Dispensing device for electronic component processing

Abstract

The utility model discloses a dispensing device for processing electronic components, which comprises a working platform and a support, a glue storage bin is fixed on the other side of a dispensing valve shell, a glue passing pipe is connected above the glue storage bin, a glue inlet is arranged at the top end of a glue passing hole, one side of the glue inlet is connected with a feeding pump, and a heater is fixed on the glue passing pipe. A placing table is arranged above the working platform, and a processed material is placed above the placing table. A sliding rail is arranged above the support, a sliding block is connected to the front portion of the sliding rail, a sliding groove is formed in the sliding block, a dispensing valve shell is fixed to the front portion of the sliding block, and a glue storage opening is formed in the bottom of the dispensing valve shell. A hole is formed in one side of the dispensing valve shell and connected with an air cavity, a connector is formed above the air cavity, and an air compressor is connected above the connector. According to the utility model, the glue solution can be softened, the glue solution is prevented from being drawn at the glue outlet, and the glue outlet is also prevented from being blocked by too thick glue solution.

Description

Technical Field

[0001] The utility model belongs to the technical direction of dispensing for electronic components, and particularly relates to a dispensing device for processing electronic components. Background Technique

[0002] Electronic components are the basic components in electronic circuits, including various electronic components and parts. They have different functions and characteristics and are used to perform various circuit functions, such as signal processing, amplification, filtering, switching, etc. Some electronic components need to be dispensed during the production process to ensure firmness, so a dispensing device is required.

[0003] Due to different ambient temperatures, the state of the glue in the dispensing device is also different, which leads to situations such as glue drawing during dispensing. In addition, long-term use of the dispensing head will cause the glue head to be blocked and the glue to flow out smoothly.

[0004] In view of the above problems, the utility model proposes a dispensing device for processing electronic components. This device judges the state of the glue by setting a heater and a sensor, and then heats the glue to soften it, avoiding glue drawing at the glue outlet and also avoiding the glue outlet being blocked due to the glue being too thick. Content of the Utility Model

[0005] The purpose of the utility model is to provide a dispensing device for processing electronic components for the existing device to solve the problems put forward in the above background technique.

[0006] To solve the above technical problems, the utility model provides the following technical solutions: A dispensing device for processing electronic components, including a working platform and a bracket. On the other side of the dispensing valve housing, a glue storage bin is fixed. Above the glue storage bin, a glue passing pipe is connected. At the top of the glue passing pipe, a glue inlet is opened. On one side of the glue inlet, a feeding pump is connected. A heater is fixed on the glue passing pipe.

[0007] The utility model further explains that a placement table is opened above the working platform, and the material to be processed is placed above the placement table.

[0008] The utility model further explains that a slide rail is opened above the bracket. In front of the slide rail, a slider is connected. A chute is opened on the slider. In front of the slider, a dispensing valve housing is fixed. A glue storage port is opened at the bottom of the dispensing valve housing.

[0009] The utility model further explains that one side of the dispensing valve housing is opened with a hole to connect an air chamber. An interface is opened above the air chamber, and an air compressor is connected above the interface.

[0010] The utility model further explains that a bushing is fixed above the inside of the dispensing valve housing. Below the bushing, a first piston is connected. Above the first piston, a spring is fixed, and the spring is welded to the bushing above.

[0011] The present utility model will be further described. A second piston is connected below the first piston, and a resistance sensor is fixed below the second piston, and a rubber rod is fixed in the middle of the resistance sensor.

[0012] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows: By providing a resistance sensor and a heater, the resistance sensor can identify the viscosity of the glue in the dispensing valve, and then transmit information to the heater. The heater can then heat up to soften the glue, avoiding the glue from drawing at the glue outlet and also preventing the glue from being too thick and clogging the glue outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0014] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 is a schematic diagram of the inside of the dispensing valve housing of the present utility model;

[0016] Figure 3 is a schematic cross-sectional view of the dispensing valve housing of the present utility model;

[0017] In the figure: 1, working platform; 2, bracket; 3, slide rail; 4, air chamber; 5, slider; 6, dispensing valve housing; 7, glue outlet; 8, glue storage bin; 9, glue conveying pipe; 10, spring; 11, first piston; 12, second piston; 13, resistance sensor; 14, rubber rod; 15, chute; 16, interface; 17, glue inlet; 18, placement table; 19, bushing; 20, heater. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The technical solution of the present utility model will be further described in detail below in conjunction with the preferred embodiments and their accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present utility model.

[0019] Please refer to Figures 1-3 , the present utility model provides a technical solution: A dispensing device for processing electronic components includes a working platform 1 and a bracket 2. A placement table 18 is provided above the working platform 1, and the material to be processed is placed above the placement table 18;

[0020] A slide rail 3 is provided above the bracket 2. The front of the slide rail 3 is connected to a slider 5. A chute 15 is provided on the slider 5. The front of the slider 5 is fixed with a dispensing valve housing 6. A glue storage port 7 is provided at the bottom of the dispensing valve housing 6;

[0021] One side of the dispensing valve housing 6 is provided with an opening connected to an air chamber 4. An interface 16 is provided above the air chamber 4. The interface 16 is connected to an air compressor (not shown in the figure) above;

[0022] A bushing 19 is fixed above the inside of the dispensing valve housing 6. A first piston 11 is connected below the bushing 19. A spring 10 is fixed above the first piston 11. The spring 10 is welded to the bushing 19 above;

[0023] The first piston 11 is connected to a second piston 12 below. A resistance sensor 13 is fixed below the second piston 12. A glue stick 14 is fixed in the middle of the resistance sensor 13;

[0024] A glue storage bin 8 is fixed on the other side of the dispensing valve housing 6. A glue conveying pipe 9 is connected above the glue storage bin 8. A glue inlet 17 is provided at the top of the glue conveying pipe 9. A feeding pump (not shown in the figure) is connected to one side of the glue inlet 17. A heater 20 is fixed on the glue conveying pipe 9.

[0025] Working principle: During the production and processing of electronic components, some electronic components will be subjected to dispensing treatment. The workpiece to be processed is placed on the placement table 18 on the workbench 1. The power is started. The feeding pump conveys the glue to the glue inlet 17. The glue flows along the glue conveying pipe to the glue storage bin 8. At the same time, the air compressor is started. The air compressor conveys the compressed air into the air chamber 4. The two air pipes in the air chamber 4 respectively convey the gas to the first piston 11 and the second piston 12. When the first piston 11 is ventilated, the first piston 11 compresses downward, and the glue stick 14 moves downward to block the glue outlet 7, stopping the glue from flowing out. When the second piston 12 is ventilated, the second piston 12 compresses upward, the spring 10 is compressed, the glue stick 14 moves upward, and the glue outlet 7 discharges glue. When the resistance sensor 13 senses that the compression resistance of the first piston 11 becomes larger, the heater 20 will heat the glue in the glue conveying pipe 9. In this way, the glue with a higher viscosity can be heated and dehumidified to avoid the situation of glue liquid drawing during dispensing, and also avoid the glue liquid being too thick and blocking the glue outlet.

[0026] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A glue dispensing device for processing electronic components, comprising a working platform (1), a bracket (2), and a glue dispensing valve housing (6), characterized in that: A glue storage bin (8) is fixed on the other side of the dispensing valve housing (6); a glue tube (9) is connected to the top of the glue storage bin (8); a glue inlet (17) is provided at the top of the glue tube (9); a feed pump is connected to one side of the glue inlet (17); and a heater (20) is fixed on the glue tube (9); A shaft sleeve (19) is fixed on the upper part of the dispensing valve housing (6), a piston (11) is connected to the lower part of the shaft sleeve (19), a spring (10) is fixed on the upper part of the piston (11), and the upper part of the spring (10) is welded to the shaft sleeve (19); The piston one (11) is connected to the piston two (12) below, a resistance sensor (13) is fixed below the piston two (12), and a rubber stick (14) is fixed in the middle of the resistance sensor (13).

2. The glue dispensing device for processing electronic components according to claim 1, characterized in that: A placement table (18) is provided above the working platform (1), and the material to be processed is placed above the placement table (18).

3. The glue dispensing device for processing electronic components according to claim 2, characterized in that: A slide rail (3) is provided above the bracket (2), a slider (5) is connected to the front of the slide rail (3), a slide groove (15) is provided on the slider (5), the dispensing valve housing (6) is fixed in front of the slider (5), and a glue storage port (7) is provided at the bottom of the dispensing valve housing (6).

4. The glue dispensing device for processing electronic components according to claim 3, characterized in that: A hole is opened on one side of the dispensing valve housing (6) to connect to the air cavity (4), an interface (16) is opened above the air cavity (4), and an air compressor is connected above the interface (16).

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