Reaction chamber temperature control system

Abstract

The utility model provides a temperature control system for a reaction chamber. The temperature control system comprises the reaction chamber, a switch unit, a cooling unit, a temperature sensor and a controller, the reaction cavity is provided with a first inlet, a second inlet, a third inlet and a gas outlet; the gas exhaust port is used for exhausting gas after chemical reaction in the reaction cavity into the vacuum pump; the temperature sensor is arranged on the outer side wall of the reaction cavity and is used for measuring the temperature of the reaction cavity; the cooling unit is arranged at the second inlet so as to control the temperature of the plasma entering the reaction cavity through the second inlet; the switch unit is arranged at the third inlet so as to control the third inlet to be opened or closed; the switch unit, the cooling unit and the temperature sensor are electrically connected with the controller. The reaction chamber has the technical effects that the design is reasonable, and the chemical reaction rate of gas in the reaction chamber can be ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a reaction chamber temperature control system. Background Art

[0002] In semiconductor equipment, a gas reduction device is mainly used to reduce the gas flowing into a vacuum pump to remove one or several gases therein. After the process in the process chamber ends, multiple gases enter the vacuum pump together after being mixed. Since the vacuum pump compresses air to do work during the vacuum pumping process, the temperature inside the vacuum pump rises, and the gas flowing through the vacuum pump will undergo a chemical reaction under the high-temperature and high-pressure environment. If one or several special gases exist in the multiple gases, they will undergo a chemical reaction under the high-temperature and high-pressure environment of the vacuum pump and generate toxic and harmful gases, liquids or solids. Among them, the gas will cause environmental pollution, the liquid will cause corrosion of the vacuum pump, and the solid will cause the vacuum pump to get stuck. The gas reduction device is to treat one or more of the gases before they flow into the vacuum pump.

[0003] In the gas reduction device, the gas from the client, the gas injected by the device, and the plasma provided by the ion generation device will converge in the reaction chamber of the gas reduction device to undergo a chemical reaction. The plasma provided by the ion generation device is a plasma with a certain temperature. It enters the reaction chamber and reacts chemically with the gas in the reaction chamber, releasing heat and causing the reaction chamber to heat up. Overheating or overcooling of the reaction chamber will affect the chemical reaction rate of the gas in the reaction chamber.

[0004] Therefore, there is an urgent need for a reaction chamber temperature control system to control the temperature of the reaction chamber, so as to ensure the chemical reaction rate of the gas in the reaction chamber. Content of the Utility Model

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art, and provides a new technical solution for a reaction chamber temperature control system.

[0006] According to one aspect of the present application, a reaction chamber temperature control system is provided, including:

[0007] A reaction chamber, which has a first inlet, a second inlet, a third inlet and a gas discharge port; the first inlet is used to introduce the client gas into the reaction chamber, the second inlet is used to introduce the plasma into the reaction chamber, the third inlet is used to introduce the reaction gas into the reaction chamber, and the gas discharge port is used to discharge the gas after the chemical reaction in the reaction chamber into the vacuum pump;

[0008] A switch unit, a cooling unit, and a temperature sensor. The temperature sensor is disposed on the outer wall of the reaction chamber for measuring the temperature of the reaction chamber; the cooling unit is disposed at the second inlet to control the temperature of the plasma entering the reaction chamber through the second inlet; the switch unit is disposed at the third inlet to control the opening or closing of the third inlet;

[0009] A controller. The switch unit, the cooling unit, and the temperature sensor are respectively electrically connected to the controller. The controller is configured to control the switch unit and the cooling unit according to the temperature collected by the temperature sensor so that the temperature of the reaction chamber is within a preset range.

[0010] Optionally, the switch unit includes a diaphragm valve and a solenoid valve. The diaphragm valve is disposed at the third inlet, and the solenoid valve is electrically connected to the diaphragm valve. The solenoid valve is configured to control the opening or closing of the diaphragm valve;

[0011] The solenoid valve is electrically connected to the controller, and the controller is configured to control the solenoid valve to be energized or de-energized;

[0012] When the solenoid valve is energized, the diaphragm valve is in an open state; when the solenoid valve is de-energized, the diaphragm valve is in a closed state.

[0013] Optionally, the cooling unit includes a cooling block and a valve. The cooling block with a hollow interior is installed at the second inlet; the cooling block has a cooling medium inlet and a cooling medium outlet; the cooling medium enters the cooling block through the cooling medium inlet to cool the plasma in the second inlet and then is discharged through the cooling medium outlet;

[0014] The valve is disposed at the cooling medium inlet, and the valve is electrically connected to the controller. The controller controls the flow rate of the cooling medium at the cooling medium inlet through the valve.

[0015] Optionally, the cooling medium is a gas or a liquid.

[0016] Optionally, the material of the cooling block is aluminum or stainless steel.

[0017] Optionally, the reaction chamber temperature control system further includes a cooling layer, and the cooling layer covers the outer wall of the reaction chamber;

[0018] The cooling medium circulates and flows in the cooling layer to cool the reaction chamber.

[0019] Optionally, the cooling medium is a gas or a liquid.

[0020] Optionally, the reaction chamber temperature control system further includes an alarm unit, and the alarm unit is electrically connected to the controller;

[0021] When the temperature collected by the temperature sensor exceeds a first preset value or is lower than a second preset value, the controller controls the alarm unit to emit an alarm signal; wherein, the first preset value is greater than the second preset value.

[0022] Optionally, the reaction chamber is fixed to a sheet metal bracket.

[0023] Optionally, the reaction chamber temperature control system further includes a ceramic gasket; the ceramic gasket is disposed between the temperature sensor and the outer sidewall of the reaction chamber.

[0024] One technical effect of the present application is as follows:

[0025] In the embodiment of the present application, the controller is used to control the switch unit and the cooling unit according to the temperature collected by the temperature sensor, so that the temperature of the reaction chamber is within a preset range, thereby enabling the reaction chamber to maintain a suitable reaction temperature, and preferably ensuring the chemical reaction rate of the gas in the reaction chamber. At the same time, since the reaction chamber has a suitable reaction temperature, the chemical reaction process of the gas in the reaction chamber can process the harmful gas to be reduced to the greatest extent, thereby prolonging the service life of the vacuum pump, lengthening the time for equipment maintenance and downtime, and creating more economic benefits for customers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of a reaction chamber temperature control system according to an embodiment of the present invention.

[0027] In the figure: 1, reaction chamber; 11, first inlet; 12, second inlet; 13, third inlet; 14, gas discharge port; 21, diaphragm valve; 22, solenoid valve; 31, cooling block; 311, cooling medium inlet; 312, cooling medium outlet; 32, valve; 4, temperature sensor; 5, controller; 6, vacuum pump. DETAILED DESCRIPTION

[0028] Now, various exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps described in these embodiments do not limit the scope of the present application.

[0029] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0030] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims indicates at least one of the connected objects. The character " / " generally indicates an "or" relationship between the associated objects before and after.

[0031] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0032] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0033] According to one aspect of the present application, referring to Figure 1 , a reaction chamber temperature control system is provided, which can monitor the temperature of the reaction chamber 1 in real time and control the temperature of the reaction chamber 1 within a preset range to ensure that the chemical reaction in the reaction chamber 1 has a suitable reaction temperature, thereby ensuring the chemical reaction rate of the gas in the reaction chamber 1.

[0034] Specifically, the reaction chamber temperature control system includes:

[0035] Reaction chamber 1, the reaction chamber 1 has a first inlet 11, a second inlet 12, a third inlet 13 and a gas discharge port 14; the first inlet 11 is used to introduce client gas into the reaction chamber 1, the second inlet 12 is used to introduce plasma into the reaction chamber 1, the third inlet 13 is used to introduce reaction gas into the reaction chamber 1, and the gas discharge port 14 is used to discharge the gas after chemical reaction in the reaction chamber 1 into the vacuum pump 6;

[0036] A switch unit, a cooling unit and a temperature sensor 4, the temperature sensor 4 is arranged on the outer wall of the reaction chamber 1 for measuring the temperature of the reaction chamber 1; the cooling unit is arranged at the second inlet 12 to control the temperature of the plasma entering the reaction chamber 1 through the second inlet 12; the switch unit is arranged at the third inlet 13 to control the opening or closing of the third inlet 13;

[0037] A controller 5, the switch unit, the cooling unit and the temperature sensor 4 are respectively electrically connected to the controller 5, and the controller 5 is used to control the switch unit and the cooling unit according to the temperature collected by the temperature sensor 4 so that the temperature of the reaction chamber 1 is within a preset range.

[0038] In the embodiment of the present application, the controller 5 is used to control the switch unit and the cooling unit according to the temperature collected by the temperature sensor 4 so that the temperature of the reaction chamber 1 is within a preset range, so that the reaction chamber 1 maintains a suitable reaction temperature, which preferably ensures the chemical reaction rate of the gas in the reaction chamber 1. At the same time, since the reaction chamber 1 has a suitable reaction temperature, the chemical reaction process of the gas in the reaction chamber 1 can process the harmful gas to be reduced to the greatest extent, thereby prolonging the service life of the vacuum pump 6, stretching the time for equipment maintenance and downtime, and creating more economic benefits for customers.

[0039] It should be noted that, in order to ensure the reaction efficiency in the reaction chamber 1, the reaction chamber 1 needs to be within a suitable temperature range. Too high or too low temperature will reduce the reaction efficiency of the gas in the reaction chamber 1. Therefore, a temperature sensor 4 is provided on the reaction chamber 1 to monitor the temperature of the reaction chamber 1 and make appropriate adjustments to the temperature. When the temperature exceeds the first preset value or is lower than the second preset value, the controller 5 controls the alarm unit to send an alarm signal to improve the safety of the reaction chamber temperature control system. The temperature of the reaction chamber 1 needs to be between the second preset value and the first preset value. If it is lower than the second preset value or higher than the first preset value, an alarm signal will be sent, and the client will perform maintenance on the equipment. If the temperature of the reaction chamber 1 is between the second preset value and the first preset value, the gas in the reaction chamber 1 will undergo normal chemical reactions. When the temperature sensor 4 monitors that the temperature of the reaction chamber 1 is gradually rising and approaching the first preset value, appropriate intervention is carried out through the switching unit and the cooling unit to achieve the purpose of cooling. When the temperature approaches the second preset value, appropriate intervention is also carried out to make the temperature close to the middle value between the second preset value and the first preset value.

[0040] Exemplarily, the first inlet 11 is in a normally open state, and the second inlet 12 is also in a normally open state. The second inlet 12 is the plasma inlet, that is, a certain plasma generated from a specific device enters the reaction chamber 1 through the second inlet 12.

[0041] Optionally, the switching unit includes a diaphragm valve 21 and a solenoid valve 22. The diaphragm valve 21 is disposed at the third inlet 13, and the solenoid valve 22 is electrically connected to the diaphragm valve 21. The solenoid valve 22 is used to control the opening or closing of the diaphragm valve 21;

[0042] The solenoid valve 22 is electrically connected to the controller 5, and the controller 5 is used to control the solenoid valve 22 to be energized or de-energized;

[0043] When the solenoid valve 22 is energized, the diaphragm valve 21 is in an open state; when the solenoid valve 22 is de-energized, the diaphragm valve 21 is in a closed state.

[0044] In the above embodiment, the third inlet 13 is the inlet for the reaction gas (i.e., the special gas). A special gas needs to be introduced into the reaction chamber 1 for the chemical reaction occurring in the reaction chamber 1 to promote the progress of the chemical reaction. A diaphragm valve 21 is installed at the third inlet 13, and the solenoid valve 22 is a pneumatically controlled solenoid valve 22. The controller 5 controls the opening of the solenoid valve 22 to control the on-off of the diaphragm valve 21, thereby achieving the control of the switch of the third inlet 13 and the purpose of controlling the flow rate of the reaction gas. Among them, the controller 5 is disposed in the control cabinet, the diaphragm valve 21 is in a normally closed state, and the solenoid valve 22 is a pneumatic solenoid valve.

[0045] Optionally, the cooling unit includes a cooling block 31 and a valve 32. The internally hollow cooling block 31 is installed at the second inlet 12. The cooling block 31 has a cooling medium inlet 311 and a cooling medium outlet 312. The cooling medium enters the cooling block 31 through the cooling medium inlet 311 to cool the plasma in the second inlet 12 and is discharged through the cooling medium outlet 312.

[0046] The valve 32 is disposed at the cooling medium inlet 311, and the valve 32 is electrically connected to the controller 5. The controller 5 controls the flow rate of the cooling medium at the cooling medium inlet 311 through the valve 32.

[0047] In the above embodiment, the cooling medium circulates into the cooling block 31 through the cooling medium inlet 311 to cool the plasma in the second inlet 12 and is discharged through the cooling medium outlet 312, so that the plasma can be cooled, and then the temperature of the reaction chamber 1 can be effectively adjusted. The flow rate of the cooling medium can be effectively adjusted through the valve 32, thereby improving the cooling efficiency of the plasma.

[0048] Optionally, the cooling medium is a gas or a liquid.

[0049] In the above embodiment, the temperature of the plasma can be effectively reduced by the circulation of the gas or liquid in the cooling block 31. When the cooling medium is a liquid, the valve 32 is a water valve, and the flow rate of the liquid can be effectively controlled through the water valve.

[0050] Optionally, the material of the cooling block 31 is aluminum or stainless steel.

[0051] In the above embodiment, aluminum or stainless steel has excellent properties of high temperature resistance and corrosion resistance, which can avoid corrosion of the cooling block 31 caused by impurities in the introduced cooling medium.

[0052] Optionally, the reaction chamber temperature control system further includes a cooling layer (not shown in the figure), and the cooling layer covers the outer side wall of the reaction chamber 1.

[0053] The cooling medium circulates and flows in the cooling layer to cool the reaction chamber 1.

[0054] In the above embodiment, the temperature of the reaction chamber 1 can be effectively reduced through the cooling layer.

[0055] Optionally, the cooling medium is a gas or a liquid. The temperature of the reaction chamber 1 can be effectively reduced by the flow of the gas or liquid in the cooling layer.

[0056] Optionally, the reaction chamber temperature control system further includes an alarm unit (not shown in the figure), and the alarm unit is electrically connected to the controller 5;

[0057] When the temperature collected by the temperature sensor 4 exceeds a first preset value or is lower than a second preset value, the controller 5 controls the alarm unit to emit an alarm signal; wherein, the first preset value is greater than the second preset value.

[0058] In the above embodiment, the alarm unit can timely alarm when the temperature of the reaction chamber 1 exceeds the first preset value or is lower than the second preset value, which helps the client to timely perform corresponding cooling or heating treatment on the reaction chamber 1.

[0059] Optionally, the reaction chamber 1 is fixed to a sheet metal bracket.

[0060] In the above embodiment, the fixing method of the reaction chamber 1 is relatively simple, which helps to ensure the stability of the gas reaction in the reaction chamber 1.

[0061] Optionally, the reaction chamber temperature control system further includes a ceramic gasket; the ceramic gasket is disposed between the temperature sensor 4 and the outer side wall of the reaction chamber 1.

[0062] In the above embodiment, the ceramic gasket can effectively avoid the temperature from affecting the service life of the temperature sensor 4 and better protect the temperature sensor 4.

[0063] In a specific embodiment, the reaction chamber temperature control system can control the temperature of the reaction chamber 1 within a suitable range. When the temperature of the reaction chamber 1 exceeds the first preset value, corresponding processing can be performed, such as alarming or shutting down. The temperature of the reaction chamber 1 is monitored in real time through the temperature sensor 4. When the temperature of the reaction chamber 1 approaches the first preset value, the controller 5 controls the cooling unit to cool the plasma and controls the gas supply amounts of the first inlet 11 and the third inlet 13, thereby controlling the temperature of the reaction chamber 1 to make the temperature of the reaction chamber 1 suitable for the internal chemical reaction of the reaction chamber 1, so as to achieve a relatively high chemical reaction efficiency, and finally enable the reaction chamber temperature control system to operate stably. When the temperature of the reaction chamber 1 reaches and exceeds the first preset value, the controller 5 controls the alarm unit to emit an alarm signal, and then issues an instruction to the solenoid valve 22, and the valve core of the solenoid valve 22 closes and controls the diaphragm valve 21 to close. At the same time, the alarm signal is transmitted to the client of the using device for the client to make timely processing.

[0064] In the embodiment of the present application, there is a correlation between the temperature of the reaction chamber 1 and the reaction efficiency of the gas in the reaction chamber 1. By monitoring the temperature of the reaction chamber 1 to judge the reaction efficiency of the gas in the reaction chamber 1 and appropriately adjusting the input amounts of the client gas and the reaction gas, not only can the maximization of economic benefits be achieved, but also the reaction efficiency of the gas in the reaction chamber 1 can be improved, and the harmful gas entering the vacuum pump 6 can be processed to the maximum extent, avoiding the occurrence of chemical reactions of the gas in the vacuum pump 6 due to high temperature to generate solids, thereby avoiding the jamming and downtime of the vacuum pump 6.

[0065] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A reaction chamber temperature control system, characterized in that: include: A reaction chamber, wherein the reaction chamber has a first inlet, a second inlet, a third inlet and a gas exhaust port; The first inlet is used to introduce client gas into the reaction chamber, the second inlet is used to introduce plasma into the reaction chamber, the third inlet is used to introduce reaction gas into the reaction chamber, and the gas exhaust port is used to exhaust the gas after the chemical reaction in the reaction chamber to the vacuum pump; a switch unit, a cooling unit and a temperature sensor, wherein the temperature sensor is disposed on the outer wall of the reaction chamber and is used to measure the temperature of the reaction chamber; the cooling unit is disposed at the second inlet to control the temperature of the plasma entering the reaction chamber through the second inlet; the switch unit is disposed at the third inlet to control the opening or closing of the third inlet; A controller, wherein the switch unit, the cooling unit, and the temperature sensor are electrically connected to the controller respectively, and the controller is used to control the switch unit and the cooling unit according to the temperature collected by the temperature sensor, so that the temperature of the reaction chamber is within a preset range.

2. The reaction chamber temperature control system according to claim 1, characterized in that: The switch unit comprises a diaphragm valve and a solenoid valve, wherein the diaphragm valve is arranged at the third inlet, the solenoid valve is electrically connected to the diaphragm valve, and the solenoid valve is used to control the opening or closing of the diaphragm valve; The solenoid valve is electrically connected to the controller, and the controller is used to control the solenoid valve to be energized or de-energized; When the solenoid valve is powered on, the diaphragm valve is in an open state; when the solenoid valve is powered off, the diaphragm valve is in a closed state.

3. The reaction chamber temperature control system according to claim 1, characterized in that: The cooling unit comprises a cooling block and a valve. The cooling block with a hollow interior is installed at the second inlet. The cooling block has a cooling medium inlet and a cooling medium outlet. The cooling medium enters the cooling block through the cooling medium inlet to cool the plasma in the second inlet and is then discharged from the cooling medium outlet. The valve is disposed at the cooling medium inlet, and the valve is electrically connected to the controller, and the controller controls the flow rate of the cooling medium at the cooling medium inlet through the valve.

4. The reaction chamber temperature control system according to claim 3, characterized in that: The cooling medium is gas or liquid.

5. The reaction chamber temperature control system according to claim 3, characterized in that: The cooling block is made of aluminum or stainless steel.

6. The reaction chamber temperature control system according to claim 1, characterized in that: It also includes a cooling layer, which is coated on the outer wall of the reaction chamber; The cooling medium circulates and flows in the cooling layer to cool the reaction chamber.

7. The reaction chamber temperature control system according to claim 6, characterized in that: The cooling medium is gas or liquid.

8. The reaction chamber temperature control system according to claim 1, characterized in that: Also includes an alarm unit, the alarm unit is electrically connected to the controller; When the temperature collected by the temperature sensor exceeds a first preset value or is lower than a second preset value, the controller controls the alarm unit to send out an alarm signal; wherein the first preset value is greater than the second preset value.

9. The reaction chamber temperature control system according to claim 1, characterized in that: The reaction chamber is fixed to the sheet metal bracket.

10. The reaction chamber temperature control system according to claim 1, characterized in that: It also includes a ceramic gasket; the ceramic gasket is arranged between the temperature sensor and the outer side wall of the reaction chamber.

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