Semiconductor material photosensitive curing device

Abstract

The utility model provides a semiconductor material photosensitive curing device, which relates to the technical field of semiconductor processing and comprises a working table, a conveying mechanism is mounted at the upper end of the working table, a plurality of trays are placed in the conveying mechanism, a support frame is mounted on the rear side of the working table, and a curing mechanism is mounted in the support frame. A tray and raw materials are placed in the base plate through the feeding device, then the motor can drive the base plate and the raw materials to move to the lower end of the sealing cover through the connecting frame, the second electric push rod pushes the sealing cover and the base plate for sealing, and a sealing cavity is formed between the sealing cover and the base plate. Then the ultraviolet lamp irradiates and solidifies the raw material, so that external dust and the like can be prevented from falling onto the surface of the raw material to influence the solidification effect, and meanwhile, the ultraviolet lamp in the sealing cavity can more accurately control the irradiation angle and distance, so that the light source is more uniformly distributed on the surface of the raw material.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a photosensitive curing device for semiconductor materials. Background Art

[0002] In the field of semiconductor material processing, the photosensitive curing technology is a key link, and its effect directly affects the performance and quality of semiconductor devices. The traditional photosensitive curing method generally adopts an open operation, that is, the semiconductor raw material is directly exposed to the external environment for ultraviolet irradiation curing. However, in the open environment, the raw material is extremely vulnerable to contamination by external dust, particles and other impurities during the curing process. Once these impurities adhere to the surface of the raw material, they will not only affect the uniformity of curing, but may also have an adverse impact on subsequent processing, thereby reducing the overall quality of the product. At the same time, in the open environment, the irradiation angle and distance of the ultraviolet lamp may be affected by various factors, resulting in uneven distribution of the ultraviolet light source on the semiconductor surface. This uneven irradiation will affect the uniformity of curing and cause differences in the performance of each part of the semiconductor. Therefore, we propose a photosensitive curing device for semiconductor materials to solve the above problems. Summary of the Utility Model

[0003] The main purpose of the utility model is to provide a photosensitive curing device for semiconductor materials, which solves the problem that the traditional photosensitive curing method generally adopts an open operation, that is, the semiconductor raw material is directly exposed to the external environment for ultraviolet irradiation curing. However, in the open environment, the raw material is extremely vulnerable to contamination by external dust, particles and other impurities during the curing process. Once these impurities adhere to the surface of the raw material, they will not only affect the uniformity of curing, but may also have an adverse impact on subsequent processing, thereby reducing the overall quality of the product. At the same time, in the open environment, the irradiation angle and distance of the ultraviolet lamp may be affected by various factors, resulting in uneven distribution of the ultraviolet light source on the semiconductor surface. This uneven irradiation will affect the uniformity of curing and cause differences in the performance of each part of the semiconductor.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0005] A photosensitive curing device for semiconductor materials, including a workbench, a transportation mechanism is installed at the upper end of the workbench, several trays are placed inside the transportation mechanism, raw materials are respectively placed on the upper ends of the trays, a support frame is installed at the rear side of the workbench, a curing mechanism is installed inside the support frame, the curing mechanism is snap-connected with the transportation mechanism, and the trays and the raw materials are located between the curing mechanism and the transportation mechanism.

[0006] Preferably, the transport mechanism includes a motor, which is installed at the upper end inside the workbench. The output end of the motor is installed with a connecting frame, and the connecting frame is movably installed at the upper end of the workbench. A plurality of chassis are installed on the outer side of the connecting frame, and the tray and the raw material are located inside the chassis.

[0007] Preferably, through holes are respectively provided through the lower ends inside the chassis, and movable grooves are respectively provided at the lower ends inside the tray. Connecting blocks are respectively movably installed through the inside of the movable grooves, and the connecting blocks are respectively snap-fitted inside the through holes.

[0008] Preferably, first electric push rods are respectively installed on both sides of the upper end inside the workbench. The output ends of the first electric push rods are installed with engaging blocks. The output ends of the first electric push rods and the engaging blocks are respectively movably installed inside the through holes. Clamping grooves are respectively provided at the lower ends of the connecting blocks, and the upper ends of the engaging blocks are respectively snap-fitted inside the clamping grooves.

[0009] Preferably, guiding grooves are respectively provided at one end of the upper surface of the chassis.

[0010] Preferably, the curing mechanism includes a second electric push rod, which is installed at the upper end of the support frame. A sealing cover is movably installed at the lower end inside the support frame. The output end of the second electric push rod movably penetrates through the inside of the support frame and is connected to the sealing cover. The lower end of the sealing cover is in contact with the chassis. A plurality of ultraviolet lamps are installed at the lower end inside the sealing cover.

[0011] Preferably, a sealing block is installed at one end of the lower surface of the sealing cover, and the sealing block is snap-fitted inside the guiding groove.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] (1) In the utility model, the tray and the raw material are placed inside the chassis through the feeding device, and then the motor can drive the chassis and the raw material to move to the lower end of the sealing cover through the connecting frame. The second electric push rod is used to push for sealing between the sealing cover and the chassis, so that a sealed cavity is formed between the sealing cover and the chassis. Then, the ultraviolet lamp can be used to irradiate and cure the raw material. This can avoid dust and the like in the outside world from falling on the surface of the raw material and affecting its curing effect. At the same time, in the sealed cavity, the ultraviolet lamp can more accurately control the irradiation angle and distance, so as to ensure that the light source is more evenly distributed on the surface of the raw material, making the performance of each part of the raw material more consistent.

[0014] (2) In the present utility model, through the cooperation of the first electric push rod and the connecting block, it is convenient for the tray and the raw materials to move up and down for loading and unloading. Then, through the engagement between the connecting block and the through hole, when the chassis drives the tray and the raw materials to move, it is more stable, avoiding the situation that the position of the tray shifts. Then, the connecting block cooperates with the movable groove. When the tray drives the raw materials for other processing, the connecting block can be inserted into the interior of the movable groove, thus not interfering with the normal movement of the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of a photosensitive curing device for semiconductor materials of the present utility model;

[0016] Figure 2 is a front view structure schematic diagram of a photosensitive curing device for semiconductor materials of the present utility model;

[0017] Figure 3 is a side view structure schematic diagram of a photosensitive curing device for semiconductor materials of the present utility model;

[0018] Figure 4 is a Figure 2 schematic diagram of the sectional structure at A-A of a photosensitive curing device for semiconductor materials of the present utility model;

[0019] Figure 5 is a Figure 3 schematic diagram of the sectional structure at B-B of a photosensitive curing device for semiconductor materials of the present utility model;

[0020] Figure 6 is a Figure 4 schematic diagram of the enlarged structure at C of a photosensitive curing device for semiconductor materials of the present utility model;

[0021] Figure 7 is a Figure 5 schematic diagram of the enlarged structure at D of a photosensitive curing device for semiconductor materials of the present utility model.

[0022] In the figure: 1, workbench; 2, transportation mechanism; 201, motor; 202, connecting frame; 203, chassis; 204, guiding groove; 205, through hole; 206, movable groove; 207, connecting block; 208, engaging groove; 209, first electric push rod; 210, engaging block; 3, raw materials; 4, tray; 5, support frame; 6, curing mechanism; 601, second electric push rod; 602, sealing cover; 603, ultraviolet lamp; 604, sealing block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] Next, in combination with the embodiments of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] As Figures 1 to 7 shown, an embodiment of the present utility model provides a photosensitive curing device for semiconductor materials, which includes a workbench 1. A transportation mechanism 2 is installed at the upper end of the workbench 1. A plurality of trays 4 are placed inside the transportation mechanism 2. Raw materials 3 are respectively placed on the upper ends of the trays 4. A support frame 5 is installed at the rear side of the workbench 1. A curing mechanism 6 is installed inside the support frame 5. The curing mechanism 6 is snap-connected to the transportation mechanism 2, and the trays 4 and the raw materials 3 are located between the curing mechanism 6 and the transportation mechanism 2.

[0025] As Figures 4 to 7 shown, in another embodiment of the present utility model, the transportation mechanism 2 includes a motor 201. The motor 201 is installed at the upper inner end of the workbench 1. The output end of the motor 201 is installed with a connecting frame 202, and the connecting frame 202 is movably installed at the upper end of the workbench 1. A plurality of chassis 203 are installed on the outer side of the connecting frame 202. The trays 4 and the raw materials 3 are located inside the chassis 203. Through holes 205 are respectively provided through the lower inner ends of the chassis 203. Moving grooves 206 are respectively provided at the lower inner ends of the trays 4. Connecting blocks 207 are respectively movably installed through the inside of the moving grooves 206. The connecting blocks 207 are respectively snap-connected inside the through holes 205. One-way electric push rods 209 are respectively installed on both sides of the upper inner end of the workbench 1. The output end of the one-way electric push rod 209 is installed with a snap block 210. The output end of the one-way electric push rod 209 and the snap block 210 are respectively movably installed inside the through hole 205. Engaging grooves 208 are respectively provided at the lower ends of the connecting blocks 207. The upper ends of the snap blocks 210 are respectively snap-connected inside the engaging grooves 208. Guide grooves 204 are respectively provided at one end of the upper surface of the chassis 203. The curing mechanism 6 includes a second electric push rod 601. The second electric push rod 601 is installed at the upper end of the support frame 5. A sealing cover 602 is movably installed at the lower inner end of the support frame 5. The output end of the second electric push rod 601 movably penetrates through the inside of the support frame 5 and is connected to the sealing cover 602. The lower end of the sealing cover 602 is in contact with the chassis 203. A plurality of ultraviolet lamps 603 are installed at the lower inner end of the sealing cover 602. A sealing block 604 is installed at one end of the lower surface of the sealing cover 602. The sealing block 604 is snap-connected inside the guide groove 204.

[0026] The feeding device guides the tray 4 and the raw material 3 along the guiding groove 204 to the upper end of the chassis 203. Then, the first electric push rod 209 pushes the engaging block 210 to move upward, so that the engaging block 210 is inserted into the engaging groove 208, connecting the output end of the first electric push rod 209 and the tray 4. Then, the feeding device can be separated from the tray 4 and leave the inside of the chassis 203. Then, the first electric push rod 209 can drive the tray 4 to move downward, causing the tray 4 to drive the raw material 3 into the inside of the chassis 203. After the tray 4 and the chassis 203 are in contact, as the first electric push rod 209 continues to move, the engaging block 210 and the engaging groove 208 are separated. Then, the connecting block 207 moves downward by its own weight, and the connecting block 207 is inserted into the through hole 205 to position the tray 4. Then, the motor 201 can drive the connecting frame 202 to rotate. After the connecting frame 202 drives the chassis 203 and the tray 4 to move to the lower end of the sealing cover 602, the second electric push rod 601 pushes the sealing cover 602 to move downward, making the sealing cover 602 fit with the chassis 203. At the same time, the sealing cover 602 drives the sealing block 604 to be inserted into the guiding groove 204, forming a sealed state between the sealing cover 602 and the chassis 203. Then, the ultraviolet lamp 603 can irradiate and cure the raw material 3. After the raw material 3 is irradiated and cured, the second electric push rod 601 can drive the sealing cover 602 to reset, and the motor 201 continues to drive the chassis 203 to move through the connecting frame 202, causing the chassis 203 to drive the cured raw material to move to the upper end of the first electric push rod 209 on the other side. The first electric push rod 209 pushes the tray 4 and the raw material 3 upward, enabling the discharging device to control the discharging along the guiding groove 204, which is simpler and more convenient.

[0027] The working principle of this semiconductor material photosensitive curing device:

[0028] In use, first, the feeding device guides the tray 4 and the raw material 3 along the guiding groove 204 to the upper end of the chassis 203. Then, the first electric push rod 209 pushes the engaging block 210 to move upward, so that the engaging block 210 is inserted into the engaging groove 208, connecting the output end of the first electric push rod 209 and the tray 4. Then, the feeding device can be separated from the tray 4 and leave the inside of the chassis 203. Then, the first electric push rod 209 drives the tray 4 to move downward, causing the tray 4 to drive the raw material 3 into the inside of the chassis 203. After the tray 4 and the chassis 203 are in contact, as the first electric push rod 209 continues to move, the engaging block 210 and the engaging groove 208 are separated. Then, the connecting block 207 moves downward by its own weight, and the connecting block 207 is inserted into the through hole 205 to position the tray 4. Then, the motor 201 drives the connecting frame 202 to rotate. After the connecting frame 202 drives the chassis 203 and the tray 4 to move to the lower end of the sealing cover 602, the second electric push rod 601 pushes the sealing cover 602 to move downward, making the sealing cover 602 fit with the chassis 203. At the same time, the sealing cover 602 drives the sealing block 604 to be inserted into the guiding groove 204, forming a sealed state between the sealing cover 602 and the chassis 203. Then, the ultraviolet lamp 603 irradiates and cures the raw material 3. After the raw material 3 is irradiated and cured, the second electric push rod 601 drives the sealing cover 602 to reset, and the motor 201 continues to drive the chassis 203 to move through the connecting frame 202, causing the chassis 203 to drive the cured raw material to move to the upper end of the first electric push rod 209 on the other side. The first electric push rod 209 pushes the tray 4 and the raw material 3 to move upward, so that the discharging device controls the discharging along the guiding groove 204. Then, repeat the above steps to continuously process the raw material 3.

[0029] Obviously, the above-mentioned embodiments of the present invention are merely examples for clearly explaining the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, based on the above description, other different forms of changes or variations can be made. It is impossible to list all the implementation manners here. Any obvious changes or variations derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. A semiconductor material photosensitive curing device, comprising a workbench (1), characterized in that: A transport mechanism (2) is installed at the upper end of the workbench (1), a plurality of trays (4) are placed inside the transport mechanism (2), raw materials (3) are placed on the upper ends of the trays (4), a support frame (5) is installed at the rear side of the workbench (1), a curing mechanism (6) is installed inside the support frame (5), the curing mechanism (6) is snap-fittedly connected to the transport mechanism (2), and the trays (4) and the raw materials (3) are located between the curing mechanism (6) and the transport mechanism (2).

2. A semiconductor material photosensitive curing device according to claim 1, characterized in that: The transport mechanism (2) comprises a motor (201), the motor (201) being mounted on the inner upper end of the workbench (1), a connecting frame (202) being mounted on the output end of the motor (201), and the connecting frame (202) being movably mounted on the upper end of the workbench (1), a chassis (203) being mounted on the outer side of the connecting frame (202), and the tray (4) and the raw material (3) being located inside the chassis (203).

3. A semiconductor material photosensitive curing device according to claim 2, characterized in that: Through holes (205) are respectively provided at the inner lower ends of the chassis (203), and movable grooves (206) are respectively provided at the inner lower ends of the trays (4). Connecting blocks (207) are respectively installed and movably penetrated inside the movable grooves (206), and the connecting blocks (207) are respectively snap-fitted and installed inside the through holes (205).

4. A semiconductor material photosensitive curing device according to claim 3, characterized in that: A No. 1 electric push rod (209) is respectively installed on both sides of the upper end of the workbench (1), and a snap-fit ​​block (210) is installed at the output end of the No. 1 electric push rod (209). The output end of the No. 1 electric push rod (209) and the snap-fit ​​block (210) are respectively movably installed inside the through hole (205), and the lower ends of the connecting blocks (207) are respectively arranged in the snap-fit ​​grooves (208), and the upper ends of the snap-fit ​​blocks (210) are respectively snap-fitted inside the snap-fit ​​grooves (208).

5. The semiconductor material photosensitive curing device according to claim 2, characterized in that: One end of the upper surface of the bottom plate (203) is respectively arranged in the guide groove (204).

6. The semiconductor material photosensitive curing device according to claim 1, characterized in that: The curing mechanism (6) comprises a No. 2 electric push rod (601), the No. 2 electric push rod (601) being mounted on the upper end of the support frame (5), a sealing cover (602) being movably mounted on the lower end of the interior of the support frame (5), an output end of the No. 2 electric push rod (601) movably passing through the interior of the support frame (5) and being connected to the sealing cover (602), a lower end of the sealing cover (602) being fitted to the chassis (203), and a plurality of ultraviolet lamps (603) being mounted on the lower end of the interior of the sealing cover (602).

7. A semiconductor material photosensitive curing device according to claim 6, characterized in that: A sealing block (604) is installed at one end of the lower surface of the sealing cover (602), and the sealing block (604) is snap-fitted and installed inside the guide groove (204).

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