 115 can cooperate with each other to provide the function of shrinking the beam width, increasing the antenna gain, and expanding the antenna bandwidth for the half-wave dipole 111.

[0072] Optionally, please refer to Figure 6 , Figure 6 which is Figure 2 the third schematic diagram of the structure of the low-frequency antenna board 11 in Figure 4 . Compared with the low-frequency antenna board 11 shown in Figure 6 , the shown low-frequency antenna board 11 may further include two antenna isolators 117.

[0073] Both of the two antenna isolators 117 are arranged on the side surface of the antenna board body 112 where the half-wave dipole 111 is etched, and are connected to the half-wave dipole 111. Among them, when the low-frequency antenna board 11 is welded to the antenna feeding layer 13, both of the two antenna isolators 117 are welded to the radiation floor 135 included in the antenna feeding layer 13, so as to improve the co-frequency isolation degree of the half-wave dipole 111 and each of the plurality of high-frequency radiation patches 122 through the two antenna isolators 117, thereby effectively reducing the signal coupling between the co-frequency antenna units in the antenna array. Among them, a single antenna isolator 117 can be obtained by connecting a low-frequency isolator and a high-frequency isolator. The low-frequency isolator is used to improve the signal isolation degree between the low-frequency antenna unit where the corresponding half-wave dipole 111 is connected and other low-frequency antenna units in the antenna array, and the high-frequency isolator is used to improve the signal isolation degree between the high-frequency antenna unit connected corresponding to the radiation floor 135 and other high-frequency antenna units in the antenna array, where the aforementioned antenna array is formed by arranging a plurality of dual-frequency common-aperture antenna structures 10 in an array.

[0074] Optionally, please refer to Figure 7 , Figure 7 which is Figure 2 the fourth schematic diagram of the structure of the low-frequency antenna board 11 in Figure 5 . Compared with the low-frequency antenna board 11 shown in Figure 7 , the shown low-frequency antenna board 11 may further include two antenna isolators 117.

[0075] Both of the two antenna isolators 117 are disposed on the side surface of the antenna board body 112 where the half-wave dipole 111 is etched, and are connected to the half-wave dipole 111. Among them, when the low-frequency antenna board 11 is welded to the antenna feed layer 13, both of the two antenna isolators 117 are welded to the radiation floor 135 included in the antenna feed layer 13, so as to improve the co-frequency isolation degree of the half-wave dipole 111 and each of the multiple high-frequency radiation patches 122 through the two antenna isolators 117, thereby effectively reducing the signal coupling between the co-frequency antenna units in the antenna array. Among them, a single antenna isolator 117 can be obtained by connecting a low-frequency isolator and a high-frequency isolator. The low-frequency isolator is used to improve the signal isolation degree between the low-frequency antenna unit where the corresponding half-wave dipole 111 is connected and other low-frequency antenna units in the antenna array, and the high-frequency isolator is used to improve the signal isolation degree between the high-frequency antenna unit connected correspondingly through the radiation floor 135 and other high-frequency antenna units in the antenna array. The foregoing antenna array is formed by array arrangement of multiple dual-frequency common-aperture antenna structures 10.

[0076] Optionally, please refer to Figure 8 , Figure 8 which is an assembly schematic diagram of the antenna array 20 provided by an embodiment of the present application. In the embodiment of the present application, the antenna array 20 may include multiple dual-frequency common-aperture antenna structures 10 of any one of the above. The multiple dual-frequency common-aperture antenna structures 10 included in the antenna array 20 are arrayed with respect to each other. The extending directions of the oscillator arms of the half-wave dipoles 111 included in the multiple dual-frequency common-aperture antenna structures 10 are parallel to each other, so as to ensure that the antenna array 20 can achieve the high / low-frequency signal transceiver processing function with high co-frequency isolation degree and high frequency band width while meeting the requirements of high assembly efficiency, high product qualification rate, high antenna integration degree, and high product reliability.

[0077] It can be understood that among the multiple low-frequency antenna boards 11 where the corresponding board body extension directions included in the antenna array 20 are on the same straight line, any one low-frequency antenna board 11 is rotated 180° in the vertical direction to obtain another low-frequency antenna board 11 adjacent to the low-frequency antenna board 11, so as to ensure that the radiation pattern of the antenna array 20 can achieve the left-right symmetry effect, and at the same time, the gain fluctuation of the symmetry point in the corresponding radiation pattern is less than 0.5 dB, so as to effectively improve the microwave communication stability performance of the antenna array 20.

[0078] In summary, in a dual-band common-aperture antenna structure and antenna array provided in an embodiment of the present application, the present application stacks a high-frequency radiation layer and an antenna feeding layer, and a plurality of first parasitic patches are spaced on a side of the high-frequency radiation layer away from the antenna feeding layer, and a plurality of high-frequency radiation patches are deployed at intervals inside the high-frequency radiation layer, so that the patch projection areas of each first parasitic patch and a high-frequency radiation patch on the antenna feeding layer at least partially overlap, and a low-frequency feeding structure and a plurality of high-frequency feeding structures are deployed on the antenna feeding layer. Each high-frequency feeding structure feeds a corresponding high-frequency radiation patch separately. An antenna board slot for partially exposing the antenna feeding layer is opened at an interval area between the plurality of first parasitic patches of the high-frequency radiation layer, so that a low-frequency antenna board can be inserted into the antenna board slot and welded to the antenna feeding layer, and the low-frequency feeding structure feeds a half-wave dipole etched on the low-frequency antenna board, so that the problem of high-low frequency crosstalk can be effectively solved through the combination of a high-frequency side-radiation structure and a low-frequency end-fire structure without additionally adding filtering stubs or filters, ensuring that the corresponding common-aperture antenna structure has broadband characteristics and high radiation efficiency. At the same time, by slotting for the low-frequency end-fire structure on the high-frequency side-radiation structure using a multi-layer circuit board stacking design, the low-frequency end-fire structure can achieve accurate alignment and efficient assembly and welding effects based on the slot positions on the high-frequency side-radiation structure, so as to further improve the assembly efficiency, product qualification rate, antenna integration and product reliability of the common-aperture antenna structure, and ensure that the corresponding common-aperture antenna structure is easy to be integrated into a reliable antenna array.

[0079] As described above, the above are only various embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A dual-frequency common-aperture antenna structure, characterized in that: The antenna structure comprises a low-frequency antenna board, and a high-frequency radiation layer and an antenna feeding layer stacked on each other, wherein a half-wave dipole is etched on the low-frequency antenna board; A plurality of first parasitic patches are arranged at intervals on the side of the high-frequency radiation layer away from the antenna feeding layer, and a plurality of high-frequency radiation patches are arranged at intervals inside the high-frequency radiation layer, wherein each of the first parasitic patches corresponds to a single high-frequency radiation patch, and each of the first parasitic patches at least partially overlaps with a patch projection area of ​​the corresponding high-frequency radiation patch on the antenna feeding layer; The antenna feeding layer is deployed with a low-frequency feeding structure and multiple high-frequency feeding structures. The high-frequency radiation layer is provided with an antenna board slot that partially exposes the antenna feeding layer at the interval area between the multiple first parasitic patches. The low-frequency antenna board is inserted into the antenna board slot and welded to the antenna feeding layer, wherein each of the high-frequency feeding structures corresponds to a high-frequency radiation patch separately, the high-frequency feeding structure is used to feed the corresponding high-frequency radiation patch, and the low-frequency feeding structure is used to feed the half-wave dipole.

2. The antenna structure according to claim 1, characterized in that: The high-frequency radiation layer includes a first dielectric layer and a second dielectric layer stacked on each other, wherein the second dielectric layer is located between the first dielectric layer and the antenna feeding layer; A plurality of the first parasitic patches are arranged at intervals from each other on a side of the first dielectric layer away from the second dielectric layer; The plurality of high-frequency radiation patches are arranged at intervals on the side of the second dielectric layer close to the first dielectric layer, wherein the patch projection area of ​​each first parasitic patch on the second dielectric layer at least partially overlaps with the corresponding high-frequency radiation patch.

3. The antenna structure according to claim 1, characterized in that: Each of the high-frequency feeding structures comprises a feeding stripline and a first connector for connecting a signal transceiver, and the antenna feeding layer comprises a third dielectric layer and a fourth dielectric layer stacked on top of each other, wherein the third dielectric layer is between the high-frequency radiation layer and the fourth dielectric layer; A radiation floor is arranged on the side of the third dielectric layer away from the fourth dielectric layer, and a plurality of first connecting through holes are opened in the third dielectric layer, wherein each of the first connecting through holes passes through the radiation floor and the third dielectric layer; A plurality of feeding strip lines are arranged on the side of the fourth dielectric layer close to the third dielectric layer, a metal floor is arranged on the side of the fourth dielectric layer away from the third dielectric layer, and a plurality of first connectors are installed on the side of the metal floor away from the fourth dielectric layer, wherein one end of each of the feeding strip lines is electrically connected to one of the high-frequency radiation patches through a feeding line via one of the first connecting through holes, and the other end of each of the feeding strip lines is electrically connected to one of the first connectors.

4. The antenna structure according to claim 3, characterized in that: The low-frequency feeding structure includes a second connector for connecting to a signal transceiver; The third dielectric layer is provided with a second connecting through hole in a local area exposed by the antenna board slot, wherein the second connecting through hole penetrates the third dielectric layer and the radiation floor at the same time, and the half-wave dipole is welded to the radiation floor; The fourth dielectric layer is provided with a third connecting through hole, the projection position of which overlaps with the second connecting through hole, wherein the third connecting through hole penetrates the fourth dielectric layer and the metal floor at the same time; The second connector is installed on the side of the metal floor away from the fourth dielectric layer, and is electrically connected to the half-wave dipole through the third connecting through hole and the second connecting through hole via a feed line.

5. The antenna structure according to claim 1, characterized in that: The low-frequency antenna board includes an antenna board body and a feeding connector; The half-wave dipole is etched on one side surface of the antenna board, and the feeding connector is arranged on the other side surface of the antenna board, wherein the antenna board is provided with a metal via hole, the metal via hole connects the feeding connector and the half-wave dipole, the feeding connector is electrically connected to the low-frequency feeding structure, and the half-wave dipole is welded to the radiation floor included in the antenna feeding layer.

6. The antenna structure according to claim 5, characterized in that: The low-frequency antenna board also includes a plurality of second parasitic patches; A plurality of the second parasitic patches are arranged at intervals on the side of the antenna plate body etched with the half-wave dipole, wherein an extension direction of each of the second parasitic patches is parallel to an extension direction of a dipole arm of the half-wave dipole.

7. The antenna structure according to claim 6, characterized in that: The low frequency antenna board also includes a plurality of third parasitic patches; A plurality of the third parasitic patches are arranged at intervals on the side of the antenna board body where the feeding connector is arranged, wherein a patch projection area of ​​each of the third parasitic patches on the antenna board body overlaps with a second parasitic patch.

8. The antenna structure according to any one of claims 5 to 7, characterized in that: The low frequency antenna board also includes two antenna isolators; The two antenna isolators are both arranged on the side of the antenna board body on which the half-wave dipole is etched, and are interconnected with the half-wave dipole, wherein the two antenna isolators are both welded to the radiation floor included in the antenna feed layer, so as to improve the same-frequency isolation of the half-wave dipole and the multiple high-frequency radiation patches.

9. The antenna structure according to any one of claims 1 to 7, characterized in that: The antenna feeding layer is respectively provided with a plurality of signal shielding holes surrounding the low-frequency feeding structure and the plurality of high-frequency feeding structures.

10. An antenna array, characterized in that: The antenna array comprises a plurality of dual-frequency co-aperture antenna structures as described in any one of claims 1 to 9 distributed in an array, wherein the extension directions of the dipole arms of the half-wave dipoles included in each of the plurality of dual-frequency co-aperture antenna structures are parallel to each other.

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