Heat dissipation structure and endoscope equipment

Abstract

The utility model provides a heat dissipation structure and endoscope equipment, and belongs to the technical field of heat dissipation of electronic components. The heat dissipation structure comprises a main board, a middle frame and a display module, the main board and the display module are installed on the two sides of the middle frame respectively, the middle frame is provided with an assembling through hole, the side, close to the middle frame, of the main board is connected with a heat conduction piece, and the heat conduction piece penetrates through the assembling through hole and makes contact with the display module so as to transfer heat to the display module. And the heat is conducted to the external environment where the display module is located through the display module. According to the endoscope equipment, the heat conduction piece is arranged to make contact with the display module, heat generated in the operation process of the mainboard can be conducted to the display module, heat dissipation is conducted through the display module, and the heat dissipation efficiency of the endoscope equipment is improved. Moreover, the requirement for the heat dissipation performance of the middle frame is reduced, the middle frame can be made of materials which are poor in heat dissipation effect and lower in weight and cost, and the cost and the weight of the whole device are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of electronic components, and in particular relates to a heat dissipation structure and endoscope equipment. Background Art

[0002] An all-in-one endoscope is a medical device that integrates an endoscope and an imaging system for endoscopic examination, diagnosis, and treatment. An all-in-one endoscope generates a certain amount of heat during endoscopic examination, so heat dissipation is required to ensure normal operation of the device and avoid overheating.

[0003] In the related art, all-in-one endoscopes generally use a cooling fan for heat dissipation, but in actual use, it is found that the heat dissipation efficiency is poor; since the heat dissipation efficiency is strongly related to the function of the device, the lower the heat dissipation efficiency, the higher the internal temperature of the all-in-one device, the lower the device performance. Utility Model Content

[0004] The purpose of this application is to provide a heat dissipation structure and endoscope equipment to solve the above-mentioned technical problems existing in the prior art.

[0005] This application is implemented as follows:

[0006] In the first aspect, an embodiment of the present application provides a heat dissipation structure, including a main board, a middle frame and a display module, wherein the main board and the display module are respectively installed on both sides of the middle frame, wherein: the middle frame is provided with an assembly through hole, and a heat conductor is connected to the side of the main board close to the middle frame, the heat conductor passes through the assembly through hole and contacts with the display module to transfer heat to the display module, and conducts the heat to the external environment where the display module is located through the display module.

[0007] Furthermore, there is an installation gap between the heat conducting member and the hole wall of the assembly through hole.

[0008] Furthermore, the heat conducting member is in contact with and fits with the hole wall of the assembly through hole.

[0009] Furthermore, the heat dissipation structure includes at least two heat conducting members, and the at least two heat conducting members are arranged along the length direction of the mainboard.

[0010] Furthermore, the heat conducting member is located in the middle of the display module.

[0011] Furthermore, the heat dissipation structure also includes a heat dissipation fan, which is located on a side of the mainboard away from the middle frame.

[0012] Furthermore, there are two heat-conducting parts. In the length direction of the mainboard, the air outlet of the heat dissipation fan is located between the two heat-conducting parts, and the air outlet faces one of the heat-conducting parts, wherein the volume of the heat-conducting part facing the air outlet is smaller than the volume of the other heat-conducting part.

[0013] Further, in the width direction of the main board, the air outlet of the heat dissipation fan is close to the first long side of the main board. The first long side is arranged adjacent to the battery installation position of the middle frame, and the heat conduction member is located in the middle of the main board.

[0014] Further, the heat dissipation structure further includes a rear cover. The rear cover is located on the side of the main board away from the middle frame. The heat dissipation fan is located between the rear cover and the main board, and the rear cover has a plurality of heat dissipation holes.

[0015] In a second aspect, an embodiment of the present application provides an endoscope device, including the heat dissipation structure provided by the first aspect embodiment.

[0016] The technical solution provided by the present application can achieve the following beneficial effects:

[0017] In the present application, by arranging the heat conduction member to be in contact with the display module, the heat generated by the main board during operation can be conducted to the display module, and the display module is used for heat dissipation, improving the heat dissipation efficiency of the endoscope device and avoiding the internal temperature of the device being too high and affecting the normal operation of each component. Moreover, the heat conduction member directly contacts the display module for heat dissipation, and has relatively low requirements for the heat dissipation performance of the middle frame. Therefore, the middle frame can select materials with relatively poor heat dissipation effects but lower weight and cost. While ensuring the heat dissipation effect, the overall cost and weight of the device can also be reduced. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments of the present invention or the description of the prior art. Obviously, the following described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 is the overall structure schematic diagram of the heat dissipation structure provided by some embodiments of the present application Figure 1 ;

[0020] Figure 2 is the internal structure schematic diagram of the heat dissipation structure provided by some embodiments of the present application;

[0021] Figure 3 is the disassembly schematic diagram of the heat dissipation structure provided by some embodiments of the present application;

[0022] Figure 4 is the disassembly schematic diagram of the main board and the middle frame provided by some embodiments of the present application;

[0023] Figure 5 is the cooperation schematic diagram of the main board and the middle frame provided by some embodiments of the present application;

[0024] Figure 6Schematic diagram of the overall structure of the heat dissipation structure provided by some embodiments of the present application Figure 2 。

[0025] In the figure: 100 - main board, 110 - first long side, 200 - middle frame, 210 - assembly through hole, 220 - battery installation position, 300 - display module, 400 - heat conducting member, 500 - heat dissipation fan, 510 - air outlet, 600 - rear cover, 610 - heat dissipation hole. Detailed implementation manners

[0026] The following description provides many different embodiments or examples for implementing different features of the present utility model. The components and arrangements described in the following specific examples are only used to concisely express the present utility model, and are only examples, not intended to limit the present utility model.

[0027] Embodiments of the present application provide a heat dissipation structure. Refer to Figures 1 to 6 As shown, this heat dissipation structure uses the heat conducting member 400 to cooperate with the display module 300 for heat dissipation to improve the heat dissipation efficiency of the endoscope device.

[0028] Refer to Figure 3 As described, the heat dissipation structure provided by the embodiments of the present application includes a main board 100, a middle frame 200, and a display module 300 that are sequentially and overlappingly arranged. The main board 100 and the display module 300 are respectively installed on both sides of the middle frame 200. The middle frame 200 serves as an installation structure, and there are installation spaces on both sides thereof. One of the installation spaces is used to install the main board 100, and the other installation space is used to install the display module 300. The display module 300 is used to display the image information obtained by the endoscope connected to the device. In some embodiments, the display module 300 includes two parts, a touch screen and a display panel. The touch screen is located on the outer layer, and the display panel is located on the inner layer.

[0029] The middle frame 200 is provided with an assembly through hole 210, and the assembly through hole 210 communicates with the installation spaces on both sides of the middle frame 200. Refer to Figure 3 As shown. The main board 100 is connected with a heat conducting member 400. The heat conducting member 400 is used to conduct heat and transfer the heat generated by the main board 100 to other components. The heat conducting member 400 is located on the side of the main board 100 close to the middle frame 200, and the heat conducting member 400 passes through the assembly through hole 210 and contacts the display module 300 located on the other side of the middle frame 200. Refer to Figure 2 As shown. After the heat conducting member 400 contacts the display module 300, the heat conducting member 400 can conduct the heat generated by the main board 100 to the display module 300, and then the heat is conducted to the external environment where the display module 300 is located through the display module 300 to dissipate heat from the main board 100.

[0030] In the prior art, a cooling fan 500 is generally installed in the integrated endoscope for heat dissipation. However, the heat dissipation effect of the cooling fan 500 has certain limitations and cannot timely dissipate the heat generated inside the integrated machine. In the embodiments of the present application, through the cooperation of the heat conducting member 400 and the display module 300, without affecting the normal use of the cooling fan 500, an additional heat dissipation method is added, improving the overall heat dissipation efficiency of the integrated machine, reducing the heat accumulation inside the integrated machine, thereby lowering the temperature of each component inside the integrated machine, ensuring that each component can operate normally, and avoiding the situation where the temperature rise inside the integrated machine due to excessive heat accumulation affects the normal operation of each component.

[0031] In the embodiments of the present application, the direct contact between the heat conducting member 400 and the display module 300 for heat dissipation is used as an auxiliary heat dissipation means, and the cooling fan 500 is mainly relied on for heat dissipation inside the device. When the heat conducting member 400 directly contacts the display module 300 for heat dissipation, other additional auxiliary heat dissipation methods can be not selected, such as the method of using the middle frame 200 for auxiliary heat dissipation. If it is necessary to use the middle frame 200 for auxiliary heat dissipation, a relatively high requirement is imposed on the heat dissipation performance of the middle frame 200, and the middle frame 200 needs to be made of a material with better heat conduction effect, such as a metal material. Since there is no need for the middle frame 200 to be used for auxiliary heat dissipation, when manufacturing the middle frame 200, a relatively low requirement is imposed on the heat dissipation performance of the middle frame 200. Therefore, some materials with relatively poor heat conduction effect but low cost can be selected, such as plastic materials. Plastic can not only reduce the cost of the middle frame 200, but also has a low weight, which is beneficial to reducing the overall cost and weight of the device. At the same time, it will not affect the heat dissipation effect of the device.

[0032] In some embodiments of the present application, as shown in Figure 2 After the heat conducting member 400 passes through the assembly through hole 210, there is an installation gap between the heat conducting member 400 and the hole wall of the assembly through hole 210. The size of the assembly through hole 210 is larger than the size of the heat conducting member 400. In this way, an installation gap can be formed between the hole wall of the assembly through hole 210 and the heat conducting member 400. Since the size of the assembly through hole 210 is larger, during the assembly process of the main board 100 and the middle frame 200, the heat conducting member 400 is more likely to pass through the assembly through hole 210, and the possibility of friction between the heat conducting member 400 and the hole wall of the assembly through hole 210 is reduced, reducing or avoiding the resistance suffered during the process of assembling the main board 100 to the middle frame 200, and improving the assembly efficiency of the main board 100 and the middle frame 200.

[0033] In some other embodiments of the present application, after the heat conducting member 400 passes through the assembly through hole 210, the heat conducting member 400 is in contact fit with the hole wall of the assembly through hole 210. The heat conducting member 400 not only contacts the display module 300, but also can contact the middle frame 200. In this way, during the process of the heat conducting member 400 conducting the heat generated by the main board 100, it can not only transfer heat to the display module 300, but also transfer heat to the middle frame 200, and use the middle frame 200 for heat dissipation, thereby further improving the heat dissipation efficiency and the heat dissipation effect on the device.

[0034] Refer to Figure 2 and Figure 3 As shown, in some embodiments of the present application, the heat dissipation structure includes at least two heat conducting members 400, and the at least two heat conducting members 400 are arranged along the length direction of the main board 100. The main board 100 has a relatively long dimension in its length direction. The heat conducting members 400 are arranged along the length direction of the main board 100, which can balance the heat dissipation amount of the main board 100 in the length direction and avoid the phenomenon that the heat conducting members 400 are too concentrated, resulting in excessive heat concentration in a certain area of the main board 100. The dimension of the main board 100 in the width direction is relatively small. Therefore, even if only one heat conducting member 400 is provided in the width direction of the main board 100, it is not easy for the heat conducting member 400 to have excessive heat concentration.

[0035] In addition, since the heat conducting member 400 conducts heat by contacting the display module 300, and finally the display module 300 performs the final heat dissipation. In some preferred embodiments of the present application, the heat conducting member 400 is directly located in the middle of the display module 300. It can be understood that the middle of the display module 300 refers to some areas around the central position of the display module 300. When the heat conducting member 400 is located in the middle of the display module 300, in the length direction or the width direction of the display module 300, the heat conducting member 400 is located at the midpoint position. So that the heat transferred from the heat conducting member 400 to the camera module can be evenly dispersed to the display module 300 as much as possible, making full use of the display module 300 for heat dissipation and improving the heat dissipation efficiency.

[0036] It should be noted that in the case where there are multiple heat conducting members 400, it means that the central positions of the multiple heat conducting members 400 overlap with the central position of the display module 300, so that the heat transferred from the heat conducting members 400 to the display module 300 can be evenly distributed on the display module 300 as much as possible.

[0037] The heat conductor 400 is installed on the mainboard 100. The heat conductor 400 can be directly installed on the electronic components on the mainboard 100, or it can be installed around the electronic components. In this application, there is no restriction on the specific installation position of the heat conductor 400. The number of heat conductors 400 should not be too many. If the number of heat conductors 400 is too large, although the heat dissipation effect of the mainboard 100 is better, since the heat dissipation fan 500 can already dissipate most of the heat, the heat conductor 400 will have excess performance. Too many heat conductors 400 will also increase the overall manufacturing process steps of the endoscope equipment, increase costs, and cause too many assembly through holes 210 to appear in the middle frame 200, affecting the overall structural strength of the middle frame 200.

[0038] In some embodiments of the present application, the heat conducting member 400 can directly select thermal conductive silicone grease as the raw material. Thermal conductive silicone grease has a good heat conduction effect, excellent high temperature resistance, good filling properties, and is easy to apply. In addition to thermal conductive silicone grease, thermal conductive glue, thermal conductive pads, thermal conductive wax and other materials can also be selected.

[0039] In some embodiments of the present application, the heat dissipation structure includes a heat dissipation fan 500 located on a side of the mainboard 100 away from the middle frame 200, Figure 4 and Figure 5 As shown. During the operation of the mainboard 100, heat will be generated on both sides thereof. The heat dissipation fan 500 and the heat conductive member 400 are respectively located on both sides of the mainboard 100, and conduct the heat on both sides of the mainboard 100 respectively, so as to avoid excessive temperature difference on both sides of the mainboard 100, resulting in low performance of the electronic components on the mainboard 100. In addition, the heat conductive member 400 directly passes through the middle frame 200 to contact the display module 300, and the gap between the middle frame 200 and the mainboard 100 can be further reduced, so that the structure of the endoscope device can be more compact. The heat dissipation fan 500 is located on the side of the mainboard 100 away from the middle frame 200, which can not only cooperate with the heat conductive member 400 to control the temperature on both sides of the mainboard 100, but also the space on this side is larger, which is more conducive to the installation of the heat dissipation fan 500.

[0040] The heat dissipation fan 500 has an air outlet 510, and the heat dissipation efficiency of the part of the main board 100 that is arranged in the air outlet direction facing the air outlet 510 is higher than that of the part of the main board 100 that is arranged away from the air outlet direction of the air outlet 510. There is a difference in the heat dissipation efficiency of the main board 100 on both sides of the air outlet 510. In some embodiments of the present application, in order to balance the overall heat dissipation efficiency of the main board 100, two heat conductive members 400 are connected to the main board 100, and the volumes of the two heat conductive members 400 are different. The larger the volume of the heat conductive member 400, the better the heat conduction effect. The two heat conductive members 400 and the heat dissipation fan 500 are arranged along the length direction of the main board 100, and the air outlet 510 of the heat dissipation fan 500 is arranged toward one of the heat conductive members 400, and the volume of the heat conductive member 400 toward which the air outlet 510 is directed is smaller than the volume of the other heat conductive member 400, refer to Figure 4 shown. Figure 4 Although the heat conducting member 400 cannot be observed, the positional relationship between the assembly through hole 210 and the heat dissipation fan 500 can be observed, and the assembly relationship between the heat conducting member 400 and the heat dissipation fan 500 can be obtained through the assembly through hole 210.

[0041] The two heat conducting members 400 and the air outlet 510 are arranged along the length direction of the mainboard 100. The three can be in a straight line at the same time or in different straight lines. The three being in different positions along the length direction of the mainboard 100 means that the three are arranged along the length direction of the mainboard 100.

[0042] For the convenience of description, the main board 100 is divided into two parts distributed along its length direction with the air outlet 510 as the boundary, and the two heat conductors 400 are respectively located on the two parts of the main board 100. The air outlet 510 is arranged toward the heat conductor 400 with a smaller volume on one side, that is, the air outlet 510 is arranged toward the part of the main board 100 corresponding to the heat conductor 400 with a smaller volume. The heat conductor 400 with a smaller volume can be arranged within the air outlet range of the air outlet 510, or can be located outside the air outlet range. The embodiments of the present application do not limit the specific position of the heat conductor 400.

[0043] In such a layout, the smaller heat-conducting member 400 and the air outlet 510 are co-located on one part of the mainboard 100, while the larger heat-conducting member 400 is located on another part of the mainboard 100. The difference in heat dissipation effect caused by the air outlet direction of the air outlet 510 is balanced by the heat-conducting members 400 of different volumes. The part of the mainboard 100 with better heat dissipation effect corresponds to the smaller heat-conducting member 400, while the part of the mainboard 100 with poor heat dissipation effect corresponds to the larger heat-conducting member 400, thereby balancing the difference in heat dissipation efficiency of the mainboard 100 located on both sides of the air outlet 510.

[0044] It should be explained that the side of the motherboard 100 close to the middle frame 200 and the side of the motherboard 100 away from the middle frame 200 can exchange heat with each other, and the two sides will not be heat-isolated from each other. Therefore, even if the heat-conducting member 400 and the heat-dissipating fan 500 are located on two different planes of the motherboard 100, heat exchange can still be performed. In addition, the heat-dissipating fan 500 is generally fixed on the middle frame 200 through the motherboard 100.

[0045] The direction of the air outlet 510 of the cooling fan 500 can be determined according to the distribution number of electronic components on the mainboard 100. Since the cooling fan 500 has a good heat dissipation effect, the air outlet 510 is generally set corresponding to the side with more electronic components on the mainboard 100 to avoid heat accumulation caused by too many electronic components.

[0046] The middle frame 200 also has a battery installation position 220 for installing a battery. The motherboard 100 and the battery are located on the same side of the middle frame 200, and the air outlet 510 of the heat dissipation fan 500 is arranged near the first long side 110 of the motherboard 100. The first long side 110 of the motherboard 100 refers to one of the long sides of the motherboard 100, and the first long side 110 is also arranged near the battery installation position 220, refer to Figure 5 As shown. The air outlet 510 is close to the battery, and the heat generated during the operation of the battery can be dissipated by the heat dissipation fan 500. The closer the air outlet 510 is to the battery mounting position 220, the better the heat dissipation effect can be achieved. The air outlet 510 is arranged near the battery mounting position 220, which can effectively prevent the battery from accumulating too much heat during operation, ensure the stability of the battery operating temperature, and ensure that the battery can be used normally.

[0047] Since the air outlet 510 is adjacent to the first long side 110 of the mainboard 100, the heat dissipation effect of the heat dissipation fan 500 on the mainboard 100 in the area around the first long side 110 is better, and the heat dissipation effect of the mainboard 100 around the other long side of the mainboard 100 is poor. In order to balance the overall heat dissipation efficiency of the mainboard 100, the heat conductive member 400 is arranged in the middle of the mainboard 100, so as to expand the range in which the heat conductive member 400 and the heat dissipation fan 500 can dissipate heat, and balance the overall heat dissipation effect of the mainboard 100. The middle of the mainboard 100 refers to the middle part in the width direction and the length direction of the mainboard 100. In addition, the heat conductive member 400 is distributed in the middle of the mainboard 100, so as to increase the heat dissipation range of the heat conductive member 400 and make full use of the heat conductive member 400.

[0048] In some embodiments of the present application, reference Figure 6As shown in the figure, the heat dissipation structure further includes a rear cover 600, which is located on the side of the main board 100 away from the middle frame 200. The heat dissipation fan 500 is located between the rear cover 600 and the main board 100, and a plurality of heat dissipation holes 610 are provided on the rear cover 600. The rear cover 600 shields and protects the main board 100 and improves the overall aesthetics of the endoscope device.

[0049] The embodiment of the present application also provides an endoscope device, including the heat dissipation structure provided in any of the above embodiments. During the use of this device, the heat dissipation efficiency is high, the heat dissipation effect is good, the heat accumulation inside the device is less, and each component inside can operate normally. The endoscope device can be an endoscope all-in-one machine or other related devices with a display module 300 during the use of the endoscope.

[0050] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure, characterized in that: The invention comprises a main board (100), a middle frame (200) and a display module (300), wherein the main board (100) and the display module (300) are respectively mounted on two sides of the middle frame (200), wherein: The middle frame (200) is provided with an assembly through hole (210); a heat conducting member (400) is connected to a side of the main board (100) close to the middle frame (200); the heat conducting member (400) passes through the assembly through hole (210) and contacts the display module (300) so as to transfer heat to the display module (300), and conduct the heat to an external environment where the display module (300) is located through the display module (300).

2. A heat dissipation structure according to claim 1, characterized in that: There is an installation gap between the heat conducting member (400) and the hole wall of the assembly through hole (210).

3. A heat dissipation structure according to claim 1, characterized in that: The heat conducting member (400) is in contact with and fits with the hole wall of the assembly through hole (210).

4. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure comprises at least two heat-conducting members (400), and the at least two heat-conducting members (400) are arranged along the length direction of the mainboard (100).

5. The heat dissipation structure according to claim 1, characterized in that: The heat conducting member (400) is located in the middle of the display module (300).

6. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further comprises a heat dissipation fan (500), and the heat dissipation fan (500) is located on a side of the mainboard (100) away from the middle frame (200).

7. A heat dissipation structure according to claim 6, characterized in that: There are two heat-conducting parts (400), and in the length direction of the mainboard (100), the air outlet (510) of the heat dissipation fan (500) is located between the two heat-conducting parts (400), and the air outlet (510) faces one of the heat-conducting parts (400), wherein the volume of the heat-conducting part (400) facing the air outlet (510) is smaller than the volume of the other heat-conducting part (400).

8. A heat dissipation structure according to claim 7, characterized in that: In the width direction of the mainboard (100), the air outlet (510) of the heat dissipation fan (500) is close to the first long side (110) of the mainboard (100), the first long side (110) is arranged adjacent to the battery mounting position (220) of the middle frame (200), and the heat conducting member (400) is located in the middle of the mainboard (100).

9. The heat dissipation structure according to claim 6, characterized in that: The heat dissipation structure further comprises a back cover (600), wherein the back cover (600) is located on a side of the mainboard (100) away from the middle frame (200), the heat dissipation fan (500) is located between the back cover (600) and the mainboard (100), and the back cover (600) has a plurality of heat dissipation holes (610).

10. An endoscope device, characterized in that: The invention comprises the heat dissipation structure according to any one of claims 1 to 9.

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