Plane grinding device for diamond semiconductor material

Abstract

The utility model discloses a plane grinding device for a diamond semiconductor material, and belongs to the technical field of grinding equipment. A plane grinding device for diamond semiconductor materials comprises a grinding disc arranged in a rotating mode, a diamond grinding layer is arranged on the surface of the top of the grinding disc, a guide groove is formed in the surface of the diamond grinding layer in the radial direction, and a semiconductor material clamp is arranged at the eccentric position of the grinding disc. A collecting cover is connected to the outer wall of the grinding disc, the section of the collecting cover is in an L shape, a collecting groove is formed in the inner side of the collecting cover, the upper portion of the side, close to the grinding disc, of the collecting groove is of an opening structure, the top of the opening structure is lower than the bottom end of the guide groove, and the top of the opening structure is higher than the top end of the grinding disc. The utility model has the advantages that the water and the chippings are prevented from spilling out, and the water and the chippings are convenient to collect.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding equipment, in particular to a planar grinding device for diamond semiconductor materials. Background Art

[0002] In the process of processing semiconductor wafers or materials, it is necessary to thin and polish the wafers or materials. Thinning is to subtract the thickness, remove a certain thickness of material to make the wafer or material thinner, so as to facilitate heat dissipation or subsequent processing (such as polishing, scribing, epitaxy, packaging, etc.). The process of polishing is to process the surface damage layer generated by grinding, improve the surface finish, and achieve the required surface quality (roughness, cleanliness, damage layer thickness, etc.). The existing semiconductor thinning processing technologies mainly adopt vertical-feed grinding thinning and horizontal grinding thinning using abrasives.

[0003] In the utility model with the publication number CN213439058U, a planar grinding device for semiconductor materials is disclosed, which includes a grinding disc, a semiconductor material clamp and a limit swing arm. The grinding disc is driven to rotate by a driving device. The top surface of the grinding disc is provided with a diamond grinding layer, and a plurality of radial guide grooves are arranged on the surface of the diamond grinding layer. The lower part of the semiconductor material clamp is cylindrical, and the semiconductor material clamp is eccentrically placed on the diamond grinding layer. The limit swing arm includes a semi-circular fork arm, and fixture rollers are respectively arranged at both ends of the semi-circular fork arm. The axis of the fixture roller is perpendicular to the fork plane of the semi-circular fork arm, and the outer cylindrical surface of the lower part of the semiconductor material clamp contacts the fixture roller. The utility model can improve the grinding removal rate, and does not require abrasives, greatly reducing the grinding time and improving the efficiency.

[0004] During its working process, water is needed for assisted grinding, and the water also plays a role in cleaning grinding debris. However, there is a lack of a shielding structure around the grinding disc, which is not conducive to the collection of waste water and debris. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the problem that the existing planar grinding device for semiconductor materials lacks the function of collecting waste water and debris, and a planar grinding device for diamond semiconductor materials is proposed.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A planar grinding device for diamond semiconductor materials, comprising a rotatably arranged grinding disc, a diamond grinding layer is provided on the top surface of the grinding disc, guide grooves are arranged radially on the surface of the diamond grinding layer, a semiconductor material fixture is arranged at an eccentric position of the grinding disc, a collection cover is connected to the outer wall of the grinding disc, the cross-section of the collection cover is L-shaped, a collection groove is provided inside the collection cover, the upper part of the side of the collection groove close to the grinding disc is an open structure, the top of the open structure is lower than the bottom end of the guide groove, and the top of the open structure is higher than the top end of the grinding disc.

[0008] Further, the bottom of the collection cover is inclined, and the bottom of the collection cover is oval.

[0009] Further, a drain pipe is provided at the lower end of the collection cover, and the drain pipe is communicated with the inside of the collection groove.

[0010] Further, a ring-shaped cover plate is provided on the top of the collection cover, and the inner circle size of the ring-shaped cover plate is larger than the outer wall size of the grinding disc.

[0011] Further, a workbench is provided below the grinding disc, a gas-liquid slip ring is arranged inside the workbench, the gas-liquid slip ring comprises a stator and a rotor, the stator is connected to the workbench, the top of the rotor is connected to the grinding disc, and the bottom of the rotor is connected to a driving motor.

[0012] Further, a central sink is provided in the middle of the top of the grinding disc, the central sink is communicated with the guide groove, a horizontal baffle is arranged in the middle of the central sink, and a water outlet pipe is arranged below the horizontal baffle.

[0013] Further, the outlet end of the water outlet pipe is located below the horizontal baffle, and the inlet end of the water outlet pipe is communicated with the liquid outlet of the conveying pipe of the rotor.

[0014] Compared with the prior art, the present invention provides a planar grinding device for diamond semiconductor materials, which has the following beneficial effects:

[0015] The planar grinding device for diamond semiconductor materials of the present invention fixes the wafer to be ground through a semiconductor material fixture during use, rotates the grinding disc, grinds the wafer through the diamond grinding layer, adds water to the surface of the diamond grinding layer during the grinding process, the water takes away the debris generated by grinding, and under the action of centrifugal force, the water and debris flow into the collection groove along the guide groove, avoiding the spillage of water and debris to pollute the working environment. Compared with the prior art, it can effectively recover the waste water and debris generated by grinding, avoid the splashing of waste water and debris, and facilitate keeping the workbench environment clean.

[0016] Other advantages, objectives and features of the present utility model will be described to some extent in the subsequent description; and to some extent, based on the study of the following text, it will be obvious to those skilled in the art; or, it can be taught from the practice of the present utility model. Brief Description of the Drawings

[0017] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 It is a front view schematic diagram of the overall structure of the present utility model;

[0019] Figure 3 It is a side view schematic diagram of the overall structure of the present utility model;

[0020] Figure 4 It is a three-dimensional sectional schematic diagram of the collection hood structure of the present utility model;

[0021] Figure 5 It is a schematic diagram of the top view effect of the cross-section of the collection hood structure of the present utility model;

[0022] Figure 6 It is a schematic diagram of the front view effect of the cross-section of the collection hood structure of the present utility model.

[0023] Figure 7 It is a sectional schematic diagram of the internal structure of the workbench of the present utility model;

[0024] Figure 8 Of the present utility model Figure 7 Enlarged schematic diagram of part A structure;

[0025] Figure 9 It is a front view schematic diagram of the internal structure of the workbench of the present utility model;

[0026] Figure 10 Of the present utility model Figure 9 Enlarged schematic diagram of part B structure;

[0027] In the figure:

[0028] 1, grinding disc; 3, semiconductor material fixture; 4, horizontal baffle; 5, collection hood; 6, drain pipe; 7, workbench; 8, gas-liquid slip ring; 9, drive motor; 10, water outlet pipe; 11, collection tank; 13, central sink. Detailed Description of the Preferred Embodiment

[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0030] Reference Figures 1-10 Figures 1-10 , a planar grinding device for a diamond semiconductor material of the present utility model includes a rotatably arranged grinding disc 1. The top surface of the grinding disc 1 is provided with a diamond grinding layer. Guide grooves are arranged along the radial direction on the surface of the diamond grinding layer. A semiconductor material clamp 3 is arranged at an eccentric position of the grinding disc 1. A collection cover 5 is connected to the outer wall of the grinding disc 1. The cross-section of the collection cover 5 is L-shaped. A collection groove 11 is opened on the inner side of the collection cover 5. The upper part of the side of the collection groove 11 close to the grinding disc 1 is an open structure. The top of the open structure is lower than the bottom end of the guide groove, and the top of the open structure is higher than the top end of the grinding disc 1.

[0031] The bottom of the semiconductor material clamp 3 is a disc. The turntable is rotatably installed on the workbench 7. A suction cup is installed at the bottom of the disc for adsorbing the wafer material to be ground. A limit swing arm (not shown in the figure) can also be installed on one side of the semiconductor material clamp 3. The limit swing arm includes a clamp roller. The clamp roller is attached to the outer wall of the disc. The clamp roller is driven by a brushless DC motor. The brushless DC motor drives the clamp roller to rotate. The clamp roller drives the disc, the suction cup and the wafer to be ground to rotate.

[0032] A certain pressure is maintained between the semiconductor material to be ground and the grinding disc 1, and the semiconductor material is ground by the diamond grinding layer.

[0033] During grinding, water is added for auxiliary grinding. At the same time, the generated debris and water are discharged from the guide grooves together. Under the centrifugal force, the water and debris flow from the guide grooves into the collection groove 11.

[0034] The upper part of the side of the collection groove 11 close to the grinding disc 1 is an open structure. The top of the open structure is lower than the bottom end of the guide groove, and the top of the open structure is higher than the top end of the grinding disc 1, so that water can easily flow from the guide grooves into the collection groove 11, and at the same time, it is avoided that the water and debris splash out from above the collection cover 5.

[0035] The bottom of the collection cover 5 is inclined, and the bottom of the collection cover 5 is oval.

[0036] The collection groove 11 inside the collection cover 5 is also inclined, so that one end of the collection cover 5 and the collection groove 11 is high and the other end is low. When the waste water and debris flow into the collection groove 11, they flow from the high end to the low end, which is convenient for collecting the waste water and debris.

[0037] The oval shape at the bottom of the collection cover 5 is an oval generated when any plane cuts a cylindrical structure along the inclined direction.

[0038] A drain pipe 6 is arranged at the low end of the collection cover 5. The drain pipe 6 is communicated with the inner side of the collection groove 11.

[0039] When the wastewater and debris flow from the high end to the low end within the collection tank 11 and then flow into the drain pipe 6, a valve can be installed on the drain pipe 6.

[0040] Meanwhile, the outlet end on the drain pipe 6 can be communicated with the delivery pipe on the rotor, enabling the wastewater and debris to enter the delivery pipe on the stator through the delivery pipe on the rotor and then be discharged from the delivery pipe on the stator into the external container.

[0041] The top of the collection hood 5 is provided with an annular cover plate, and the inner circle size of the annular cover plate is larger than the outer wall size of the grinding disc 1.

[0042] The top of the annular cover plate is a flat and equal-height annular plane, and the annular plane is higher than the surface of the diamond grinding layer, so that the outer side wall of the collection hood 5 can block the water and debris flowing out around the grinding disc 1.

[0043] The inner circle size of the annular cover plate is larger than the outer wall size of the grinding disc 1 to avoid interference between the inner wall of the annular cover plate and the disc of the semiconductor material fixture 3 during the rotation process.

[0044] A workbench 7 is arranged below the grinding disc 1. An air-liquid slip ring 8 is arranged inside the workbench 7. The air-liquid slip ring 8 includes a stator and a rotor. The stator is connected to the workbench 7, the top of the rotor is connected to the grinding disc 1, and the bottom of the rotor is connected to the driving motor 9.

[0045] A plurality of delivery pipes are installed inside both the stator and the rotor, and the delivery pipes are in a sliding and sealing connection relationship in one-to-one correspondence. The driving motor 9 drives the rotor to rotate, and the rotor drives the grinding disc 1 to rotate on the workbench 7 for self-rotation.

[0046] A central sink 13 is opened in the middle of the top of the grinding disc 1. The central sink 13 is communicated with the guide groove. A horizontal baffle 4 is arranged in the middle of the central sink 13, and a water outlet pipe 10 is arranged below the horizontal baffle 4.

[0047] The top of the central sink 13 is open. There is a gap between the bottom of the horizontal baffle 4 and the bottom of the bottom of the central sink 13. After the water outlet pipe 10 flushes to the bottom of the horizontal baffle 4, it splashes out in all directions and then flows into the guide groove from one end of the guide groove close to the central sink 13. After being mixed with the debris generated by grinding, it flows out from the end of the guide groove far from the central sink and flows into the collection tank 11.

[0048] The outlet end of the water outlet pipe 10 is located below the horizontal baffle 4, and the inlet end of the water outlet pipe 10 is communicated with the liquid outlet of the delivery pipe of the rotor.

[0049] At least two delivery pipes are installed inside the stator and the rotor, which are respectively used to convey water into the water outlet pipe 10 and discharge the wastewater flowing out from the collection tank 11.

[0050] Working principle: When in use, the semiconductor material to be ground is fixed to the bottom of the semiconductor material fixture 3, and the driving motor 9 is started. The driving motor 9 drives the grinding disc 1 to rotate by itself through the gas-liquid slip ring 8, and the semiconductor material is ground by the diamond grinding layer on the surface of the grinding disc 1.

[0051] Water from an external water source enters the water outlet pipe 10 through the delivery pipe on the gas-liquid slip ring. Under the blocking action of the horizontal baffle 4 and the self-rotation of the grinding disc 1, the water splashes around the central sink 13, enters the guiding groove, mixes with the debris generated by grinding, then flows into the collection tank 11, and finally flows out through the drain pipe 6 and another delivery pipe of the gas-liquid slip ring.

[0052] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

[0053] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0054] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A surface grinding device for diamond semiconductor material, comprising a rotatably arranged grinding disc (1), the top surface of the grinding disc (1) being provided with a diamond grinding layer, the surface of the diamond grinding layer being provided with guide grooves in the radial direction, and a semiconductor material fixture (3) being provided at an eccentric position of the grinding disc (1), characterized in that: A collecting hood (5) is connected to the outer wall of the grinding disc (1); the cross section of the collecting hood (5) is L-shaped; a collecting groove (11) is provided on the inner side of the collecting hood (5); the upper part of the collecting groove (11) on the side close to the grinding disc (1) is an open structure; the top of the opening structure is lower than the bottom end of the guide groove; and the top of the opening structure is higher than the top of the grinding disc (1).

2. The surface grinding device for diamond semiconductor material according to claim 1, characterized in that: The bottom of the collecting cover (5) is arranged to be inclined, and the bottom of the collecting cover (5) is elliptical.

3. A surface grinding device for diamond semiconductor material according to claim 2, characterized in that: A drainage pipe (6) is provided at the lower end of the collection cover (5), and the drainage pipe (6) is communicated with the inner side of the collection tank (11).

4. The surface grinding device for diamond semiconductor material according to claim 1, characterized in that: An annular cover plate is provided on the top of the collecting cover (5), and the inner circle size of the annular cover plate is larger than the outer wall size of the grinding disc (1).

5. The surface grinding device for diamond semiconductor material according to claim 1, characterized in that: A workbench (7) is arranged below the grinding disc (1), and a gas-liquid slip ring (8) is arranged inside the workbench (7). The gas-liquid slip ring (8) comprises a stator and a rotor, the stator is connected to the workbench (7), the top of the rotor is connected to the grinding disc (1), and the bottom of the rotor is connected to the drive motor (9).

6. A surface grinding device for diamond semiconductor material according to claim 5, characterized in that: A central trough (13) is provided in the middle of the top of the grinding disc (1), the central trough (13) is connected to the guide groove, a horizontal baffle (4) is provided in the middle of the central trough (13), and a water outlet pipe (10) is provided below the horizontal baffle (4).

7. A surface grinding device for diamond semiconductor material according to claim 6, characterized in that: The outlet end of the water outlet pipe (10) is located below the horizontal baffle (4), and the inlet end of the water outlet pipe (10) is connected to the liquid outlet of the delivery pipe of the rotor.

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